PCF8563 Datasheet by NXP USA Inc.

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1. General description
The PCF8563 is a CMOS1 Real-Time Clock (RTC) and calendar optimized for low power
consumption. A programmable clock output, interrupt output, and voltage-low detector are
also provided. All addresses and data are transferred serially via a two-line bidirectional
I2C-bus. Maximum bus speed is 400 kbit/s. The register address is incremented
automatically after each written or read data byte.
2. Features and benefits
Provides year, month, day, weekday, hours, minutes, and seconds based on a
32.768 kHz quartz crystal
Century flag
Clock operating voltage: 1.0 V to 5.5 V at room temperature
Low backup current; typical 0.25 Aat V
DD = 3.0 V and Tamb =25C
400 kHz two-wire I2C-bus interface (at VDD = 1.8 V to 5.5 V)
Programmable clock output for peripheral devices (32.768 kHz, 1.024 kHz, 32 Hz, and
1Hz)
Alarm and timer functions
Integrated oscillator capacitor
Internal Power-On Reset (POR)
I2C-bus slave address: read A3h and write A2h
Open-drain interrupt pin
3. Applications
Mobile telephones
Portable instruments
Electronic metering
Battery powered products
PCF8563
Real-time clock/calendar
Rev. 11 — 26 October 2015 Product data sheet
1. The definition of the abbreviations and acronyms used in this data sheet can be found in Section 18.
STS/A,
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Real-time clock/calendar
4. Ordering information
[1] Not recommended for new designs. Replacement part is PCF8563T/5.
[2] Not recommended for new designs. Replacement part is PCF8563TS/5.
5. Marking
Table 1. Ordering information
Type number Package
Name Description Version
PCF8563BS/4 HVSON10 plastic thermal enhanced very thin small outline
package; no leads; 10 terminals;
body 3 30.85 mm
SOT650-1
PCF8563T/5 SO8 plastic small outline package; 8 leads;
body width 3.9 mm SOT96-1
PCF8563T/F4[1] SO8 plastic small outline package; 8 leads;
body width 3.9 mm SOT96-1
PCF8563TS/4[2] TSSOP8 plastic thin shrink small outline package; 8 leads;
body width 3 mm SOT505-1
PCF8563TS/5 TSSOP8 plastic thin shrink small outline package; 8 leads;
body width 3 mm SOT505-1
Table 2. Marking codes
Type number Marking code
PCF8563BS/4 8563S
PCF8563T/5 PCF8563
PCF8563T/F4 8563T
PCF8563TS/4 8563
PCF8563TS/5 P8563
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Real-time clock/calendar
6. Block diagram
(1) COSCO; values see Table 30.
Fig 1. Block diagram of PCF8563
001aah658
PCF8563
OSCILLATOR
32.768 kHz DIVIDER CLOCK OUT
INTERRUPT
CLKOUT
INT
MONITOR
POWER ON
RESET
WATCH
DOG
I2C-BUS
INTERFACE
OSCI
SCL
SDA
OSCO
VDD
VSS
TIMER FUNCTION
TIMER_CONTROL0E
TIMER0F
CONTROL
CONTROL_STATUS_100
CONTROL_STATUS_201
CLKOUT_CONTROL0D
TIME
VL_SECONDS02
MINUTES03
HOURS04
DAYS05
ALARM FUNCTION
MINUTE_ALARM09
HOUR_ALARM0A
DAY_ALARM0B
WEEKDAY_ALARM0C
WEEKDAYS06
CENTURY_MONTHS07
YEARS08
(1)
jjjj CECE CCCCC 33333 C 3333 CECE C
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Real-time clock/calendar
7. Pinning information
7.1 Pinning
For mechanical details, see Figure 29. Top view. For mechanical details, see
Figure 30.
Fig 2. Pin configuration for HVSON10
(PCF8563BS) Fig 3. Pin configuration for SO8
(PCF8563T)
Top view. For mechanical details, see Figure 31.
Fig 4. Pin configuration for TSSOP8 (PCF8563TS)
001aaf981
PCF8563BS
SDA
INT
V
SS
SCL
n.c. CLKOUT
OSCO V
DD
OSCI n.c.
Transparent top view
56
4 7
3 8
2 9
1 10
terminal 1
index area
PCF8563T
OSCI V
DD
OSCO CLKOUT
INT SCL
V
SS
SDA
001aaf975
1
2
3
4
6
5
8
7
PCF8563TS
OSCI VDD
OSCO CLKOUT
INT SCL
VSS SDA
001aaf976
1
2
3
4
6
5
8
7
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Real-time clock/calendar
7.2 Pin description
[1] The die paddle (exposed pad) is connected to VSS through high ohmic (non-conductive) silicon attach and
should be electrically isolated. It is good engineering practice to solder the exposed pad to an electrically
isolated PCB copper pad for better heat transfer but it is not required as the RTC doesn’t consume much
power. In no case should traces be run under the package exposed pad.
Table 3. Pin description
Symbol Pin Description
SO8, TSSOP8 HVSON10
OSCI 1 1 oscillator input
OSCO 2 2 oscillator output
INT 3 4 interrupt output (open-drain; active LOW)
VSS 45
[1] ground
SDA 5 6 serial data input and output
SCL 6 7 serial clock input
CLKOUT 7 8 clock output, open-drain
VDD 8 9 supply voltage
n.c. - 3, 10 not connected; do not connect and do not
use as feed through
Table 27
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Real-time clock/calendar
8. Functional description
The PCF8563 contains sixteen 8-bit registers with an auto-incrementing register address,
an on-chip 32.768 kHz oscillator with one integrated capacitor, a frequency divider which
provides the source clock for the Real-Time Clock (RTC) and calender, a programmable
clock output, a timer, an alarm, a voltage-low detector, and a 400 kHz I2C-bus interface.
All 16 registers are designed as addressable 8-bit parallel registers although not all bits
are implemented. The first two registers (memory address 00h and 01h) are used as
control and/or status registers. The memory addresses 02h through 08h are used as
counters for the clock function (seconds up to years counters). Address locations 09h
through 0Ch contain alarm registers which define the conditions for an alarm.
Address 0Dh controls the CLKOUT output frequency. 0Eh and 0Fh are the Timer_control
and Timer registers, respectively.
The Seconds, Minutes, Hours, Days, Months, Years as well as the Minute_alarm,
Hour_alarm, and Day_alarm registers are all coded in Binary Coded Decimal (BCD)
format.
When one of the RTC registers is written or read, the contents of all time counters are
frozen. Therefore, faulty writing or reading of the clock and calendar during a carry
condition is prevented.
8.1 CLKOUT output
A programmable square wave is available at the CLKOUT pin. Operation is controlled by
the register CLKOUT_control at address 0Dh. Frequencies of 32.768 kHz (default),
1.024 kHz, 32 Hz, and 1 Hz can be generated for use as a system clock, microcontroller
clock, input to a charge pump, or for calibration of the oscillator. CLKOUT is an open-drain
output and enabled at power-on. If disabled it becomes high-impedance.
8.2 Register organization
Table 4. Formatted registers overview
Bit positions labelled as x are not relevant. Bit positions labelled with N should always be written with logic 0; if read they
could be either logic 0 or logic 1. After reset, all registers are set according to Table 27.
Address Register name Bit
76543210
Control and status registers
00h Control_status_1 TEST1 N STOP N TESTC N N N
01h Control_status_2 N N N TI_TP AF TF AIE TIE
Time and date registers
02h VL_seconds VL SECONDS (0 to 59)
03h Minutes x MINUTES (0 to 59)
04h Hours x x HOURS (0 to 23)
05h Days x x DAYS (1 to 31)
06hWeekdaysxxxxxWEEKDAYS (0 to 6)
07h Century_months C x x MONTHS (1 to 12)
08h Years YEARS (0 to 99)
Table 27 07 Semion 8.9 0, 0, Semion 8.10 0, w 1 7 00, 000, 0, Tab‘e 7 Section 8.8
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Real-time clock/calendar
8.3 Control registers
8.3.1 Register Control_status_1
[1] Default value.
