74ABT241 Datasheet by NXP USA Inc.

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Product specification 1998 Jan 16
INTEGRATED CIRCUITS
Supersedes data of 1996 Sep 25
IC23 Data Handbook
74ABT241
Octal buffer/line driver (3-State)
3333333333 V EEEEEEEEEE 3
Philips Semiconductors Product specification
74ABT241Octal buffer/line driver (3-State)
2
1998 Jan 16 853–1456 18867
FEATURES
Octal bus interface
3-State buffers
Power-up 3-State
Output capability: +64mA/–32mA
Latch-up protection exceeds 500mA per Jedec Std 17
ESD protection exceeds 2000 V per MIL STD 883 Method 3015
and 200 V per Machine Model
Inputs are disabled during 3-State mode
DESCRIPTION
The 74ABT241 high-performance BiCMOS device combines low
static and dynamic power dissipation with high speed and high
output drive.
The 74ABT241 device is an octal buffer that is ideal for driving bus
lines. The device features two Output Enables (1OE, 2OE), each
controlling four of the 3-State outputs.
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS
Tamb = 25°C; GND = 0V TYPICAL UNIT
tPLH
tPHL
Propagation delay
An to Yn CL = 50pF; VCC = 5V 2.6
2.7 ns
CIN Input capacitance VI = 0V or VCC 3 pF
COUT Output capacitance Outputs disabled; VO = 0V or VCC 7 pF
ICCZ Total supply current Outputs disabled; VCC = 5.5V 50 µA
ORDERING INFORMATION
PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER
20-Pin Plastic DIP –40°C to +85°C74ABT241 N 74ABT241 N SOT146-1
20-Pin plastic SO –40°C to +85°C74ABT241 D 74ABT241 D SOT163-1
20-Pin Plastic SSOP Type II –40°C to +85°C74ABT241 DB 74ABT241 DB SOT339-1
20-Pin Plastic TSSOP Type I –40°C to +85°C74ABT241 PW 74ABT241PW DH SOT360-1
PIN CONFIGURATION
1
2
3
4
5
6
7
8
9
10 11
12
13
14
15
16
17
18
19
20
1OE
1A0
2Y0
1A1
2Y1
1A2
2Y2
1A3
2Y3 1Y3
GND
2A2
1Y2
2A1
1Y1
2A0
1Y0
2OE
VCC
2A3
SA00038
PIN DESCRIPTION
PIN NUMBER SYMBOL NAME AND FUNCTION
2, 4, 6, 8 1A0 – 1A3 Data inputs
17, 15, 13, 11 2A0 – 2A3 Data inputs
18, 16, 14, 12 1Y0 – 1Y3 Data outputs
3, 5, 7, 9 2Y0 – 2Y3 Data outputs
1, 19 1OE, 2OE Output enables
10 GND Ground (0V)
20 VCC Positive supply voltage
wgf w w iseaJan 16
Philips Semiconductors Product specification
74ABT241Octal buffer/line driver (3-State)
1998 Jan 16 3
LOGIC SYMBOL (IEEE/IEC)
1
2 18
4 16
6 14
812
19
17 3
15 5
13 7
11 9
EN
EN
SA00040
LOGIC SYMBOL
1OE
1
1A0
2
1A1
4
1A2
6
1A3
8
2OE
19
2A0
17
2A1
18
15
2A2
13
16
2A3
11
14
12
1Y0
1Y1
1Y2
1Y3
2Y0
2Y1
2Y2
2Y3
3
5
7
9
SA00039
FUNCTION TABLE
INPUTS OUTPUTS
1OE 1An 2OE 2An 1Yn 2Yn
L L H L L L
L H H H H H
H X L X Z Z
H = High voltage level
L = Low voltage level
X = Don’t care
Z = High impedance ”off” state
ABSOLUTE MAXIMUM RATINGS1, 2
SYMBOL PARAMETER CONDITIONS RATING UNIT
VCC DC supply voltage –0.5 to +7.0 V
IIK DC input diode current VI < 0 –18 mA
VIDC input voltage3–1.2 to +7.0 V
IOK DC output diode current VO < 0 –50 mA
VOUT DC output voltage3output in Off or High state –0.5 to +5.5 V
IOUT DC output current output in Low state 128 mA
Tstg Storage temperature range –65 to 150 °C
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
Philips Semiconductors Product specification
74ABT241Octal buffer/line driver (3-State)
1998 Jan 16 4
RECOMMENDED OPERATING CONDITIONS
SYMBOL PARAMETER LIMITS UNIT
Min Max
VCC DC supply voltage 4.5 5.5 V
VIInput voltage 0 VCC V
VIH High-level input voltage 2.0 V
