74ALVT16543 Datasheet by NXP USA Inc.

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74ALVT16543
2.5 V/3.3 V ALVT 16-bit registered
transceiver (3-State)
Product data sheet
Supersedes data of 1998 Feb 13 2004 Sep 14
INTEGRATED CIRCUITS
SYMBOL PARAMETER
Philips Semiconductors Product data sheet
74ALVT16543
2.5 V/3.3 V 16-bit registered transceiver (3-State)
2
2004 Sep 14
FEATURES
16-bit universal bus interface
5 V I/O Compatible
3-State buffers
Output capability: +64 mA/–32 mA
TTL input and output switching levels
Input and output interface capability to systems at 5 V supply
Bus-hold data inputs eliminate the need for external pull-up
resistors to hold unused inputs
Live insertion/extraction permitted
Power-up 3-State
Power-up reset
No bus current loading when output is tied to 5 V bus
Latch-up protection exceeds 500mA per JEDEC Std 17
ESD protection exceeds 2000 V per MIL STD 883 Method 3015
and 200 V per Machine Model
DESCRIPTION
The 74ALVT16543 is a high-performance BiCMOS product
designed for VCC operation at 2.5 V or 3.3 V with I/O compatibility
up to 5 V. The device can be used as two 8-bit transceivers or one
16-bit transceiver.
The 74ALVT16543 contains two sets of eight D-type latches, with
separate control pins for each set. Using data flow from A to B as an
example, when the A-to-B Enable (nEAB) input and the A-to-B Latch
Enable (nLEAB) input are LOW, the A-to-B path is transparent.
A subsequent LOW-to-HIGH transition of the nLEAB signal puts the
A data into the latches where it is stored and the B outputs no longer
change with the A inputs. With nEAB and nOEAB both LOW, the
3-State B output buffers are active and display the data present at
the outputs of the A latches.
Control of data flow from B to A is similar, but using the nEBA,
nLEBA, and nOEBA inputs.
Active bus-hold circuitry is provided to hold unused or floating data
inputs at a valid logic level.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS TYPICAL
UNIT
SYMBOL
PARAMETER
Tamb = 25 °C; GND = 0 V 2.5 V 3.3 V
UNIT
tPLH
tPHL
Propagation delay
nAx to nBx or nBx to nAx CL = 50 pF 1.8
2.7 1.6
1.8 ns
CIN Input capacitance DIR, OE VI = 0 V or VCC 3 3 pF
CI/O I/O pin capacitance Outputs disabled; VI/O = 0 V or VCC 9 9 pF
ICCZ Total supply current Outputs disabled 40 70 µA
ORDERING INFORMATION
PACKAGES TEMPERATURE RANGE TYPE NUMBER DWG NUMBER
56-Pin Plastic SSOP Type III –40 °C to +85 °C 74ALVT16543DL SOT371-1
56-Pin Plastic TSSOP Type II –40 °C to +85 °C 74ALVT16543DGG SOT364-1
LOGIC SYMBOL (IEEE/IEC)
9 11 D
5 D
56
54
55
1
3
2
5
29
26
27
28
31
30
6
8
9
10
12
13
14
52
51
49
48
47
45
44
15
16
17
19
20
21
23
43 24
42
41
40
38
37
36
34
33
3
1EN3 (BA)
G1
1C5
2EN4 (AB)
G2
2C6
6 D 4
7EN9 (BA)
G7
7C11
8EN10 (AB)
G8
8C12
12 D 10
SW00151
HHHH HHHH HHHH HHHH :, , : jjjjjjjjjjjjjjjjjjjjjjjjjjjj EEKEKKEKEEKEKEEKEEKEKEEKEEKE
Philips Semiconductors Product data sheet