[2] Bits labeled as N should always be written with logic 0.
8.3.2 Register Control_status_2
Alarm registers
09h Minute_alarm AE_M MINUTE_ALARM (0 to 59)
0Ah Hour_alarm AE_H x HOUR_ALARM (0 to 23)
0Bh Day_alarm AE_D x DAY_ALARM (1 to 31)
0ChWeekday_alarmAE_WxxxxWEEKDAY_ALARM (0 to 6)
CLKOUT control register
0DhCLKOUT_controlFExxxxxFD[1:0]
Timer registers
0EhTimer_controlTExxxxxTD[1:0]
0Fh Timer TIMER[7:0]
Table 4. Formatted registers overview …continued
Bit positions labelled as x are not relevant. Bit positions labelled with N should always be written with logic 0; if read they
could be either logic 0 or logic 1. After reset, all registers are set according to Table 27.
Address Register name Bit
76543210
Table 5. Control_status_1 - control and status register 1 (address 00h) bit description
Bit Symbol Value Description Reference
7 TEST1 0[1] normal mode
must be set to logic 0 during normal operations
Section 8.9
1 EXT_CLK test mode
6N 0
[2] unused
5STOP0
[1] RTC source clock runs Section 8.10
1 all RTC divider chain flip-flops are asynchronously set to logic 0; the RTC
clock is stopped (CLKOUT at 32.768 kHz is still available)
4N 0
[2] unused
3 TESTC 0 Power-On Reset (POR) override facility is disabled; set to logic 0 for
normal operation Section 8.11.1
1[1] Power-On Reset (POR) override may be enabled
2to0 N 000
[2] unused
Table 6. Control_status_2 - control and status register 2 (address 01h) bit description
Bit Symbol Value Description Reference
7to5 N 000
[1] unused
4TI_TP0
[2] INT is active when TF is active (subject to the status of TIE) Section 8.3.2.1
and
Section 8.8
1INT pulses active according to Table 7 (subject to the status of TIE);
Remark: note that if AF and AIE are active then INT will be
permanently active
Section 8.3.2.1
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Real-time clock/calendar
[1] Bits labeled as N should always be written with logic 0.
[2] Default value.
8.3.2.1 Interrupt output
Bits TF and AF: When an alarm occurs, AF is set to logic 1. Similarly, at the end of a
timer countdown, TF is set to logic 1. These bits maintain their value until overwritten
using the interface. If both timer and alarm interrupts are required in the application, the
source of the interrupt can be determined by reading these bits. To prevent one flag being
overwritten while clearing another, a logic AND is performed during a write access.
Bits TIE and AIE: These bits activate or deactivate the generation of an interrupt when
TF or AF is asserted, respectively. The interrupt is the logical OR of these two conditions
when both AIE and TIE are set.
3AF 0
[2] read: alarm flag inactive Section 8.3.2.1
write: alarm flag is cleared
1 read: alarm flag active
write: alarm flag remains unchanged
2TF 0
[2] read: timer flag inactive
write: timer flag is cleared
1 read: timer flag active
write: timer flag remains unchanged
1AIE 0
[2] alarm interrupt disabled
1 alarm interrupt enabled
0TIE 0
[2] timer interrupt disabled
1 timer interrupt enabled
Table 6. Control_status_2 - control and status register 2 (address 01h) bit description …continued
Bit Symbol Value Description Reference
When bits TIE and AIE are disabled, pin INT will remain high-impedance.
Fig 5. Interrupt scheme
013aaa087
TE
COUNTDOWN COUNTER
AF: ALARM
FLAG
CLEAR
SET
to interface:
read AF
0
1
TF: TIMER
CLEAR
SET
PULSE
GENERATOR 2
CLEAR
TRIGGER
TIE
INT
from interface:
clear TF
from interface:
clear AF
set alarm
flag AF
to interface:
read TF
TI_TP
AIE
e.g. AIE
0
1
Table 7 9 Table 9
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Countdown timer interrupts: The pulse generator for the countdown timer interrupt uses
an internal clock and is dependent on the selected source clock for the countdown timer
and on the countdown value n. As a consequence, the width of the interrupt pulse varies
(see Table 7).
[1] TF and INT become active simultaneously.
[2] n = loaded countdown value. Timer stops when n = 0.
8.4 Time and date registers
The majority of the registers are coded in the BCD format to simplify application use.
8.4.1 Register VL_seconds
[1] Start-up value.
Table 7. INT operation (bit TI_TP = 1)[1]
Source clock (Hz) INT period (s)
n=1
[2] n>1
[2]
4096 18192 14096
64 1128 164
1164 164
160 164 164
Table 8. VL_seconds - seconds and clock integrity status register (address 02h) bit
description
Bit Symbol Value Place value Description
7 VL 0 - clock integrity is guaranteed
1[1] - integrity of the clock information is not guaranteed
6 to 4 SECONDS 0 to 5 ten’s place actual seconds coded in BCD format, see Table 9
3 to 0 0 to 9 unit place
Table 9. Seconds coded in BCD format
Seconds value
(decimal) Upper-digit (tens place) Digit (unit place)
Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
00 0000000
01 0000001
02 0000010
: :::::::
09 0001001
10 0010000
: :::::::
58 1011000
59 1011001
e Figure 6 perm 0! battery operauon
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Real-time clock/calendar
8.4.1.1 Voltage-low detector and clock monitor
The PCF8563 has an on-chip voltage-low detector (see Figure 6). When VDD drops below
Vlow, bit VL in the VL_seconds register is set to indicate that the integrity of the clock
information is no longer guaranteed. The VL flag can only be cleared by using the
interface.
The VL flag is intended to detect the situation when VDD is decreasing slowly, for example
under battery operation. Should the oscillator stop or VDD reach Vlow before power is
re-asserted, then the VL flag is set. This will indicate that the time may be corrupted.
8.4.2 Register Minutes
8.4.3 Register Hours
8.4.4 Register Days
[1] The PCF8563 compensates for leap years by adding a 29th day to February if the year counter contains a
value which is exactly divisible by 4, including the year 00.
Fig 6. Voltage-low detection
VL set
normal power
operation
period of battery
operation
t
VDD
Vlow
mgr887
Table 10. Minutes - minutes register (address 03h) bit description
Bit Symbol Value Place value Description
7 - - - unused
6 to 4 MINUTES 0 to 5 ten’s place actual minutes coded in BCD format
3 to 0 0 to 9 unit place
Table 11. Hours - hours register (address 04h) bit description
Bit Symbol Value Place value Description
7 to 6 - - - unused
5 to 4 HOURS 0 to 2 ten’s place actual hours coded in BCD format
3to0 0to9 unit place
Table 12. Days - days register (address 05h) bit description
Bit Symbol Value Place value Description
7 to 6 - - - unused
5to4 DAYS
[1] 0 to 3 ten’s place actual day coded in BCD format
3to0 0to9 unit place
Table 14 see Table 16
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Real-time clock/calendar
8.4.5 Register Weekdays
[1] Definition may be re-assigned by the user.
8.4.6 Register Century_months
[1] This bit may be re-assigned by the user.
[2] This bit is toggled when the register Years overflows from 99 to 00.
Table 13. Weekdays - weekdays register (address 06h) bit description
Bit Symbol Value Description
7 to 3 - - unused
2 to 0 WEEKDAYS 0 to 6 actual weekday values, see Table 14
Table 14. Weekday assignments
Day[1] Bit
210
Sunday 0 0 0
Monday 0 0 1
Tuesday 0 1 0
Wednesday 0 1 1
Thursday 1 0 0
Friday 1 0 1
Saturday110
Table 15. Century_months - century flag and months register (address 07h) bit description
Bit Symbol Value Place value Description
7C
[1] 0[2] - indicates the century is x
1 - indicates the century is x + 1
6 to 5 - - - unused
4 MONTHS 0 to 1 ten’s place actual month coded in BCD format, see Table 16
3 to 0 0 to 9 unit place
Table 16. Month assignments in BCD format
Month Upper-digit
(ten’s place) Digit (unit place)
Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
January 0 0 0 0 1
February 0 0 0 1 0
March 0 0 0 1 1
April00100
May00101
June00110
July00111
August01000
September 0 1 0 0 1
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Real-time clock/calendar
8.4.7 Register Years
[1] When the register Years overflows from 99 to 00, the century bit C in the register Century_months is
toggled.
