Product Index > Connectors, Interconnects > Sockets for ICs, Transistors

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Compare Parts Datasheets Image Digi-Key Part Number Manufacturer Part Number Manufacturer Description Quantity Available
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Packaging Series Part Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Dielectric Material Operating Temperature
   
4808-3004-CP Datasheet 4808-3004-CP - 3M 3M5473-ND CONN IC DIP SOCKET 8POS TIN 19,049 - Immediate Available: 19,049 $0.51000 1 Minimum: 1 Tube? 4800 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
4816-3000-CP Datasheet 4816-3000-CP - 3M 3M5463-ND CONN IC DIP SOCKET 16POS TIN 10,864 - Immediate Available: 10,864 $0.51000 1 Minimum: 1 Tube? 4800 Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
8444-21B1-RK-TR Datasheet 8444-21B1-RK-TR - 3M 3M4421B1TR-ND CONN SOCKET PLCC 44POS TIN 1,800 - Immediate Available: 1,800 $1.45919 360 Minimum: 360 Tape & Reel (TR)?
Alternate Packaging
8400 Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8444-21B1-RK-TR Datasheet 8444-21B1-RK-TR - 3M 3M4421B1CT-ND CONN SOCKET PLCC 44POS TIN 1,936 - Immediate Available: 1,936 $2.28000 1 Minimum: 1 Cut Tape (CT)?
Alternate Packaging
8400 Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8444-21B1-RK-TR Datasheet 8444-21B1-RK-TR - 3M 3M4421B1DKR-ND CONN SOCKET PLCC 44POS TIN 1,936 - Immediate Available: 1,936 Digi-Reel® 1 Minimum: 1 Digi-Reel®?
Alternate Packaging
8400 Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8468-11B1-RK-TP Datasheet 8468-11B1-RK-TP - 3M 3M6811B1-ND CONN SOCKET PLCC 68POS TIN 2,767 - Immediate Available: 2,767 $2.29000 1 Minimum: 1 Tube? 8400 Active PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
214-3339-00-0602J Datasheet 214-3339-00-0602J - 3M 3M1402-ND CONN IC DIP SOCKET ZIF 14POS GLD 1,107 - Immediate Available: 1,107 $18.70000 1 Minimum: 1 Tray? Textool™ Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
220-3342-00-0602J Datasheet 220-3342-00-0602J - 3M 3M2002-ND CONN IC DIP SOCKET ZIF 20POS GLD 773 - Immediate Available: 773 $19.89000 1 Minimum: 1 Bulk? Textool™ Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
224-1275-00-0602J Datasheet 224-1275-00-0602J - 3M 3M2402-ND CONN IC DIP SOCKET ZIF 24POS GLD 397 - Immediate Available: 397 $20.09000 1 Minimum: 1 Tube? Textool™ Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
216-3340-00-0602J Datasheet 216-3340-00-0602J - 3M 3M1602-ND CONN IC DIP SOCKET ZIF 16POS GLD 2,037 - Immediate Available: 2,037 $20.16000 1 Minimum: 1 Tube? Textool™ Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
240-1280-00-0602J Datasheet 240-1280-00-0602J - 3M 3M4002-ND CONN IC DIP SOCKET ZIF 40POS GLD 145 - Immediate Available: 145 $22.81000 1 Minimum: 1 Tube? Textool™ Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
224-5248-00-0602J Datasheet 224-5248-00-0602J - 3M 3M5000-ND CONN IC DIP SOCKET ZIF 24POS GLD 132 - Immediate Available: 132 $24.11000 1 Minimum: 1 Bulk? Textool™ Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
208-7391-55-1902 Datasheet 208-7391-55-1902 - 3M 3M5054-ND CONN SOCKET SOIC 8POS GOLD 344 - Immediate Available: 344 $26.46000 1 Minimum: 1 Bulk? Textool™ Active SOIC 8 (2 x 4)
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Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
248-1282-00-0602J Datasheet 248-1282-00-0602J - 3M 3M5004-ND CONN IC DIP SOCKET ZIF 48POS GLD 275 - Immediate Available: 275 $28.70000 1 Minimum: 1 Tube? Textool™ Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