74ALVT165432.5 V/3.3 V 16-bit registered transceiver (3-State)
2004 Sep 14 3
PIN CONFIGURATION
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
27
28
30
29
1OEAB
1LEAB
1EAB
GND
1A0
1A1
1A2
1A3
1A4
GND
1A5
1A6
1A7
2A0
2A2
GND
2A3
VCC
2A1
2A4
2A5
2A6
2A7
2EAB
VCC
GND
2LEAB
2OEAB
1OEBA
1LEBA
1EBA
GND
1B0
1B1
1B2
1B3
1B4
GND
1B5
1B6
1B7
2B0
2B2
GND
2B3
VCC
2B1
2B4
2B5
2B6
2B7
2EBA
VCC
GND
2LEBA
2OEBA
SH00037
LOGIC SYMBOL
3
54
1EAB
1EBA
2 1LEAB
55 1LEBA
11OEAB
561OEBA
26
31
2EAB
2EBA
27 2LEAB
30 2LEBA
282OEAB
292OEBA
5 6 10 12 13 1489
52 51 47 45 44 4349 48
15 16 20 21 23 2417 19
42 41 37 36 34 3340 38
SH00038
1A0 1A1 1A2 1A3 1A4 1A5 1A6 1A7
1B0 1B1 1B2 1B3 1B4 1B5 1B6 1B7
2A0 2A1 2A2 2A3 2A4 2A5 2A6 2A7
2B0 2B1 2B2 2B3 2B4 2B5 2B6 2B7
PIN DESCRIPTION
PIN NUMBER SYMBOL NAME AND FUNCTION
5, 6, 8, 9, 10, 12, 13, 14
15, 16, 17, 19, 20, 21, 23, 24 1A0 – 1A7,
2A0 – 2A7 A Data inputs/outputs
52, 51, 49, 48, 47, 45, 44, 43
42, 41, 40,38, 37, 36, 34, 33 1B0 – 1B7,
2B0 – 2B7 B Data inputs/outputs
1, 56
28, 29 1OEAB, 1OEBA,
2OEAB, 2OEBA A to B / B to A Output Enable inputs (active-LOW)
3, 54
26, 31 1EAB, 1EBA,
2EAB, 2EBA A to B / B to A Enable inputs (active-LOW)
2, 55
27, 30 1LEAB, 1LEBA,
2LEAB, 2LEBA A to B / B to A Latch Enable inputs (active-LOW)
4, 11, 18, 25, 32, 39, 46, 53 GND Ground (0 V)
7, 22, 35, 50 VCC Positive supply voltage
S m m S
Philips Semiconductors Product data sheet
74ALVT165432.5 V/3.3 V 16-bit registered transceiver (3-State)
2004 Sep 14 4
LOGIC DIAGRAM
D
LE
Q
D
LE
Q
DETAIL A
nB0
nB1nA1
nB2nA2
nB3nA3
nB4nA4
nB5nA5
nB6nA6
nB7nA7
DETAIL A X 7
nOEAB
nEAB
nLEAB
nOEBA
nEBA
nLEBA
nA0
SH00039
FUNCTION TABLE
INPUTS OUTPUTS
STATUS
nOEXX nEXX nLEXX nAx or nBx nBx or nAx
STATUS
H X X X Z Disabled
X H X X Z Disabled
L
L
L
Lh
lZ
ZDisabled + Latch
L
LL
L
h
lH
LLatch + Display
L
LL
LL
LH
LH
LTransparent
L L H X NC Hold
H = HIGH voltage level
h = HIGH voltage level one setup time prior to the LOW-to-HIGH transition of nLEXX or nEXX (XX = AB or BA)
L = LOW voltage level
l = LOW voltage level one setup time prior to the LOW-to-HIGH transition of nLEXX or nEXX (XX = AB or BA)
X = Don’t care
= LOW-to-HIGH transition of nLEXX or nEXX (XX = AB or BA)
NC= No change
Z = High-impedance or “off” state
(n v DC Du! ut curtent SYMBOL PARAMETER
Philips Semiconductors Product data sheet
74ALVT165432.5 V/3.3 V 16-bit registered transceiver (3-State)
2004 Sep 14 5
ABSOLUTE MAXIMUM RATINGS1, 2
SYMBOL PARAMETER CONDITIONS RATING UNIT
VCC DC supply voltage –0.5 to +4.6 V
IIK DC input diode current VI < 0 V –50 mA
VIDC input voltage3–0.5 to +7.0 V
IOK DC output diode current VO < 0 V –50 mA
VOUT DC output voltage3Output in Off or HIGH state –0.5 to +7.0 V
IOUT
p
Output in LOW state 128
mA
I
OUT
Output in HIGH state –64
mA
Tstg Storage temperature range –65 to +150 °C
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150 °C.
