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Product Overview
Digi-Key Part Number TS391SNL500C-ND
Quantity Available 5
Can ship immediately
Manufacturer

Manufacturer Part Number

TS391SNL500C

Description THERMALLY STABLE SOLDER PASTE NO
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Manufacturer Standard Lead Time 3 Weeks
Detailed Description

Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Cartridge, 17.64 oz (500g)

Documents & Media
Datasheets TS391SNL500C
MSDS Material Safety Datasheet TS391SNL500C MSDS
Featured Product Thermally Stable Solder Paste
Online Catalog CHIP QUIK® Thermally Stable Solder Paste No-Clean
Product Attributes Select All
Categories
Manufacturer Chip Quik Inc.
Series -
Part Status Active
Type Solder Paste
Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter -
Melting Point 423 ~ 428°F (217 ~ 220°C)
Flux Type No-Clean
Wire Gauge -
Process Lead Free
Form Cartridge, 17.64 oz (500g)
Shelf Life 12 Months
Shelf Life Start Date of Manufacture
Shipping Info -
 
Associated Product
Additional Resources
Standard Package ? 1

12:17:39 6/20/2018

Price & Procurement
 

Quantity
All prices are in USD.
Price Break Unit Price Extended Price
1 128.25000 $128.25

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