216-7224-55-1902 Datasheet 216-7224-55-1902 - 3M 3M5077-ND CONN SOCKET SOIC 16POS GOLD 261 - Immediate Available: 261 $29.45000 1 Minimum: 1 Bulk? Textool™ Active SOIC 16 (2 x 8)
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Gold
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Beryllium Copper Through Hole Closed Frame Solder
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Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
232-1287-00-0602J Datasheet 232-1287-00-0602J - 3M 3M5005-ND CONN IC DIP SOCKET ZIF 32POS GLD 120 - Immediate Available: 120 $30.84000 1 Minimum: 1 Bulk? Textool™ Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
210-2599-00-0602 Datasheet 210-2599-00-0602 - 3M 3M5061-ND CONN SOCKET SIP ZIF 10POS GOLD 125 - Immediate Available: 125 $35.73000 1 Minimum: 1 Bulk? Textool™ Active SIP, ZIF (ZIP) 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole
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Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
203-2737-55-1102 Datasheet 203-2737-55-1102 - 3M 3M10849-ND CONN TRANSIST TO-3/TO-66 3POS 120 - Immediate Available: 120 $37.89000 1 Minimum: 1 Bulk? Textool™ Active Transistor, TO-3 and TO-66 3 (Rectangular)
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Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.234" (5.94mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -55°C ~ 150°C
228-7396-55-1902 Datasheet 228-7396-55-1902 - 3M 3M5059-ND CONN SOCKET SOIC 28POS GOLD 164 - Immediate Available: 164 $40.00000 1 Minimum: 1 Bulk? Textool™ Active SOIC 28 (2 x 14)
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Gold
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Beryllium Copper Through Hole Closed Frame Solder
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Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
200-6311-9UN-1900 Datasheet 200-6311-9UN-1900 - 3M 3M5067-ND CONN SOCKET PGA ZIF 121POS GOLD 129 - Immediate Available: 129 $42.77000 1 Minimum: 1 Bulk? Textool™ Active PGA, ZIF (ZIP) 121 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole
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Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
248-4205-01 Datasheet 248-4205-01 - 3M 3M10836-ND CONN SOCKET QFN 48POS GOLD 26 - Immediate Available: 26 $103.69000 1 Minimum: 1 Bulk? Textool™ Active QFN 48 (4 x 12) 0.016" (0.40mm) Gold
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Beryllium Copper Through Hole Closed Frame Solder
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Gold
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Beryllium Copper Polyethersulfone (PES)
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200-6325-9UN-1900 Datasheet 200-6325-9UN-1900 - 3M 3M5073-ND CONN SOCKET PGA ZIF 625POS GOLD 30 - Immediate Available: 30 $111.64000 1 Minimum: 1 Bulk? Textool™ Active PGA, ZIF (ZIP) 625 (25 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole
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Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
4808-3000-CP Datasheet 4808-3000-CP - 3M 3M5461-ND CONN IC DIP SOCKET 8POS TIN 15,776 - Immediate Available: 15,776 $0.51000 1 Minimum: 1 Tube? 4800 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
4814-3004-CP Datasheet 4814-3004-CP - 3M 3M5474-ND CONN IC DIP SOCKET 14POS TIN 13,697 - Immediate Available: 13,697 $0.51000 1 Minimum: 1 Tube? 4800 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
4814-3000-CP Datasheet 4814-3000-CP - 3M 3M5462-ND CONN IC DIP SOCKET 14POS TIN 11,247 - Immediate Available: 11,247 $0.51000 1 Minimum: 1 Tube? 4800 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
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20:23:17 8/20/2019