Bosch Sensortec

BMM150 Geomagnetic Sensors

Bosch's BMM150 geomagnetic sensors feature average current consumption of 170 µA (low-power preset), or 500 µA (normal mode)

Image of Bosch's BMM150 Geomagnetic SensorsBosch’s BMM150 is a low-power and low-noise, 3-axis, digital geomagnetic sensor to be used in compass applications. The 12-pin wafer level chip-scale package (WLCSP) with a footprint of 1.56 mm² x 1.56 mm² and 0.60 mm height provides high design flexibility to a developer of mobile devices. Applications like virtual reality or gaming on mobile devices such as mobile phones, tablet PCs, or portable media players require 9-axis inertial sensing including magnetic heading information.

The Bosch Sensortec BMM150 shuttle-board is a PCB with a BMM150 geomagnetic sensor mounted on it. It allows easy access to the sensors pins via a simple socket. As all Bosch Sensortec sensor shuttle boards have an identical footprint, they can be plugged into Bosch Sensortec’s advanced development tools (such as the development board or application board). Of course, the BMM150 shuttle board can also be used for the users own implementations.

Features
  • I²C and SPI digital interfaces
  • 0.3 µT resolution
  • Typical magnetic range of ±1300 µT (x,y-axis), ±2500 µT (z-axis)
  • Temp range -40°C to 85°C
  • Supply voltage VDD: 1.62 V to 3.6 V, VDDIO: 1.2 V to 3.6 V
  • Average current consumption: 170 µA (low-power preset), 500 µA (normal mode)
Applications
  • Augmented reality applications and location-based services
  • Indoor and outdoor navigation
  • Gaming
  • Pointing devices

BMM150 Geomagnetic Sensors

ImageManufacturer Part NumberDescriptionPart StatusAxisAvailable QuantityView Details
SENSOR FLIPCORE/HALL SPI 12WLCSPBMM150SENSOR FLIPCORE/HALL SPI 12WLCSPActiveX, Y, Z200 - ImmediateView Details

BMM150 Shuttle-Board

ImageManufacturer Part NumberDescriptionSensing RangeInterfaceAvailable QuantityView Details
SHUTTLE BOARD DEV KIT BMM150BMM150-SHUTLSHUTTLE BOARD DEV KIT BMM150±1300µT, ±2500µTI²C, SPI0View Details
Published: 2016-08-04

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