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6,684 In Stock
Can ship immediately
 

Quantity
All prices are in USD.
Price Break Unit Price Extended Price
1 0.10000 $0.10
10 0.08700 $0.87
50 0.07800 $3.90
100 0.06900 $6.90
500 0.06000 $30.00
1,000 0.04500 $45.00
5,000 0.03900 $195.00

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HF115AC-0.0055-AC-90

Datasheet
Digi-Key Part Number BER169-ND
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Manufacturer

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Manufacturer Part Number HF115AC-0.0055-AC-90
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Description THERM PAD 21.84MMX18.79MM W/ADH
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Manufacturer Standard Lead Time 20 Weeks
Detailed Description

Thermal Pad Gray 21.84mm x 18.79mm Rectangular Adhesive - One Side

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Product Attributes
Type Description Select All
Categories
Manufacturer Bergquist
Series Hi-Flow® 115-AC
Part Status Active
Usage TO-218, TO-220, TO-247
Type Pad, Sheet
Shape Rectangular
Outline 21.84mm x 18.79mm
Thickness 0.0055" (0.140mm)
Material Phase Change Compound
Adhesive Adhesive - One Side
Backing, Carrier Fiberglass
Color Gray
Thermal Resistivity 0.35°C/W
Thermal Conductivity 0.8W/m-K
Shelf Life 6 Months
Shelf Life Start -
Storage/Refrigeration Temperature -
 
Environmental & Export Classifications
Lead Free Status / RoHS Status Lead free / ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
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Additional Resources
Standard Package 100
Other Names BER169
BG428814
HF115AC-90
HF115AC00055AC90
HF115TAAC-90