Board-Level Heat Sinks

CUI’s spacing-saving HSS and HSE series are suitable for devices in TO-218, TO-220, TO-252, and TO-263 packages

Image of CUI's Board-Level Heat SinksDesigned to dissipate heat in natural convection and forced air environments, CUI’s line of stamped and extruded heat sinks has the variety of form factors and transistor package types to meet various onboard cooling needs. With thermal resistance conveniently measured under 4 conditions for each heat sink, users have the ability to select the ideal product for their specific application with greater ease.

Features
  • Stamped and extruded designs
  • Variety of form factors
  • Thermal resistance down to 4.49°C/W @ 75°C ΔT, nat conv
  • Aluminum and copper options
  • Tin plated and black anodized material finishes
  • Available with and without solder pins
  • TO-218, TO-220, TO-252, and TO-263 transistor package types

Board-Level Heat Sinks

ImageManufacturer Part NumberDescriptionAvailable QuantityView Details
HEAT SINK, EXTRUSION, TO-220, 25HSE-B20250-040H-01HEAT SINK, EXTRUSION, TO-220, 251368 - ImmediateView Details
HEAT SINK, EXTRUSION, TO-220, 25HSE-B20254-035H-02HEAT SINK, EXTRUSION, TO-220, 251188 - ImmediateView Details
HEAT SINK, EXTRUSION, TO-220, 25HSE-B20254-035H-01HEAT SINK, EXTRUSION, TO-220, 25885 - ImmediateView Details
HEAT SINK, EXTRUSION, TO-220,25.HSE-B20254-035HHEAT SINK, EXTRUSION, TO-220,25.99 - ImmediateView Details
HEAT SINK, EXTRUSION, TO-220, 25HSE-B254-045HHEAT SINK, EXTRUSION, TO-220, 251113 - ImmediateView Details
HEATSINK TO-220 2.9W ALUMINUMHSS-B20-NP-06HEATSINK TO-220 2.9W ALUMINUM1435 - ImmediateView Details
HEATSINK TO-220 2.6W ALUMINUMHSS-B20-CP-01HEATSINK TO-220 2.6W ALUMINUM4121 - ImmediateView Details
HEATSINK TO-220 6.5W ALUMINUMHSS-B20-NP-04HEATSINK TO-220 6.5W ALUMINUM1327 - ImmediateView Details
HEATSINK TO-220 2.9W ALUMINUMHSS-B20-061H-03HEATSINK TO-220 2.9W ALUMINUM5094 - ImmediateView Details
HEATSINK TO-220 6.8W ALUMINUMHSS-B20-NP-12HEATSINK TO-220 6.8W ALUMINUM3854 - ImmediateView Details
Published: 2017-06-14