3. The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
2.5 V RANGE LIMITS 3.3 V RANGE LIMITS
UNIT
SYMBOL
PARAMETER
MIN MAX MIN MAX
UNIT
VCC DC supply voltage 2.3 2.7 3.0 3.6 V
VIInput voltage 0 5.5 0 5.5 V
VIH HIGH-level input voltage 1.7 2.0 V
VIL Input voltage 0.7 0.8 V
IOH HIGH-level output current –8 –32 mA
IOL
LOW-level output current 8 32
mA
I
OL LOW-level output current; current duty cycle 50 %; f 1 kHz 24 64
mA
t/vInput transition rise or fall rate; Outputs enabled 10 10 ns/V
Tamb Operating free-air temperature range –40 +85 –40 +85 °C
HbGHJevel output voltage LOWrbevel output voltage B ‘ H‘Vd‘ "‘nl Data m uts
Philips Semiconductors Product data sheet
74ALVT165432.5 V/3.3 V 16-bit registered transceiver (3-State)
2004 Sep 14 6
DC ELECTRICAL CHARACTERISTICS (3.3 V ± 0.3 V RANGE)
LIMITS
SYMBOL PARAMETER TEST CONDITIONS Temp = –40 °C to +85 °C UNIT
MIN TYP1MAX
VIK Input clamp voltage VCC = 3.0 V; IIK = –18 mA –0.85 –1.2 V
VOH
HIGH-level out
p
ut voltage
VCC = 3.0 V to 3.6 V; IOH = –100 µA VCC – 0.2 VCC
V
V
OH
HIGH
-
level
out ut
voltage
VCC = 3.0 V; IOH = –32 mA 2.0 2.3
V
VCC = 3.0 V; IOL = 100 µA 0.07 0.2
VOL
LOW–level out
p
ut voltage
VCC = 3.0 V; IOL = 16 mA 0.25 0.4
V
V
OL
LOW
level
out ut
voltage
VCC = 3.0 V; IOL = 32 mA 0.3 0.5
V
VCC = 3.0 V; IOL = 64 mA 0.4 0.55
VRST Power-up output low voltage6VCC = 3.6 V; IO = 1 mA; VI = VCC or GND – 0.55 V
VCC = 3.6 V; VI = VCC or GND Control pins 0.1 ± 1
VCC = 0 V or 3.6 V; VI = 5.5 V 0.1 10
IIInput leakage current VCC = 3.6 V; VI = VCC
4
0.5 1 µA
VCC = 3.6 V; VI = 0 V Data pins
4
0.1 –5
VCC = 3.6 V; VI = 5.5 V 0.1 20
IOFF Off current VCC = 0 V; VI or VO = 0 V to 4.5 V 0.1 ± 100 µA
Bus Hold current
VCC = 3 V; VI = 0.8 V 75 130
IHOLD
B
us
H
o
ld
curren
t
Data in
p
uts
7VCC = 3 V; VI = 2.0 V –75 –140 µA
Data
in uts
VCC = 0 V to 3.6 V; VCC = 3.6 V ± 500 – –
IEX Current into an output in the
High state when VO > VCC VO = 5.5 V; VCC = 3.0 V 50 125 µA
IPU/PD Power-up/down 3-State output
current3VCC 1.2 V; VO = 0.5 V to VCC; VI = GND or VCC;
OE/OE = Don’t care 40 ± 100 µA
ICCH VCC = 3.6 V; Outputs HIGH; VI = GND or VCC;
IO = 0 mA 0.07 0.1
ICCL Quiescent supply current VCC = 3.6 V; Outputs LOW; VI = GND or VCC;
IO = 0 mA 3.6 5 mA
ICCZ VCC = 3.6 V; Outputs disabled;
VI = GND or VCC, IO = 0 mA5 0.07 0.1
ICC Additional supply current per
input pin2VCC = 3 V to 3.6 V; One input at VCC – 0.6 V;
Other inputs at VCC or GND 0.04 0.4 mA
NOTES:
