CUI’s line of high-performance Peltier modules offer superior cooling performance and a longer cycle life with its innovative arcTEC structure. This unique construction utilizes a combination of thermally conductive resin between the ceramic and copper on the cold side of the module, a high temperature solder, and larger P/N elements made from premium silicon ingot. The elasticity of arcTEC’s resin layer allows for thermal expansion and contraction during the repeated heating and cooling of normal operation, which reduces stress on the elements, resulting in a better thermal connection, superior mechanical bond, and no marked drop-off in performance over time.
Thanks to their reliable solid state construction, precise temperature control, and quiet operation, these thermoelectric coolers are ideal for medical and industrial applications as well as designs where forced air cooling is not an option.
- arcTEC structure
- Ranging in size from 30 mm to 40 mm
- Profiles as low as 3.1 mm
- IMAX from 2.0 A to 8.5 A
- Wide ΔTMAX of 77°C (Th=50°C)
- Solder melting point up to 235°C
- Precise temperature control
- Longer thermal cycle life