74ABT541 Datasheet by NXP USA Inc.

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74ABT541
Octal buffer/line driver (3-State)
Product specification
Supersedes data of 1996 Sep 10 1998 Jan 16
INTEGRATED CIRCUITS
IC23 Data Handbook
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Philips Semiconductors Product specification
74ABT541Octal buffer/line driver (3-State)
2
1998 Jan 16 853-1458 18864
FEATURES
Octal bus interface
Functions similar to the ’ABT241
Provides ideal interface and increases fan-out of MOS
Microprocessors
Efficient pinout to facilitate PC board layout
3-State buffer outputs sink 64mA and source 32mA
Power-up 3-State
Latch-up protection exceeds 500mA per Jedec JC40.2 Std 17
ESD protection exceeds 2000 V per MIL STD 883 Method 3015
and 200 V per Machine Model
Live insertion/extraction permitted
DESCRIPTION
The 74ABT541 high-performance BiCMOS device combines low
static and dynamic power dissipation with high speed and high
output drive.
The 74ABT541 device is an octal buffer that is ideal for driving bus
lines. The outputs are all capable of sinking 64mA and sourcing
32mA. The device features input and outputs on opposite sides of
the package to facilitate printed circuit board layout.
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS
Tamb = 25°C; GND = 0V TYPICAL UNIT
tPLH
tPHL
Propagation delay
An to Yn CL = 50pF; VCC = 5V 2.9 ns
CIN Input capacitance VI = 0V or VCC 4 pF
COUT Output capacitance Outputs disabled; VO = 0V or VCC 7 pF
ICCZ Total supply current Outputs disabled; VCC = 5.5V 500 nA
ORDERING INFORMATION
PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER
20-Pin Plastic DIP –40°C to +85°C74ABT541 N 74ABT541 N SOT146-1
20-Pin plastic SO –40°C to +85°C74ABT541 D 74ABT541 D SOT163-1
20-Pin Plastic SSOP Type II –40°C to +85°C74ABT541 DB 74ABT541 DB SOT339-1
20-Pin Plastic TSSOP Type I –40°C to +85°C74ABT541 PW 74ABT541PW DH SOT360-1
PIN CONFIGURATION
1
2
3
4
5
6
7
8
9
10 11
12
13
14
15
16
17
18
19
20
OE0
A0
A1
A2
A3
A4
A5
A6
A7
GND
VCC
OE1
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
SA00202
LOGIC SYMBOL
A0
A1
A2
A3
A4
A5
A6
A7
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
1
19
OE0
OE1
SA00203
Philips Semiconductors Product specification
74ABT541Octal buffer/line driver (3-State)
1998 Jan 16 3
LOGIC SYMBOL (IEEE/IEC)
EN
19
2 18
317
416
515
1&
614
713
812
911
SA00204
PIN DESCRIPTION
PIN NUMBER SYMBOL NAME AND FUNCTION
2, 3, 4, 5,
6, 7, 8, 9 A0 – A7 Data inputs
18, 17, 16, 15,
14, 13, 12, 11 Y0 – Y7 Data outputs
1, 19 OE0, OE1Output enables
10 GND Ground (0V)
20 VCC Positive supply voltage
FUNCTION TABLE
INPUTS OUTPUTS
OE0 OE1 An Yn
L
L
X
H
L
L
H
X
L
H
X
X
L
H
Z
Z
H = High voltage level
L = Low voltage level
X = Don’t care
Z = High impedance ”off” state
ABSOLUTE MAXIMUM RATINGS1, 2
