Si2494/3x/29/19/18/17FT18-EVB User Guide Datasheet by Silicon Labs

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SILIEEIN LABS
Rev. 0.4 8/11 Copyright © 2016 by Silicon Laboratories Si24xxVMB-EVB
Global Voice ISOmodem-EVB
Evaluation Board for the Si2494/39/38/37/36/35/29/19/18/17
ISOModem
Description
The Global Voice ISOmodem EVB evaluation board
provides the system designer with an easy way of
evaluating the ISOmodem. The Voice ISOmodem EVB
consists of a motherboard with a complete removable
daughter card
The Voice ISOmodem is a complete controller based
modem chipset with an integrated and programmable
direct access arrangement (DAA) that meets the global
telephone line requirements. It is available in a 24-pin or
38-pin system side device and a 16-pin line side device.
The hardware versions at the time of publication are:
Voice Mother Board Si24xxVMB Rev 2.0
Modem Daughter Card Si24xx2G-DC Rev 2.0
Modem Daughter Card Si24xx2G-QFN38-DC Rev
1.0
The voice daughter card is populated with the correct
ISOmodem system side chip (Si2494/39/38/37/36/35/
29/19/18/17) and the correct line side DAA chip, the
Si3018 to suit the voice applications.
The ISOmodem eliminates the need for a separate DSP
data pump, modem controller, memories, codec,
isolation transformers, relays, opto-isolators and a 3-4
wire hybrid. The ISOmodem is ideal for embedded
modem and voice applications due to its small board
area, controller based architecture, low power
consumption and global compliance.
An onboard rectifier, filter, and voltage regulator allow
the power input to be 7.5–13 V ac or dc (either polarity)
supplied through a screw terminal (J8) or a standard
2 mm power jack (J9). Alternatively, power can be
supplied through the USB interface (whether the USB or
RS232 interface is used).
The Power Source Selection in automatic, while the
signaling port is selected by a jumper (JP23).
The evaluation board audio power amplifier can drive
an external speaker for either call progress monitoring
or speakerphone function. A small onboard speaker,
suitable for call progress monitoring, is installed.
Please note that fax modem versions listed in the title
require a software driver in order to implement fax send/
receive functionality. The driver must be compliant with
the Silicon Labs ISOmodem and with applicable ITU-T
standards (e.g., T.30, T.31, T.4 and T.6) Contact Silicon
Labs for details.
Features
This evaluation board includes the following:
Socketed module with the modem chipset
USB or asynch RS232 Serial Interface
RJ11 connection to the phone line
Onboard relay-excludable RJ11 connection
RS232 and USB interface to the PC
Direct access to the ISOmodem signals for
embedded system evaluation
Power from a provided 8.5–13.5 V dc power supply
or from the USB port
Handset connector (J1)
Onboard hookswitch
External hookswitch connector
Jumper matrix that allows any handset wiring
scheme to work with this board
Onboard speakerphone microphone
RCA jack connector to an optional off-board
speakerphone electret microphone
Selectable and adjustable electret power supplies for
both handset and speakerphone microphones
Onboard 300 mW audio power amplifier (into a 4
load) for driving either onboard or external speaker.
Onboard voice coil driven loudspeaker for call
monitoring
LED display of all RS232 signals
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Functional Block Diagram
As shown in Figure 1, the daughter card is a plug-in component with the complete modem, while the rest of the
motherboard provides selectable serial RS232 or USB links, the sound subsystem, and power regulation and
distribution.
Figure 1. Functional Block Diagram
The voice ISOmodem EVB provides a sound system consisting of the Si3000 codec along with a handset RJ10
connector as well as onboard microphone and loudspeaker with options for these devices to be placed off-board.
The bias voltages for both the onboard microphone and the handset microphone can modified and alternate
sources used.
This allows the board to be used as a telephone or as a speakerphone as is, or to be integrated into the customer's
system.
The evaluation board can drive an external speaker or a small onboard speaker. For speaker-phone applications it
is recommended that an off board loudspeaker be used.
An onboard rectifier, filter and voltage regulator allow the power input to be 8.5 to 13.5 V peak ac or dc of either
polarity supplied through screw terminals (J8) or a standard 2 mm power jack (J9). Alternatively the power can be
supplied through the USB interface. Automatic switching is provided for the power, but not for the data interface.
That data interface is selected by JP23.
Call
Progress
Audio
Si3000
PCM
USB/RS232
Connectors
J11/J10
I/O LED
Display Sound
Subsystem
RJ 11
Telephone
Connector
RJ 11
Telephone
Connector
Exclusion
Relay
On Board
Hook Switch
Si2494/
Si2438
Series
ISOmodem
Silicon Labs
SI3018 DAA
ISOmodem
Daughter
Card
Handset
RJ10
Ext.
Speaker
JP11
Interface
Logic
EXT.
Microphone
J2
Loudspeaker
Power
Connectors
Regulation
&
Switching
LED Status
Display
Pwr
Amp
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1. Global Voice ISOmodem EVB
The evaluation board is shown in Figure 2. Note the socketed daughter card with the modem chipset on the bottom
right of the board.
Figure 2. Global Voice ISOmodem Evaluation Board
The ISOmodem chip requires software driver in order to perform either FAX or sound functionality. Contact Silicon
Labs for details. “AN244: Si2438/37/36/35/29/19/18/17 Fax Modem Designer’s Guide” and “AN93: Si2494/93/57/
39/34/15/04 Data Modem Designer’s Guide” are useful for driver development.
The Global Voice ISOmodem EVB provides an RJ11 jack for interfacing to the phone line and the USB or serial
ports can interface to a PC or a host CPU. This allows the board to operate as a class 1 fax modem for an
evaluation or as a global voice and data modem (depending on the specific ISOmodem used).
A handset, microphone and speaker can also be attached to demonstrate the sound features, which may include
TAM and speaker-phone operations, depending on the specific ISOmodem chip used. Table 1 lists which
ISOmodem chips have these features. A software driver or application is required to perform these data and sound
operations. The included UltraCOM application can demonstrate the sound features of the ISOmodem and
provides a tool to aid development.
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2. Daughter Cards
There are two types of daughter cards available for this EVB. One supports the TSSOP version of the system side
chip, and the other supports the QFN38 version of the system side.
An example of the TSSOP version of the daughter card is shown in Figure 3. It has the ISOmodem system-side
chip as well as the Si3018 DAA chip. The left side of the board contains the system side while the right side
contains the DAA chip along with the few interface parts needed to connect tot a telephone line.
Figure 3. Daughter Card
Although this card is provided as part of the global voice EVB, it can also be directly connected to an embedded
system using TTL logic.
When run by a software driver the chipset on this daughter card is capable of making fax calls, telephone calls with
a handset, data calls and both. TAM and speaker-phone operations. Table 1 lists the various ISOmodem chips and
their features.
Table 1. ISOModem Features
Part Number Fax Data Handset TAM Speaker
Phone
Si2417 V.17 — ——
Si2418 V.17 — 
Si2419 V.17 V.32bis ——
Si2429 V.29 
Si2435 V.34 — ——
Si2436 V.34 — 
Si2437 V.34 V.34 ——
Si2438 V.34 V.34 
Si2439 — V.34 
Si2494 — V.92 
A \Mre Handset Cable 3 , . SILIEIJN LABS
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Rev. 0.4 5
3. Setup and Evaluation
This section explains how to set up the Voice ISOmodem EVB for evaluation as an RS-232 or USB interface.
Jumper settings and system interconnections are given, as well as the use of an demonstration and test
application provided called UltraCOM.
See the following documents for additional technical details
Si2494/39/38/37/36/35/29/19/18/17 data sheets
“AN244: Fax Modem Designer's Guide"
“AN93: Data Modem Designer’s Guide”
Diagrams and tables are provided here that define the operation of all the jumpers, settings and connectors, as
well as their default states.
A typical global voice EVB as it arrives from the factory can be connected into a system by using only four cables.
Figure 4. Global Voice ISOmodem EVB Connection
The UltraCOM application provided on the included CD can be used to demonstrate:
Telephone Operation.
Speakerphone Operation
Telephone answering machine operation.
Fax Operation can be demonstrated but requires a fax driver application.
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3.1. Jumpers
Figure 5 shows the function and location of the jumpers present on the global fax EVB.
JP23 Selects USB
or RS232
operation but If
no jumper is in
place neither is
used and host
must connnect
via J103 to
connect
J10. DB9
connection to
Host if JP 23
selects it.
J11. USB
connection to Host
if JP 23 selects it.
J2. Optional
mic. Input
connector
JP8. On board
mic. And
jumper to
enable it.
JP1, 2, 3, 4.
Jumpers that
configure
handset wiring to
any style. See
schematic for
details.
JP14, On Board
Speaker enable
jumper
JP12. On
Board
Power Amp
Enable.
J8, J9. Alternate
power supply
connector
options.
JP11, Audio
power output.
Recommended
for speaker-
phone operation.
J5. PSTN RJ11
connection
J5. Telephone
RJ11 connection
Daughter Cards
(rev 2.0 TSSOP ,
or rev 1.0 QFN)
plug into J101,
and JP16. here.
T1, V1A, V1B, Y2A, Y2B, PSTN
protection devices. Alternate
footprints support most
possible configurations
UART signal
LED
displays
and test
points
J103. Alternate signal
connection path to
host. Used if no
jumper is at JP23.
CMOS signaling
LS1, On Board
Speaker.
J1. Handset
Connector
JP33 Autobaud
enable
T59, TP12,TP13.
Shunt Resistor and
test points for
current
measurements
J30. Aux
Audio
connector
R13. Speaker-
phone mic gain
control
JP6, JP15, JP9.
Si3000 line in mixer
jumpers for :
microphone, AUX in
(J30), & AOUT
JP5. Mic.
fixed gain vs
adjustable
gain jumper
R24. Audio
power amplifier
gain control
J6. Uart Signaling
options. Shown
for TSSOP and
QFN default
setup.
JP34 Enable
Exclusion Relay
(operated by RI
pin)
JP24 Chooses
EEPROM operation
instead of Si3000 for
non QFN daughter
cards
JP10, JP7, JP13.
PWR Amp
input mixer
jumpers for :
AOUT, Si3000
line out, & AUX
IN (J30)
Figure 5. Function and Location of Global Voice ISOmodem EVB Jumpers
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Rev. 0.4 7
Table 2 explains the use of the data related jumpers. It also shows the default state.
Check all jumper settings on the EVB before applying power.
These default data related jumper settings shown below configure the EVB for USB serial operation with auto baud
as a default. Any terminal emulator program configured to communicate through the virtual com port created by the
provided driver can be used to communicate with the EVB. There are no BAUD settings required since the modem
has an auto baud feature.
The USB virtual com port drivers needed for the USB link to work are on the provided CD.
Customers that want to use an RS232 port only need to change JP23 and connect an RS232 cable to the host. As
with the USB configuration, any terminal emulator program configured to communicate through a PC COM port
can be used to communicate with the EVB.
Although the user can exercise many of the modem commands (including voice features) using a terminal
emulator program, a fax driver is required to implement fax send/receive functionality.
This EVB also provides an application, UltraCOM distributed on the CD that can act as a terminal emulator and as
a sound feature demonstration vehicle. See Appendix I for an UltraCOM quick start guide that shows how to run
this demonstration.
Table 2. Digital Data Related Jumpers
Jumper Number Pins Jumped Default State Comments
JP23 1–2 USB selected
2–3 UART selected
J6 1-2, 4-5, 7-8, 10-11, 13-14 Typical Si2438/37/36/35/29/19/18/17 FT
setup (24 pin pkg)
JP33 1-2 Disable Auto baud
JP24 1-2 Enable EEPROM
2-3 Enable Si3000
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Table 3 explains the use of the analog audio oriented jumpers and adjustments, while showing the default state.
These jumpers and adjustments can be used to tailor the operation of the global fax EVB so that it interfaces well
with the users host system and provides the maximum flexibility as the choice of loudspeaker microphone and
alternate sources of sound.
Table 3. Sound Related Jumpers
Jumper
Number Pins Jumped Default
State Comments
JP34 1–2 Enable Exclusion Relay
JP1 1–2 Handset pin 4 connection (ground)*
JP2 1–2 Handset pin 3 connection (ground)*
JP3 4–5 Handset pin 2 connection (earpiece signal)*
JP4 2–3 Handset pin 1 connection (mouthpiece signal)*
JP24 1–2 Enable EEPROM (factory use only)
2–3 Enable Si3000
JP5 1–2 Variable mic gain = 6 to 34 dB
3–3 Fixed mic gain = 21 dB
JP6 1–2 Mic to input mixer
JP15 1–2 External Line In to input mixer
JP9 1–2 AOUT to input mixer
JP8 1–2 Connects on board mic
JP10 1–2 AOUT to power amp mixer
JP7 1–2 Si3000 line out to power amp mixer
JP13 1–2 Aux Input to power amp mixer
JP14 1–2 On Board Speaker connected
JP12 1–2 Enable Pwr Amp.
*Note: For typical Cisco handset.
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Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 9
3.2. I/O and Adjustments
Table 4 explains the use of the adjustable analog audio-oriented controls as well as their default state.
3.3. USB Interface Data Link Setup Quick Start
1. Set jumpers according to the default configuration shown in Table 2 on page 7.
2. Connect:
Install USB cable and provided driver.
RJ-11 to phone line or test box.
