PMD4003K Datasheet by NXP USA Inc.

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founded by Phlhps
1. Product profile
1.1 General description
NPN low VCEsat Breakthrough In Small Signal (BISS) transistor and high-speed
switching diode to protect the base-emitter junction in reverse direction in a SOT346
(SC-59A/TO-236) small Surface-Mounted Device (SMD) plastic package.
1.2 Features
nLow VCEsat (BISS) transistor and high-speed switching diode as driver
nHigh-speed switching diode to protect the base-emitter junction
nApplication-optimized pinout
nInternal connections to minimize layout effort
nSpace-saving solution
nReduces component count
1.3 Applications
nPower MOSFET driver
1.4 Quick reference data
[1] Pulse test: tp300 µs; δ≤0.02.
PMD4003K
MOSFET driver
Rev. 01 — 3 November 2006 Product data sheet
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
NPN transistor
VCEO collector-emitter voltage open base - - 40 V
ICcollector current - - 1 A
ICM peak collector current single pulse;
tp1ms --2A
Diode
IFforward current - - 0.2 A
VFforward voltage IF=200 mA [1] --1.1 V
film
PMD4003K_1 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 3 November 2006 2 of 15
NXP Semiconductors PMD4003K
MOSFET driver
2. Pinning information
3. Ordering information
4. Marking
Table 2. Pinning
Pin Description Simplified outline Symbol
1 base TR1, cathode D1
2 emitter TR1, anode D1
3 collector TR1
12
3
006aaa655
D1
TR1
12
3
Table 3. Ordering information
Type number Package
Name Description Version
PMD4003K SC-59A plastic surface-mounted package; 3 leads SOT346
Table 4. Marking codes
Type number Marking code
PMD4003K D3
PMD4003K_1 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 3 November 2006 3 of 15
NXP Semiconductors PMD4003K
MOSFET driver
5. Limiting values
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
[3] Device mounted on a ceramic PCB, Al2O3, standard footprint.
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
NPN transistor
VCBO collector-base voltage open emitter - 40 V
VCEO collector-emitter voltage open base - 40 V
ICcollector current - 1 A
ICM peak collector current single pulse;
tp1ms -2A
IBbase current - 0.3 A
IBM peak base current single pulse;
tp1ms -1A
Ptot total power dissipation Tamb 25 °C[1] - 260 mW
[2] - 365 mW
[3] - 485 mW
Diode
IFforward current - 0.2 A
IFRM repetitive peak forward
current tp1 ms; δ= 0.25 - 0.6 A
IFSM non-repetitive peak forward
current square wave
tp1µs-9A
tp100 µs-3A
tp10 ms - 1.7 A
Device
Tjjunction temperature - 150 °C
Tamb ambient temperature 65 +150 °C
Tstg storage temperature 65 +150 °C
PMD4003K_1 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 3 November 2006 4 of 15
NXP Semiconductors PMD4003K
MOSFET driver
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
[3] Device mounted on a ceramic PCB, Al2O3, standard footprint.
(1) Ceramic PCB, Al2O3, standard footprint
(2) FR4 PCB, mounting pad for collector 1 cm2
(3) FR4 PCB, standard footprint
Fig 1. Power derating curves
006aaa880
Tamb (°C)
75 17512525 7525
200
400
600
Ptot
(mW)
0
(1)
(2)
(3)
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
NPN transistor
Rth(j-a) thermal resistance from
junction to ambient in free air [1] - - 480 K/W
[2] - - 340 K/W
[3] - - 255 K/W
PMD4003K_1 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 3 November 2006 5 of 15
NXP Semiconductors PMD4003K
MOSFET driver
FR4 PCB, standard footprint
Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
FR4 PCB, mounting pad for collector 1 cm2
Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
006aaa881
10510102
104102
101
tp (s)
103103
1
102
10
103
Zth(j-a)
(K/W)
1
duty cycle =
0.75
0.33
0.05
0.02
0.01
0.5
0.2
0.1
1
0
006aaa882
10510102
104102
101
tp (s)
103103
1
102
10
103
Zth(j-a)
(K/W)
1
duty cycle =
0.75
0.33
0.05
0.02
0.01
0.5
0.2
0.1
1
0
PMD4003K_1 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 3 November 2006 6 of 15
NXP Semiconductors PMD4003K
MOSFET driver
Ceramic PCB, Al2O3, standard footprint
Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
006aaa883
10510102
104102
101
tp (s)
103103
1
102
10
103
Zth(j-a)
(K/W)
1
duty cycle =
0.75
0.33
0.05
0.02
0.01
0.5
0.2
0.1
1
0
PMD4003K_1 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 3 November 2006 7 of 15
NXP Semiconductors PMD4003K
MOSFET driver
7. Characteristics
[1] Pulse test: tp300 µs; δ≤0.02.