8.5 Setting and reading the time
Figure 7 shows the data flow and data dependencies starting from the 1 Hz clock tick.
During read/write operations, the time counting circuits (memory locations 02h through
08h) are blocked.
This prevents
Faulty reading of the clock and calendar during a carry condition
Incrementing the time registers, during the read cycle
October10000
November10001
December10010
Table 16. Month assignments …continuedin BCD format
Month Upper-digit
(ten’s place) Digit (unit place)
Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Table 17. Years - years register (08h) bit description
Bit Symbol Value Place value Description
7 to 4 YEARS 0 to 9 ten’s place actual year coded in BCD format[1]
3to0 0to9 unit place
Fig 7. Data flow for the time function
013aaa092
1 Hz tick
WEEKDAY
SECONDS
MINUTES
HOURS
DAYS
LEAP YEAR
CALCULATION
MONTHS
YEARS
C
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Real-time clock/calendar
After this read/write access is completed, the time circuit is released again and any
pending request to increment the time counters that occurred during the read access is
serviced. A maximum of 1 request can be stored; therefore, all accesses must be
completed within 1 second (see Figure 8).
As a consequence of this method, it is very important to make a read or write access in
one go, that is, setting or reading seconds through to years should be made in one single
access. Failing to comply with this method could result in the time becoming corrupted.
As an example, if the time (seconds through to hours) is set in one access and then in a
second access the date is set, it is possible that the time may increment between the two
accesses. A similar problem exists when reading. A roll over may occur between reads
thus giving the minutes from one moment and the hours from the next.
Recommended method for reading the time:
1. Send a START condition and the slave address for write (A2h).
2. Set the address pointer to 2 (VL_seconds) by sending 02h.
3. Send a RESTART condition or STOP followed by START.
4. Send the slave address for read (A3h).
5. Read VL_seconds.
6. Read Minutes.
7. Read Hours.
8. Read Days.
9. Read Weekdays.
10. Read Century_months.
11. Read Years.
12. Send a STOP condition.
8.6 Alarm registers
8.6.1 Register Minute_alarm
Fig 8. Access time for read/write operations
Table 18. Minute_alarm - minute alarm register (address 09h) bit description
Bit Symbol Value Place value Description
7 AE_M 0 - minute alarm is enabled
1[1] - minute alarm is disabled
6 to 4 MINUTE_ALARM 0 to 5 ten’s place minute alarm information coded in BCD
format
3 to 0 0 to 9 unit place
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Real-time clock/calendar
[1] Default value.
8.6.2 Register Hour_alarm
[1] Default value.
8.6.3 Register Day_alarm
[1] Default value.
8.6.4 Register Weekday_alarm
[1] Default value.
8.6.5 Alarm flag
By clearing the alarm enable bit (AE_x) of one or more of the alarm registers, the
corresponding alarm condition(s) are active. When an alarm occurs, AF is set to logic 1.
The asserted AF can be used to generate an interrupt (INT). The AF is cleared using the
interface.
The registers at addresses 09h through 0Ch contain alarm information. When one or
more of these registers is loaded with minute, hour, day or weekday, and its
corresponding AE_x is logic 0, then that information is compared with the current minute,
hour, day, and weekday. When all enabled comparisons first match, the alarm flag (AF in
register Control_2) is set to logic 1.
Table 19. Hour_alarm - hour alarm register (address 0Ah) bit description
Bit Symbol Value Place value Description
7 AE_H 0 - hour alarm is enabled
1[1] - hour alarm is disabled
6 - - - unused
5 to 4 HOUR_ALARM 0 to 2 ten’s place hour alarm information coded in BCD
format
3 to 0 0 to 9 unit place
Table 20. Day_alarm - day alarm register (address 0Bh) bit description
Bit Symbol Value Place value Description
7 AE_D 0 - day alarm is enabled
1[1] - day alarm is disabled
6 - - - unused
5 to 4 DAY_ALARM 0 to 3 ten’s place day alarm information coded in BCD
format
3 to 0 0 to 9 unit place
Table 21. Weekday_alarm - weekday alarm register (address 0Ch) bit description
Bit Symbol Value Description
7 AE_W 0 weekday alarm is enabled
1[1] weekday alarm is disabled
6 to 3 - - unused
2 to 0 WEEKDAY_ALARM 0 to 6 weekday alarm information
E;
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Real-time clock/calendar
The generation of interrupts from the alarm function is controlled via bit AIE. If bit AIE is
enabled, the INT pin follows the condition of bit AF. AF will remain set until cleared by the
interface. Once AF has been cleared, it will only be set again when the time increments to
match the alarm condition once more. Alarm registers which have their AE_x bit at logic 1
are ignored.
8.7 Register CLKOUT_control and clock output
Frequencies of 32.768 kHz (default), 1.024 kHz, 32 Hz, and 1 Hz can be generated for
use as a system clock, microcontroller clock, input to a charge pump, or for calibration of
the oscillator.
[1] Default value.
(1) Only when all enabled alarm settings are matching.
It’s only on increment to a matched case that the alarm flag is set, see Section 8.6.5.
Fig 9. Alarm function block diagram
013aaa088
WEEKDAY ALARM
AEN_W
WEEKDAY TIME
=
DAY ALARM
AEN_D
DAY TIME
=
HOUR ALARM
AEN_H
HOUR TIME
=
MINUTE ALARM
AEN_M
MINUTE TIME
=
check now signal
set alarm flag AF (1)
AEN_M = 1
1
0
example
Table 22. CLKOUT_control - CLKOUT control register (address 0Dh) bit description
Bit Symbol Value Description
7 FE 0 the CLKOUT output is inhibited and CLKOUT output is
set high-impedance
1[1] the CLKOUT output is activated
6 to 2 - - unused
1 to 0 FD[1:0] frequency output at pin CLKOUT
00[1] 32.768 kHz
01 1.024 kHz
10 32 Hz
11 1 Hz
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Real-time clock/calendar
8.8 Timer function
The 8-bit countdown timer at address 0Fh is controlled by the Timer_control register at
address 0Eh. The Timer_control register determines one of 4 source clock frequencies for
the timer (4096 Hz, 64 Hz, 1 Hz, or 160 Hz), and enables or disables the timer. The timer
counts down from a software-loaded 8-bit binary value. At the end of every countdown,
the timer sets the timer flag TF. The TF may only be cleared by using the interface. The
asserted TF can be used to generate an interrupt on pin INT. The interrupt may be
generated as a pulsed signal every countdown period or as a permanently active signal
which follows the state of TF. Bit TI_TP is used to control this mode selection. When
reading the timer, the current countdown value is returned.
8.8.1 Register Timer_control
[1] Default value.
[2] These bits determine the source clock for the countdown timer; when not in use, TD[1:0] should be set to
160 Hz for power saving.
8.8.2 Register Timer
The register Timer is an 8-bit binary countdown timer. It is enabled and disabled via the
Timer_control register bit TE. The source clock for the timer is also selected by the
Timer_control register. Other timer properties such as interrupt generation are controlled
via the register Control_status_2.
For accurate read back of the count down value, it is recommended to read the register
twice and check for consistent results, since it is not possible to freeze the countdown
timer counter during read back.
Table 23. Timer_control - timer control register (address 0Eh) bit description
Bit Symbol Value Description
7TE 0
[1] timer is disabled
1 timer is enabled
6 to 2 - - unused
1 to 0 TD[1:0] timer source clock frequency select[2]
00 4.096 kHz
01 64 Hz
10 1 Hz
11[2] 160 Hz
Table 24. Timer - timer value register (address 0Fh) bit description
Bit Symbol Value Description
7 to 0 TIMER[7:0] 00h to FFh countdown period in seconds:
where n is the countdown value
Table 25. Timer register bits value range
Bit
76543210
1286432168421
CountdownPeriod n
SourceClockFrequency
---------------------------------------------------------------
=
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Real-time clock/calendar
8.9 EXT_CLK test mode
A test mode is available which allows for on-board testing. In such a mode it is possible to
set up test conditions and control the operation of the RTC.