3. Open the terminal emulator program, and apply power to the EVB.
4. Select the serial COM channel used.
5. Type "AT" followed by a carriage return. (Autobaud automatically adjusts modem DTE speed and protocol.).
The modem should echo "AT" and then send the "OK" response code.
6. Type ATH1 and ATH0 to seize and release the telephone line.
3.4. UltraCOM Installation Instructions
Perform the following steps:
1. Double-click the ultracom.msi file to launch the installer. Click Next.
Figure 6. UltraCOM Setup Wizard
2. Accept the default installation path and click Next.
Table 4. Audio Adjustments
Ref Default State Comments
R13 4 turns CW Mic Preamp Gain 6 dB to 34 dB
R24 CCW(21.4 dB) Power Amp Gain 21.4 dB to 46.4 dB WRT line out
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Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
10 Rev. 0.4
Figure 7. Select Installation Folder Dialog Box
3. Click Install to start the installation.
Figure 8. Install Dialog Box
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Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 11
4. After installation is complete, click Finish to close the installer.
Figure 9. Completing UltraCOM Setup Wizard
5. UltraCOM may be launched from the desktop link or from the Start menu:
Start ProgramsUltraCOMUltraCOM
6. From the UltraCOM main menu, select Help Index. This will load the help file.
7. Select the Quick Start link from the main menu and review the information.
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Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
12 Rev. 0.4
Figure 10. Quick Start
3.5. USB Interface Data Link Setup Quick Start
1. Set jumpers according to the default configuration shown in Figure 5.
2. Install the USB driver for your operating system from the CD supplied with the evaluation board.
3. Connect:
USB cable to PC
RJ-11 to phone line or test box
4. Open the terminal emulator program.
5. Select one of the USB Virtual Com Port numbers in the emulator program's user interface.
6. Type "AT" followed by a carriage return. (Autobaud automatically adjusts modem DTE speed and protocol.).
The modem should echo "AT" and then send the "OK" response code.
7. Type ATH1 and ATH0 to seize and release the telephone line.
LWIre Handset Came , . SILIEIJN LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 13
3.6. Sound Demonstration Using UltraCOM Quick Start Guide
Step 1: Perform the Quick Start USB Interface Data Link Setup Quick Start
1. Set jumpers according to the default configuration shown in Figure 5.
2. Install the USB driver for your operating system from the CD supplied with the evaluation board.
3. Connect:
USB cable to PC
RJ-11 to phone line or test box
4. Open the terminal emulator program.
5. Select one of the USB Virtual Com Port numbers in the emulator program's user interface.
6. Type "AT" followed by a carriage return. (Autobaud automatically adjusts modem DTE speed and protocol.).
The modem should echo "AT" and then send the "OK" response code.
7. Type ATH1 and ATH0 to seize and release the telephone line.
Step 2
Add connections to a loudspeaker and a handset as shown in the following diagram.
Figure 11. Sound Demonstration Hardware Interconnect Guide
Step 3:
1. Install UltraCOM (provided in this kit) on Windows XP
2. Launch UltraCOM.
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Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
14 Rev. 0.4
Step 4:
Select "Terminal-Open" making sure the serial configuration is as shown (except for port selection), then select OK.
Figure 12. UltraCOM Serial Configuration Dialog Box
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Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 15
Step 5:
1. Select Open Plug-In (The Green Icon) in the screen snapshot that follows.
2. Respond OK to "Load Plug-in" "24xx Voice Functions"
Figure 13. UltraCOM Load Plug-In Dialog Box
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16 Rev. 0.4
Step 6:
Wait for the screen below to open and the patch to load.
Figure 14. UltraCOM Plug-Ins Patch Load Phase
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Rev. 0.4 17
Step 7:
Use the interface above to do the following:
Go off hook with the handset by selecting the handset symbol
Select the speakerphone button to start that mode.
Dial a DTMF number.
Note the following suggestions.
Use the external off-board speaker for speakerphone functionality
Use the on-board electret for the microphone.
Use the PSTN, a PBX or a Line Simulator for the phone line.
How to Change the Patch Used in the UltraCOM Plug-In
Figure 15. UltraCOM Plug-In Patch Changing
3.7. Power Requirements
The EVB has an onboard diode bridge, filter capacitor, and voltage regulators. Power can be supplied from the
USB connection or a source capable of providing 8.5–13.5 V dc or 6–9.5 VRMS peak ac and at least 300 mA. A
suitable wall mounted 9 V supply is provided with the kit.
Of the 300 mA required current 200 mA is used to drive the loudspeaker and may be removed from the
requirement if the power amp is enabled by placing a jumper on JP12.
Power may be applied to the Voice ISOmodem EVB through the screw terminals, J8, the 2 mm power jack, J9, or
the USB cable. The modem cable may be used to supply power even if the modem is configured for RS-232
operation.
The power consumed by the audio section is limited with an active limiter. This circuit will protect the power
sources when the sound is overdriven or if the amplifier output is shorted. The power amplifier is also naturally
protected with thermal limiting. Digital operations such as host to modem serial data transfer or the modem
telephone line operations are unaffected by the limiter operation.
Note that the modem will take power from wherever it finds it and that it is possible to use the RS232 port for
signaling and the USB for power or to use the USB for signaling and to provide power through the provided
external 9 V supply.
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18 Rev. 0.4
3.8. EVB Part Numbers
The Voice ISOmodem evaluation boards are offered in multiple versions. The first four numbers indicate the
system-side device. The options include speed and various audio capabilities as well as package and temperature.
See Figure 16:
Figure 16. EVB Part Number Example
Si2438FT18-EVB
Si2437FT18-EVB
Si2436FT18-EVB
Si2435FT18-EVB
Si2419FT18-EVB
Si2418FT18-EVB
Si2417FT18-EVB
Si2494AFM18-EVB
Si2439AFM18-EVB
RXD TXD, cst PCM $34 , . SILIEDN LABS
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Rev. 0.4 19
4. Voice ISOmodem EVB Functional Description
The Voice ISOmodem EVB is a multipurpose evaluation system. The modem daughter card illustrates the small
size and few components required to implement an entire controller-based modem with global compatibility. The
daughter card can be used independently of, or in conjunction with, the motherboard. The motherboard adds
features that enhance the ease of evaluating the many capabilities of the Si24xx ISOmodem.
4.1. Motherboard
The motherboard provides a convenient interface to the Si24xx ISOmodem DC (daughter card). The versatile
power supply allows for a wide range of ac and dc voltages to power the board.
A versatile digital IO system allows either a USB virtual com port to be used to interface to the board or an RS-232
transceivers with a DB9 connector allowing the EVB to be easily connected to a PC or other terminal device. A
jumper option allows direct access to the LVCMOS/TTL level serial inputs to the Si24xx, bypassing the RS-232
transceivers or USB interface. This is particularly useful for directly connecting the Si24xx to embedded systems.
The motherboard provides connectivity to a telephone line or a phone extension via a pair of RJ11connectors. The
extension connector may be actively excluded by an onboard relay.
A switch and a connector is provided on the motherboard that is read by the modem firmware and can perform the
hookswitch function.
The motherboard also contains a complete sound system including microphone, loudspeaker and handset
connector. The sound system includes easy to adjust gain controls and extra inputs that allow system generated
noises to be added to the sound.
A functional block diagram of the system as a whole can be seen below.
Figure 17. Sound System Block Diagram
Call
Progress
Audio PWM
RXD, TXD, CTSb
Si3000
PCM
USB
Interface
CP2101
USB
Connector
J11
RS232
Connector
J10
MUX
LED
Drivers &
Display
Optioning
Switch
Matrix
J6
Sound
Subsystem
CD,
RI,
DTR,
RTS,
DSR
RJ 11
Telephone
Connector
RJ 11
Telephone
Connector
Exclusion
Relay
Tip and Ring
RIb
Enabled
by JP34
J103
JP23 jumper selects USB
vs. UART or neither
Si24xx
ISOmodem
Silicon Labs
Si3018 DAA ISOmodem
Daughter Card
J101
JP16
Direct Access Header
Handset
RJ10
Ext.
Speaker
JP11
RS232
Drivers &
receivers EXT.
Microphone
J2
($9 SILICON LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
20 Rev. 0.4
4.1.1. Power Supply
4.1.1.1. Power Distribution
The power distribution diagram for the global voice EVB can be seen in Figure 18 below. Analog and Digital
voltages are separately regulated while the audio power amplifier supply is current limited to prevent accidental
overload and disruption of the digital supplies.
Figure 18. Power Distribution Diagram
The onboard full-wave rectifier and filter ensure the correct polarity is applied to the Voice ISOmodem EVB.
Daughter card 3.3 V power is supplied through voltage regulator U3. Daughter card current can be measured by
connecting a DVM across R59, a 1 current sensing resistor in the 3.3 V supply line to the daughter card.
The input voltage to either J8 or J9 must be between 8.5 and 13.5 V dc, or 6 and 9.5 VPEAK ac. The motherboard
includes a diode bridge (D12) to guard against a polarity reversal of the dc voltage or to rectify an ac voltage. The
power source must be capable of continuously supplying at least 100 mA. The voltage regulator, U10, can provide
5 V for the motherboard and the input for voltage regulator U3, which outputs 3.3 V for use on the motherboard and
to power the daughter card. Alternately, power may be supplied to U3 through D11 from the USB port.
The power consumed by the audio section is limited with an active limiter. This circuit will protect both power
sources and the audio amplifier when the sound is overdriven or if the amplifier output is shorted. Digital operations
such as host to modem serial data transfer or the modem telephone line operations are unaffected by the limiter
operation.
Two indicator LEDs indicate main power (+5 V) and audio amp power (~+4.5 V). See Figure 15 for locations. You
will notice the one for the audio power blinking when audio is loud and clipping. This is normal.
USB
Connector
J11
External
Power
Connector
J8
External
Power
Connector
J9
Rectifier
Bridge &
Capacitor
5 Volt
Regulator
Switch
(2 diodes)
3.3 Volt
Regulator
Reset
Generator
Manual
Reset Switch
Switch
(2 diodes)
5 Volt
Regulator
Current
Limiter +(4-5)V Audio Pwr Amp
3.3 Volt
Regulator
+3.3V Analog
+3.3V Digital
+5V Power
Master Reset
, . SILIEDN LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 21
4.1.2. Reset Circuitry
The Si24xx requires a reset pulse to remain low for at least 5.0 ms after the power supply has stabilized during the
power up sequence or for at least 5.0 ms during a power-on reset. Most production Si24xx modem chipset
applications require that RESET be controlled by the host processor. Certain Si24xx operation modes, including
power down, require a hardware reset to recover.
The Voice ISOmodem EVB contains two reset options, an automatic power-on reset device, U18 (DS1818)
(default), and a manual reset switch (S1) to permit resetting the chip without removing power. A reset, regardless of
the mechanism, causes all modem settings to revert to factory default values.
4.1.3. DS1818
The DS1818 is a small, low-cost device that monitors the voltage on VD and an external reset pushbutton. If VD
drops below 3.0 V, the DS1818 provides a 220 ms active-low reset pulse. On power up, the DS1818 also outputs
an active low reset pulse for 220 ms after VD reaches 90% of the nominal 3.3 V value. The DS1818 outputs a 220
ms reset pulse any time the power supply voltage exceeds the 3.3 V 10% window.
4.1.4. Manual Reset
The manual reset switch (S1) performs a power-on reset. This resets the Si24xx to factory defaults without turning
off power. Pressing S1 activates the reset monitor in the DS1818 and produces a 220 ms active low reset pulse.
4.1.5. Interface Selection
The serial interface of the Voice ISOmodem EVB can be connected to a computer, terminal, embedded system, or
any other data terminal equipment (DTE) via a standard RS-232 interface, USB interface, or through a direct TTL
serial interface.
At the heart of this capability is the MUX and the jumper that controls it: JP23.
4.1.5.1. RS-232 Interface
The serial cable connects to J10 on the motherboard and provides a data link the PC or embedded host processor.
Moving the jumper on JP23 enables the RS232 interface or the USB interface.
The Maxim MAX3237 transceiver interfaces directly with the TTL levels available at the serial interface of the
Si24xx and, using internal charge pumps, makes these signals compatible with the RS-232 standard. The RS-232
transceiver on the Voice ISOmodem EVB can communicate at rates between 300 bps and 1 Mbps. This simplifies
the connection to PCs and other data terminal equipment (DTE).
The signals available on the Voice ISOmodem EVB serial interface (DB9 connector) are listed in Table 6 along with
the various signal names used and both connector pin numbers and ISOmodem package pin numbers.
Table 5. Board Configuration
JP23 Modem Signalling Done Via
X Header, J103
1–2 Jumped USB Port
2–3 Not Jumped Serial Port
($9 SILICON LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
22 Rev. 0.4
4.1.5.2. USB Interface
The USB cable connects to J11 on the motherboard and provides both data and power.
This operation mode uses the standard factory jumper settings illustrated in Table 2 on page 7.
Installing a jumper on J23 enables the USB interface and disables the RS-232 interface. The USB interface is
provided by U12. A USB driver for this chip is available for most PC and MAC operating systems on the CD.
4.1.5.3. Direct Access Interface
The direct access interface header (J103) can be used to connect the motherboard to an embedded system.
If J103 is used in this manner, it is necessary to remove the jumber from JP23 to disable both the RS-232 and USB
interface and prevent signal contention. See Table 5.
In this mode, the motherboard continue to supply a few other signals and functions such as power (derived from
J8, J9, or USB) as well as a power-on reset signal and the telephone line connection via the exclusion relay contact
and the RJ-11 jack connected to the modem line side.
