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SMD291SNL250T3 Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g)
Price & Procurement
 

Quantity
All prices are in USD.
Price Break Unit Price Extended Price
1 54.95000 $54.95

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Product Overview
Digi-Key Part Number SMD291SNL250T3-ND
Copy   SMD291SNL250T3-ND
Quantity Available 3
Can ship immediately
Manufacturer

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Manufacturer Part Number

SMD291SNL250T3

Copy   SMD291SNL250T3
Description SOLDER PASTE SAC305 250G T3
Copy   SOLDER PASTE SAC305 250G T3
Manufacturer Standard Lead Time 3 Weeks
Detailed Description

Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g)

Copy   Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5)  Jar, 8.8 oz (250g)
Documents & Media
Datasheets SMD291SNL250T3
MSDS Material Safety Datasheet SMD291SN
Online Catalog CHIP QUIK® Solder Paste
Product Attributes Select All
Categories
Manufacturer Chip Quik Inc.
Series -
Part Status Active
Type Solder Paste
Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter -
Melting Point 423 ~ 428°F (217 ~ 220°C)
Flux Type No-Clean
Wire Gauge -
Process Lead Free
Form Jar, 8.8 oz (250g)
Shelf Life 6 Months
Shelf Life Start Date of Manufacture
Storage/Refrigeration Temperature 37°F ~ 46°F (3°C ~ 8°C)
Shipping Info Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Weight 0.551 lb (249.93g)
 
Environmental & Export Classifications
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL) Not Applicable
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Additional Resources
Standard Package ? 1

00:42:12 11/18/2018