SYMBOL PARAMETER CONDITIONS RATING UNIT
VCC DC supply voltage –0.5 to +7.0 V
IIK DC input diode current VI < 0 –18 mA
VIDC input voltage3–1.2 to +7.0 V
IOK DC output diode current VO < 0 –50 mA
VOUT DC output voltage3output in Off or High state –0.5 to +5.5 V
IOUT DC output current output in Low state 128 mA
Tstg Storage temperature range –65 to 150 °C
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
Philips Semiconductors Product specification
74ABT541Octal buffer/line driver (3-State)
1998 Jan 16 4
RECOMMENDED OPERATING CONDITIONS
SYMBOL PARAMETER LIMITS UNIT
Min Max
VCC DC supply voltage 4.5 5.5 V
VIInput voltage 0 VCC V
VIH High-level input voltage 2.0 V
VIL Low-level Input voltage 0.8 V
IOH High-level output current –32 mA
IOL Low-level output current 64 mA
t/vInput transition rise or fall rate 0 5 ns/V
Tamb Operating free-air temperature range –40 +85 °C
DC ELECTRICAL CHARACTERISTICS
LIMITS
SYMBOL PARAMETER TEST CONDITIONS Tamb = +25°CTamb = –40°C
to +85°CUNIT
Min Typ Max Min Max
VIK Input clamp voltage VCC = 4.5V; IIK = –18mA –0.9 –1.2 –1.2 V
VCC = 4.5V; IOH = –3mA; VI = VIL or VIH 2.5 2.9 2.5 V
VOH High-level output voltage VCC = 5.0V; IOH = –3mA; VI = VIL or VIH 3.0 3.4 3.0 V
VCC = 4.5V; IOH = –32mA; VI = VIL or VIH 2.0 2.4 2.0 V
VOL Low-level output voltage VCC = 4.5V; IOL = 64mA; VI = VIL or VIH 0.42 0.55 0.55 V
IIInput leakage current VCC = 5.5V; VI = GND or 5.5V ±0.01 ±1.0 ±1.0 µA
IOFF Power-off leakage current VCC = 0.0V; VI or VO 4.5V ±5.0 ±100 ±100 µA
IPU/IPD Power-up/down 3-state
output current3VCC = 2.0V; VO = 0.5V; VI = GND or VCC;
VOE = Don’t care ±5.0 ±50 ±50 µA
IOZH 3-State output High current VCC = 5.5V; VO = 2.7V; VI = VIL or VIH 5.0 50 50 µA
IOZL 3-State output Low current VCC = 5.5V; VO = 0.5V; VI = VIL or VIH –5.0 –50 –50 µA
ICEX Output High leakage current VCC = 5.5V; VO = 5.5V; VI = GND or VCC 5.0 50 50 µA
IOOutput current1VCC = 5.5V; VO = 2.5V –40 –100 –180 –40 –180 mA
ICCH VCC = 5.5V; Outputs High, VI = GND or VCC 0.5 250 250 µA
ICCL Quiescent supply current VCC = 5.5V; Outputs Low, VI = GND or VCC 24 30 30 mA
ICCZ VCC = 5.5V; Outputs 3-State;
VI = GND or VCC 0.5 250 250 µA
Outputs enabled, one input at 3.4V, other
inputs at VCC or GND; VCC = 5.5V 0.5 1.5 1.5 mA
ICC Additional supply current per
input pin2Outputs 3-State, one data input at 3.4V,
other inputs at VCC or GND; VCC = 5.5V 0.5 50 50 µA
Outputs 3-State, one enable input at 3.4V,
other inputs at VCC or GND; VCC = 5.5V 0.5 1.5 1.5 mA
NOTES:
1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
2. This is the increase in supply current for each input at 3.4V.
3. This parameter is valid for any VCC between 0V and 2.1V with a transition time of up to 10msec. For VCC = 2.1V to VCC = 5V 10%, a
transition time of up to 100µsec is permitted.
