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SMD291AX250T3 Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 8.8 oz (250g)
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96 In Stock
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1 41.95000 $41.95

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SMD291AX250T3

Datasheet
Digi-Key Part Number SMD291AX250T3-ND
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Manufacturer

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Manufacturer Part Number SMD291AX250T3
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Description SOLDER PASTE SN63/PB37 250G
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Manufacturer Standard Lead Time 4 Weeks
Detailed Description

Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 8.8 oz (250g)

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Documents & Media
Datasheets SMD291AX250T3
MSDS Material Safety Datasheet SMD291AX, SMD4300AX, TS391AX
HTML Datasheet SMD291AX250T3
Online Catalog CHIP QUIK® Solder Paste
Product Attributes
Type Description Select All
Categories
Manufacturer Chip Quik Inc.
Series -
Packaging Jar
Part Status Active
Type Solder Paste
Composition Sn63Pb37 (63/37)
Diameter -
Melting Point 361°F (183°C)
Flux Type No-Clean
Wire Gauge -
Process Leaded
Form Jar, 8.8 oz (250g)
Shelf Life 12 Months, 6 Months
Shelf Life Start Date of Manufacture
Storage/Refrigeration Temperature 37°F ~ 46°F (3°C ~ 8°C)
Digi-Key Storage Refrigerated
Shipping Info Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Weight 0.551 lb (249.93 g)
 
Environmental & Export Classifications
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) Not Applicable
California Prop 65
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Additional Resources
Standard Package 1