2PC4617M Series Datasheet by NXP USA Inc.

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DATA SHEET
Product data sheet 2003 Jul 15
DISCRETE SEMICONDUCTORS
2PC4617M series
NPN general purpose transistors
M3D883
BOTTOM VIEW
MARKING TVPE NUMBER MARKING CODE 2PC4617QM D7 2PC4617RM D8 2PC4617SM D9 \_l ’_‘ Emlnm wew 2003 Ju‘ 15
2003 Jul 15 2
NXP Semiconductors Product data sheet
NPN general purpose transistors 2PC4617M series
FEATURES
Leadless ultra small plastic package
(1 mm × 0.6 mm × 0.5 mm)
Board space 1.3 × 0.9 mm
Power dissipation comparable to SOT23.
APPLICATIONS
General purpose small signal DC applications
Low and medium frequency AC applications
Mobile communications, digital (still) cameras, PDAs,
PCMCIA cards.
DESCRIPTION
NPN general purpose transistor in a SOT883 leadless ultra
small plastic package.
PNP complement: 2PA1776M series.
MARKING
TYPE NUMBER MARKING CODE
2PC4617QM D7
2PC4617RM D8
2PC4617SM D9
PINNING
PIN DESCRIPTION
1base
2emitter
3collector
handbook, halfpage
MAM475
1
2
3
2
1
3
Bottom view
Fig.1 Simplified outline (SOT883) and symbol.
QUICK REFERENCE DATA
SYMBOL PARAMETER MAX. UNIT
VCEO collector-emitter voltage 50 V
ICcollector current (DC) 100 mA
ICM peak collector current 200 mA
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 60134).
Notes
1. Refer to SOT883 standard mounting conditions (footprint), FR4 with 60 μm copper strip line.
2. Device mounted on a FR4 printed-circuit board, single-sided copper, mounting pad for collector 1 cm2.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCBO collector-base voltage open emitter 50 V
VCEO collector-emitter voltage open base 50 V
VEBO emitter-base voltage open collector 5 V
ICcollector current (DC) 100 mA
ICM peak collector current 200 mA
IBM peak base current 200 mA
Ptot total power dissipation Tamb 25 °C
note 1 250 mW
note 2 430 mW
Tstg storage temperature 65 +150 °C
Tjjunction temperature 150 °C
Tamb operating ambient temperature 65 +150 °C
2003 Jul 15 3
NXP Semiconductors Product data sheet
NPN general purpose transistors 2PC4617M series
THERMAL CHARACTERISTICS
Notes
1. Refer to SOT883 standard mounting conditions (footprint), FR4 with 60 μm copper strip line.
2. Device mounted on a FR4 printed-circuit board, single-sided copper, mounting pad for collector 1 cm2.
CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
Note
1. Pulse test: tp 300 μs; δ 0.02.
SYMBOL PARAMETER CONDITIONS VALUE UNIT
Rth j-a thermal resistance from junction to ambient in free air
note 1 500 K/W
note 2 290 K/W
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
ICBO collector-base cut-off current VCB = 30 V; IE = 0 100 nA
VCB = 30 V; IE = 0; Tj = 150 °C5μA
IEBO emitter-base cut-off current VEB = 4 V; IC = 0 100 nA
hFE DC current gain VCE = 6 V; IC = 1 mA
2PC4617QM 120 270
2PC4617RM 180 390
2PC4617SM 270 560
VCEsat collector-emitter saturation voltage IC = 50 mA; IB = 5 mA; note 1 200 mV
Cccollector capacitance IE = ie = 0; VCB = 12 V; f = 1 MHz 1.5 pF
fTtransition frequency VCE = 12 V; IC = 2 mA;
f = 100 MHz
100 MHz
NXP Semiconductors NPN general pu PACKAGE OUTLINE Leadless ultra small pla 2 ‘ 1 ‘ ‘ \ in, ,i i, D T ' ‘ a E 2 m A |: :I T E 77,7,7,7,7,7, D o as \_A_A_A_A_‘_A_A_A_A_l scale DIMENSIONS (mm are the orlgmal mmensmns) A 1 ‘ uNIT At) m“ b D E e e L L‘ use 020 055 062 102 can 030 mm 046 “03 012 0A7 055 095 “5 “65 022 022 Mme 1 Incmdmg mahng chness OUTLINE REFERENCES EUROPEA VERSION IE5 JEDEC JEITA PROJECTIO 50mm 507on S@ 2003 Ju‘ 15 4
2003 Jul 15 4
NXP Semiconductors Product data sheet
NPN general purpose transistors 2PC4617M series
PACKAGE OUTLINE
UNIT A1
max.
A(1) bb
1e1
eLL
1
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.50
0.46 0.20
0.12 0.55
0.47
0.03 0.62
0.55 0.35 0.65
DIMENSIONS (mm are the original dimensions)
Note
1. Including plating thickness
0.30
0.22
0.30
0.22
SOT883 SC-101 03-02-05
03-04-03
DE
1.02
0.95
L
E
2
3
1
b
b1
A1
A
D
L1
0 0.5 1 mm
scale
L
eadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm SOT88
3
e
e1
2003 Jul 15 5
NXP Semiconductors Product data sheet
NPN general purpose transistors 2PC4617M series
DATA SHEET STATUS
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DOCUMENT
STATUS(1) PRODUCT
STATUS(2) DEFINITION
Objective data sheet Development This document contains data from the objective specification for product
development.
Preliminary data sheet Qualification This document contains data from the preliminary specification.
Product data sheet Production This document contains the product specification.
DISCLAIMERS
General Information in this document is believed to be
accurate and reliable. However, NXP Semiconductors
does not give any representations or warranties,
expressed or implied, as to the accuracy or completeness
of such information and shall have no liability for the
consequences of use of such information.
Right to make changes NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
Suitability for use NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in medical, military, aircraft, space or life support
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
Applications Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) may cause permanent damage to
the device. Limiting values are stress ratings only and
operation of the device at these or any other conditions
above those given in the Characteristics sections of this
document is not implied. Exposure to limiting values for
extended periods may affect device reliability.
Terms and conditions of sale NXP Semiconductors
products are sold subject to the general terms and
conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, including those
pertaining to warranty, intellectual property rights
infringement and limitation of liability, unless explicitly
otherwise agreed to in writing by NXP Semiconductors. In
case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter
will prevail.
No offer to sell or license Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
Quick reference data The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
founded by PHILIPS
NXP Semiconductors
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com
© NXP B.V. 2009
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were
made to the content, except for the legal definitions and disclaimers.
Printed in The Netherlands 613514/01/pp6 Date of release: 2003 Jul 15 Document order number: 9397 750 11484

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