OUTPUT Vm mam Waveform 1. Wavelorms Showing me lnpul (An) m ompm (Vn) v" ouwm Propagation Delays iseaJan 16
Philips Semiconductors Product specification
74ABT541Octal buffer/line driver (3-State)
1998 Jan 16 5
AC CHARACTERISTICS
GND = 0V; tR = tF = 2.5ns; CL = 50pF, RL = 500
LIMITS
SYMBOL PARAMETER WAVEFORM Tamb = +25°C
VCC = +5.0V Tamb = –40°C to +85°C
VCC = +5.0V ±0.5V UNIT
Min Typ Max Min Max
tPLH
tPHL
Propagation delay
An to Yn 11.0
1.0 2.6
2.9 4.1
4.2 1.0
1.0 4.6
4.6 ns
tPZH
tPZL
Output enable time
to High and Low level 21.1
2.1 3.1
4.4 4.8
5.9 1.1
2.1 5.3
6.4 ns
tPHZ
tPLZ
Output disable time
from High and Low level 22.1
1.7 5.1
4.7 6.6
6.2 2.1
1.7 7.1
6.7 ns
AC WAVEFORMS
VM = 1.5V, VIN = GND to 3.0V
INPUT
1.5V
OUTPUT
tPLH tPHL
SA00028
1.5V
1.5V 1.5V
3 V
0 V
VOH
VOL
Waveform 1. Waveforms Showing the Input (An) to Output (Yn)
Propagation Delays
OEn
INPUT
VM
VM
tPZH tPHZ
Yn
OUTPUT
VOH
VM
VM
Yn
OUTPUT VOL
tPZL tPLZ 3.5V
0V
VOL + 0.3V
VOH – 0.3V
SA00206
Waveform 2. Waveforms Showing the 3-State Output Enable
and Disable Times
TEST CIRCUIT AND WAVEFORMS
CL = 50 pF 500
Load Circuit
DEFINITIONS
CL = Load capacitance includes jig and probe capacitance;
see AC CHARACTERISTICS for value.
TEST S1
tpd open
tPLZ/tPZL 7 V
tPHZ/tPZH open
SA00012
500
From Output
Under Test
S1
7 V
Open
GND
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Philips Semiconductors Product specification
74ABT541Octal buffer/line driver (3-State)
1998 Jan 16 6
DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1
pin 1 Index {H H Hi} H H} 0 5 10mm |_._._._._|_._._._._A scale DIMENSIONS (Inch dlmenflont are cleaved mm me origin.- mm dimensions) qur max. A1 A: A; 0,, c N" EN e H: L L, 0 v w y z") a 0.30 2,45 0.49 032 130 7a 1005 11 11 09 mm 2'65 0.10 2,25 0'25 0.30 023 120 74 ‘27 1000 ‘4 04 10 025 025 0‘ 04 a“ 0.012 0.096 0019 0010 0.51 030 0.42 0042 004a 0025 0” .1 "'0'“ 0 0 0.004 0.089 0.01 0014 0009 0.49 029 0050 0.39 0055 0015 0039 am 001 0004 0010 Nae I. Flaslic 0v metal pvolvusions 010.15 mm maxwmum pevswde ave not mcluded REFERENCES ou'erE EUROPEAN IssuE nA‘rE VERSION .Ec JEDEC EIM PROJEDYION H sonasr‘ 075EOA MsoisAC EQ 95701724
Philips Semiconductors Product specification
74ABT541Octal buffer/line driver (3-State)
1998 Jan 16 7
SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
Philips Semiconductors Product specification
74ABT541Octal buffer/line driver (3-State)
1998 Jan 16 8
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1
-HHHHHHHHH" , ,i i,i, A2 — § (A3) A Ow LL E & ‘HHH HHHHHm L J4; 0 25 5mm Li—l—A—lgigl—I—HJ DIMENSIONS (mm are ih. Orlglnnl dlmonslons) W" mix. ‘1 A2 A: b» c 0‘” E‘z' . H: L L, c: v w y zm e mm W 3.32 3.23 026 3'13 3.? ii 2.3 0-65 22 ‘10 3.22 33 02 m 0,1 3,3 2: N019: 1 Flask; or metal pvovusions of o 15 mm maximum per side are "0‘ \ncluded, 2 Flash inlerlead protrusions of 0.25 mm maximum per side are no eluded, OU'flJNE REFERENCES EUROPEAN IssuE DATE VERSION IEc JEDEC EIAJ PROJECTION soTaao-I MO-153AC E- @ 9965-0930:
Philips Semiconductors Product specification
74ABT541Octal buffer/line driver (3-State)
1998 Jan 16 9
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1
Philips Semiconductors Product specification
74ABT541Octal buffer/line driver (3-State)
1998 Jan 16 10
NOTES
Document alder numbev 93977750703614 Laémnwbm PH I LI PS
Philips Semiconductors Product specification
74ABT541Octal buffer/line driver (3-State)
yyyy mmm dd 11
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print code Date of release: 05-96
Document order number: 9397-750-03614
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Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition [1]
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
Data sheet status
[1] Please consult the most recently issued datasheet before initiating or completing a design.

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