J103 provides access to all the ISOmodem system side signals available on the daughter card.
If the user wishes to go further and use his embedded system's power supply or reset line, he can remove the
daughter card from the mother board and integrate it directly into his system.
Table 6. DB9 Pin Connections (J10)
J10 Name J10 Symbol J10 Pin ISOmodem Pin
Number ISOmodem
Signal Name
Carrier Detect CD 1* See Note* DCD/EESD
Received Data RXD 2 9 RXD
Transmit Data TXD 3 10 TXD
Data Terminal Ready DTR 4* See Note* ESC/RI
Signal Ground SG 5 6 GND
Data Set Ready DSR 6* See Note* INT/AOUT
Ready to Send RTS 7* See Note* RTS/RXCLK
Clear to Send CTS 8 11 CTS
Ring Indicator RD 9* 17 RI
*Note: JP6 jumper option.
, . SILIEIJN LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 23
4.1.6. Exclusion Relay
The exclusion relay (Figure 19) on the motherboard allows the modem to turn on the relay and exclude the phone
line connection from an auxiliary device such as a telephone connected to the second RJ11 socket. The relay is
enabled via jumper JP34.
The control signal used is the one called RIb and is managed by special command sequences (see application
notes AN93 or AN244). RIb goes low to turn on the relay via a driver transistor.
See the diagram below for the location of the connectors and the relay.
Note that the RIb signal must be kept high during the reset pulse, due to the use of this pin for special
manufacturing functions. This demands that this pin drive either an NMOS relay driver transistor or a 3.3 V
referenced buffer like the one used here.
Figure 19. Exclusion Relay and Surge Protection
RJ11connectionto
PSTN
RJ11connectionto
Telephone
ExclusionRelay
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requirementsexceed
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OptionalFootprintstobe
usedifcustomerhas
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voltagerequirements.
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Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
24 Rev. 0.4
4.1.7. Surge Protection Circuits
This evaluation board is designed to provide several possible levels of surge protection.
The ISOmodem alone does not need surge protection for a global implementation except for the components
normally selected and implemented on the daughter card. These are the P3100B sidactor and the Y2 caps used
for C1, C2, C8, and C9.
There are two basic reasons a customer may enhance this surge protection. The first is to protect the telephone
exclusion relay, which often does not meet the same surge capability of the Y2 caps, and the second is to meet
enhanced requirements put forth by customers and/or corporate guidelines.
Thus, footprints for either low-current 800 V or 1 kV high-current longitudinal GDTs are in place on the board (see
Figure 20) to protect either the typical 2.5 kV exclusion relay or the 5 kV capacitors on the daughter card. But, note
that the relay used on this motherboard is 5 kV rated (as are the capacitors) and does not need special protection.
Regardless of which GDT is used by the customer, it is required to stay at 1 kV or less to control stress on the
ISOmodem during the GDT arcing process.
For extra metallic protection where higher current surges are mandated, a GDT combined with a common-mode
choke acting as a delay element is recommended. The choke protects the Sidactor due to its leakage inductance,
allowing the metallic GDT to fire first. There are two possible GDTs shown in Figure 20, and the optimal one can be
chosen by the trading of cost for current carrying capacity. When populated with capable ceramic parts, the
motherboard and modem can survive 15 kV/ 2 , 1.2/50 µs combination waveform, i.e. 7.5 kA surge current.
Figure 20. Optional Surge Protection Enhancement Circuits
, . SILIEDN LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 25
4.1.8. The Sound System
Figure 21. Sound System
The sound system on the board is centered around the Si3000 code chip shown in the above diagram, and is
designed to demonstrate handset operation as well as speakerphone and telephone answering machine
operation.
The Si3000 links to the ISOmodem via a PCM bus that allows the transfer of audio between the modem and the
various audio "peripherals" that the Si3000 links to the following:
Loudspeaker
Handset microphone and speaker
Microphone
Line In
Line Out
4.1.8.1. The Power Amplifier and Loudspeaker
The Power amplifier on the global Voice ISOmodem EVB can drive a 4 speaker with 300 mW of audio that has 3
possible sources:
Si3000 Line out
Aux in, J30 signal SPKR_AUX_IN (e.g., a customer system's generated beeps or ticks)
Call progress analog signal from modem. (ISOmodem's call dialing and negotiation tones)
The power amplifier itself is a low cost, rugged 3.3 V bridge device, the LM4862M. Similar parts are available from
other vendors.
The sources listed above can be independently turned off by jumpers JP7, 10, and 13 or be gain controlled with no
interaction, by changing the value of the summing node current injection resistors' values.
The inverted input of this chip is used as a summing junction for an audio mixer for the inputs mentioned above and
with gain control effected via the feedback resistor R24.
AOUT_INTD ‘ I C83 R138 R139 R140 : U288 01 UP 1k 1k 1k : A08602ARM H W - ‘ a + 7 C85 Jim £87: 100“ 6 . I L n i I __ : 0qu 1701“: . . ($9 SILICON LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
26 Rev. 0.4
The customer can change the resistor values when integrating the global Voice ISOmodem EVB to his system, but
should keep the RC formed by the 1 µF input caps at a 50 Hz or higher corner to avoid a thump on turn on.
The power amplifier is enabled by JP12. This jumper can also be tied to a host signal to allow the host to shut down
the amplifier.
4.1.8.2. The Call Progress Signal
The call progress tone discussed in this section comes from a PWM output pin on the ISOmodem. The PWM
signal is processed by a high-pass filter (see below).
When using this circuit it is important to extend the modem reset time to 10 ms. This is the time to charge C83 via
the built in weak pull ups in case that the modem has been operating prior to reset and has put the AOUT into a
PWM state that is 100% low. Any modifications to this circuit or reset time should be done keeping in mind the
following rule: The ISOmodem reset time and AOUT capacitive loading must be balanced so that the AOUT pin
must have time to charge it's load to a high state.
It should be noted that when creating the call progress output with this circuit, about half the noise present in the
audio bandwidth on the modem supply pins is passed along with the call progress tone. Consequently, the modem
supply needs to be fairly clean.
Figure 22. High-Pass Filter
4.1.8.3. The Input Mixer
An input mixer is also in the sound section of the global fax EVB. It drives the line input of the Si3000 with a mixture
of the following possible sources:
An electret microphone
An auxiliary line input, J30 signal (Si3000_LINE_IN)
Call progress analog signal from modem. (ISOmodem's call dialing and negotiation tones)
4.1.8.4. The Speakerphone Electret Microphone
The electret microphone listed above is amplified by a preamp before this mixer. The gain of the microphone
preamp can be adjusted via a potentiometer if JP5 pins 1 and 2 are jumpered, or is fixed by R12 and R15 when
JP5 pins 2 and 3 are jumpered. It is intended for speakerphone use.
This electret microphone in this case can be either the microphone that comes installed on this board or an
external one connected to the RCA jack J2. There is a dedicated electret power supply available to power either of
these two microphones. The supply is configured so that it is easy for the user to adjust its voltage between 0 and
3.3 V by varying R27 and R30. This allows the user to most closely match the operation of his intended target. The
onboard electret is enabled by JP8.
PWM FilterPWM Filter
‘ n: ouu unm bmwA J‘ HANDsEr 515-20 m «andsec spake: a[ pm 2:3, “15' m. ;s a: pm 1 am sun )5 m 1 Q m m m BEE Hawdset SpeaKtx a: pm: 252 .4 n. ; at P;n . harm an: a: m. 1 Q m m 1 SILIEIJN LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 27
4.1.8.5. The Handset
The handset signals are all processed by the Si3000 chip. The board provides a matrix of connectors to allow ANY
handset pin configuration to be used. This jumper array is shown in Figure 23. The default setting is shown in
Table 3 on page 8.
Figure 23. Handset
MicrophoneSignal
EarpieceSignal
($9 SILICON LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
28 Rev. 0.4
4.2. Daughter Cards
There are two types of daughter card; one is for QFN packaged modem chips, and one is for smaller packages.
The daughter card itself is a complete modem solution perfectly suited for use in an embedded system.
The daughter card requires a 3.3 V supply capable of providing at least 35 mA. Be sure to provide the proper
power-on reset pulse to the daughter card if it is used in the stand-alone mode.
The Voice ISOmodem EVB motherboard connects to the daughter card through two connectors, J101 and JP16.
JP101 is an 8x2 socket providing connection to all Si24xx digital signals and a regulated 3.3 V power.
The Si24xx digital signals and power also appear at JP103 and they are LVCMOS and TTL compatible. JP103 can
be used for monitoring purposes or may be used as the interface to the users host if JP23 has no jumper, thus
disabling the on board digital multiplexer. In this case note that the PCM link to the Si3000 is still in place and is still
connected to the daughter card signals.
JP16 is a 4x1 socket providing connection between the daughter card and both the RJ-11 phone jack and the
exclusion relay on the motherboard.
The daughter cards for this global Voice ISOmodem EVB come with the appropriate ISOmodem system side chip
installed and are identical otherwise. The possible ISOmodem system side chips are shown in Figure 24:
Figure 24. ISOmodem System-Side Chip Part Number Scheme
The line side chip on the daughter card is the Si3018 DAA chip. It works with a few low cost discrete parts that
complete the telephone line interface.
Small 33 pF capacitors link the system side to the isolated side and provide both data and power transfer to the
isolated telephone line circuit.
The connection between the Si3018 chip and the telephone line is done via a diode bridge to control line polarity
and beads to control EMI.
A Sidactor is placed across the phone line for surge arresting reasons, while a pair of capacitors link the tip and
ring to system ground in order to minimize EMI radiation and EMI Susceptibility.
PCB layout for this circuit is somewhat critical, for link integrity, EMI, and surge reasons,. Anyone planning to
design a PCB layout should check application note AN244 or AN93 and also submit the PCB design to Silicon
Labs for checking. The layout used on this daughter card is shown in this user's guide.
Si2438FT
Si2437FT
Si2436FT
Si2435FT
Si2419FT
Si2418FT
Si2417FT
Si2494FM
Si2439FM
, . SILIEDN LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 29
4.2.1. Reset Requirements
The Voice ISOmodem daughter card must be properly reset at powerup. The reset pin (pin 8) of the Si24xx (J101,
pin 13) must be held low for at least 5.0 ms after power is applied and stabilized to ensure the device is properly
reset.
4.2.2. Crystal Requirements
Clock accuracy and stability are important in modem applications. To ensure reliable communication between
modems, the clock must remain within 100 ppm of the design value over the life of the modem. The crystal
selected for use in a modem application must have a frequency tolerance of less than 100 ppm for the combination
of initial frequency tolerance, drift over the normal operating temperature range, and five year aging. Other
considerations, such as production variations in PC board capacitance and the tolerance of loading capacitors,
must also be taken into account.
4.2.3. Protection
The Voice ISOmodem EVB meets or exceeds all FCC and international PTT requirements and recommendations
for high-voltage surge and isolation testing without any modification. The protection/isolation circuitry includes C1,
C2, C8, C9, FB1, FB2, and RV1. The PCB layout is also a key "component" in the protection circuitry. The Voice
ISOmodem EVB provides isolation to 3 kV. Contact Silicon Laboratories for information about designing to higher
levels of isolation.
4.2.4. Daughter Card Strapping and Jumper Options
Both types of daughter cards have some strapping options that are preconfigured at the factory. These are
explained in the schematic and in more detail in AN93.
The QFN daughter card also has a two jumper options. One, JP1, selects SPI operation, which is usable if the user
also does not use a jumper at JP23 on the motherboard and provides host SPI connectivity at J103. The other
jumper, JP2, enables the operation of the EEPROM chip, which is on the daughter card. There is an EEPROM chip
on the motherboard, which is only used with the TSSOP daughter card.
SILICON LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
30 Rev. 0.4
5. Motherboard and Daughter Card Schematics
"RS232"
Connectors
for ISOModem
module.
TXD
GPIO3
RXD
NC
CTS
NC
RESET
GND
NC
VD
GPIO4
GPIO5
NC
NC
Si2401
GPIO2
GPIO1
TXD/WR
ESC/D3
RXD/RD
SDI/EESD/D2
CTSb/CS
RIb/D1
RESET
GND
INTb/D0
VD
AOUT/INTb
FSYNCH/D6
RTSb/D7
CLKOUT/EECS/A0
Si24xx
DCDb/D4
SDO/EECLK_RTSb/D5
15
16
13
14
11
12
9
10
7
8
6
1
3
4
5
Net names correspond to Si24xx.
See table for Si2401 equivalents
2
Table NOT on silkscreen
JP1/3
"USB"
RXD
TXD
CTSb
CD
RIb
RTSb
RTSb
"FSYNCHb"
"SDO_EECLK_RTSb"
"SDI_EESD"
DSRb
"RXD"
"TXD"
"CTSb"
"RESETb"
"RTSb"
"DCDb"
"INT"
"AOUT_INTb"
"RIb"
"ESC"
"CLKOUT_EECSb"
"SI3000 EN"
"EEPROM EN"
TSSOP24 SOIC16 SOIC16
24xx 24xx 2401
SDI/EESD NC NC
FSYNCH RIb RIb
RIb NC NC
SDO/EECLK RTSb GPIO1
AOUT/INTb INTb INTb/AOUT
TSSOP24
24xx
SOIC16
24xx
SOIC16
2401
DCDDCDDCD
NCNC RIb
ESCESCESC
NCNC
INTbNCNC
RTSb
Silk Screen Text
"GND"
"+3.3V"
JP6 Left Pin Signals
JP6 Right Pin Signals
Leaded
Leaded
Leaded
Leaded
Pull Down Can
strap FSYNCHb to
GND enabling
EEPROM
Select High Chooses B2 port
From Power Supply Page
To Host Interface Page
To AOUT circuit on Voice
and Call Pro gres s Page
To Si3000 Codec on Voice
and Call Pro gres s Page
T1 and GDT's may be
needed fo r unnusual
surge requirements.