The test mode is entered by setting bit TEST1 in register Control_status_1. Then
pin CLKOUT becomes an input. The test mode replaces the internal 64 Hz signal with the
signal applied to pin CLKOUT. Every 64 positive edges applied to pin CLKOUT will then
generate an increment of one second.
The signal applied to pin CLKOUT should have a minimum pulse width of 300 ns and a
maximum period of 1000 ns. The internal 64 Hz clock, now sourced from CLKOUT, is
divided down to 1 Hz by a 26divide chain called a prescaler. The prescaler can be set into
a known state by using bit STOP. When bit STOP is set, the prescaler is reset to 0 (STOP
must be cleared before the prescaler can operate again).
From a STOP condition, the first 1 second increment will take place after 32 positive
edges on CLKOUT. Thereafter, every 64 positive edges will cause a one-second
increment.
Remark: Entry into EXT_CLK test mode is not synchronized to the internal 64 Hz clock.
When entering the test mode, no assumption as to the state of the prescaler can be made.
8.9.1 Operation example:
1. Set EXT_CLK test mode (Control_status_1, bit TEST1 = 1).
2. Set STOP (Control_status_1, bit STOP = 1).
3. Clear STOP (Control_status_1, bit STOP = 0).
4. Set time registers to desired value.
5. Apply 32 clock pulses to CLKOUT.
6. Read time registers to see the first change.
7. Apply 64 clock pulses to CLKOUT.
8. Read time registers to see the second change.
Repeat steps 7 and 8 for additional increments.
Figure 1D Figure 11 Tame 26 |:W>m * a
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Real-time clock/calendar
8.10 STOP bit function
The function of the STOP bit is to allow for accurate starting of the time circuits. The STOP
bit function will cause the upper part of the prescaler (F2 to F14) to be held in reset and
thus no 1 Hz ticks will be generated (see Figure 10). The time circuits can then be set and
will not increment until the STOP bit is released (see Figure 11 and Table 26).
The STOP bit function will not affect the output of 32.768 kHz on CLKOUT, but will stop
the generation of 1.024 kHz, 32 Hz, and 1 Hz.
The lower two stages of the prescaler (F0 and F1) are not reset; and because the I2C-bus
is asynchronous to the crystal oscillator, the accuracy of re-starting the time circuits will be
between zero and one 8.192 kHz cycle (see Figure 11).
Fig 10. STOP bit functional diagram
013aaa089
OSCILLATOR
32768 Hz
16384 Hz
OSCILLATOR STOP
DETECTOR
F0F1F13
RESET
F14
RESET
F2
RESET
2 Hz
1024 Hz
32 Hz
1 Hz tick
STOP
CLKOUT source
reset
8192 Hz
4096 Hz
32768 Hz
1 Hz
Fig 11. STOP bit release timing
001aaf912
8192 Hz
stop released
0 μs to 122 μs
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Real-time clock/calendar
[1] F0 is clocked at 32.768 kHz.
The first increment of the time circuits is between 0.507813 s and 0.507935 s after STOP
bit is released. The uncertainty is caused by the prescaler bits F0 and F1 not being reset
(see Table 26) and the unknown state of the 32 kHz clock.
8.11 Reset
The PCF8563 includes an internal reset circuit which is active whenever the oscillator is
stopped. In the reset state the I2C-bus logic is initialized including the address pointer and
all registers are set according to Table 27. I2C-bus communication is not possible during
reset.
Table 26. First increment of time circuits after STOP bit release
Bit Prescaler bits [1] 1Hz tick Time Comment
STOP F0F1-F2 to F14 hh:mm:ss
Clock is running normally
0
01-0 0001 1101 0100
12:45:12 prescaler counting normally
STOP bit is activated by user. F0F1 are not reset and values cannot be predicted externally
1
XX-0 0000 0000 0000
12:45:12 prescaler is reset; time circuits are frozen
New time is set by user
1
XX-0 0000 0000 0000
08:00:00 prescaler is reset; time circuits are frozen
STOP bit is released by user
0
XX-0 0000 0000 0000
08:00:00 prescaler is now running
XX-1 0000 0000 0000
08:00:00 -
XX-0 1000 0000 0000
08:00:00 -
XX-1 1000 0000 0000
08:00:00 -
:
::
11-1 1111 1111 1110
08:00:00 -
00-0 0000 0000 0001
08:00:01 0 to 1 transition of F14 increments the time circuits
10-0 0000 0000 0001
08:00:01 -
:
::
11-1 1111 1111 1111
08:00:01 -
00-0 0000 0000 0000
08:00:01 -
10-0 0000 0000 0000
08:00:01 -
:
::
11-1 1111 1111 1110
08:00:01 -
00-0 0000 0000 0001
08:00:02 0 to 1 transition of F14 increments the time circuits
013aaa076
0.507813 to 0.507935 s
1.000000 s
value, Figure 12
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Real-time clock/calendar
[1] Registers marked x are undefined at power-up and unchanged by subsequent resets.
8.11.1 Power-On Reset (POR) override
The POR duration is directly related to the crystal oscillator start-up time. Due to the long
start-up times experienced by these types of circuits, a mechanism has been built in to
disable the POR and hence speed up on-board test of the device. The setting of this
mode requires that the I2C-bus pins, SDA and SCL, are toggled in a specific order as
shown in Figure 12. All timings are required minimums.
Once the override mode has been entered, the device immediately stops, being reset,
and normal operation may commence i.e. entry into the EXT_CLK test mode via I2C-bus
access. The override mode may be cleared by writing logic 0 to TESTC. TESTC must be
set to logic 1 before re-entry into the override mode is possible. Setting TESTC to logic 0
during normal operation has no effect except to prevent entry into the POR override
mode.
Table 27. Register reset value[1]
Address Register name Bit
76543210
00h Control_status_100001000
01h Control_status_200000000
02h VL_seconds 1xxxxxxx
03h Minutes xxxxxxxx
04h Hours xxxxxxxx
05h Days xxxxxxxx
06h Weekdays xxxxxxxx
07h Century_monthsxxxxxxxx
08h Years xxxxxxxx
09h Minute_alarm 1xxxxxxx
0AhHour_alarm 1xxxxxxx
0BhDay_alarm 1xxxxxxx
0ChWeekday_alarm1xxxxxxx
0DhCLKOUT_control1xxxxx00
0EhTimer_control 0xxxxx11
0FhTimer xxxxxxxx
Fig 12. POR override sequence
mgm664
SCL
500 ns 2000 ns
SDA
8 ms
override active
power-on
Figure 15
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Real-time clock/calendar
9. Characteristics of the I2C-bus
The I2C-bus is for bidirectional, two-line communication between different ICs or modules.
The two lines are a Serial DAta line (SDA) and a Serial CLock line (SCL). Both lines must
be connected to a positive supply via a pull-up resistor. Data transfer may be initiated only
when the bus is not busy.
9.1 Bit transfer
One data bit is transferred during each clock pulse. The data on the SDA line must remain
stable during the HIGH period of the clock pulse as changes in the data line at this time
will be interpreted as a control signal (see Figure 13).
9.2 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy.
A HIGH-to-LOW transition of the data line while the clock is HIGH is defined as the START
condition - S.
A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP
condition - P (see Figure 14).
9.3 System configuration
A device generating a message is a transmitter; a device receiving a message is a
receiver. The device that controls the message is the master; and the devices which are
controlled by the master are the slaves (see Figure 15).
Fig 13. Bit transfer
mbc621
data line
stable;
data valid
change
of data
allowed
SDA
SCL
Fig 14. Definition of START and STOP conditions
mbc622
SDA
SCL P
STOP condition
SDA
SCL
S
START condition
W
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Real-time clock/calendar
9.4 Acknowledge
The number of data bytes transferred between the START and STOP conditions from
transmitter to receiver is unlimited. Each byte of eight bits is followed by an acknowledge
cycle.