1. All typical values are at VCC = 3.3 V and Tamb = 25 °C.
2. This is the increase in supply current for each input at the specified voltage level other than VCC or GND.
3. This parameter is valid for any VCC between 0 V and 1.2 V with a transition time of up to 10 msec. From VCC = 1.2 V to VCC = 3.3 V ±0.3 V
a transition time of 100 µsec is permitted. This parameter is valid for Tamb = 25 °C only.
4. Unused pins at VCC or GND.
5. ICCZ is measured with outputs pulled up to VCC or pulled down to ground.
6. For valid test results, data must not be loaded into the flip-flops (or latches) after applying power.
7. This is the bus hold overdrive current required to force the input to the opposite logic state.
HbGHJevel output voltage
Philips Semiconductors Product data sheet
74ALVT165432.5 V/3.3 V 16-bit registered transceiver (3-State)
2004 Sep 14 7
DC ELECTRICAL CHARACTERISTICS (2.5 V ± 0.2 V RANGE)
LIMITS
SYMBOL PARAMETER TEST CONDITIONS Temp = –40 °C to +85 °C UNIT
MIN TYP1MAX
VIK Input clamp voltage VCC = 2.3 V; IIK = –18 mA –0.85 –1.2 V
VOH
HIGH-level out
p
ut voltage
VCC = 2.3 V to 3.6 V; IOH = –100 µA VCC – 0.2 VCC
V
V
OH
HIGH
-
level
out ut
voltage
VCC = 2.3 V; IOH = –8 mA 1.8 2.1
V
VCC = 2.3 V; IOL = 100 µA 0.07 0.2
VOL LOW-level output voltage VCC = 2.3 V; IOL = 24 mA 0.3 0.5 V
VCC = 2.3 V; IOL = 8 mA – 0.4
VRST Power-up output low voltage7VCC = 2.7 V; IO = 1 mA; VI = VCC or GND 0.55 V
VCC = 2.7 V; VI = VCC or GND Control pins 0.1 ± 1
VCC = 0 V or 2.7 V; VI = 5.5 V 0.1 10
IIInput leakage current VCC = 2.7 V; VI = 5.5 V
4
0.1 20 µA
VCC = 2.7 V; VI = VCC Data pins
4
0.1 10
VCC = 2.7 V; VI = 0 V 0.1 –5
IOFF Off current VCC = 0 V; VI or VO = 0 V to 4.5 V 0.1 ± 100 µA
I
HOLD
Bus Hold current VCC = 2.3 V; VI = 0.7 V 120 –
µA
IHOLD
Data inputs6VCC = 2.3 V; VI = 1.7 V –6 –
µA
IEX Current into an output in the
HIGH state when VO > VCC VO = 5.5 V; VCC = 2.3 V 50 125 µA
IPU/PD Power-up/down 3-State output
current3VCC 1.2 V; VO = 0.5 V to VCC; VI = GND or VCC;
OE/OE = Don’t care 40 100 µA
ICCH VCC = 2.7 V; Outputs HIGH, VI = GND or VCC;
IO = 0 mA 0.04 0.1
ICCL Quiescent supply current VCC = 2.7 V; Outputs LOW, VI = GND or VCC;
IO = 0 mA 2.6 4.5 mA
ICCZ VCC = 2.7 V; Outputs disabled; VI = GND or VCC;
IO = 0 mA5 0.04 0.1
ICC Additional supply current per
input pin2VCC = 2.3 V to 2.7 V; One input at VCC – 0.6 V;
Other inputs at VCC or GND 0.01 0.4 mA
NOTES:
1. All typical values are at VCC = 2.5 V and Tamb = 25 °C.
2. This is the increase in supply current for each input at the specified voltage level other than VCC or GND.
3. This parameter is valid for any VCC between 0 V and 1.2 V with a transition time of up to 10 msec. From VCC = 1.2 V to VCC = 2.5 V ±0.2 V
a transition time of 100 µsec is permitted. This parameter is valid for Tamb = 25 °C only.
