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TS391AX250 Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 8.8 oz (250g)
Product Overview
Digi-Key Part Number TS391AX250-ND
Copy   TS391AX250-ND
Quantity Available 16
Can ship immediately
Manufacturer

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Manufacturer Part Number

TS391AX250

Copy   TS391AX250
Description THERMALLY STABLE SOLDER PASTE NO
Copy   THERMALLY STABLE SOLDER PASTE NO
Manufacturer Standard Lead Time 3 Weeks
Detailed Description

Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 8.8 oz (250g)

Copy   Leaded No-Clean Solder Paste Sn63Pb37 (63/37)  Jar, 8.8 oz (250g)
Documents & Media
Datasheets TS391AX250
MSDS Material Safety Datasheet TS391AX250 MSDS
Featured Product Thermally Stable Solder Paste
Online Catalog CHIP QUIK® Thermally Stable Solder Paste No-Clean
Product Attributes Select All
Categories
Manufacturer Chip Quik Inc.
Series -
Part Status Active
Type Solder Paste
Composition Sn63Pb37 (63/37)
Diameter -
Melting Point 361°F (183°C)
Flux Type No-Clean
Wire Gauge -
Process Leaded
Form Jar, 8.8 oz (250g)
Shelf Life 12 Months
Shelf Life Start Date of Manufacture
Shipping Info -
 
Environmental & Export Classifications
Lead Free Status / RoHS Status Contains lead / RoHS non-compliant
Moisture Sensitivity Level (MSL) Not Applicable
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Additional Resources
Standard Package ? 1
Price & Procurement
 

Quantity
All prices are in USD.
Price Break Unit Price Extended Price
1 54.95000 $54.95

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02:42:11 9/25/2018