2PC4617 Datasheet by NXP USA Inc.

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2 emitter H 3 collector K 1 3 : 3. Ordering information W by MP;
1. Product profile
1.1 General description
NPN transistor in a SOT416 (SC-75) plastic package. The PNP complement is 2PA1774.
1.2 Features
Low current (max. 150 mA)
Low voltage (max. 50 V)
1.3 Applications
General-purpose switching and amplification in communication, Electronic Data
Processing (EDP) and consumer applications.
2. Pinning information
3. Ordering information
2PC4617
NPN general-purpose transistor
Rev. 05 — 17 November 2009 Product data sheet
Table 1. Pinning
Pin Description Simplified outline Symbol
1base
2emitter
3 collector
12
3
sym02
1
3
2
1
Table 2. Ordering information
Type number Package
Name Description Version
2PC4617Q SC-75 plastic surface mounted package; 3 leads SOT416
2PC4617R
2PC4617S
2PC4617_5 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 05 — 17 November 2009 2 of 7
NXP Semiconductors 2PC4617
NPN general-purpose transistor
4. Marking
5. Limiting values
[1] Transistor mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint.
6. Thermal characteristics
[1] Transistor mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint.
Table 3. Marking codes
Type number Marking code
2PC4617Q ZQ
2PC4617R ZR
2PC4617S ZS
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCBO collector-base voltage open emitter - 60 V
VCEO collector-emitter voltage open base - 50 V
VEBO emitter-base voltage open collector - 7 V
ICcollector current (DC) - 150 mA
ICM peak collector current - 200 mA
IBM peak base current - 200 mA
Ptot total power dissipation Tamb 25 °C[1] -150mW
Tstg storage temperature 65 +150 °C
Tjjunction temperature - 150 °C
Tamb ambient temperature 65 +150 °C
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from
junction to ambient
[1] --833K/W
2PC4617_5 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 05 — 17 November 2009 3 of 7
NXP Semiconductors 2PC4617
NPN general-purpose transistor
7. Characteristics
[1] Pulse test: tp300 μs; δ≤0.02.
Table 6. Characteristics
Tamb = 25
°
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
ICBO collector-base
cut-off current IE=0 A; V
CB =30V - - 100 nA
IE=0 A; V
CB =30V;
Tj= 150 °C--5μA
IEBO emitter-base
cut-off current IC=0 A; V
EB =4V - - 100 nA
hFE DC current gain IC=1mA; V
CE =6V [1]
2PC4617Q 120 - 270
2PC4617R 180 - 390
2PC4617S 270 - 560
VCEsat collector-emitter
saturation
voltage
IC=50mA; I
B=5mA [1] --200mV
Cccollector
capacitance IE=i
e=0 A;
VCB =12V; f=1MHz --1.5pF
fTtransition
frequency IC=2mA; V
CE =12V;
f = 100 MHz
[1] 100 - - MHz
05 1mm scale DIMENSIONS (mm are me angmal dumensmns) UNIT A A‘ n D E H L o max p c e e, E p v w m o 95 a 1 a an a 25 1 a a a 175 045 023 050 015 um 14 a7 ‘ 05 145 015 on 02 02 OUTLINE REFERENCES EUROPEAN IssuE DATE VERSION .5; JEDEC J5,” PaoJEcnoN sow a 5075 g @ W Fig 1. Package outline SOT416 (SC-75) 2mm; @NXP a v 2am AM my“ Producl data sheel 4 Rev. 05 — l7 November 2009
2PC4617_5 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 05 — 17 November 2009 4 of 7
NXP Semiconductors 2PC4617
NPN general-purpose transistor
8. Package outline
Fig 1. Package outline SOT416 (SC-75)
UNIT A1
max bpcDEe1HELpQw
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.1 0.30
0.15
0.25
0.10
1.8
1.4
0.9
0.7 0.5
e
11.75
1.45 0.2
v
0.2
DIMENSIONS (mm are the original dimensions)
0.45
0.15
0.23
0.13
SOT416 SC-75
wM
bp
D
e1
e
A
A1
Lp
Q
detail X
HE
EAB
B
vMA
0 0.5 1 mm
scale
A
0.95
0.60
c
X
12
3
Plastic surface-mounted package; 3 leads SOT41
6
04-11-04
06-03-16
Figure 1 “Package oullme SOT416 SC-75 "
2PC4617_5 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 05 — 17 November 2009 5 of 7
NXP Semiconductors 2PC4617
NPN general-purpose transistor
9. Revision history
Table 7. Revision history
Document ID Release date Data sheet status Change notice Supersedes
2PC4617_5 20091117 Product data sheet - 2PC4617_4
Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content.
Figure 1 “Package outline SOT416 (SC-75): updated
2PC4617_4 20041125 Product data sheet - 2PC4617_3
2PC4617_3 19990521 Product specification - 2PC4617_2
2PC4617_2 19980721 Product specification - 2PC4617_1
2PC4617_1 19970709 Product specification - -
hngzllwwwmxgcom salesaddresses@nxp.com
2PC4617_5 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 05 — 17 November 2009 6 of 7
NXP Semiconductors 2PC4617
NPN general-purpose transistor
10. Legal information
10.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
10.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
lounded by PHILIPS
NXP Semiconductors 2PC4617
NPN general-purpose transistor
© NXP B.V. 2009. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 17 November 2009
Document identifier: 2PC4617_5
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
12. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 2
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4
9 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 5
10 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 6
10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 6
10.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
10.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
10.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
11 Contact information. . . . . . . . . . . . . . . . . . . . . . 6
12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

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