Table 7. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
NPN transistor
ICBO collector-base cut-off
current VCB =40V; I
E= 0 A - - 100 nA
VCB =40V; I
E=0A;
Tj= 150 °C--50µA
hFE DC current gain VCE =5V; I
C= 1 mA 300 450 -
VCE =5V; I
C= 200 mA 300 450 830
VCE =5V; I
C= 500 mA [1] 300 400 -
VCE =5V; I
C=1A [1] 200 340 -
VCE =5V; I
C=2A [1] 75 120 -
VCEsat collector-emitter
saturation voltage IC= 100 mA; IB= 5 mA - 30 80 mV
IC= 500 mA; IB=50mA [1] - 100 120 mV
IC= 1 A; IB= 100 mA [1] - 180 230 mV
IC= 2 A; IB= 200 mA [1] - 360 440 mV
VBEsat base-emitter saturation
voltage IC= 100 mA; IB= 5 mA - 0.75 0.9 V
IC= 500 mA; IB=50mA [1] - 0.9 1.1 V
IC= 1 A; IB= 100 mA [1] -12V
IC= 2 A; IB= 200 mA [1] - 1.1 1.3 V
VBE base-emitter voltage VCE =5V; I
C= 500 mA [1] - 760 - mV
Diode
VFforward voltage IF=200 mA [1] --1.1 V
Device
tddelay time IC= 0.5 A; IB=25mA - 5 - ns
trrise time - 27 - ns
ton turn-on time - 32 - ns
tsstorage time - 1520 - ns
tffall time - 184 - ns
toff turn-off time - 1704 - ns
Device with optional capacitor C1
tddelay time IC= 0.5 A; IB=25mA;
C1 = 2.2 nF -2-ns
trrise time - 2 - ns
ton turn-on time - 4 - ns
tsstorage time - 150 - ns
tffall time - 154 - ns
toff turn-off time - 304 - ns
PMD4003K_1 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 3 November 2006 8 of 15
NXP Semiconductors PMD4003K
MOSFET driver
VCE =5V
(1) Tamb =55 °C
(2) Tamb =25°C
(3) Tamb = 100 °C
(4) Tamb = 125 °C
(5) Tamb = 150 °C
Tamb =25°C
Fig 5. DC current gain as a function of collector
current; typical values Fig 6. Collector current as a function of
collector-emitter voltage; typical values
VCE =5V
(1) Tamb =55 °C
(2) Tamb =25°C
(3) Tamb = 100 °C
IC/IB=20
(1) Tamb =55 °C
(2) Tamb =25°C
(3) Tamb = 100 °C
Fig 7. Base-emitter voltage as a function of collector
current; typical values Fig 8. Base-emitter saturation voltage as a function of
collector current; typical values
006aaa884
400
200
600
800
hFE
0
IC (mA)
101104
103
110
2
10
(2)
(1)
(3) (4) (5)
006aaa885
VCE (V)
054231
0.8
1.6
2.4
IC
(A)
0
IB (mA) = 17
15.3
13.6
11.9
10.2
8.5
6.8
5.1
3.4
1.7
006aaa886
0.6
0.4
0.8
1.0
VBE
(V)
0.2
IC (mA)
101104
103
110
2
10
(1)
(2)
(3)
006aaa887
0.6
0.8
0.4
1.0
1.2
VBEsat
(V)
0.2
IC (mA)
101104
103
110
2
10
(1)
(2)
(3)
PMD4003K_1 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 3 November 2006 9 of 15
NXP Semiconductors PMD4003K
MOSFET driver
8. Test information
IC/IB=20
(1) Tamb = 100 °C
(2) Tamb =25°C
(3) Tamb =55 °C
Tamb =25°C
(1) IC/IB= 100
(2) IC/IB=50
(3) IC/IB=10
Fig 9. Collector-emitter saturation voltage as a
function of collector current; typical values Fig 10. Collector-emitter saturation voltage as a
function of collector current; typical values
006aaa888
IC (mA)
101104
103
110
2
10
101
1
VCEsat
(V)
102
(1)
(2)
(3)
006aaa889
101
102
1
VCEsat
(V)
103
IC (mA)
101104
103
110
2
10
(1)
(2)
(3)
IC= 0.5 A; IB= 25 mA; R1 = 68 ; R2 = 300 ; RC=18; C1 = 2.2 nF
Fig 11. Test circuit for switching times
006aaa869
3 k
DUT
VCC
VI
VO
D1
R2
R1
C1
TR1
RC
oscilloscope 450
(probe) (probe) oscilloscope
The indicated -xxx are the last three digits of the 12NC ordering code-.7 fi’i
PMD4003K_1 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 3 November 2006 10 of 15