A slave receiver, which is addressed, must generate an acknowledge after the
reception of each byte.
Also a master receiver must generate an acknowledge after the reception of each
byte that has been clocked out of the slave transmitter.
The device that acknowledges must pull-down the SDA line during the acknowledge
clock pulse, so that the SDA line is stable LOW during the HIGH period of the
acknowledge related clock pulse (set-up and hold times must be taken into
consideration).
A master receiver must signal an end of data to the transmitter by not generating an
acknowledge on the last byte that has been clocked out of the slave. In this event, the
transmitter must leave the data line HIGH to enable the master to generate a STOP
condition.
Acknowledgement on the I2C-bus is illustrated in Figure 16.
Fig 15. System configuration
mba605
MASTER
TRANSMITTER
RECEIVER
SLAVE
RECEIVER
SLAVE
TRANSMITTER
RECEIVER
MASTER
TRANSMITTER
MASTER
TRANSMITTER
RECEIVER
SDA
SCL
Fig 16. Acknowledgement on the I2C-bus
mbc602
S
START
condition
9821
clock pulse for
acknowledgement
not acknowledge
acknowledge
data output
by transmitter
data output
by receiver
SCL from
master
Figure 17 L 9L +‘ Figure 18 Figure 19 Figure 20
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Real-time clock/calendar
9.5 I2C-bus protocol
9.5.1 Addressing
Before any data is transmitted on the I2C-bus, the device which should respond is
addressed first. The addressing is always carried out with the first byte transmitted after
the start procedure.
The PCF8563 acts as a slave receiver or slave transmitter. Therefore the clock signal SCL
is only an input signal, but the data signal SDA is a bidirectional line.
Two slave addresses are reserved for the PCF8563:
Read: A3h (10100011)
Write: A2h (10100010)
The PCF8563 slave address is illustrated in Figure 17.
9.5.2 Clock and calendar READ or WRITE cycles
The I2C-bus configuration for the different PCF8563 READ and WRITE cycles is shown in
Figure 18, Figure 19 and Figure 20. The register address is a 4-bit value that defines
which register is to be accessed next. The upper four bits of the register address are not
used.
Fig 17. Slave address
mce189
1 0 1 0 0 0 1 R/W
group 1 group 2
Fig 18. Master transmits to slave receiver (WRITE mode)
S0ASLAVE ADDRESS REGISTER ADDRESS A ADATA P
acknowledgement
from slave acknowledgement
from slave acknowledgement
from slave
R/W
auto increment
memory register address
013aaa346
n bytes
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Real-time clock/calendar
(1) At this moment master transmitter becomes master receiver and PCF8563 slave receiver becomes slave transmitter.
Fig 19. Master reads after setting register address (write register address; READ data)
S0A
SLAVE ADDRESS REGISTER ADDRESS A A
R/W
A
DATA
013aaa041
P
1
auto increment
memory register address
last byte
R/W
S1
n bytes
(1)
acknowledgement
from slave acknowledgement
from slave acknowledgement
from slave acknowledgement
from master
no acknowledgement
from master
auto increment
memory register address
SLAVE ADDRESS
DATA
Fig 20. Master reads slave immediately after first byte (READ mode)
S1A
SLAVE ADDRESS DATA A1DATA
acknowledgement
from slave acknowledgement
from master no acknowledgement
from master
R/W
auto increment
register address
013aaa347
auto increment
register address
n bytes last byte
P
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Real-time clock/calendar
9.6 Interface watchdog timer
During read/write operations, the time counting circuits are frozen. To prevent a situation
where the accessing device becomes locked and does not clear the interface, the
PCF8563 has a built in watchdog timer. Should the interface be active for more than 1 s
from the time a valid slave address is transmitted, then the PCF8563 will automatically
clear the interface and allow the time counting circuits to continue counting. The watchdog
will trigger between 1 s and 2 s after receiving a valid slave address. Each time the
watchdog period is exceeded, 1 s will be lost from the time counters.
The watchdog is implemented to prevent the excessive loss of time due to interface
access failure e.g. if main power is removed from a battery backed-up system during an
interface access.
a. Correct data transfer: read or write
b. Incorrect data transfer; read or write
Fig 21. Interface watchdog timer
013aaa420
SLAVE ADDRESS
running
time
counters
WD timer
data
WD timer tracking
time counters frozen running
DATA
t < 1 s
DATA STOP
START
013aaa421
SLAVE ADDRESS
running
time
counters
WD timer
data
WD timer tracking
time counters frozen running
DATA
1 s < t < 2 s
DATA
START data transfer fail
WD trips
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Real-time clock/calendar
10. Internal circuitry
Fig 22. Device diode protection diagram
013aaa348
SDA
VSS
SCL
INT
CLKOUT
OSCO
VDD
OSCI
PCF8563
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Real-time clock/calendar
11. Limiting values
[1] Pass level; Human Body Model (HBM), according to Ref. 5 “JESD22-A114.
[2] Pass level; Charged-Device Model (CDM), according to Ref. 6 “JESD22-C101.
[3] Pass level; latch-up testing according to Ref. 7 “JESD78 at maximum ambient temperature (Tamb(max)).
[4] According to the NXP store and transport requirements (see Ref. 9 UM10569) the devices should be stored at a temperature of +8 C
to +45 C and a humidity of 25 % to 75 %. For long term storage products deviant conditions are described in that document.
Table 28. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDD supply voltage 0.5 +6.5 V
IDD supply current 50 +50 mA
VIinput voltage on pins SCL, SDA,
and OSCI
0.5 +6.5 V
VOoutput voltage on pins CLKOUT and INT 0.5 +6.5 V
IIinput current at any input 10 +10 mA
IOoutput current at any output 10 +10 mA
Ptot total power dissipation - 300 mW
VESD electrostatic discharge voltage HBM
HVSON10 (PCF8563BS/4) [1] -3500 V
SO8 (PCF8563T/F4) [1]
TSSOP8 (PCF8563TS/4) [1]
SO8 (PCF8563T/5) [1] -
-
-
-
-
-
2000 V
TSSOP8 (PCF8563TS/5) [1]
CDM
HVSON10 (PCF8563BS/4) [2] 2000 V
SO8 (PCF8563T/F4) [2] 1000 V
SO8 (PCF8563T/5) [2] 1500 V
TSSOP8 (PCF8563TS/4) [2] 1500 V
TSSOP8 (PCF8563TS/5) [2] 1750 V
Ilu latch-up current [3] -200mA
Tstg storage temperature [4] 65 +150 C
Tamb ambient temperature operating device 40 +85 C
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Real-time clock/calendar
12. Static characteristics
Table 29. Static characteristics
VDD = 1.8 V to 5.5 V; VSS =0V; T
amb =
40
C to +85
C; fosc = 32.768 kHz; quartz Rs=40k
; CL= 8 pF; unless otherwise
specified.
Symbol Parameter Conditions Min Typ Max Unit
Supplies
VDD supply voltage interface inactive;
fSCL =0Hz;
Tamb =25C
[1] 1.0 - 5.5 V
interface active;
fSCL = 400 kHz 1.8 - 5.5 V
clock data integrity;
Tamb =25CVlow -5.5V
IDD supply current interface active
fSCL =400kHz --800A
fSCL =100kHz --200A
interface inactive (fSCL = 0 Hz); CLKOUT
disabled; Tamb =25C
[2]
VDD = 5.0 V - 275 550 nA
VDD = 3.0 V - 250 500 nA
VDD = 2.0 V - 225 450 nA
interface inactive (fSCL = 0 Hz); CLKOUT
disabled; Tamb =40 Cto +85C
[2]
VDD = 5.0 V - 500 750 nA
VDD = 3.0 V - 400 650 nA
VDD = 2.0 V - 400 600 nA
interface inactive (fSCL = 0 Hz); CLKOUT
enabled at 32 kHz; Tamb =25C
[2]
VDD = 5.0 V - 825 1600 nA
VDD = 3.0 V - 550 1000 nA
VDD = 2.0 V - 425 800 nA
interface inactive (fSCL = 0 Hz); CLKOUT
enabled at 32 kHz; Tamb =40 Cto +85C
[2]
VDD = 5.0 V - 950 1700 nA
VDD = 3.0 V - 650 1100 nA
VDD = 2.0 V - 500 900 nA
Inputs
VIL LOW-level input
voltage
0.5 - +0.3VDD V
VIH HIGH-level
input voltage 0.7VDD -5.5V
ILI input leakage
current VI=V
DD or VSS 10 +1A
Ciinput
capacitance
[3] --7pF
ngures ‘ ‘ ‘
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Real-time clock/calendar
[1] For reliable oscillator start-up at power on use VDD greater than 1.3 V. If powered up at 1.0 V the oscillator will start but it might be a bit
slow, especially if at high temperature. Normally the power supply is not 1.0 V at start up and only comes at the end of battery discharge.