4. Unused pins at VCC or GND.
5. ICCZ is measured with outputs pulled up to VCC or pulled down to ground.
6. Not guaranteed.
7. For valid test results, data must not be loaded into the flip-flops (or latches) after applying power.
Philips Semiconductors Product data sheet
74ALVT165432.5 V/3.3 V 16-bit registered transceiver (3-State)
2004 Sep 14 8
AC CHARACTERISTICS (3.3 V ± 0.3 V RANGE)
GND = 0 V; tR = tF = 2.5 ns; CL = 50 pF; RL = 500 ; Tamb = –40 °C to +85 °C.
LIMITS
SYMBOL PARAMETER WAVEFORM VCC = 3.3 V ± 0.3 V UNIT
MIN TYP1MAX
tPLH
tPHL
Propagation delay
nAx to nBx or nBx to nAx 20.5
0.5 1.6
1.8 2.6
3.0 ns
tPLH
tPHL
Propagation delay
nLEBA to nAx, nLEAB to nBx 1
21.0
1.0 2.4
2.4 4.0
4.0 ns
tPZH
tPZL
Output enable time
nOEBA to nAx, nOEAB to nBx 4
51.0
1.0 2.3
1.8 4.0
3.1 ns
tPHZ
tPLZ
Output disable time
nOEBA to nAx, nOEAB to nBx 4
51.0
1.0 3.1
2.7 4.8
4.2 ns
tPZH
tPZL
Output enable time
nEBA to nAx, nEAB to nBx 4
51.0
1.0 2.5
1.9 4.2
3.1 ns
tPHZ
tPLZ
Output disable time
nEBA to nAx, nEAB to nBx 4
51.0
1.0 2.9
2.4 4.9
4.2 ns
NOTE:
1. All typical values are at VCC = 3.3 V and Tamb = 25 °C.
AC SETUP REQUIREMENTS (3.3 V ± 0.3 V RANGE)
GND = 0 V; tR = tF = 2.5 ns; CL = 50 pF; RL = 500 ; Tamb = –40 °C to +85 °C.
LIMITS
SYMBOL PARAMETER WAVEFORM VCC = 3.3 V ± 0.3 V UNIT
MIN TYP
ts(H)
ts(L) Setup time
nAx to nLEAB, nBx to nLEBA 30.5
0.7 0
–0.4 ns
th(H)
th(L) Hold time
nAx to nLEAB, nBx to nLEBA 31.5
1.5 0.2
–0.3 ns
ts(H)
ts(L) Setup time
nAx to nEAB, nBx to nEBA 30.5
1.1 –0.3
–0.6 ns
th(H)
th(L) Hold time
nAx to nEAB, nBx to nEBA 31.2
2.0 0.6
0.1 ns
tW(L) Latch enable pulse width, LOW 3 1.5 – ns
Philips Semiconductors Product data sheet
74ALVT165432.5 V/3.3 V 16-bit registered transceiver (3-State)
2004 Sep 14 9
AC CHARACTERISTICS (2.5 V ± 0.2 V RANGE)
GND = 0 V; tR = tF = 2.5 ns; CL = 50 pF; RL = 500 ; Tamb = –40 °C to +85 °C.
