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Product Overview
Digi-Key Part Number TS391SNL250-ND
Quantity Available 11
Can ship immediately
Manufacturer

Manufacturer Part Number

TS391SNL250

Description THERMALLY STABLE SOLDER PASTE NO
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Manufacturer Standard Lead Time 3 Weeks
Detailed Description

Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g)

Documents & Media
Datasheets TS391SNL250
MSDS Material Safety Datasheet TS391SNL250 MSDS
Featured Product Thermally Stable Solder Paste
Online Catalog Thermally Stable Solder Paste No-Clean
Product Attributes Select All
Categories
Manufacturer Chip Quik Inc.
Series -
Part Status Active
Type Solder Paste
Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter -
Melting Point 423 ~ 428°F (217 ~ 220°C)
Flux Type No-Clean
Wire Gauge -
Process Lead Free
Form Jar, 8.8 oz (250g)
Shelf Life 12 Months (Date of Manufacture)
Shipping Info -
 
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Additional Resources
Standard Package ? 1

03:39:52 5/26/2018

Price & Procurement
 

Quantity
All prices are in USD.
Price Break Unit Price Extended Price
1 69.95000 $69.95

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