For details contact the
factory.
5 kV rated Rel ay
Extra High Surge
Protection: Large
Ceramic GDT's
Extra Surge
Protection:
Small Glass
GDT's.
RIGHT RIGHT
NC or INTb nc or INTb/AOUT
Table on back
silkscreen for
J6
RS-232 Si24xx 16 pin Si2401 16 pin
CD DCD or NC DCD or nc
RI NC or RIb NC or RIb
DTR ESC or NC ESC or NC
RTS NC or RTSb nc or GPIO1
DSR
"J6 Jumper Connectiveity"
Si24xx 24 pin
"SOIC16: 1-2, 5-6, 7-8, 11-12, 14-15"
"TSSOP24: 1-2, 4-5, 7-8, 10-11, 13-14"
"Recommended J6 settings"
INTb or AOUT/INTb
DCD or SDI/EESD
RI or FSYNCH
ESC or RIb
RTS or SDO/EECLK
LEFT LEFT LEFTRIGHT
CLKOUT_EECSb
FSYNCHb
SDI_EESD
CLKOUT_EECSb
CTSb
RESETb
RXD
DCDb
ESC
RTS_M
CD_M
DTR_M
DSR_M
AOUT_INTb
VCC_Modem
DCDb
RIb
FSYNCHb
RI_M
RTSb
TXD
INTb
SDI_EESD
ESC
SDI_EESD
FSYNCHb
RIb
RIb
SDO_EECLK_RTSb
SDO_EECLK_RTSb
SDI_EESD
ESC
RTSb
DCDb
RIb
INTb
CTSb
INTb
TXD
AOUT_INTb
RXD
CLKOUT_EECSb
FSYNCHb
RXD
TXD
RESETb
CTSb
RTSb
SELECT
CLKOUT_EECSb
SDO_EECLK_RTSb
SDO_EECLK_RTSb
SDI_EESD
DSR_M
CD_M
RI_M
DTR_M
RTS_M
SDO_EECLK_RTSb
AO UT _ INT b
FSYNCHb
CLKOUT_EECSb
ENABLE_MUXb
TXD_T
RTS_T
DTR_T
TXD_U
RTS_U
DTR_U
RXD_T
CTS_T
DSR_T
CD_T
RI_T
RXD_U
CTS_U
DSR_U
CD_U
RI_U
RESETb
AOUT_INTb
FSYNCHb
SDI_EESD
SSI_SDO
SSI_CLKOUT
+5V_RAW
+3.3V
+3.3V
+3.3V
+3.3V
+3.3V
+3.3V
+5V_RAW
+3.3V
+3.3V
+3.3V
+3.3V
+3.3V
+3.3V
+3.3V
+3.3V
+3.3V
U14
IDT74CBTLV3257
U14
IDT74CBTLV3257
GND
8VCC 16
1B1
2
2B1
5
3B1
11
4B1
14
1A 4
2A 7
3A 9
4A 12
1B2
3
2B2
6
3B2
10
4B2
13
OE 15
S1
R157 681R157 681
C35 0.1uFC35 0.1uF
K1CK1C
9
10
8
D46DTR D46DTR
R91
10K
R91
10K
R155 681R155 681
Q5
MMBT3906-7-F
Q5
MMBT3906-7-F
C70
560pF
C70
560pF
D48DSR D48DSR
TP7
Turret
GNDTP7
Turret
GND
J103
8X2 Shrouded Header
J103
8X2 Shrouded Header
1
122
3
344
5
566
7
788
9
910 10
11
11
13
13
15
15
12 12
14 14
16 16
D54
BAV23A
D54
BAV23A
C73
560pF
C73
560pF
C69
1uF
C69
1uF
C72 0.1uFC72 0.1uF
R162681 R162681
TP19TP19
D53 REDRS232 D53 REDRS232
TP17TP17
V1A
1000V
RA-102M-C6-Y
NOP O P
V1A
1000V
RA-102M-C6-Y
NOP O P
D45RI D45RI
R84
1.5k
R84
1.5k
U27
MAX4521
U27
MAX4521
IN1
1
V+ 13
GND
5
IN4
8IN3
9
NC3
11
V-
4
NC2
14
IN2
16
NC1
3
NC4
6
COM1 2
COM2 15
COM3 10
COM4 7
VL 12
TP24TP24
TP8
Turret
GNDTP8
Turret
GND
R114 0 NIR114 0 NI
V2A
350V
RA-351M-C6-Y
NOP O P
V2A
350V
RA-351M-C6-Y
NOP O P
R113
10K
R113
10K
D6
MMBD3004S-7-F
D6
MMBD3004S-7-F
R170 681R170 681
C75 0.1uFC75 0.1uF
TP25
Turret
GND
TP25
Turret
GND
R43
10K
R43
10K
D41RXD D41RXD
V1B
800V
NOP O P
GTCA28-801L-P05
V1B
800V
NOP O P
GTCA28-801L-P05
FB11
600 Ohm
BLM18AG601SN1
FB11
600 Ohm
BLM18AG601SN1
R160 681R160 681
TP6
TIP
BLUE
TP6
TIP
BLUE
TP23TP23
C33 0.1uFC33 0.1uF
R70 0R70 0
R60 10KR60 10K
+
-
K1A
Fujitsu FT R-C1GA4.5G
+
-
K1A
Fujitsu FT R-C1GA4.5G
1
12
V2B
350V
NOP O P
GTCA28-351L-P05
V2B
350V
NOP O P
GTCA28-351L-P05
Q1
MMBTA06LT1
Q1
MMBTA06LT1
TP12
+3.3V
RED
TP12
+3.3V
RED
J7
NOP O P
J7
NOP O P
1
12
23
34
45
5
JP2 4JP2 4
R158 681R158 681
R39 10K
NOP O P
R39 10K
NOP O P
R101 200R101 200
R115 0 NIR115 0 NI
TP2
Turret
GNDTP2
Turret
GND
TP22TP22
R156 681R156 681
D52 RED
USB D52 RED
USB
U13
IDT74CBTLV3257
U13
IDT74CBTLV3257
GND
8VCC 16
1B1
2
2B1
5
3B1
11
4B1
14
1A 4
2A 7
3A 9
4A 12
1B2
3
2B2
6
3B2
10
4B2
13
OE 15
S1
J5A
RJ-11
TELEPHONE
J5A
RJ-11
TELEPHONE
1
2
3
4
5
6
D5
EXCLUSION
D5
EXCLUSION
R59
1.0
R59
1.0
K1BK1B
4
3
5
R163681 R163681
J6
HEADER 5x3
J6
HEADER 5x3
1
2
3
4
5
6
7
8
9
10
11
13 15
12
14
TP20TP20
C74
1uF
C74
1uF
T1
3.3mH
NOP O P
T1
3.3mH
NOP O P
2 3
1 4
R51 10KR51 10K
J5B
RJ-11
PST N L INE
J5B
RJ-11
PST N L INE
7
8
9
10
11
12
R85
1.5k
R85
1.5k
R87 10KR87 10K
JP3 3
Autobaud Dis.
JP3 3
Autobaud Dis.
12
JP3 4
Exclusion En.
JP3 4
Exclusion En.
12
JP1 6
4X1 Socket
JP1 6
4X1 Socket
D44CD D44CD
TP9
Turret
GNDTP9
Turret
GND
TP5
RING
BLUE
TP5
RING
BLUE
R41 10KR41 10K
D43CTS D43CTS
TP16TP16
R52 10KR52 10K
R69 0R69 0
R169 681R169 681
C71 0.1uFC71 0.1uF
J101
HEADER 8x2
J101
HEADER 8x2
1
122
3
344
5
566
7
788
9
910 10
11
11
13
13
15
15
12 12
14 14
16 16
TP13
Isense
RED
TP13
Isense
RED
R42 10KR42 10K
D47RTS D47RTS
R159 681R159 681
D42TXD D42TXD
R49 10KR49 10K
U5
EEPROM 32K
U5
EEPROM 32K
/CS
1MISO
2MOSI
5SCLK
6/WP 3
GND
4
/HOLD 7
VCC 8
U26
74LCX541
U26
74LCX541
A1
2
A2
3
A3
4
A4
5
A5
6
A6
7
A7
8
A8
9
G1
1
G2
19
Y1 18
Y2 17
Y3 16
Y4 15
Y5 14
Y6 13
Y7 12
Y8 11
VCC 20
GND
10
JP2 3JP2 3
TP21TP21
R40
10K
R40
10K
Figure 25. Motherboard Main Digital Logic
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 31
To MUX
EXT MIC IN
GAIN SEL
1-2 Variable
2-3 Fixed
5.5KHz
pole
CW: 34 dB
CCW: 6 dB
EXT MIC IN GAIN ADJ
power
Consumption
Here is 20
mA at 3.3
Volts
CAPS FOR AD8602ARM OPAMPS
EXT DIFF SPKR GAIN ADJ
High Pass set for 50 Hz Corner
"Do not gound
speaker+ or
Speaker -
14KHZ pole
Gain WRT to Line
Out: CW/46.4 dB
CCW: 21.4 dB
To MODEM
Si3000 Option Strapping
Several footprint compatiple
variations of this amplifier are in
production allowing an easy price
vs power tradeoff. EG. LM4819.
"Pin 1"
"Pin 1"
ATT Ref Handset
Speaker at pins 2&3
Mic. in. is at pin 4
with GND at pin 1.
Pin 1
JP1
JP4
Pin 5
Pin 5
Cisco Ref Handset
Speaker at pins
2&3, Mic. in. is
at pin 1 and GND
is pin 4
Pin 1
JP1
JP4
Differing handsets can be accomodated
as shown in these two examples
SPKR_AUX_IN
SI3000_LINE_IN
SI3000_LINE_IN
SPKR_AUX_IN
FSYNCHb
RESETb
SSI_CLKOUT
SSI_SDO
SDI_EESD
AOUT_INTb
+3V3_A
VGND
+3V3_A
VGND
+3V3_A
+3V3_A
+3V3_A
VGND
+3.3V
+3V3_A
GND
GND
VGND
+3V3_A
+3V3_A
VGND
+3V3_A
+4.5V
VGND
+3.3V
JP6
JUMPER
JP6
JUMPER
1 2
R9 0R9 0
C7 1uFC7 1uF
R25 10KR25 10K
JP14 En. Lcl. SpeakerJP14 En. Lcl. Speaker
1 2
C18 1uFC18 1uF
R31
10K
R31
10K
J30
5X2 Shrouded Header
J30
5X2 Shrouded Header
1
122
3
344
5
566
7
788
9
910 10
R3
200
R3
200
R23
3.01K
R23
3.01K
R6
2K
R6
2K
R20 10KR20 10K
R45
100K
R45
100K
FB1 600 OhmFB1 600 Ohm
+
C17
100uF
+
C17
100uF
JP1JP1
R4 10KR4 10K
C4
0.1uF
C4
0.1uF
R14 1KR14 1K
R29
3.01K
R29
3.01K
C20
1uF
C20
1uF
R13
50K
R13
50K
1 3
2
U4
LM4862
U4
LM4862
SHUTDOWN
1
BYPASS
2
IN+
3
IN-
4
VO2 8
GND
7VDD 6
VO1 5
FB2 600 OhmFB2 600 Ohm
R37
100K
R37
100K
JP5JP5
C15
2.2nF
C15
2.2nF
R33
1K
R33
1K
R32
0
R32
0
R28
200
R28
200
R38
100K
R38
100K
R10 4.7KR10 4.7K
C12
0.1uF
C12
0.1uF
R22
499
R22
499
Input
Output
Si3000
U2
Input
Output
Si3000
U2
MCLK
7
SCLK
8
FSYNC
6SDI
4SDO
5
RESET*
9LINEI 11
MIC_ BIAS 2
MIC_ IN 10
LINEO 15
SPKR_L 16
SPKR_R 1
VD 12
VA 13
GND
14
HDST
3
LS1
SPEAKER
LS1
SPEAKER
R12 5.1KR12 5.1K
+
-
U22B
AD8602ARM
+
-
U22B
AD8602ARM
5
6
7
JP1 0JP1 0
1 2
R30
10M
R30
10M
+
C6 100uF
+
C6 100uF
JP1 2
Pwr Amp Enable JP1 2
Pwr Amp Enable
1 2
C11
1uF
C11
1uF
R36
100K
R36
100K
C28
0.1uF
C28
0.1uF
+
-
U21B
AD8602ARM
+
-
U21B
AD8602ARM
5
6
7
C37 1uFC37 1uF
JP2JP2
C27
0.1uF
C27
0.1uF
J2
RCA JACK
EXT MIC.
J2
RCA JACK
EXT MIC.