LIMITS
SYMBOL PARAMETER WAVEFORM VCC = 2.5 V ± 0.2 V UNIT
MIN TYP1MAX
tPLH
tPHL
Propagation delay
nAx to nBx or nBx to nAx 21.0
1.0 1.8
2.7 5.1
4.5 ns
tPLH
tPHL
Propagation delay
nLEBA to nAx, nLEAB to nBx 1
21.5
1.5 3.9
3.6 6.4
5.9 ns
tPZH
tPZL
Output enable time
nOEBA to nAx, nOEAB to nBx 4
51.5
1.5 4.0
2.7 6.5
4.6 ns
tPHZ
tPLZ
Output disable time
nOEBA to nAx, nOEAB to nBx 4
51.5
1.5 3.7
2.6 5.6
4.0 ns
tPZH
tPZL
Output enable time
nEBA to nAx, nEAB to nBx 4
51.5
1.5 4.2
2.8 7.0
5.0 ns
tPHZ
tPLZ
Output disable time
nEBA to nAx, nEAB to nBx 4
51.5
1.5 3.6
2.4 5.6
3.9 ns
NOTE:
1. All typical values are at VCC = 2.5 V and Tamb = 25 °C.
AC SETUP REQUIREMENTS (2.5 V ± 0.2 V RANGE)
GND = 0 V; tR = tF = 2.5 ns; CL = 50 pF; RL = 500 ; Tamb = –40 °C to +85 °C.
LIMITS
SYMBOL PARAMETER WAVEFORM VCC = 2.5 V ± 0.2 V UNIT
MIN TYP
ts(H)
ts(L) Setup time
nAx to nLEAB, nBx to nLEBA 30.5
1.0 –0.2
–0.5 ns
th(H)
th(L) Hold time
nAx to nLEAB, nBx to nLEBA 31.0
1.0 0.2
–0.2 ns
ts(H)
ts(L) Setup time
nAx to nEAB, nBx to nEBA 30.5
1.5 –0.3
–0.6 ns
th(H)
th(L) Hold time
nAx to nEAB, nBx to nEBA 31.2
1.5 0
0.2 ns
tW(L) Latch enable pulse width, LOW 3 1.5 – ns
fl ‘ W/A i?
Philips Semiconductors Product data sheet
74ALVT165432.5 V/3.3 V 16-bit registered transceiver (3-State)
2004 Sep 14 10
AC WAVEFORMS
For all waveforms VM = 1.5 V or VCC/2, whichever is less.
VM
VM
VIN VM
tPHL tPLH
VM
VOUT
0 V
VOH
VOL
SW00185
3.0 V or VCC
whichever is
less
Waveform 1. Propagation Delay For Inverting Output
VM
VM
VM
tPLH tPHL
VM
VIN
VOUT
0 V
VOH
VOL
SW00186
3.0 V or VCC
whichever is
less
Waveform 2. Propagation Delay For Non-Inverting Output
VM
nAx,
nBx
VMVM
VMVMVM
nLEAB, nLEBA,
nEAB, nEBA
ts(H) th(H) ts(L) th(L)
tw(L)
0V
0V
NOTE: The shaded areas indicate when the input is permitted
to change for predictable output performance.
SW00187
3.0V or VCC
whichever
is less
3.0V or VCC
whichever
is less
Waveform 3. Data Setup and Hold Times and Latch Enable
Pulse Width
VM
nOEAB, nOEBA,
nEAB, nEBA VM
tPZH tPHZ
0V
VM
nAx, nBx
0V
SW00188
3.0V or VCC
whichever
is less
3.0V or VCC
Waveform 4. 3-State Output Enable Time to High Level and
Output Disable Time from High Level
tPZL tPLZ
VM
VM
nOEAB, nOEBA,
nEAB, nEBA
nAx, nBx
0V
VOL
SW00189
3.0V or VCC
whichever
is less
3.0V or VCC
whichever
is less
VM
Waveform 5. 3-State Output Enable Time to Low Level and
Output Disable Time from Low Level
Philips Semiconductors Product data sheet
74ALVT165432.5 V/3.3 V 16-bit registered transceiver (3-State)
2004 Sep 14 11
TEST CIRCUIT AND WAVEFORMS
PULSE
GENERATOR
VIN VOUT
CL
VCC
RL
Test Circuit for 3-State Outputs
VMVM
tW
NEGATIVE
PULSE 10% 10%
90% 90%
0V
VMVM
tW
POSITIVE
PULSE
90% 90%
10% 10% 0V
tTHL (tF)
tTLH (tR)t
THL (tF)
tTLH (tR)
DEFINITIONS
RL = Load resistor; see AC CHARACTERISTICS for value.
