Add To Favorites
Product Overview
Digi-Key Part Number BER167-ND
Quantity Available 5,153
Can ship immediately
Manufacturer

Manufacturer Part Number

HF115AC-0.0055-AC-54

Description THERM PAD 19.05MMX12.7MM W/ADH
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 2 Weeks
Detailed Description

Thermal Pad Gray 19.05mm x 12.70mm Rectangle Adhesive - One Side

Documents & Media
Datasheets Hi-Flow 115-AC
Other Related Documents Sil-Pad Metric Configurations
Environmental Information Hi-Flow 115-AC Material Report
Design Resources Thermal Interface Materials Explained
PCN Packaging Henkel/Berquist Revised Brands 10/May/2016
Online Catalog Hi-Flow® 115-AC Series
Product Attributes Select All
Categories
Manufacturer Bergquist
Series Hi-Flow® 115-AC
Part Status Active
Usage TO-220
Type Pad, Sheet
Shape Rectangle
Outline 19.05mm x 12.70mm
Thickness 0.0055" (0.140mm)
Material Phase Change Compound
Adhesive Adhesive - One Side
Backing, Carrier Fiberglass
Color Gray
Thermal Resistivity 0.35°C/W
Thermal Conductivity 0.8 W/m-K
 
You May Also Be Interested In
Additional Resources
Standard Package ? 100
Other Names BER167
BG426641
HF115AC-54
HF115AC00055AC54
HF115TAAC-54

15:10:05 5/22/2018

Price & Procurement
 

Quantity
All prices are in USD.
Price Break Unit Price Extended Price
1 0.10000 $0.10
10 0.08700 $0.87
50 0.07800 $3.90
100 0.06900 $6.90
500 0.06000 $30.00
1,000 0.04500 $45.00
5,000 0.03900 $195.00

Submit a request for quotation on quantities greater than those displayed.

Send Feedback