HSAutoLink™ II Interconnect System

Molex's HSAutoLink II interconnect system features shrouds and latches standard to meet USCAR requirements

Image of Molex's HSAutoLink™ II Interconnect SystemThe robust HSAutoLink II interconnect system from Molex delivers data rates up to 5 Gbps, supporting high-speed media protocols including USB 3.1 (5 Gb/s data rate), to meet increasing bandwidth requirements for advanced in-vehicle infotainment, telematics, and camera devices. It optimizes device-side space savings to meet future needs for increasing high-speed communication links.

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Electrical
  • Voltage (max.): 36 V
  • Current (max.): 1.5 A (higher current rating achievable)
  • Contact resistance: 20 milliohms
  • Dielectric withstanding voltage: 500 VAC
  • Insulation resistance (min.): 100 Megohms
Mechanical
  • Insertion force to PCB (max.): 20 N
  • Mating force (max.): 75 N
  • Unmating force (max.): 75 N
  • Connector: 25 cycles
  • Terminal system: 5000 cycles
Applications
  • Automotive and commercial vehicles
  • Infotainment
  • Telematics devices
  • Navigation systems
  • Connected vehicle services
  • Diagnostics or data up-loading for flashing ECUs
  • Advanced driver assistance system (ADAS)
    • Multiple cameras for around vehicle view monitoring, lane departure, pedestrian warning, night vision, loading/unloading operations, and more
  • Camera-to-controller/controller-to-display connections

USB Connectors

ImageManufacturer Part NumberDescriptionAvailable QuantityView Details
CONN FMALE HDR USB2.0 MINI B R/A49616-0715CONN FMALE HDR USB2.0 MINI B R/A928 - ImmediateView Details
CONN FMALE HDR USB2.0 MINI B R/A49616-0711CONN FMALE HDR USB2.0 MINI B R/A2197 - ImmediateView Details

LVDS

ImageManufacturer Part NumberDescriptionAvailable QuantityView Details
LVDS MINI-B/MINI-B 0.50M A-TO-A1110415001LVDS MINI-B/MINI-B 0.50M A-TO-A1702 - ImmediateView Details
Published: 2018-02-09