C23 1uF
C23 1uF
R27
324K
R27
324K
JP1 3JP1 3
1 2
R35
1K
R35
1K
R18
100K
R18
100K
+
-
V+
V-
U21A
AD8602ARM
+
-
V+
V-
U21A
AD8602ARM
1
2
3
4 8
C24
0.1uF
C24
0.1uF
C22 1uF
C22 1uF
MK1
LCL. MIC.
MK1
LCL. MIC.
1
2
C8 10uFC8 10uF
+
-
V+
V-
U20A
AD8602ARM
+
-
V+
V-
U20A
AD8602ARM
1
2
3
4 8
C26
0.1uF
C26
0.1uF
C25
0.1uF
C25
0.1uF
J1 HANDSETJ1 HANDSET
1
2
3
4
JP3JP3
R2 0 NIR2 0 NI
D1
MMBD3004S-7-F
D1
MMBD3004S-7-F
R7 2KR7 2K
C29
0.1uF
C29
0.1uF
JP4JP4
D2
MMBD3004S-7-F
D2
MMBD3004S-7-F
C21
1uF
C21
1uF
FB4 600 OhmFB4 600 Ohm
JP1 1
DIFF SPKR OUT
JP1 1
DIFF SPKR OUT
R44
3.01K
R44
3.01K
C19
2.2nF
C19
2.2nF
C34
1uF
C34
1uF
JP9
JUMPER
JP9
JUMPER
1 2
C10
0.1uF
C10
0.1uF
C5
0.1uF
C5
0.1uF
FB3 600 OhmFB3 600 Ohm
C3
0.1uF
C3
0.1uF
JP1 5
JUMPER
JP1 5
JUMPER
1 2
JP8
EN. LCL MIC JP8
EN. LCL MIC
1 2
R24
50K
R24
50K
1 3
2
R34
1K
R34
1K
C14
0.1uF
C14
0.1uF
R21
2K
R21
2K
D3
MMBD3004S-7-F
D3
MMBD3004S-7-F
R11
2K
R11
2K
R17 10KR17 10K
R15
49.9K
R15
49.9K
C30
0.1uF
C30
0.1uF
+
-
V+
V-
U22A
AD8602ARM
+
-
V+
V-
U22A
AD8602ARM
1
2
3
4 8
C31
1uF
C31
1uF
C98 4.7uFC98 4.7uF
+
-
U20B
AD8602ARM
+
-
U20B
AD8602ARM
5
6
7
C13 560pFC13 560pF
JP7JP7
1 2
R19 10KR19 10K
R5
100K
R5
100K
R16 1KR16 1K
Figure 26. Motherboard Sound Processing Circuits
' 4h { Tm Hh SILICON LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
32 Rev. 0.4
RS-232, Female, Front View
USB
input
threshold of
0.8 and 2.4
Volts
Output voltages:
CMOS, 0 and 5
Volts
Keep Very Close
RXD_232
CTS_232
RD_232
TXD_232
DTR_232
DSR_232
RTS_232
CD_232
RXD_T
CTS_T
DSR_T
CD_T
RI_T
TXD_T
RTS_T
DTR_T
RI_U
CD_U
DSR_U
TXD_U
RXD_U
CTS_U
RTS_U
DTR_U
+3.3V
+3.3V
VCC_USB
DN5 15VDN5 15V
C58
0.1uF
C58
0.1uF
R112
10K
R112
10K
DN4 15VDN4 15V
DN1 15VDN1 15V
FB8
600 Ohm
BLM18AG601SN1
FB8
600 Ohm
BLM18AG601SN1
R110 10KR110 10K
U11
MAX3237
U11
MAX3237
C2+ 1
C2- 3
C1+ 28
C1- 25
V+
27
V-
4
T1IN 24
T2IN 23
T3IN 22
T4IN 19
T5IN 17
R1OUTB 16
R1OUT 21
R2OUT 20
R3OUT 18
EN 13
GND
2
T1OUT
5
T2OUT
6
T3OUT
7
T4OUT
10
T5OUT
12
VCC 26
R1IN
8
R2IN
9
R3IN
11
MBAUD
15
SHDN
14
C62
0.1uF
C62
0.1uF
DN8 15VDN8 15V
C53
0.1uF
C53
0.1uF
DN3 15VDN3 15V
C52
560pF
C52
560pF
R109 10KR109 10K
J10
DB9
J10
DB9
CD(O)
1
RXD(O)
2
TXD(I)
3
DTR(I)
4
SG
5
DSR(O) 6
RTS(I) 7
CTS(O) 8
RD(O) 9
MH
10
MH
11
D14D14
C63
0.1uF
C63
0.1uF
DN7 15VDN7 15V
DN2 15VDN2 15V
R111 10KR111 10K
U12
CP2102
U12
CP2102
REGIN
7
VDD 6
GND
3
VBUS
8
D-
5
D+
4
CTS 23
RTS 24
RXD 25
TXD 26
DSR 27
DTR 28
DCD 1
RI 2
SUSPEND 11
SUSPEND 12
RST 9
GND
EPAD
D15D15
C57 0.1uFC57 0.1uF
C61
0.1uF
C61
0.1uF
J11
USB Type B
J11
USB Type B
+V 1
D- 2
D+ 3
GND 4
SH
5SH
6
C59
0.1uF
C59
0.1uF
C56 0.1uFC56 0.1uF
DN6 15VDN6 15V
FB9
600 Ohm
BLM18AG601SN1
FB9
600 Ohm
BLM18AG601SN1
R108
0
NOPOP
R108
0
NOPOP
C54
1uF
C54
1uF
C60
0.01uF
C60
0.01uF
C55
1uF
C55
1uF
Figure 27. Motherboard Host I/O
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 33
RESETb
+4.5V
+3.3V
VCC_USB
+3V3_A
+5V_RAW
J8
7-12V AC/DC PWR
J8
7-12V AC/DC PWR
1
2
C40
0.1uF
50V
C40
0.1uF
50V
R103 1.6R103 1.6
R105 1.6R105 1.6
+
C41
560uF
6.3V
+
C41
560uF
6.3V D51
RED
+4.5V
D51
RED
+4.5V
Q4
MMBTA06LT1
Q4
MMBTA06LT1
D49
MMBD3004S-7-F
D49
MMBD3004S-7-F
D11
STPS140Z
SOD-123D11
STPS140Z
SOD-123
R98
0.05
R98
0.05
TP10
+4.5V
RED
TP10
+4.5V
RED
U1
LT1963A-3.3 V
SOT223
U1
LT1963A-3.3 V
SOT223
GND
IN OUT
GND
D50 RED
+3.3V PWR
D50 RED
+3.3V PWR
C65
1uF
C65
1uF
D9 STPS140ZD9 STPS140Z
D13 STPS140ZD13 STPS140Z
U18
DS1818
U18
DS1818
VCC
2
GND
3RST 1
U3
LT1963A-3.3 V
SOT223
U3
LT1963A-3.3 V
SOT223
GND
IN OUT
GND
+
C45
470uF
+
C45
470uF
C51
0.01uF
25V
C51
0.01uF
25V
C66
10uF
C66
10uF
R97
200
R97
200
C48
0.1uF
50V
C48
0.1uF
50V
FB7
600 Ohm
FB7
600 Ohm
R100
1.33K
R100
1.33K
C96
0.1uF
C96
0.1uF
Q3
FCX1051ATA
Q3
FCX1051ATA
FB6
600 Ohm
FB6
600 Ohm
C2
10uF
C2
10uF
-+
D12
Bridge Rectifier
-+
D12
Bridge Rectifier
TP1
+3V3_A
RED
TP1
+3V3_A
RED
C43
1uF
C43
1uF R57
0.05
R57
0.05
C42
0.01uF
25V
C42
0.01uF
25V
R161 681R161 681
R99
200
R99
200
C39
10uF
C39
10uF
C1
0.1uF
NOPO P
C1
0.1uF
NOPO P
C49
10uF
C49
10uF
R1
0.05
R1
0.05
+
C44
470uF
+
C44
470uF
U10
TO263-3N
LM2937ES-5.0
U10
TO263-3N
LM2937ES-5.0
GND
IN OUT
GND
U8
TO263-3N
LM2937ES-5.0
U8
TO263-3N
LM2937ES-5.0
GND
IN OUT
GND
S1
RESET
S1
RESET
R102
1.33K
R102
1.33K
J9
7-12V AC/DC PWR
J9
7-12V AC/DC PWR
3
2
1
R104
0.05
R104
0.05
R96
3.57
R96
3.57
D7
STPS140Z
SOD-123
D7
STPS140Z
SOD-123
Figure 28. Motherboard Power Supply and Reset
E E I: EH E? q W PH ET": E Hi SSSSSSSSSSS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
34 Rev. 0.4
These components are for
internal Silabs use only.
:LUHVFRPPRQWR
SLQSDUWV
No
R103 R106R101
No
No
No
No No
No Yes
NoNo
No Yes
PKG_16.11 & PKG_24.15
PKG_16.3 & PKG_24.4
PKG_16.15 & PKG_24.23
PKG_16.7 & PKG_24.11
PKG_24.16
R102
No
No
Yes
Yes
Yes
No Yes X
XNo
No
Yes
SPI 32 kHz
SPI 27 MHz
SPI 4.9252 MHz
Pin11 Pin3 Pin15Pin7
Pin15 Pin23Pin11
R104 R106R101 R102
No Yes
X
X
No
Yes
No
Yes
No
Yes
Pin16
SOIC16 System Side Strapping Table
UART 4.9152 MHz
UART 27 MHz
UART 32 kHz Parallel
PKG_24.17
R105
Pin17
X
X
X
X
Parallel
27 Mhz
4.9152 MHz
SPI
SPI
SPI
No Yes
No Yes
No
No
Yes 27 Mhz
Yes X 4.9152 MHz
32.768 kHzNo No
No No UARTNo Yes 32.768 kHzX
No No UARTNo No No
No No UARTNo No Yes
4.9152 MHz
27 Mhz
TSSOP24 System Side Strapping Table
Y1, Y1B & Y3 are alternate footprints and frequencies.
The Values of C40 & C41 vary. See The BOM.
2QO\RQH6\VWHPVLGHSDUWLV
VROGHUHGDWWLPH8RU8
CTSb AOUT_INTb INTb RIb DCDb
CTSb AOUT_INTb FSYNCH(RI) DCDb
SDO_EECLK_RTSb
DCDb
ESC
AOUT_INTb
RXD
RESETb
XTALI
XTALO
RXD
RTSb
RESETb
DCDb
FSYNCH
RTSb
INTb
ESC
RIb
SDI_EESD
AOUT_INTb
CLKOUT_EECSb_AO
CLKOUT_EECSb_AO
TXD
CTSb
TXD
CTSb
FSYNCH
SDO_EECLK_RTSb
SDO_EECLK_RTSb
SDI_EESD
RIb
AOUT_INTb
FSYNCH
INTb
ESC
DCDb
RIb
SDI_EESD
VDA
XTALO
XTALI
XTALO
AOUT_INTb
CTSb
DCDb
FSYNCH
INTb
RIb
VDA
VDB
RXD
TXD
CTSb
XTALI
RESETb
C1A
C2A
C1A
C2A
VDD
VDD
VDD
VDD
C41 33pFC41 33pF
U12
Si2493
U12
Si2493
CLKIN/XTALI 1
XTALO 2
CLKOUT/EECSb/A0
3
FSYNCH/D6
4
VD3.3 5
GND
6
VDA
7
RTSb/SPI_CSb/D7
8
VDB
19
GND
20 VD 3.3 21
C2A 13
C1A 14
ESC/D3
22 DCDb/D4
23 SDO/EECLK/D5
24
CTS/SPI_SCLK/CSb
11
RXD/SPI_MISO/RDb
9
TXD/SPI_MOSI/WRb
10
RESET
12
RIb/D1
17
SDI/EESD/D2
18
AOUT/INTb
15
INTb/D0
16
Y3
27 MHz
Y3
27 MHz
GND
2
VCC 4
OUT 3
NC
1
R111 200R111 200
C54
1uF
C54
1uF
C55
0.1uF
C55
0.1uF
R110 200R110 200
U13
Si24xx-16 pin
U13
Si24xx-16 pin
CLKIN/XTALI 1
XTALO 2
RIb
3
VDD3.3 4
RXD_SPI_MISO
5
TXD_SPI_MOSI
6
CTSb_SPI_SCLK
7
RESET
8C2A 9
C1A 10
INTb
11
GND
12
VA
13
ESC
14 DCDb
15
RTSb_SPI_CSb
16
R18 1.2KR18 1.2K
R112 200R112 200
C40 33pFC40 33pF
Y1
4.9152MHz
Y1
4.9152MHz
C53
0.22uF
C53
0.22uF
J1
SOCKET 8x2
J1
SOCKET 8x2
1
122
3
344
5
566
7
788
9
910 10
11
11
13
13
15
15
12 12
14 14
16 16
C56
0.1uF
C56
0.1uF
R103 10KR103 10K
R106 10KR106 10K
R120 NIR120 NI
R121 NIR121 NI
C50
0.1uF
C50
0.1uF
R101 10KR101 10K
C51
0.22uF
C51
0.22uF
C52
0.1uF
C52
0.1uF
Y1B
32.768KHz
Y1B
32.768KHz
R102 10KR102 10K
R104 10KR104 10K
FB5FB5
R105 1KR105 1K
Figure 29. Daughter Card (Si24xx2G-DC Rev 2.0) System Side
T W ; Hum flab
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 35
Bias
Ring Detect/CID/Voltage monitoring
DC Term
Add 0.020 to 0.030 sq.
inches of Cu at all
transistor collectors
Place C3 near D1
No GND or I_GND
copper planes in DAA
section.