VIL Low-level Input voltage 0.8 V
IOH High-level output current –32 mA
IOL Low-level output current 64 mA
t/vInput transition rise or fall rate 0 5 ns/V
Tamb Operating free-air temperature range –40 +85 °C
DC ELECTRICAL CHARACTERISTICS
LIMITS
SYMBOL PARAMETER TEST CONDITIONS Tamb = +25°CTamb = –40°C
to +85°CUNIT
Min Typ Max Min Max
VIK Input clamp voltage VCC = 4.5V; IIK = –18mA –0.9 –1.2 –1.2 V
VCC = 4.5V; IOH = –3mA; VI = VIL or VIH 2.5 2.9 2.5 V
VOH High-level output voltage VCC = 5.0V; IOH = –3mA; VI = VIL or VIH 3.0 3.4 3.0 V
VCC = 4.5V; IOH = –32mA; VI = VIL or VIH 2.0 2.4 2.0 V
VOL Low-level output voltage VCC = 4.5V; IOL = 64mA; VI = VIL or VIH 0.42 0.55 0.55 V
IIInput leakage current VCC = 5.5V; VI = GND or 5.5V ±0.01 ±1.0 ±1.0 µA
IOFF Power-off leakage current VCC = 0.0V; VI or VO 4.5V ±5.0 ±100 ±100 µA
IPU/IPD Power-up/down 3-State
output current3VCC = 2.0V; VO = 0.5V; VI = GND or VCC;
VOE = VCC; VOE = GND ±5.0 ±50 ±50 µA
IOZH 3-State output High current VCC = 5.5V; VO = 2.7V; VI = VIL or VIH 5.0 50 50 µA
IOZL 3-State output Low current VCC = 5.5V; VO = 0.5V; VI = VIL or VIH –5.0 –50 –50 µA
ICEX Output High leakage current VCC = 5.5V; VO = 5.5V; VI = GND or VCC 5.0 50 50 µA
IOOutput current1VCC = 5.5V; VO = 2.5V –50 –100 –180 –50 –180 mA
ICCH VCC = 5.5V; Outputs High, VI = GND or VCC 50 250 250 µA
ICCL Quiescent supply current VCC = 5.5V; Outputs Low, VI = GND or VCC 24 30 30 mA
ICCZ VCC = 5.5V; Outputs 3–State;
VI = GND or VCC 50 250 250 µA
Outputs enabled, one input at 3.4V, other
inputs at VCC or GND; VCC = 5.5V 0.5 1.5 1.5 mA
ICC Additional supply current per
input pin2Outputs 3-State, one data input at 3.4V, other
inputs at VCC or GND; VCC = 5.5V 50 250 250 µA
Outputs 3-State, one enable input at 3.4V,
other inputs at VCC or GND; VCC = 5.5V 0.5 1.5 1.5 mA
NOTES:
1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
2. This is the increase in supply current for each input at 3.4V.
3. This parameter is valid for any VCC between 0V and 2.1V with a transition time of up to 10msec. For VCC = 2.1V to VCC = 5V 10%, a
transition time of up to 100 µsec is permitted.
OUTPUT vm SA 00523 Waveform 1. Wavelorms Showing me Inpul (An) :0 Oulpul (Vn) Fropagalion Delays Vn OUTPUT (MW iseaJan 16
Philips Semiconductors Product specification
74ABT241Octal buffer/line driver (3-State)
1998 Jan 16 5
AC CHARACTERISTICS
GND = 0V; tR = tF = 2.5ns; CL = 50pF, RL = 500
LIMITS
SYMBOL PARAMETER WAVEFORM Tamb = +25°C
VCC = +5.0V Tamb = –40°C to +85°C
VCC = +5.0V ±0.5V UNIT
Min Typ Max Min Max
tPLH
tPHL
Propagation delay
An to Yn 11.0
1.0 2.6
2.7 4.1
4.2 1.0
1.0 4.6
4.6 ns
tPZH
tPZL
Output enable time
to High and Low level 21.1
1.3 3.2
4.3 6.3
5.8 1.1
1.3 6.8
6.8 ns
tPHZ
tPLZ
Output disable time
from High and Low level 21.6
1.0 3.6
2.6 6.1
5.4 1.6
1.0 7.1
5.9 ns
AC WAVEFORMS
VM = 1.5V, VIN = GND to 3.0V
INPUT
1.5V
OUTPUT
tPLH tPHL
SA00028
1.5V
1.5V 1.5V
3 V
0 V
VOH
VOL
Waveform 1. Waveforms Showing the Input (An)
to Output (Yn) Propagation Delays
OE INPUT
VM
VM
tPZH tPHZ
Yn OUTPUT
VOH
VM
VM
Yn OUTPUT
VOL
tPZL tPLZ 3.5V
0V
VOL + 0.3V
VOH – 0.3V
SA00041
OE INPUT
Waveform 2. Waveforms Showing the 3–State Output
Enable and Disable Times
TEST CIRCUIT AND WAVEFORMS
CL = 50 pF 500
Load Circuit
DEFINITIONS
CL = Load capacitance includes jig and probe capacitance;
see AC CHARACTERISTICS for value.
