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Product Overview
Digi-Key Part Number 294-1109-ND
Quantity Available 2,754
Can ship immediately
Manufacturer

Manufacturer Part Number

BDN11-3CB/A01

Description HEATSINK CPU W/ADHESIVE 1.11"SQ
Manufacturer Standard Lead Time 14 Weeks
Detailed Description

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount

Documents & Media
Datasheets BDN Series, Adhesive Heat Sink
A01 Laminating Adhesive
Product Training Modules Low-Cost, High Performance Spartan®-3 Generation
Environmental Information RoHS Cert of Compliance
Design Resources Thermal Interface Materials Explained
Online Catalog BDN Series
Product Attributes Select All
Categories
Manufacturer CTS Thermal Management Products
Series BDN
Part Status Active
Type Top Mount
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method Thermal Tape, Adhesive (Included)
Shape Square, Pin Fins
Length 1.110" (28.19mm)
Width 1.110" (28.19mm)
Diameter -
Height Off Base (Height of Fin) 0.355" (9.02mm)
Power Dissipation @ Temperature Rise -
Thermal Resistance @ Forced Air Flow 7.20°C/W @ 400 LFM
Thermal Resistance @ Natural 20.90°C/W
Material Aluminum
Material Finish Black Anodized
 
Environmental & Export Classifications
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
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Additional Resources
Standard Package ? 1,000
Other Names 294-1109
BDN113CB/A01
BDN113CBA01

01:57:14 8/21/2018

Price & Procurement
 

Quantity
All prices are in USD.
Price Break Unit Price Extended Price
1 2.74000 $2.74
10 2.66500 $26.65
25 2.59320 $64.83
50 2.44940 $122.47
100 2.30520 $230.52
250 2.16116 $540.29
500 2.08912 $1,044.56
1,000 1.87300 $1,873.00
5,000 1.83698 $9,184.91

Submit a request for quotation on quantities greater than those displayed.

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