TIP
RING
Keep 5 mm creepage
rules between this DAA
section and all else.
C1A
C2A
I_GND
I_GND
I_GND
I_GND
R12
56.2
R12
56.2 C10
0.01uF
C10
0.01uF
Q5
MMBTA06LT1
Q5
MMBTA06LT1
Q3
MMBTA42LT1
Q3
MMBTA42LT1
C4X1uF
25VX8R
C4X1uF
25VX8R
RV1
P3100SB
RV1
P3100SB
Q1
MMBTA42LT1
Q1
MMBTA42LT1
FB1
600 Ohm
FB1
600 Ohm
R2
150
R2
150
R4
2.49K
R4
2.49K
C5
0.1uF
C0603
C5
0.1uF
C0603
C6
0.1uF
C0603
C6
0.1uF
C0603
C2 33pFC2 33pF
C8
680pF
C8
680pF
-+
D1
HD04
-+
D1
HD04
Q2
MMBTA92LT1
Q2
MMBTA92LT1
C9
680pF
C9
680pF
R6
100K
R6
100K
FB2
600 Ohm
FB2
600 Ohm
R11
73.2
R11
73.2
C1 33pFC1 33pF
R13
56.2
R13
56.2
C7 2.7nFC7 2.7nF
+
C41uF
+
C41uF
R15
0
R15
0
Z1
43V
Z1
43V
R7 20MR7 20M
J2
TSM-104-01-T-SV
4X1 Header
J2
TSM-104-01-T-SV
4X1 Header
Q4
MMBTA06LT1
Q4
MMBTA06LT1
R8 20MR8 20M
R3
3.65K
R3
3.65K
C3
0.01uF
C3
0.01uF
R9
1M
R9
1M
R5
100K
R5
100K
R1
1.07K
R1
1.07K
R16
0
R16
0
U2
Si3018
U2
Si3018
QE 1
DCT 2
RX 3
IB
4
C1B
5
C2B
6
VREG
7
RNG1 8
DCT2 16
IGND
15
DCT3 14
QB 13
QE2 12
SC
11
VREG2
10 RNG2 9
R10
536
R10
536
Figure 30. Daughter Card (Si24xx2G-DC Rev 2.0) Line Side
MM 33 a iii SSSSSSSSSSS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
36 Rev. 0.4
These components are for internal
Silabs use only.
R103R102
27 Mhz
4.9152 MHz
32.768 kHz
The two Crystals are
alternate footprints and
frequencies. The values of
C40 and C41 are different at
the two frequencies. See The
BOM.
The 27 MHz oscillator is a
stand-in for a customer
provide system clock, saving
the cost of a crystal and two
caps.
RIb DCDb
P1
P2
P3
P14
P10
P8
P4
P5
P9
P7
P11
P12
P16
P13
Pin 2
Pin 35
Pin 19
Pin 28
Yes
Yes
No
No
No
No
Y1CY1BY1A
Yes
Yes
Yes
No No
No
No
No
No
** R102 is 1k because
Voice motherboards use a
10 k pullup on RIb when
the exclusion relay driver
is enabled via the jumper.
RXD_SPI_MISO
FSYNCH
RTSb_SPI_CS
INTb
ESC
RIb
SDI
AOUT
CLKOUT
TXD_SPI_MOSI
CTSb_SPI_SCLK
SDO
RESETb
DCDb
RIb
SDI
XTALO
DCDb
INTb
RIb
XTALI
AOUT
EESDI
EESDO
RXD_SPI_MISO
TXD_SPI_MOSI
RTSb_SPI_CS
CTSb_SPI_SCLK
RESETb
CLKOUT
ESC
XTALO
EECS
DCDb
EECLK
XTALI
SDO
FSYNCH
INTb
RIb
SDI
FSYNCH
EECLK
EESDI
EESDO
EECS
GPIO1
GPIO1
C1A
C2A
VDD
VDD
VDD
VDD
VDD
C1A
C2A
TPV3TPV3
JP2 EE En
JP2 EE En
C50
0.1uF
C0402
C50
0.1uF
C0402
TPV6TPV6
TPV4TPV4
C52
0.1uF
C0402
C52
0.1uF
C0402
C41 33pFC41 33pF
R121 0R121 0
C56
0.1uF
C56
0.1uF
R120 0R120 0
J1
SOCKET 8x2
J1
SOCKET 8x2
1
122
3
344
5
566
7
788
9
910 10
11
11
13
13
15
15
12 12
14 14
16 16
FB5FB5
TPV1TPV1
R101 10KR101 10K
TPV5TPV5
C51
0.22uF
C51
0.22uF
R18
1.2K
R18
1.2K
TPV2TPV2
C40 33pFC40 33pF
JP1
SPI En
JP1
SPI En
C54
1uF
C54
1uF
Y1C
27 MHz
Y1C
27 MHz
GND
2
VCC 4
OUT 3
NC
1
C55 0.1uFC55 0.1uF
R103 10KR103 10K
C57 0.1uFC57 0.1uF
U3
EEPROM 32K
U3
EEPROM 32K
/CS
1MISO
2MOSI
5SCLK
6/WP 3
GND
4
/HOLD 7
VCC 8
R102 1KR102 1K
R122 0R122 0
Y1A
32.768KHz
Y1A
32.768KHz
U1
Si2493
U1
Si2493
GPIO1
1
NC1
4
FSYNCH_
2
CLKOUT
3
VDD 5
GND
6
VREG 7
SDI
8
RIb
19
GPIO11/A0
20
UART_CTS_/SPI_SCLK/CS_
21
EECLK
13
AOUTb
14
UART_RXD/SPI_MISO/RD_
22 UART_TXD/SPI_MOSI/WR_
23 UART_RTS_/SPI_CS_/D7
24
EESDO
11
SDO
9
EESDI
10
EECS
12
C2A 17
C1A 18
AOUT
15
RESET_
16
GPIO18/D0
34
INT_
35
CLKIN/XTALI 36
XTALO 37
NC3
38 NC2
27
GND
25 VDD 26
EC/D5
29
GPIO25/D3
31 GPIO16/D2
32
DCD_/D6
28
GPIO24/D4
30
GPIO17/D1
33
TPV7TPV7
R123 0R123 0
Y1B
4.9152MHz
Y1B
4.9152MHz
R104 10KR104 10K
Figure 31. QFN Daughter Card (Si24xx2G-QFN38-DC Rev 1.0) System Side
WW } Q ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, SILIEDN LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 37
Bias
Ring Detect/CID/Voltage monitoring
Hookswitch
DC Term
Add 0.020 to 0.030 sq. inches of Cu at all
transistor collectors
Place C3 near D1
No Ground Plane In DAA Section
TIP
RING
C1A
C2A
I_GND
I_GND
I_GND
I_GND
C10
0.01uF
C10
0.01uF
R12
56.2
R12
56.2
Q1
MMBTA42LT1
Q1
MMBTA42LT1
RV1
P3100SB
RV1
P3100SB
C4X1uF
25VX8R
C4X1uF
25VX8R
Q3
MMBTA42LT1
Q3
MMBTA42LT1
Q5
MMBTA06LT1
Q5
MMBTA06LT1
R2
150
R2
150
FB1
600 Ohm
FB1
600 Ohm
C2 33pFC2 33pF
C6
0.1uF
C0603
C6
0.1uF
C0603
C5
0.1uF
C0603
C5
0.1uF
C0603
R4
2.49K
R4
2.49K
Q2
MMBTA92LT1
Q2
MMBTA92LT1
-+
D1
HD04
-+
D1
HD04
C8
680pF
C8
680pF
R6
100K
R6
100K
C9
680pF
C9
680pF
C1 33pFC1 33pF
R11
73.2
R11
73.2
FB2
600 Ohm
FB2
600 Ohm
C7 2.7nFC7 2.7nF
R13
56.2
R13
56.2
R15
0
R15
0
+
C41uF
+
C41uF
J2
TSM-104-01-T-SV
4X1 Header
J2
TSM-104-01-T-SV
4X1 Header
R7 20MR7 20M
Z1
43V
Z1
43V
R8 20MR8 20M
Q4
MMBTA06LT1
Q4
MMBTA06LT1
R3
3.65K
R3
3.65K
C3
0.01uF
C3
0.01uF
R9
1M
R9
1M
R5
100K
R5
100K
R10
536
R10
536
U2
Si3018
U2
Si3018
QE 1
DCT 2
RX 3
IB
4
C1B
5
C2B
6
VREG
7
RNG1 8
DCT2 16
IGND
15
DCT3 14
QB 13
QE2 12
SC
11
VREG2
10 RNG2 9
R16
0
R16
0
R1
1.07K
R1
1.07K
Figure 32. Daughter Card (Si24xx2G-QFN38-DC Rev 1.0) Line Side
me was ma amass mm on cm; m 742v was we : mom ch @- axu EI- an m- m EI- 03 @I- In em El- 9124 asu n HANDSET E5 ($9 SILICON LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
38 Rev. 0.4
6. Motherboard and Daughter Card PCB Layouts
Figure 33. Motherboard Primary Side Component and Silkscreen View
L JL-JL JL J am] am mu ma um um um gnu r 1r 1r 1r 1 3.5.: 323223; 2 m =3 : x: a a; 0' £2, a: 0' a; umu 0 am 3;. O 3.x .5: 0' a: 2 E 53):: 3 uz £2. a u: 525:3 3 £2, awn H 5E9 E oz amt. E uz x3333 E mi Ex 02 3 gm 2. 3 us 32 3 on Ea E 3 oz 3;. 3 Dz 13;: 3 z z e. 3 So uz 3 8; 3:25 3 3m 3 :62 :3 2%. :3 :62 :3 E 2 5:; =3 s 35 (3 : :5” «2‘2 . 2:250 :95; e SILIEDN LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 39
Figure 34. Motherboard Bottom Side Component and Silkscreen View
.amwmmwflu . . 3 ..-._-.l :1. -..-....- . .olvhh. ii. Inf-HA - ..
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
40 Rev. 0.4
Figure 35. Motherboard Primary Side Signal Layer
SILIEDN LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 41
Figure 36. Motherboard Layer 2 Ground Plane
SILICON LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
42 Rev. 0.4
Figure 37. Motherboard Layer 3 Power Plane
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 43
Figure 38. Motherboard Secondary Side, Signal Layer
I I I ® .5828. www I I 9N». onlowxéfiw WWW I I no mm I I E I I 2x NFERFW I I I MEE I I ududud I-I-Iv E 000 I {alt "I I I I IE "OPE I. IE I l8:l l I Gltl 31 8 I I I I I I I I I I I IIgIoI Jill I I éilil‘l IIIIIII I 5IIIIIIIIIIII I I 0' 1 13' | - _¢o mm. :3 _ 5 .mo IN" ll II_N=- “.me me 132-4 no 258 r L _|._ll_I- ; I I I I—0 no. I @m-= —=:_m r. . .._L I In.» ($9 SILICON LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
44 Rev. 0.4
Figure 39. Daughter Card Primary Side, Component and Silkscreen
fl. - :IK' I I; .'.g | | I“ I MI I I? I l S a: Q) I I - g. I «5 [fl :3 ' 22° II . llllll O .- 3 [CO 660 IIIII IIIII Ill-llaeoaafleo , . SILIEDN LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 45
Figure 40. Daughter Card Secondary Side, Component and Silkscreen
E5131 r #me 1mg:— 'Mfi SSSSSSSSSSS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
46 Rev. 0.4
.
Figure 41. Daughter Card Primary Side
9 .. :1?- ! ' 1..
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 47
Figure 42. Daughter Card Secondary Side
SILICON LABS o op >mm 2: :22: l l 8- 50 83% @Q W. l O J I." m I. mm I I : In: W. E.» H— u" l 8 ”m H l 98 “la l E I a: 8-.l I. l “yam E 34"". .n u u. . mm m I :E 3 H H 5 MW . ..aw9 " ~ _ - ' o ' +0 II h::::=:u Ilflwflw a "8 L... III-E. I. m'm cz - ~ +9.00. W40. N2 50 .- WEE—Em... J 0 «0-11! "l_|_l_o won. I SE 0 o r. I IL IL .
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
48 Rev. 0.4
Figure 43. QFN Daughter Card Primary Side, Component and Silkscreen
a: M. a: IIco Ml mm 5 €l00l II I- - meomlo.. - EB- - 8:.Ih___._#. m- ' Im 53- I. ' - .3 o I IV» ll- - ESFEW” - :5. 8M 2 SILIEDN LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 49
Figure 44. QFN Daughter Card Secondary Side, Component and Silkscreen
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
50 Rev. 0.4
Figure 45. QFN Daughter Card Primary Side
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 51
Figure 46. QFN Daughter Card Secondary Side
($9 SILICON LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
52 Rev. 0.4
7. Bill of Materials
The following sections contain the bills of materials for the motherboard and daughter card.
