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79 In Stock
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TS391SNL50

Datasheet
Digi-Key Part Number TS391SNL50-ND
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Manufacturer

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Manufacturer Part Number TS391SNL50
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Description THERMALLY STABLE SOLDER PASTE NO
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Manufacturer Standard Lead Time 3 Weeks
Detailed Description

Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.76 oz (50g)

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Documents & Media
Datasheets TS391SNL50
MSDS Material Safety Datasheet TS391SNL50 MSDS
Featured Product Thermally Stable Solder Paste
HTML Datasheet TS391SNL50
Online Catalog CHIP QUIK® Thermally Stable Solder Paste No-Clean
Product Attributes
Type Description Select All
Categories
Manufacturer Chip Quik Inc.
Series -
Part Status Active
Type Solder Paste
Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter -
Melting Point 423 ~ 428°F (217 ~ 220°C)
Flux Type No-Clean
Wire Gauge -
Process Lead Free
Form Jar, 1.76 oz (50g)
Shelf Life 12 Months
Shelf Life Start Date of Manufacture
Storage/Refrigeration Temperature 68°F ~ 77°F (20°C ~ 25°C)
Shipping Info -
 
Environmental & Export Classifications
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
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Additional Resources
Standard Package 1