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ENGINEERED CONNECTIVITY FOR 5G COMMUNICATIONS

THE FUTURE IS FAST

Today, TE Connectivity (TE) is building a future reality where intelligence will be integrated into infrastructure. Cars will drive themselves, houses will be self-cleaning, agriculture will work sustainably, and electrical grids will respond automatically to fluxes in energy demands. Simply put, we’ll live in a smarter, more connected world. It’s a determined undertaking and getting there will require devices that can operate within a much broader bandwidth at exceptionally higher speeds. Not only will these devices need to be faster and more adaptable, they’ll need to be smaller, lighter, more economical, and superabundant—we foresee billions of connected devices built with more than a trillion sensors. It’s going to be awesome, and it’s going to change everything. But 5G isn’t some far-off dream: we are already designing and building devices to support the increased speed, capacity, and bandwidth of 5G networks.

The next generation of speed is here. TE is leading the industry with a full spectrum of ultra-compact, impossibly powerful solutions for optimizing 5G connectivity. From integrating and expanding the internet of things to re-imagining public transportation, 5G’s faster, safer networks will augment and empower every industry on earth. Billions of people will live in a 5G world within the next decade, and it will take uncompromising, innovative components to set your product apart.

*TE Connectivity, TE Connectivity (logo), and TE are trademarks.

  • By Application
  • By Products

Browse 5G by Application Solutions

  • Server Solutions
  • Switching and Routers Solutions
  • Storage Solutions

Solutions for a Board Range of Configurations

Servers are the heart of the data network. TE offers the solutions you need to keep your servers running. TE’s backplane, board-to-board, I/O, power and copper cable solutions help enable server architectures that address industry needs of higher bandwidth and improved thermal management. TE offers a complete portfolio of complementary products and agile system expertise to help you optimize the design of your server configuration whether blade, rack mount or sleds. In addition to solutions for disaggregated systems, TE can also extend your reach, reduce your power consumption, and increase speed and density to address the demands of always-connected data centers.

High Speed Backplane

 

Internal Interconnect

 

Input/Output (I/O)

 

Power

 

Memory & Sockets

 

Copper Cable Assemblies

 

Bandwidth for the Next Generation

TE Connectivity’s (TE) global experience in a wide range of connectivity applications helps our customers “design in” efficiency and agility into data center infrastructure and data center equipment. We have a full set of interconnect and cabling solutions to increase bandwidth, density and reliability for all types of telecommunications and enterprise routing and switching equipment. We offer products for applications at 10, 25, 40, 100 and up to 400 Gbps to support converged internet protocol (IP) networks. Count on us to provide solutions to support your enterprise’s current and future demand for data, speed, and power efficiency

High Speed Backplane

 

Internal Interconnect

 

Input/Output (I/O)

 

Power

 

Ethernet

 

Copper Cable Assemblies

 

Storage Solutions that Grow with Your Demand

As the Internet of Things (IoT) expands and the growing connected world generates exponentially more data, efficient and reliable storage solutions become even more critical within the data center. Whether you are designing to scale up or scale out with your data center storage solutions, TE has a broad range of input/output (I/O), board-to-board, power products and more to help you achieve your storage performance objectives. We combine innovation and quality, dependable products with the flexibility to deliver storage interconnect solutions practically anywhere in the world. We are your partner for creating the solutions that meet the demand of the next generation of our data-driven world.

High Speed Backplane

 

Internal Interconnect

 

Input/Output (I/O)

 

Power

 

Memory & Sockets

 

Copper Cable Assemblies

 

Browse 5G by Product Solutions

  • ZQSFP+ Connectors
  • STRADA MESA
  • LGA 3647
  • ANTENNAS
  • ELCON MINI
zQSFP+ Connector

z-Quad Small Form-factor Pluggable Plus (zQSFP+) Connector System

TE’s zQSFP+ connector has been designed for applications in the telecommunications, data center and networking markets that require a high-speed, high-density connector. The interconnect offers four channels of high-speed differential signals with data rates ranging from 25 Gbps up to potentially 40 Gbps, and will support 100 Gbps (4x25 Gbps) Ethernet and 100 Gbps 4X InfiniBand Enhanced Data Rate (EDR) requirements.