NXP Semiconductors PMD4003K
MOSFET driver
9. Package outline
10. Packing information
[1] For further information and the availability of packing methods, see Section 15.
Fig 12. Package outline SOT346 (SC-59A/TO-236)
04-11-11Dimensions in mm
3.0
2.5 1.7
1.3
0.26
0.10
12
3
1.9
0.50
0.35
1.3
1.0
3.1
2.7
0.6
0.2
Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
3000 10000
PMD4003K SOT346 4 mm pitch, 8 mm tape and reel -115 -135
: // 4 , wwwwwwwwww , wwwwwwwwww
PMD4003K_1 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 3 November 2006 11 of 15
NXP Semiconductors PMD4003K
MOSFET driver
11. Soldering
Fig 13. Reflow soldering footprint
Fig 14. Wave soldering footprint
solder lands
solder paste
solder resist
occupied area Dimensions in mm
sot346
1.00
0.70
(3x)
1.55
2.60
3.40
0.95
3.15
3
12
1.20
0.60 (3x)
0.70 (3x)
3.30
0.95
2.90
sot346
4.605.20
2.80
4.70
12
3
1.20
3.40
1.20 (2x)
preferred transport direction during soldering
solder lands
solder resist
occupied area
Dimensions in mm
PMD4003K_1 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 3 November 2006 12 of 15
NXP Semiconductors PMD4003K
MOSFET driver
12. Mounting
PCB thickness:
FR4 PCB = 1.6 mm
ceramic PCB = 0.635 mm
PCB thickness = 1.6 mm
Fig 15. FR4 PCB, standard footprint;
ceramic PCB, Al2O3, standard
footprint
Fig 16. FR4 PCB, mounting pad for
collector 1 cm2
006aaa674
40
0.8
0.5
0.7
43.4
Dimensions in mm
006aaa675
40
0.8
0.5
0.7
10
43.4
10
Dimensions in mm
PMD4003K_1 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 3 November 2006 13 of 15
NXP Semiconductors PMD4003K
MOSFET driver
13. Revision history
Table 9. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PMD4003K_1 20061103 Product data sheet - -
PMD4003K_1 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 3 November 2006 14 of 15
NXP Semiconductors PMD4003K
MOSFET driver
14. Legal information
14.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
14.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
15. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
founded by PHILIPS
NXP Semiconductors PMD4003K
MOSFET driver
© NXP B.V. 2006. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 3 November 2006
Document identifier: PMD4003K_1
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
16. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 7
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 9
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
10 Packing information. . . . . . . . . . . . . . . . . . . . . 10
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
12 Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
13 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 13
14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14
14.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14
14.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
14.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
14.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
15 Contact information. . . . . . . . . . . . . . . . . . . . . 14
16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

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