TEST S1
tpd open
tPLZ/tPZL 7 V
tPHZ/tPZH open
SA00012
500
From Output
Under Test
S1
7 V
Open
GND
p. seanng plane b 20 I 11 MH inlindex 1}” L1} L1} Lu" LuJ LLI’IILLIJ U L..." LuJ U 1 I 10 5 10mm l_._._._l_|_._._._._l scale DIMENSIONS (Inch dimonslona In derived from 111. nngIIIII mm dimonalona) A A1 A2 1‘) (‘7 Z") UNIT max. ml". 111:» b b‘ c 0 E 0 0. L M; MN w m“ 1.73 0,53 030 26.92 6.40 3.50 0,25 10,0 """ "2 “'5' 3'2 1.30 0.38 02:5 26.54 6.22 2'54 762 3.05 7.80 as ”25‘ 2'0 . 0.068 0.021 0.014 1050 0.25 0.14 0.52 0.59 ”"65 0‘7 “02° 0,13 0,051 0.015 0.009 1045 0.24 °“° 03° 0.12 0.31 0.33 00‘ 0”” mm 1. P135119 or meml protrusions 010 25 mm m ' um perside are nol included. OUTLINE REFERENCES EUROPEAN ISSUEDA'I'E VERSION IEC JEDEC EW PROJECTION 9244—1} same-1 scaoa E- @ 950544
Philips Semiconductors Product specification
74ABT241Octal buffer/line driver (3-State)
1998 Jan 16 6
DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1
)> \_______________ A2 _j J A 1 (A3) , 1 : pin 1 index f {H H H jag; o 5 10 mm |_._._._._|_._._._._A scale DIMENSIONS {inch dim-minus m duivcd lrom m- or nil mm dim-minus) uurrmLA‘ A: A: up e [WEm e "E L LP a v w y 1(“6 "'"‘ 2'55 32?: :23 0‘25 $233 333 :32: 3: “27 $233 “4 $21 :23 “25 0‘25 W 323 an mmfimmmmmmmxmmmwwmm“ Note L Plasn'c or may pvolrusions won mm maxwmum perswde ave not mcluded‘ REFERENCES 3:;;:: E.“ mm mans so'r ‘ as" 075EOA M301 SAC 12 Q m
Philips Semiconductors Product specification
74ABT241Octal buffer/line driver (3-State)
1998 Jan 16 7
SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
1"fiHHHHHHHHH" ‘ f: . ’" ’ * ’ ’ A. (A3) A piniindex i ‘ ‘ f 97.0 ‘ ‘0 *L‘ IE 0 5mm |_A_I_I_I_I_I_A_I_I_l DIMENSIONS (mm Ire the orlglml dlmenslont) A W" max. “I “2 A: ”p ° 0‘“ E‘” e H: L LP a v w y 20: a 0.21 ‘50 0.35 0.20 7.4 5.4 7.9 1.03 U 9 0.9 8° '"'“ 2° 0.05 165 0'25 0.25 0.09 7.0 5.2 0’65 7.5 “25 0.53 07 0‘2 0‘” 0,1 0.5 0° N0" 1. PIBS1K> or mml protrusions 0' 0 20 mm maxim um per Side are "0| included. OUTLINE REFERENCES EUROPEAN ISSUEDATE VERSION IEC JEDEC EIAJ PROJECTION SOT339-I MO-ISUAE E- @ 99:09:09:
Philips Semiconductors Product specification
74ABT241Octal buffer/line driver (3-State)
1998 Jan 16 8
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1
.IIHHHHHHHH“ i,i, A2 — § (A3) Ow LL E I ‘HHH HHHHHIO L II x: a 2'5 5 mm |_|_|_A_|_I_|_|_|_A_l scale A 1 2 1 UNIT max A‘ A2 A3 I:p c D" E" 0 H5 L LD 9 v w y zH I: ms 095 no 02 as 45 as 075 04 05 3° """ “‘0 0.05 0,30 "'25 019 0.1 m 5.3 ”‘65 5,2 “0 0.50 03 0’2 ”“3 0" 02 0° N019: I Flask; or metal protrusions of o 15 mm maxImum per sIde are run Included, 2 Flash inlerlead protrusions of 0.25 mm maximum per side are n eluded, OU'flJNE REFERENCES EUROPEAN IssuE DATE VERSION IEc JEDEC Em PROJECTION We soTaao-I MO-153AC E- @ 95-02-04
Philips Semiconductors Product specification
74ABT241Octal buffer/line driver (3-State)
1998 Jan 16 9
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1
77777777777777
Philips Semiconductors Product specification
74ABT241Octal buffer/line driver (3-State)
yyyy mmm dd 10
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print code Date of release: 05-96
Document order number: 3997-750-03464
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Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition [1]
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
Data sheet status
[1] Please consult the most recently issued datasheet before initiating or completing a design.

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