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Product Overview
Digi-Key Part Number TS391LT250-ND
Quantity Available 0
Manufacturer

Manufacturer Part Number

TS391LT250

Description THERMALLY STABLE SOLDER PASTE NO
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Manufacturer Standard Lead Time 3 Weeks
Detailed Description

Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 250g (9 oz)

Documents & Media
Datasheets TS391LT250
MSDS Material Safety Datasheet TS391LT250 MSDS
Featured Product Thermally Stable Solder Paste
Online Catalog Thermally Stable Solder Paste No-Clean
Product Attributes Select All
Categories
Manufacturer Chip Quik Inc.
Series -
Part Status Active
Type Solder Paste
Composition Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter -
Melting Point 281°F (138°C)
Flux Type No-Clean
Wire Gauge -
Process Lead Free
Form Jar, 250g (9 oz)
Shelf Life 12 Months (Date of Manufacture)
Shipping Info -
 
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Additional Resources
Standard Package ? 1

11:41:51 2/21/2018

Price & Procurement
 

Quantity
All prices are in USD.
Price Break Unit Price Extended Price
1 84.95000 $84.95

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