7.1. Motherboard Bill of Materials
Table 7. MotherBoard Bill of Materials
Item NI Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr
48 NI 3 R2, R114,
R115 01A ThickFilm R0603 CR0603-16W-000 Venkel
1 NOPOP 1 C1 0.1 µF 10V ±20% X7R C0402 C0402X7R100-104M Venkel
33 NOPOP 1 J7 2 mm, RT ANG SHROUDE
DCONN1X5-S5B-PH-
SM4-TB S5B-PH-SM4-TB JST
63 NOPOP 6 R39, R49,
R51 10 k1/10W ±1% ThickFilm R0603 CR0603-10W-1002F Venkel
71 NOPOP 1 R108 0 1A ThickFilm R0603 CR0603-16W-000 Venkel
77 NOPOP 1 T1 3.3 mH TelCom IND-CMC-7X8 750311349 Wurth/Mid-
com
90 NOPOP 1 V1A 1000 V 1000V GDT GDT-RA-C6-Y RA-102M-C6-Y OKAYA
91 NOPOP 1 V1B 800 V 800V GDT GDT-450-6X8MM GTCA28-801L-P05 Tyco
92 NOPOP 1 V2A 350 V 350V GDT GDT-RA-C6-Y RA-351M-C6-Y OKAYA
93 NOPOP 1 V2B 350 V 350V GDT GDT-450-6X8MM GTCA28-351L-P05 Tyco
2 2 C2 C39 10 µF 10V ±20% X7R C1206 C1206X7R100-106M Venkel
3 27 C3, C4, C5,
C10, C12,
C14, C24,
C25, C26,
C27, C28,
C29, C30,
C33, C35,
C53, C56,
C57, C58,
C59, C61,
C62, C63,
C71, C72,
C75, C96
0.1 µF 10V ±20% X7R C0402 C0402X7R100-104M Venkel
4 2 C6, C17 100 µF 16V ±20% Alum_Elec C6.6X6.6MM EEEFK1C101P Panasonic
516C7, C11,
C18, C20,
C21, C22,
C23, C31,
C34, C37,
C43, C54,
C55, C65,
C69, C74
1 µF 10V ±10% X7R C0603 C0603X7R100-105K Venkel
6 3 C8, C49,
C66 10 µF 16V ±10% X5R C0805 C0805X5R160-106K Venkel
7 4 C13, C52,
C70 C73 560 pF 16V ±10% X7R C0603 C0603X7R160-561K Venkel
8 2 C15, C19 2.2 nF 16V ±10% X7R C0603 C0603X7R160-222K Venkel
9 2 C40, C48 0.1 µF 50V ±10% X7R C0603 C0603X7R500-104K Venkel
, . SILIEDN LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 53
10 1 C41 560 µF 6.3V ±20% Alum_Elec C3.5X8MM-RAD EEUFM0J561 Panasonic
11 3 C42, C51,
C60 0.01 µF 25 V ±10% X7R C0402 C0402X7R250-103K Venkel
12 2 C44, C45 470 µF 25 V ±20% Alum_Elec C10.3X10.3MM EMVE250ADA471MJ
A0G United
Chemicon
13 1 C98 4.7 µF 6.3 V ±10% X5R C0603 C0603X5R6R3-475K Venkel
14 8 DN1, DN2,
DN3, DN4,
DN5, DN6,
DN7, DN8,
15 V 225 mW 15 V Zener, Dual SOT23-AAK MMBZ15VDLT1G On Semi
15 7 D1, D2, D3,
D6, D14,
D15, D49
MMBD3004S-7-F 225 mA 300 V DUAL SOT23-AKC MMBD3004S-7-F Diodes Inc.
16 13 D5, D41,
D42, D43,
D44, D45,
D46, D47,
D48, D50,
D51, D52,
D53
RED 25 mA 1.9 V SMT, Chip-
LED LED-HSMX-C170 HSMC-C170 Avago
Technolo-
gies
17 4 D7, D9, D11,
D13 STPS140Z 1.0 A 40 V Schottky SOD-123 STPS140Z ST MICRO
18 1 D12 Bridge
Rectifier 0.8 A 100 V BRIDGE MiniDIP4 HD01-T Diodes Inc.
19 1 D54 BAV23A 400 mA 200 V DUAL SOT23-KKA BAV23A Diodes Inc.
20 9 FB1, FB2,
FB3, FB4,
FB6, FB7,
FB8, FB9,
FB11
600 200 mA SMT L0603 BLM18AG601SN1 MuRata
21 4 HD5, HD6,
HD7, HD8 Screw MH-125NP NSS-4-4-01 Richco
Plastic Co
22 4 HW1, HW2,
HW3, HW4 Standoff N/A 2397 SPC Tech-
nology
23 4 JP1, JP2,
JP3, JP4 Header 5x1 Header CONN1X5-TSW TSW-105-07-T-S Samtec
24 3 JP5, JP23,
JP24 Header 1x3 Header CONN-1X3 TSW-103-07-T-S Samtec
25 9 JP6, JP7,
JP8, JP9,
JP10, JP12,
JP13, JP14,
JP15
Jumper Header CONN-1X2 TSW-102-07-T-S Samtec
26 1 JP11 HEADER 4X1 Header CONN-1X4 TSW-104-07-T-S Samtec
27 1 JP16 4X1 Socket Socket CONN-1X4 SSW-104-01-T-S Samtec
28 2 JP33, JP34 JUMPER Unshrouded CONN-1X2 68000-402 Berg
29 1 J1 RJ10 - Handset Handset RJ10-4P4C 806-GMX-N-44 Mouser
30 1 J2 RCA Jack RCA CONN-RCA-RCJ-
04X 161-0097-E Kobiconn
Table 7. MotherBoard Bill of Materials (Continued)
Item NI Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr
($9 SILICON LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
54 Rev. 0.4
31 1 J5 RJ–11 RJ-11 RJ11-DUAL-MTJG MTJG-2-64-2-2-1 ADAM
TECH
32 1 J6 HEADER 5x3 Header CONN3X5 TSW-105-07-S-T Samtec
34 1 J8 CONN TRBLK 2 TERM BLK CONN-1X2-TB 1729018 PHOENIX
CONTACT
35 1 J9 Power Jack 1 A BARREL CONN-3-PWR ADC-002-1 Adam Tech
36 1 J10 DB9 D-SUB CONN-9-DBF D09S33E4GX00LF FCI
37 1 J11 USB Type B USB CONN-USB-B 292304-1 Tyco
38 1 J30 5x2 Shrouded
Header Shrouded CONN2X5-4W 5103309-1 Tyco
39 1 J101 HEADER 8x2 Header CONN2X8 TSW-108-07-S-D Samtec
40 1 J103 8x2 Shrouded
Header Shrouded CONN2X8-4W 5103309-3 Tyco
41 1 K1 Relay HV DPDT RLY-TXS2SA FTR-C1GA4.5G Fujitsu
42 1 LS1 Speaker 0.5 W
Max SPEAKER-
RE2308NL RE-2308-NL Regal
43 1 MK1 Microphone MIC-6X2.7mm CMC-2742PBJ-A CUI Inc
44 2 Q1 Q4 MMBTA06LT1 500 mA 80 V NPN SOT23-BEC MMBTA06LT1 On Semi
45 1 Q3 FCX1051ATA 2 W 40 V NPN SOT89-BCE FCX1051ATA Zetex
46 1 Q5 MMBT3906-7-F 200 mA 40 V PNP SOT23-BEC MMBT3906-7-F Diodes Inc.
47 4 R1, R57,
R98, R104 0.05 1/4 W ±5% ThickFilm R0805 LCR0805-R050J Venkel
49 2 R3, R28 200 1/10 W ±1% ThickFilm R0603 CR0603-10W-2000F Venkel
50 16 R4, R17,
R19, R20,
R25, R31,
R40, R41,
R42, R43,
R52, R60,
R87, R91
R109, R110,
R111, R112,
R113
10 k1/10 W ±1% ThickFilm R0603 CR0603-10W-1002F Venkel
51 6 R5, R18,
R36, R37,
R38, R45
100 k1/10 W ±1% ThickFilm R0603 CR0603-10W-1003F Venkel
52 4 R6, R7, R11,
R21 2k1/10 W ±1% ThickFilm R0603 CR0603-10W-2001F Venkel
53 2 R9, R32 0 1A ThickFilm R0603 CR0603-16W-000 Venkel
54 1 R10 4.7 k1/16 W ±5% ThickFilm R0603 CR0603-16W-472J Venkel
55 1 R12 5.1 k1/16 W ±5% ThickFilm R0603 CR0603-16W-512J Venkel
56 2 R13, R24 50 kTRIM POT-PV37W PV37W503C01B00 Murata
57 5 R14, R16,
R33, R34,
R35
1k1/16 W ±1% ThickFilm R0603 CR0603-16W-1001F Venkel
Table 7. MotherBoard Bill of Materials (Continued)
Item NI Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr
, . SILIEDN LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 55
58 1 R15 49.9 k1/16 W ±0.5
%ThickFilm R0603 CR0603-16W-4992D Venkel
59 1 R22 499 1/10 W ±1% ThickFilm R0603 CR0603-10W-4990F Venkel
60 3 R23, R29,
R44 3.01 k1/16 W ±1% ThickFilm R0603 CR0603-16W-3011F Venkel
61 1 R27 324 k1/10 W ±1% ThickFilm R0603 CR0603-10W-3243F Venkel
62 1 R30 10 M1/16 W ±1% ThickFilm R0603 CR0603-16W-1005F Venkel
64 1 R59 1 1/10 W ±1% ThickFilm R0603 CR0603-10W-1R00F Venkel
65 2 R69, R70 0 10 A 0 Wire RES-7MM ZOR-12-R Yageo
66 2 R84, R85 1.5 k1/16 W ±5% ThickFilm R0603 CR0603-16W-152J Venkel
67 1 R96 3.57 1/10 W ±1% ThickFilm R0603 CR0603-10W-3R57F Venkel
68 3 R97, R99,
R101 200 1/10 W ±5% ThickFilm R0603 CR0603-10W-2000J Venkel
69 2 R100, R102 1.33 K1/10 W ±1% ThickFilm R0603 CR0603-10W-1331F Venkel
70 2 R103, R105 1.6 1/4 W ±5% ThickFilm R1206 CR1206-8W-1R6J Venkel
72 11 R155, R156,
R157, R158,
R159, R160,
R161, R162,
R163, R169,
R170
681 1/10 W ±1% ThickFilm R0603 CR0603-10W-6810F Venkel
73 1 S1 SW
Pushbutton 50 mA 12 Vdc Tactile SW4N6.5X4.5-PB 101-0161-EV Mountain
Switch
74 4 TP1, TP10,
TP12, TP13 Red Loop Testpoint 151-207-RC Kobiconn
75 5 TP2, TP7,
TP8, TP9,
TP25
Turret Turret TP[12594] 2551-2-00-44-00-00-
07-0 Mill-Max
76 10 TP5, TP6,
TP16, TP17,
TP19, TP20,
TP21, TP22,
TP23, TP24,
Blue Loop Testpoint 151-205-RC Kobiconn
78 2 U1, U3 LT1963A-3.3 V 1.5 A
max LDO SOT223 LT1963AEST-
3.3#PBF Linear Tech-
nologies
79 1 U2 Si3000 VOICE
CODEC SO16N6.0P1.27 SI3000-KS SiLabs
80 1 U4 LM4862 SO8N6.0P1.27 LM4862M National
Semicon-
ductor
81 1 U5 EEPROM 32K Serial TSSOP8N6.4P0.65 25LC320A-I/ST Microchip
Technology
82 2 U8, U10 5 0.5 A
max LDO TO263-3N LM2937ES-5.0 National
Semicon-
ductors
83 1 U11 MAX3237 5.5 V RS232 TSSOP28 MAX3237EIPWR TI
Table 7. MotherBoard Bill of Materials (Continued)
Item NI Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr
($9 SILICON LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
56 Rev. 0.4
84 1 U12 CP2102 MCU QFN28N5X5P0.5 CP2102-GM SiLabs
85 2 U13, U14 IDT74CBTLV3257 MUX TSSOP16N6.4P0.65 IDT74CBTLV3257PG
GIDT
86 1 U18 DS1818 3.3 V 10% SOT-23 DS1818-10 Dallas
Semicon-
ductor
87 3 U20, U21,
U22 AD8602ARM SOP8N4.9P0.65 AD8602ARM Analog
Devices
88 1 U26 74LCX541 Buffer TSSOP20N6.4P0.65 74LCX541MTC Fairchild
89 1 U27 MAX4521 TSSOP16N6.4P0.65 MAX4521CUE+ Maxim
Table 8. Motherboard Bill of Materials (Non-Populated Footprints)
Item Qty Reference Value Rating Tol Dielectric PCB Footprint Manufacturer Part
Number Manufacturer
91 3 R1,R73,R102 0R 1/16 W RC0603 CR0603-16W-000T Venkel
92 2 R31,R32 10k 1/16 W ±5% RC0603 CR0603-16W-103JT Venkel
93 1 C10 10 uF 10 V ±10
%
X7R CC0805 GRM21BR71A106KE51L Murata
Table 7. MotherBoard Bill of Materials (Continued)
Item NI Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr
, . SILIEDN LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 57
7.2. Daughter Card Bill of Materials
Table 9. Si24xx Daughter Card Bill of Materials
Item Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr
1 2 C1, C2 33 pF Y2 250 V ±10% Y2 C1808 SCC1808X330K502T Holy Stone
2 1 C3 0.01 µF 250 V ±10% X7R C0805 GRM21BR72E103KW03L Murata
3 1 C4 1 µF 50 V ±20% Alum_Elec C3.3X3.3MM EEE1HS010SR Panasonic
4 2 C5, C6 0.1 µF 16 V ±20% X7R C0603 C0603X7R160-104M Venkel
5 1 C7 2.7 nF 50 V ±20% X7R C0603 C0603X7R500-272M Venkel
6 2 C8, C9 680 pF Y2 250 V ±10% Y2 C1808 SCC1808X681K502T Holy Stone
7 1 C10 0.01 µF 16 V ±20% X7R C0603 C0603X7R160-103M Venkel
8 2 C40,
C41 18 pF 50 V ±5% COG C0603 C0603COG500-180J Venkel
9 3 C50,
C52,
C56
0.1 µF 10 V ±20% X7R C0603 C0603X7R100-104M Venkel
10 2 C51,
C53 0.22 µF 6.3 V ±10% X5R C0603 C0603X7R6R3-224K Venkel
11 1 C54 1 µF 25 V ±10% X5R C0603 C0603X5R250-105K Venkel
12 1 D1 HD04 0.8 A 400 V BRIDGE MiniDIP4 HD04-T Diodes Inc.
