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TS391SNL250 Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g)
Price & Procurement
 

Quantity
All prices are in USD.
Price Break Unit Price Extended Price
1 69.95000 $69.95

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Product Overview
Digi-Key Part Number TS391SNL250-ND
Copy   TS391SNL250-ND
Quantity Available 26
Can ship immediately
Manufacturer

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Manufacturer Part Number

TS391SNL250

Copy   TS391SNL250
Description THERMALLY STABLE SOLDER PASTE NO
Copy   THERMALLY STABLE SOLDER PASTE NO
Manufacturer Standard Lead Time 3 Weeks
Detailed Description

Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g)

Copy   Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5)  Jar, 8.8 oz (250g)
Documents & Media
Datasheets TS391SNL250
MSDS Material Safety Datasheet TS391SNL250 MSDS
Featured Product Thermally Stable Solder Paste
Online Catalog CHIP QUIK® Thermally Stable Solder Paste No-Clean
Product Attributes Select All
Categories
Manufacturer Chip Quik Inc.
Series -
Part Status Active
Type Solder Paste
Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter -
Melting Point 423 ~ 428°F (217 ~ 220°C)
Flux Type No-Clean
Wire Gauge -
Process Lead Free
Form Jar, 8.8 oz (250g)
Shelf Life 12 Months
Shelf Life Start Date of Manufacture
Storage/Refrigeration Temperature 68°F ~ 77°F (20°C ~ 25°C)
Shipping Info -
 
Environmental & Export Classifications
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL) Not Applicable
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Additional Resources
Standard Package ? 1

01:25:50 1/23/2019