Key Features & Benefits

  • Increased Data Rates
    • Data transfer rates of 28 Gbps NRZ and 56 Gbps PAM-4
    • Supports Ethernet and InfiniBand (IB) Enhanced Data Rate (EDR) requirements
    • Supports single channel, dual channel and quad channel implementations
  • Industry Standard and Customizable Design
    • Industry standard interface
    • Backwards compatible with QSFP+ cables and transceivers
    • Improved loss budget for optics and copper cables at 10 Gbps
  • Comprehensive Portfolio and Inventory
    • Features behind and through bezel cages with various lightpipe and heat sink options
    • Well-stocked distribution channel
  • Improved EMI Performance
    • Increased data rates make EMI protection more challenging
    • Provide excellent EMI protection through 56 Gbps

 

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STRADA Mesa

Connectors enable efficient use of PCB space and deliver +15 Gbps high speed performance.

With spatial requirements continuing to become more critical in designs for telecommunications, computer, military, rail systems, and more, TE offer the STRADA Mesa mezzanine connector to provide a stacking, board-to-board connection solution for efficient PCB space utilization. The STRADA Mesa product design delivers a high-speed performance of +15 Gbps. In addition, the design provides three pin and socket signal contact arrangement options -- high-speed differential, high-density single-ended and RF/ Coaxial -- to suit various application requirements.

Key Features & Benefits

  • Data rates up to 15+ Gbps
  • 100 Ohm impedance
  • Single ended, differential, and power configurations
  • Optional power contacts spaced for 48V applications per UL 1950
  • 14 amp Current rating
  • Optional guide system to accommodate blind mating
  • Stack heights from 8-42mm in 1mm increments
  • Press-Fit (Eye-of-the-Needle) PCB attach.
  • Open space to allow for Airflow through connector
  • Three housing sizes (widths): Standard: 40, 80, and 120 pairs; Half: 24, 48, and 88 pairs; Power: 6 -12 contacts

 

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LGA Sockets

Ease of Soldering and Positioning

TE LGA sockets provide a compressive electrical interconnect between the processor and the printed circuit board (PCB). As computing power increases, chips’ pin count are increasing. A robust bolster plate provides a reliable interconnection to the microprocessor package and limits PCB bowing during compression to ensure a reliable connection. The contact tip geometry is optimized to reduce risk of contact damage during handling and package installation. TE flexible tooling provides high-quality, fast turnaround time for prototypes so sockets can be in your hands at the earliest stages of your program.

Key Features & Benefits

  • Socket housing facilitates efficient soldering to the PCB.
  • Socket is supplied with a cap to facilitate vacuum pick and place.
  • Backplates are available in zinc or nickel plating.

 

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Antennas

Flexibility

TE broad portfolio of antenna technologies includes standard antennas and custom antennas, with two shot molding, stamped metal, flexible printed circuit (FPC), printed circuit board (PCB) and laser direct structuring (LDS) solutions. Available as embedded or multi-element external antennas, these solutions provide high-clarity transmissions in wireless devices in a wide variety of frequencies including, but not limited to: Bluetooth, Wi-Fi, LTE and ZigBee. TE operate design and manufacturing facilities worldwide, with testing capabilities in near and far field patterns, scattering parameters, SAR, vibration, humidity, temperature shock, salt fog, throughput and acoustic.

Key Features & Benefits

  • High performance and innovative products
    • High reliability: high performance and isolation
    • High efficiency: optimized throughput, minimal losses
  • In-house testing and validation
  • State-of-the art antenna laboratories and personnel, deployed globally
  • Innovation leader with leading patent portfolio
  • Quick-turn designs and prototypes
  • World class manufacturing capabilities
  • Thrive on opportunities to solve problems together with our customers
  • Community leader listed on Dow Jones Sustainability Index and named one of World’s Most Ethical Companies by Ethisphere® Institute

 

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ELCON MINI

Mini Connector with Optimal Power

Pack more power into smaller spaces with TE ELCON Mini power interconnects that feature a small, 8 mm height form-factor and support higher current than similar sized solutions (up to 40 Amps per contact, 400 Volts AC or DC). These interconnects provide confidence in system performance with their low resistance, highly reliable interface. Features include positive metal latch retention, optional coding contacts for sense/detect functionality, enhanced grounding, and use of industry-proven crimp contacts.

Key Features & Benefits

  • Support high current up to 40 A per contact and a 400 V rating with a cost-effective stamped contact design
  • Small, 8 mm height form-factor that is roughly the size of a space-saving HDMI connector
  • Offered in 2-, 3-, 4- and 6- (2x3 position configurations - broader, more versatile portfolio than the competition
  • Connector available in both vertical and right-angle mounts as well as press fit and through hole
  • Low resistance, highly reliable interface
  • Positive metal latch retention
  • Cable assemblies ordered in standard or high-flex designs for easier routability, and are highly customizable
  • Support 14-10 AWG cable sizes (2.5 mm2 to 6 mm2)

 

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