13 3 FB1,
FB2,
FB5
600 200 mA SMT L0603 BLM18AG601SN1 Murata
14 1 J1 SOCKET 8x2 SOCKET SOCKETX8-100-SMT SSW-108-22-G-D-VS Samtec
15 1 J2 4X1 Header_0 CONN1X4-100-SMT TSM-104-01-T-SV Berg
16 2 Q1 Q3 MMBTA42LT1 200 mA 300 V NPN SOT23-BEC MMBTA42LT1 On Semi
17 1 Q2 MMBTA92LT1 100 mA 300 V PNP SOT23-BEC MMBTA92LT1 On Semi
18 2 Q4 Q5 MMBTA06LT1 500 mA 80 V NPN SOT23-BEC MMBTA06LT1 On Semi
19 1 RV1 P3100SB 275 V Sidactor DO-214AA-NP P3100SBL Littelfuse
20 1 R1 1.07 k1/2 W ±1% ThickFilm R2010 CR2010-2W-1071F Venkel
21 1 R2 150 1/16 W ±5% ThickFilm R0603 CR0603-16W-151J Venkel
22 1 R3 3.65 k1/2 W ±1% ThickFilm R2010 CR2010-2W-3651F Venkel
23 1 R4 2.49 k1/2 W ±1% ThickFilm R2010 CR2010-2W-2491F Venkel
24 2 R5, R6 100 k1/16 W ±5% ThickFilm R0603 CR0603-16W-104J Venkel
25 2 R7, R8 20 M1/8 W ±5% ThickFilm R0805 CR0805-8W-206J Venkel
26 1 R9 1 M1/16 W ±1% ThickFilm R0603 CR0603-16W-1004F Venkel
27 1 R10 536 1/4 W ±1% ThickFilm R1206 CR1206-4W-5360F Venkel
28 1 R11 73.2 1/2 W ±1% ThickFilm R2010 CR2010-2W-73R2F Venkel
29 2 R12,
R13 56.2 1/16 W ±1% ThickFilm R0603 CR0603-16W-56R2F Venkel
30 2 R15,
R16 01 A ThickFilm R0603 CR0603-16W-000 Venkel
31 2 R120,
R121 01 A ThickFilm R0603 CR0603-16W-000 Venkel
32 1 R18 1.2 k1/10 W ±5% ThickFilm R0603 CR0603-10W-121J Venkel
33 4 R101,
R102,
R103,
R104,
R106
10 k1/10 W ±5% ThickFilm R0603 CR0603-10W-103J Venkel
34 1 R105 1 k1/10 W ±5% ThickFilm R0603 CR0603-10W-102J Venkel
($9 SILICON LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
58 Rev. 0.4
35 3 R110,
R111,
R112
200 1/10 W ±5% ThickFilm R0603 CR0603-10W-2000J Venkel
36 1 U2 Si3018 300 V LineSide SO16N6.0P1.27 Si3018-F-GS SiLabs
37 1 U12 Si24xx ISOMODEM TSSOP24N6.4P0.65 Si2493-E-FT SiLabs
38 1 U13 Si24xx 16pin SOIC Si24xx Silicon
Laboratories
39 1 Y1B
(Y1, Y3) 32.768 kHz XTAL-3X8-LD ECS–.327–12.5–8X ECS
International
40 1 Z1 43 V 500 mW 43 V Zener SOD-123 BZT52C43-7-F Diodes Inc.
Table 10. Daughter Card Bill of Materials (Non-Populated Footprints)
Item Qty Reference Value Rating Tol Dielectric PCB Footprint Manufacturer Part
Number Manufacturer
1 1 C50 0.1 µF 16 V ±20% X7R CC0603 C0603X7R160-104MNE Venkel
2 2 C55,C56 0.1 µF 10 V ±20% X7R CC0603 C0603C124K Kemet
31 R18 1.3k1/16 W ±5% RC0603 CR0603-16W-132JT Venkel
4 5 R19,R20,
R21,R22,R23
01/16W ±5% RC0603 CR0603-16W-000J Venkel
5 1 U4 Si2401 16pin SOIC Silicon Labs
Table 9. Si24xx Daughter Card Bill of Materials (Continued)
Item Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr
, . SILIEDN LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 59
7.3. QFN Daughter Card Bill of Materials
Table 11. Si24xx QFN Daughter Card Bill of Materials
Item Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr
1 2 C1, C2 33 pF Y2 250 V ±10% Y2 C1808 SCC1808X330K502T Holy Stone
2 1 C3 0.01 µF 250 V ±10% X7R C0805 C0805X7R251-103K Venkel
3 1 C4 1 µF 50 V ±20% Alum_Elec C3.3X3.3MM EEE1HS010SR Panasonic
5 2 C5, C6 0.1 µF 16 V ±20% X7R C0603 C0603X7R160-104M Venkel
6 1 C7 2.7 nF 50 V ±20% X7R C0603 C0603X7R500-272M Venkel
7 2 C8, C9 680 pF Y2 250 V ±10% Y2 C1808 SCC1808X681K502T Holy Stone
8 1 C10 0.01 µF 16 V ±20% X7R C0603 C0603X7R160-103M Venkel
9B 2 C40, C41 18 pF 50 V ±5% COG C0603 C0603COG500-180J Venkel
10 5 C50, C52,
C55, C56,
C57
0.1 µF 10 V ±10% X7R C0402 C0402X7R100-104K Venkel
11 1 C51 0.22 µF 10 V ±10% X7R C0603 C0603X7R100-224K Venkel
12 1 C54 1 µF 25 V ±10% X5R C0603 C0603X5R250-105K Venkel
13 1 D1 HD04 0.8 A 400 V BRIDGE MiniDIP4 HD04-T Diodes Inc.
14 3 FB1, FB2,
FB5 600 200 mA SMT L0603 BLM18AG601SN1 MuRata
15 2 JP1, JP2 JUMPER Header CONN-1X2 TSW-102-07-T-S Samtec
16 1 J1 SOCKET 8x2 SOCKET SOCKETX8-100-SMT SSW-108-22-G-D-VS Samtec
17 1 J2 4X1 Header SMT CONN1X4-TSM TSM-104-01-T-SV Samtec
18 2 Q1, Q3 MMBTA42LT1 200 mA 300 V NPN SOT23-BEC MMBTA42LT1 On Semi
19 1 Q2 MMBTA92LT1 100 mA 300 V PNP SOT23-BEC MMBTA92LT1 On Semi
20 2 Q4, Q5 MMBTA06LT1 500 mA 80 V NPN SOT23-BEC MMBTA06LT1 On Semi
21 1 RV1 P3100SB 275 V Sidactor DO-214AA-NP P3100SBL Littelfuse
22 1 R1 1.07 k1/2 W ±1% ThickFilm R2010 CR2010-2W-1071F Venkel
23 1 R2 150 1/16 W ±5% ThickFilm R0603 CR0603-16W-151J Venkel
24 1 R3 3.65 k1/2 W ±1% ThickFilm R2010 CR2010-2W-3651F Venkel
25 1 R4 2.49 k1/2 W ±1% ThickFilm R2010 CR2010-2W-2491F Venkel
26 2 R5, R6 100 k1/16 W ±5% ThickFilm R0603 CR0603-16W-104J Venkel
27 2 R7, R8 20 M1/8 W ±5% ThickFilm R0805 CR0805-8W-206J Venkel
28 1 R9 1 M1/16 W ±1% ThickFilm R0603 CR0603-16W-1004F Venkel
29 1 R10 536 1/4 W ±1% ThickFilm R1206 CR1206-4W-5360F Venkel
30 1 R11 73.2 1/2 W ±1% ThickFilm R2010 CR2010-2W-73R2F Venkel
31 2 R12, R13 56.2 1/16 W ±1% ThickFilm R0603 CR0603-16W-56R2F Venkel
32 2 R15, R16 0 1 A ThickFilm R0603 CR0603-16W-000 Venkel
($9 SILICON LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
60 Rev. 0.4
33 1 R18 1.2 k1/16 W ±5% ThickFilm R0402 CR0402-16W-122J Venkel
34 2 R101,
R104 10 k1/10 W ±5% ThickFilm R0603 CR0603-10W-103J Venkel
36 1 R122 0 1 A ThickFilm R0402 CR0402-16W-000 Venkel
38 1 U1 Si2494/39 ISOMODEM QFN38N5X7P0.5 Si2494-A-FM/Si2439-A-
FM SiLabs
39 1 U2 Si3018 300 V LineSide SO16N6.0P1.27 Si3018-F-GS SiLabs
40 1 U3 EEPROM 32K Serial TSSOP8N6.4P0.65 25LC320A-I/ST Microchip
Technology
41 1 Y1A 32.768 kHz XTAL-3X8-LD ECS–.327–12.5–8X ECS
International
44 1 Z1 43 V 500 mW 43 V Zener SOD-123 BZT52C43-7-F Diodes Inc.
Table 12. Si24xx QFN Daughter Card Bill of Materials (Non-Populated Footprints)
Item Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr
4 1 C4X 1 µF 25 V ±10% X8R C1206 C3216X8R1E105K TDK
9 2 C40, C41 33 pF 50 V ±5% COG C0402 C0402COG500-330J Venkel
32B 2 R120,
R121
01 A ThickFilm R0603 CR0603-16W-000 Venkel
34 1 R103 10 k1/10 W ±5% ThickFilm R0603 CR0603-10W-103J Venkel
35 1 R102 1 k1/10 W ±5% ThickFilm R0603 CR0603-10W-1001J Venkel
36B 1 R123 0 1 A ThickFilm R0402 CR0402-16W-000 Venkel
42 1 Y1B 4.9152 MHz XTAL-HC49U-SMT FOXSDLF/049-20 FOX
Electronic
43 1 Y1C 27 MHz 3.3 V XTAL OSC OSC4N5X3.2-FOX924 FOX924B-27.000 FOX
Table 11. Si24xx QFN Daughter Card Bill of Materials
Item Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr
, . SILIEDN LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 61
8. Complete Design Package on CD
(See Sales Representative for Details)
Silicon Laboratories can provide a complete design package of the Voice ISOmodem EVB including the following:
OrCad Schematics
Gerber Files
Please contact your local sales representative or Silicon Laboratories headquarters sales for ordering information.
($9 SILIEEIN LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
62 Rev. 0.4
DOCUMENT CHANGE LIST
Revision 0.1 to Revision 0.2
Updated Voice Motherboard description,
schematics, silkscreens, and configuration from 1.0
to 2.0 revision.
Updated Daughtercard description, schematics,
silkscreens, and configuration.
Added support for Si2494/39 voice and data
modems.
Updated "Description" on page 1.
Updated "2.Daughter Cards" on page 4.
Added "4.1.7.Surge Protection Circuits" on page 24.
Updated "4.1.8.2.The Call Progress Signal" on page
26.
Updated "4.2.Daughter Cards" on page 28.
Added "4.2.4.Daughter Card Strapping and Jumper
Options" on page 29.
Added "7.3.QFN Daughter Card Bill of Materials" on
page 59.
Added "8.Complete Design Package on CD" on
page 61.
Updated Figure 5, “Function and Location of Global
Voice ISOmodem EVB Jumpers,” on page 6.
Updated Figure 29 on page 34.
Added Figure 31, “QFN Daughter Card (Si24xx2G-
QFN38-DC Rev 1.0) System Side,” on page 36.
Added Figure 32, “Daughter Card (Si24xx2G-
QFN38-DC Rev 1.0) Line Side,” on page 37.
Added Figure 43, “QFN Daughter Card Primary
Side, Component and Silkscreen,” on page 48.
Added Figure 44, “QFN Daughter Card Secondary
Side, Component and Silkscreen,” on page 49.
Added Figure 45, “QFN Daughter Card Primary
Side,” on page 50.
Added Figure 46, “QFN Daughter Card Secondary
Side,” on page 51.
Updated Table 2, “Digital Data Related Jumpers,” on
page 7.
Added Table 11, “Si24xx QFN Daughter Card Bill of
Materials,” on page 59.
Added Table 12, “Si24xx QFN Daughter Card Bill of
Materials (Non-Populated Footprints),” on page 60.
Revision 0.2 to Revision 0.3
Updated Table 3, “Sound Related Jumpers,” on
page 8.
Corrected R13 adjustment information.
Changed obsolete references, such as “JP5”.
Updated Table 5, “Board Configuration,” on page 21.
Added missing jumper information.
Revision 0.3 to Revision 0.4
Updated "3.3.USB Interface Data Link Setup Quick
Start" on page 9.
Removed JP5 reference.
, . SILIEDN LABS
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4 63
NOTES:
SILICON LABS
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Connected.
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Disclaimer
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intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical"
parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without
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EFM32®, EFR, Ember®, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZRadio®, EZRadioPRO®,
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