VDD min of 1.0 V is specified so that the customer can calculate how large a battery or capacitor they need for their application. VDD min
of 1.3 V or greater is needed to ensure speedy oscillator start-up time.
[2] Timer source clock = 160 Hz, level of pins SCL and SDA is VDD or VSS.
[3] Tested on sample basis.
Outputs
IOL LOW-level
output current output sink current;
VOL =0.4V; V
DD =5V
on pin SDA 3 - - mA
on pin INT 1- - mA
on pin CLKOUT 1 - - mA
ILO output leakage
current VO=V
DD or VSS 10 +1A
Voltage detector
Vlow low voltage Tamb =25C; sets bit VL; see Figure 6 -0.91.0V
Table 29. Static characteristics …continued
VDD = 1.8 V to 5.5 V; VSS =0V; T
amb =
40
C to +85
C; fosc = 32.768 kHz; quartz Rs=40k
; CL= 8 pF; unless otherwise
specified.
Symbol Parameter Conditions Min Typ Max Unit
Tamb =25C; Timer = 1 minute. Tamb =25C; Timer = 1 minute.
Fig 23. Supply current IDD as a function of supply
voltage VDD; CLKOUT disabled Fig 24. Supply current IDD as a function of supply
voltage VDD; CLKOUT = 32 kHz
02 6
mgr888
4VDD (V)
1
0
0.4
0.2
0.8
0.6
IDD
(μA)
02 6
mgr889
4VDD (V)
1
0
0.4
0.2
0.8
0.6
IDD
(μA)
Figure 27 i
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Real-time clock/calendar
13. Dynamic characteristics
VDD = 3 V; Timer = 1 minute. Tamb =25C; normalized to VDD =3V.
Fig 25. Supply current IDD as a function of
temperature T; CLKOUT = 32 kHz Fig 26. Frequency deviation as a function of supply
voltage VDD
40 0 40 120
mgr890
80 T (°C)
1
0
0.4
0.2
0.8
0.6
IDD
(μA)
02 6
4
2
4
2
0
mgr891
4VDD (V)
frequency
deviation
(ppm)
Table 30. Dynamic characteristics
VDD = 1.8 V to 5.5 V; VSS =0V; T
amb =
40
C to +85
C; fosc = 32.768 kHz; quartz Rs=40k
; CL= 8 pF; unless otherwise
specified.
Symbol Parameter Conditions Min Typ Max Unit
Oscillator
COSCO capacitance on pin OSCO 15 25 35 pF
fosc/fosc relative oscillator frequency variation VDD =200mV;
Tamb =25C-0.2-ppm
Quartz crystal parameters (f = 32.768 kHz)
Rsseries resistance - - 100 k
CLload capacitance parallel [1] 7 - 12.5 pF
Ctrim trimmer capacitance external;
on pin OSCI 5- 25pF
CLKOUT output
CLKOUT duty cycle on pin CLKOUT [2] -50-%
I2C-bus timing characteristics (see Figure 27)[3][4]
fSCL SCL clock frequency [5] - - 400 kHz
tHD;STA hold time (repeated) START condition 0.6 - - s
tSU;STA set-up time for a repeated START condition 0.6 - - s
tLOW LOW period of the SCL clock 1.3 - - s
tHIGH HIGH period of the SCL clock 0.6 - - s
trrise time of both SDA and SCL signals
standard-mode - - 1 s
fast-mode - - 0.3 s
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Product data sheet Rev. 11 — 26 October 2015 31 of 45
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Real-time clock/calendar
[1] CL is a calculation of Ctrim and COSCO in series: .
[2] Unspecified for fCLKOUT = 32.768 kHz.
[3] All timing values are valid within the operating supply voltage at ambient temperature and referenced to VIL and VIH with an input voltage
swing of VSS to VDD.
[4] A detailed description of the I2C-bus specification is given in Ref. 11 “UM10204.
[5] I2C-bus access time between two STARTs or between a START and a STOP condition to this device must be less than one second.
tffall time of both SDA and SCL signals - - 0.3 s
tBUF bus free time between a STOP and START
condition 1.3 - - s
Cbcapacitive load for each bus line - - 400 pF
tSU;DAT data set-up time 100 - - ns
tHD;DAT data hold time 0 - - ns
tSU;STO set-up time for STOP condition 0.6 - - s
tw(spike) spike pulse width on bus - - 50 ns
Table 30. Dynamic characteristics …continued
VDD = 1.8 V to 5.5 V; VSS =0V; T
amb =
40
C to +85
C; fosc = 32.768 kHz; quartz Rs=40k
; CL= 8 pF; unless otherwise
specified.
Symbol Parameter Conditions Min Typ Max Unit
CL
Ctrim COSCO

Ctrim COSCO
+
-----------------------------------------
=
Fig 27. I2C-bus timing waveforms
SDA
mga728
SDA
SCL
tSU;STA tSU;STO
tHD;STA
tBUF tLOW
tHD;DAT tHIGH
tr
tf
tSU;DAT
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Product data sheet Rev. 11 — 26 October 2015 32 of 45
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Real-time clock/calendar
14. Application information
14.1 Quartz frequency adjustment
14.1.1 Method 1: fixed OSCI capacitor
By evaluating the average capacitance necessary for the application layout, a fixed
capacitor can be used. The frequency is best measured via the 32.768 kHz signal
available after power-on at pin CLKOUT. The frequency tolerance depends on the quartz
crystal tolerance, the capacitor tolerance and the device-to-device tolerance (on average
5 ppm). Average deviations of 5 minutes per year can be easily achieved.
14.1.2 Method 2: OSCI trimmer
Using the 32.768 kHz signal available after power-on at pin CLKOUT, fast setting of a
trimmer is possible.
14.1.3 Method 3: OSCO output
Direct measurement of OSCO out (accounting for test probe capacitance).
Fig 28. Application diagram
mgm665
SCL
SDA
VSS
OSCI
OSCO
CLOCK CALENDAR
PCF8563
SDA
SCL
MASTER
TRANSMITTER/
RECEIVER
VDD
VDD
SDA SCL
RR
VDD
(I2C-bus)
R: pull-up resistor
R =
1 F
tr
Cb
100 nF
E W 1‘ F» 6%? f) O nal mans n5) c D"! D" E 31255 31 02 29 215 21 FE c JDE m0 M22 Er©
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Product data sheet Rev. 11 — 26 October 2015 33 of 45
NXP Semiconductors PCF8563
Real-time clock/calendar
15. Package outline
Fig 29. Package outline SOT650-1 (HVSON10) of PCF8563BS
0.50.21 0.05
0.00
A1Eh
b
UNIT D(1) ye
2
e1
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 3.1
2.9
cD
h
1.75
1.45
y1
3.1
2.9
2.55
2.15
0.30
0.18 0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT650-1 MO-229 - - -- - -
E(1)
0.55
0.30
L
0.1
v
0.05
w
0 2 mm1
scale
SOT650-1
HVSON10: plastic thermal enhanced very thin small outline package; no leads;
10 terminals; body 3 x 3 x 0.85 mm
A(1)
max.