CL = Load capacitance includes jig and probe capacitance:
See AC CHARACTERISTICS for value.
RT = Termination resistance should be equal to ZOUT of
pulse generators.
INPUT PULSE REQUIREMENTS
FAMILY
74ALVT16
SWITCH POSITION
TEST SWITCH
tPLZ/tPZL 6V or VCC x 2
tPLH/tPHL Open
tPHZ/tPZH GND
6.0V or VCC x 2
RTRL
Open
GND
SW00025
D.U.T.
Amplitude Rep. Rate tWtRtF
3.0V or VCC
whichever
is less
v10MHz 500ns v2.5ns v2.5ns
VIN
VIN
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Philips Semiconductors Product data sheet
74ALVT165432.5 V/3.3 V 16-bit registered transceiver (3-State)
2004 Sep 14 12
SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm SOT371-1
Dy -.l<-z 5‘="" hhhhhhhhhhhhwhhhhhhhhhhhhh="" 2"="" pin="" 1="" index="" 0/="" |="" *="" w="" ’79="" .hhhhhhhhhh="" hihhhhhhh="" hhhhh="" 25="" j;="" dimensions="" (mm="" are="" the="" original="" dimension-l="" a="" uurr="" mm="" a.="" a:="" a3="" b,="" c="" d"!="" em="" 0="" n;="" l="" l,="" o="" v="" w="" y="" z="" e="" 015="" ms="" oze="" 0,2="" «m="" 52="" e3="" 05="" 0,50="" 05="" 3"="" mm="" '2="" 005="" 035="" ”5="" 017="" m="" 135="" so="" 0'5="" 79="" '="" 04="" 0,35="" “25="" °'°5="" °‘="" 01="" a“="" mom="" 1="" p‘asllc="" or="" metal="" pvotrusiuns="" ofojs="" mm="" maximum="" perswde="" are="" not="" inc‘uded,="" 2‘="" p‘asllc="" mtenead="" protvusions="" owes="" mm="" maxlmum="" per="" slde="" ave="" not="" \ncluded‘="" ouyline="" references="" european="" issueda're="" vensiou="" iec="" jedec="" j5,”="" projection="" w="" sotasa-i="" m0453="" e@="" 030249="">
Philips Semiconductors Product data sheet
74ALVT165432.5 V/3.3 V 16-bit registered transceiver (3-State)
2004 Sep 14 13
TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1
Philips Semiconductors Product data sheet
74ALVT165432.5 V/3.3 V 16-bit registered transceiver (3-State)
2004 Sep 14 14
REVISION HISTORY
Rev Date Description
_3 20040914 Product data sheet (9397 750 14059). Supersedes data of 1998 Feb 13 (9397 750 03568).
Modifications:
Ordering information table on page 2:
remove “North America” column; rename third column from “Outside North America” to “Type Number”.
DC Electrical Characteristics (3.3 V ± 0.3 V range) table on page 6:
II on Data pins: add condition ‘VCC = 3.6 V; VI = 5.5 V’ and values 0.1 µA (typ) and 20 µA (max).