AA1
c
detail X
y
Dh
Eh
e
L
10
51
6
D
E
y1C
C
BA
01-01-22
02-02-08
terminal 1
index area
terminal 1
index area
X
e1
bAC
C
B
vM
wM
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
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Product data sheet Rev. 11 — 26 October 2015 34 of 45
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Fig 30. Package outline SOT96-1 (SO8) of PCF8563T
UNIT A
max. A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 5.0
4.8 4.0
3.8 1.27 6.2
5.8 1.05 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.10.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
1.0
0.4
SOT96-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
4
5
pin 1 index
1
8
y
076E03 MS-012
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.20
0.19 0.16
0.15 0.05 0.244
0.228 0.028
0.024 0.028
0.012
0.010.010.041 0.004
0.039
0.016
0 2.5 5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
99-12-27
03-02-18
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Product data sheet Rev. 11 — 26 October 2015 35 of 45
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Fig 31. Package outline SOT505-1 (TSSOP8) of PCF8563TS
UNIT A1
A
max. A2A3bpLHELpwyv
ceD(1) E(2) Z(1) θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.15
0.05 0.95
0.80 0.45
0.25 0.28
0.15 3.1
2.9 3.1
2.9 0.65 5.1
4.7 0.70
0.35 6°
0°
0.1 0.10.10.94
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.7
0.4
SOT505-1 99-04-09
03-02-18
wM
bp
D
Z
e
0.25
14
85
θ
A
A2A1
Lp
(A3)
detail X
L
HE
E
c
vMA
X
A
y
2.5 5 mm0
scale
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1
1.1
pin 1 index
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Product data sheet Rev. 11 — 26 October 2015 36 of 45
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16. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that
all normal precautions are taken as described in JESD625-A, IEC 61340-5 or equivalent
standards.
17. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
17.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
17.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
Figure 32 Table 31 g Figure 32
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17.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
17.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 32) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 31 and 32
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 32.
Table 31. SnPb eutectic process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350 350
< 2.5 235 220
2.5 220 220
Table 32. Lead-free process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350 350 to 2000 > 2000
< 1.6 260 260 260
1.6 to 2.5 260 250 245
> 2.5 250 245 245
mammum peak temperature a MSL “th damage \evel mmrmum peak temperature a mlmmum soldenng temperature
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For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
18. Abbreviations
MSL: Moisture Sensitivity Level
Fig 32. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
Table 33. Abbreviations
Acronym Description
BCD Binary Coded Decimal
CDM Charged-Device Model
CMOS Complementary Metal Oxide Semiconductor
ESD ElectroStatic Discharge
HBM Human Body Model
I2C Inter-Integrated Circuit
IC Integrated Circuit
LSB Least Significant Bit
MSB Most Significant Bit
MSL Moisture Sensitivity Level
PCB Printed-Circuit Board
POR Power-On Reset
RTC Real-Time Clock
SCL Serial CLock line
SDA Serial DAta line
SMD Surface Mount Device
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19. References
[1] AN10365 — Surface mount reflow soldering description
[2] IEC 60134 — Rating systems for electronic tubes and valves and analogous
semiconductor devices
[3] IEC 61340-5 — Protection of electronic devices from electrostatic phenomena
[4] IPC/JEDEC J-STD-020 — Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices
[5] JESD22-A114 — Electrostatic Discharge (ESD) Sensitivity Testing Human Body
Model (HBM)
[6] JESD22-C101 — Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components
[7] JESD78 — IC Latch-Up Test
[8] JESD625-A — Requirements for Handling Electrostatic-Discharge-Sensitive
(ESDS) Devices
[9] UM10569 — NXP store and transport requirements
[10] SNV-FA-01-02 — Marking Formats Integrated Circuits
[11] UM10204 — I2C-bus specification and user manual
Table 3 Table note 1 Table 28 Table nole 4 Table 29 M m in Table 22
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20. Revision history
Table 34. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PCF8563 v.11 20151026 Product data sheet - PCF8563 v.10
Modifications: Removed DIP8 package
Table 3: Corrected Table note 1
Table 28, Table note 4: Corrected “the devices have to be stored” to “the devices should be
stored”
Table 29:
Deleted Table note 1 from VDD fSCL = 400 kHz
VIL: Corrected VSS to 0.5
VIH: Corrected VDD to 5.5
Corrected Table note 1
PCF8563 v.10 20120403 Product data sheet - PCF8563 v.9
Modifications: Adjusted marking codes
Adjusted text for FE = 0 in Table 22
PCF8563 v.9 20110616 Product data sheet - PCF8563 v.8
PCF8563 v.8 20101118 Product data sheet - PCF8563 v.7
PCF8563 v.7 20100723 Product data sheet - PCF8563_6
PCF8563_6 20080221 Product data sheet - PCF8563_5
PCF8563_5 20070717 Product data sheet - PCF8563-04
PCF8563-04
(9397 750 12999) 20040312 Product data - PCF8563-03
PCF8563-03
(9397 750 11158) 20030414 Product data - PCF8563-02
PCF8563-02
(9397 750 04855) 19990416 Product data - PCF8563_N_1
PCF8563_N_1
(9397 750 03282) 19980325 Objective specification - -
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Product data sheet Rev. 11 — 26 October 2015 41 of 45
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21. Legal information
21.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
21.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
21.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
hug :l/www. nxgcom salesaddresses®nx9£0m
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Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
21.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP Semiconductors N.V.
22. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
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23. Tables
Table 1. Ordering information . . . . . . . . . . . . . . . . . . . . .2
Table 2. Marking codes . . . . . . . . . . . . . . . . . . . . . . . . . .2
Table 3. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .5
Table 4. Formatted registers overview . . . . . . . . . . . . . .6
Table 5. Control_status_1 - control and status register 1
(address 00h) bit description . . . . . . . . . . . . . . .7
Table 6. Control_status_2 - control and status register 2
(address 01h) bit description . . . . . . . . . . . . . . .7
Table 7. INT operation (bit TI_TP = 1)[1]. . . . . . . . . . . . . .9
Table 8. VL_seconds - seconds and clock integrity status
register (address 02h) bit description . . . . . . . .9
Table 9. Seconds coded in BCD format . . . . . . . . . . . . .9
Table 10. Minutes - minutes register (address 03h)
bit description . . . . . . . . . . . . . . . . . . . . . . . . .10
Table 11. Hours - hours register (address 04h)
bit description . . . . . . . . . . . . . . . . . . . . . . . . .10
Table 12. Days - days register (address 05h)
bit description . . . . . . . . . . . . . . . . . . . . . . . . .10
Table 13. Weekdays - weekdays register (address 06h)
bit description . . . . . . . . . . . . . . . . . . . . . . . . .11
Table 14. Weekday assignments . . . . . . . . . . . . . . . . . . .11
Table 15. Century_months - century flag and months
register (address 07h) bit description . . . . . . . .11
Table 16. Month assignments in BCD format. . . . . . . . . .11
Table 17. Years - years register (08h) bit description. . . .12
Table 18. Minute_alarm - minute alarm register
(address 09h) bit description . . . . . . . . . . . . . .13
Table 19. Hour_alarm - hour alarm register (address 0Ah)
bit description . . . . . . . . . . . . . . . . . . . . . . . . . .14
Table 20. Day_alarm - day alarm register (address 0Bh)
bit description . . . . . . . . . . . . . . . . . . . . . . . . . .14
Table 21. Weekday_alarm - weekday alarm register
(address 0Ch) bit description . . . . . . . . . . . . . .14
Table 22. CLKOUT_control - CLKOUT control register
(address 0Dh) bit description . . . . . . . . . . . . . .15
Table 23. Timer_control - timer control register
(address 0Eh) bit description . . . . . . . . . . . . . .16
Table 24. Timer - timer value register (address 0Fh)
bit description . . . . . . . . . . . . . . . . . . . . . . . . .16
Table 25. Timer register bits value range . . . . . . . . . . . . .16
Table 26. First increment of time circuits after STOP
bit release . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Table 27. Register reset value[1] . . . . . . . . . . . . . . . . . . .20
Table 28. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .27
Table 29. Static characteristics . . . . . . . . . . . . . . . . . . . .28
Table 30. Dynamic characteristics . . . . . . . . . . . . . . . . . .30
Table 31. SnPb eutectic process (from J-STD-020D) . . .37
Table 32. Lead-free process (from J-STD-020D) . . . . . .37
Table 33. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .38
Table 34. Revision history . . . . . . . . . . . . . . . . . . . . . . . .40
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Product data sheet Rev. 11 — 26 October 2015 44 of 45
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24. Figures
Fig 1. Block diagram of PCF8563 . . . . . . . . . . . . . . . . . .3
Fig 2. Pin configuration for HVSON10 (PCF8563BS) . . .4
Fig 3. Pin configuration for SO8 (PCF8563T) . . . . . . . . .4
Fig 4. Pin configuration for TSSOP8 (PCF8563TS). . . . .4
Fig 5. Interrupt scheme . . . . . . . . . . . . . . . . . . . . . . . . . .8
Fig 6. Voltage-low detection. . . . . . . . . . . . . . . . . . . . . .10
Fig 7. Data flow for the time function . . . . . . . . . . . . . . .12
Fig 8. Access time for read/write operations . . . . . . . . .13
Fig 9. Alarm function block diagram. . . . . . . . . . . . . . . .15
Fig 10. STOP bit functional diagram . . . . . . . . . . . . . . . .18
Fig 11. STOP bit release timing. . . . . . . . . . . . . . . . . . . .18
Fig 12. POR override sequence . . . . . . . . . . . . . . . . . . .20
Fig 13. Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Fig 14. Definition of START and STOP conditions. . . . . .21
Fig 15. System configuration . . . . . . . . . . . . . . . . . . . . . .22
Fig 16. Acknowledgement on the I2C-bus . . . . . . . . . . . .22
Fig 17. Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . .23
Fig 18. Master transmits to slave receiver
(WRITE mode). . . . . . . . . . . . . . . . . . . . . . . . . . .23
Fig 19. Master reads after setting register address (write
register address; READ data) . . . . . . . . . . . . . . .24
Fig 20. Master reads slave immediately after first byte
(READ mode) . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Fig 21. Interface watchdog timer . . . . . . . . . . . . . . . . . . .25
Fig 22. Device diode protection diagram . . . . . . . . . . . . .26
Fig 23. Supply current IDD as a function of supply voltage
VDD; CLKOUT disabled . . . . . . . . . . . . . . . . . . . .29
Fig 24. Supply current IDD as a function of supply voltage
VDD; CLKOUT = 32 kHz. . . . . . . . . . . . . . . . . . . .29
Fig 25. Supply current IDD as a function of temperature
T; CLKOUT = 32 kHz . . . . . . . . . . . . . . . . . . . . . .30
Fig 26. Frequency deviation as a function of supply voltage
VDD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
Fig 27. I2C-bus timing waveforms . . . . . . . . . . . . . . . . . .31
Fig 28. Application diagram . . . . . . . . . . . . . . . . . . . . . . .32
Fig 29. Package outline SOT650-1 (HVSON10) of
PCF8563BS. . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Fig 30. Package outline SOT96-1 (SO8) of PCF8563T. .34
Fig 31. Package outline SOT505-1 (TSSOP8) of
PCF8563TS. . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Fig 32. Temperature profiles for large and small
components . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
NXP Semiconductors PCF8563
Real-time clock/calendar
© NXP Semiconductors N.V. 2015. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 26 October 2015
Document identifier: PCF8563
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
25. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
5 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
8 Functional description . . . . . . . . . . . . . . . . . . . 6
8.1 CLKOUT output . . . . . . . . . . . . . . . . . . . . . . . . 6
8.2 Register organization . . . . . . . . . . . . . . . . . . . . 6
8.3 Control registers . . . . . . . . . . . . . . . . . . . . . . . . 7
8.3.1 Register Control_status_1 . . . . . . . . . . . . . . . . 7
8.3.2 Register Control_status_2 . . . . . . . . . . . . . . . . 7
8.3.2.1 Interrupt output . . . . . . . . . . . . . . . . . . . . . . . . . 8
8.4 Time and date registers . . . . . . . . . . . . . . . . . . 9
8.4.1 Register VL_seconds . . . . . . . . . . . . . . . . . . . . 9
8.4.1.1 Voltage-low detector and clock monitor . . . . . 10
8.4.2 Register Minutes. . . . . . . . . . . . . . . . . . . . . . . 10
8.4.3 Register Hours . . . . . . . . . . . . . . . . . . . . . . . . 10
8.4.4 Register Days. . . . . . . . . . . . . . . . . . . . . . . . . 10
8.4.5 Register Weekdays. . . . . . . . . . . . . . . . . . . . . 11
8.4.6 Register Century_months. . . . . . . . . . . . . . . . 11
8.4.7 Register Years . . . . . . . . . . . . . . . . . . . . . . . . 12
8.5 Setting and reading the time. . . . . . . . . . . . . . 12
8.6 Alarm registers . . . . . . . . . . . . . . . . . . . . . . . . 13
8.6.1 Register Minute_alarm . . . . . . . . . . . . . . . . . . 13
8.6.2 Register Hour_alarm . . . . . . . . . . . . . . . . . . . 14
8.6.3 Register Day_alarm . . . . . . . . . . . . . . . . . . . . 14
8.6.4 Register Weekday_alarm . . . . . . . . . . . . . . . . 14
8.6.5 Alarm flag . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
8.7 Register CLKOUT_control and clock output. . 15
8.8 Timer function . . . . . . . . . . . . . . . . . . . . . . . . . 16
8.8.1 Register Timer_control . . . . . . . . . . . . . . . . . . 16
8.8.2 Register Timer . . . . . . . . . . . . . . . . . . . . . . . . 16
8.9 EXT_CLK test mode. . . . . . . . . . . . . . . . . . . . 17
8.9.1 Operation example: . . . . . . . . . . . . . . . . . . . . 17
8.10 STOP bit function . . . . . . . . . . . . . . . . . . . . . . 18
8.11 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
8.11.1 Power-On Reset (POR) override . . . . . . . . . . 20
9 Characteristics of the I2C-bus . . . . . . . . . . . . 21
9.1 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
9.2 START and STOP conditions . . . . . . . . . . . . . 21
9.3 System configuration . . . . . . . . . . . . . . . . . . . 21
9.4 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 22
9.5 I2C-bus protocol. . . . . . . . . . . . . . . . . . . . . . . 23
9.5.1 Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
9.5.2 Clock and calendar READ or WRITE cycles . 23
9.6 Interface watchdog timer . . . . . . . . . . . . . . . . 25
10 Internal circuitry . . . . . . . . . . . . . . . . . . . . . . . 26
11 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 27
12 Static characteristics . . . . . . . . . . . . . . . . . . . 28
13 Dynamic characteristics. . . . . . . . . . . . . . . . . 30
14 Application information . . . . . . . . . . . . . . . . . 32
14.1 Quartz frequency adjustment. . . . . . . . . . . . . 32
14.1.1 Method 1: fixed OSCI capacitor . . . . . . . . . . . 32
14.1.2 Method 2: OSCI trimmer . . . . . . . . . . . . . . . . 32
14.1.3 Method 3: OSCO output . . . . . . . . . . . . . . . . 32
15 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 33
16 Handling information . . . . . . . . . . . . . . . . . . . 36
17 Soldering of SMD packages. . . . . . . . . . . . . . 36
17.1 Introduction to soldering. . . . . . . . . . . . . . . . . 36
17.2 Wave and reflow soldering. . . . . . . . . . . . . . . 36
17.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . 37
17.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 37
18 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 38
19 References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
20 Revision history . . . . . . . . . . . . . . . . . . . . . . . 40
21 Legal information . . . . . . . . . . . . . . . . . . . . . . 41
21.1 Data sheet status. . . . . . . . . . . . . . . . . . . . . . 41
21.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
21.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 41
21.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 42
22 Contact information . . . . . . . . . . . . . . . . . . . . 42
23 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
24 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
25 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

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