AC Characteristics (3.3 V ± 0.3 V range) table on page 8:
change propagation delay nAx to nBx tPLH Max. time from 2.5 ns to 2.6 ns
change output disable time nOEBA to nAx, nOEAB to nBx tPHZ (Max.) time from 4.7 ns to 4.8 ns
change output disable time nOEBA to nAx, nOEAB to nBx tPLZ (Max.) time from 4.0 ns to 4.2 ns
change output disable time nEBA to nAx, nEAB to nBx tPHZ (Max.) time from 4.5 ns to 4.9 ns
change output disable time nEBA to nAx, nEAB to nBx tPLZ (Max.) time from 3.8 ns to 4.2 ns
AC Setup Requirements (3.3 V ± 0.3 V range) table on page 8:
change setup time nAx to nLEAB, nBx to nLEBA ts(H) (Min.) from 0.0 ns to 0.5 ns; (Typ.) from –0.8 ns to 0 ns
change setup time nAx to nLEAB, nBx to nLEBA ts(L) (Typ.) from –0.3 ns to –0.4 ns
change hold time nAx to nLEAB, nBx to nLEBA th(H) (Typ.) from 0.4 ns to 0.2 ns
change hold time nAx to nLEAB, nBx to nLEBA th(L) (Typ.) from 0.8 ns to –0.3 ns
change setup time nAx to nEAB, nBx to nEBA ts(H) (Typ.) from –0.8 ns to –0.3 ns
change setup time nAx to nEAB, nBx to nEBA ts(L) (Typ.) from –0.2 ns to –0.6 ns
change hold time nAx to nEAB, nBx to nEBA th(H) (Typ.) from 0.3 ns to 0.6 ns
change hold time nAx to nEAB, nBx to nEBA th(L) (Typ.) from 1.1 ns to 0.1 ns
AC Setup Requirements (2.5 V ± 0.2 V range) table on page 9:
change setup time nAx to nLEAB, nBx to nLEBA ts(H) (Min.) from 0 ns to 0.5 ns; (Typ.) from –0.9 ns to –0.2 ns
change setup time nAx to nLEAB, nBx to nLEBA ts(L) (Typ.) from 0.2 ns to –0.5 ns
change hold time nAx to nLEAB, nBx to nLEBA th(H) (Min.) from 0.8 ns to 1.0 ns; (Typ.) from –0.2 ns to 0.2 ns
change hold time nAx to nLEAB, nBx to nLEBA th(L) (Min.) from 1.7 ns to 1.0 ns; (Typ.) from 1.0 ns to –0.2 ns
change setup time nAx to nEAB, nBx to nEBA ts(H) (Min.) from 0 ns to 0.5 ns; (Typ.) from –1.0 ns to –0.3 ns
change setup time nAx to nEAB, nBx to nEBA ts(L) (Typ.) from 0.4 ns to –0.6 ns
change hold time nAx to nEAB, nBx to nEBA th(H) (Min.) from 0.5 ns to 1.2 ns; (Typ.) from 0.2 ns to 0 ns
change hold time nAx to nEAB, nBx to nEBA th(L) (Min.) from 2.0 ns to 1.5 ns; (Typ.) from 1.3 ns to 0.2 ns
_2 19980213 Product specification (9397 750 03568). ECN 853-1823 18958 of 13 February 1998.
Supersedes data of 1995 Dec 21.
_1 19951221
sales.addresses@www.semiconduclorsphilipsxmm, Mémmbm PHILIPS
Philips Semiconductors Product data sheet
74ALVT165432.5 V/3.3 V 16-bit registered transceiver (3-State)
2004 Sep 14 15
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given
in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no
representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be
expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree
to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes in the products—including circuits, standard cells, and/or software—described
or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated
via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys
no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent,
copyright, or mask work right infringement, unless otherwise specified.
Contact information
For additional information please visit
http://www.semiconductors.philips.com. Fax: +31 40 27 24825
For sales offices addresses send e-mail to:
sales.addresses@www.semiconductors.philips.com.
Koninklijke Philips Electronics N.V. 2004
All rights reserved. Published in the U.S.A.
Date of release: 09-04
Document number: 9397 750 14059


Data sheet status[1]
Objective data sheet
Preliminary data sheet
Product data sheet
Product
status[2] [3]
Development
Qualification
Production
Definitions
This data sheet contains data from the objective specification for product development.
Philips Semiconductors reserves the right to change the specification in any manner without notice.
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL
http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
Level
I
II
III

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