370(Wrap) Datasheet by Multicore

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Alloys: Flux: 370 Flux Hunt's Aud vame‘ mg KOH/g 150475 Hahde Comm "In 00 OO-ssnz DIN 8515 DTDSQQA Soldering Iron: So‘dermg Process C‘eamng: Technologies
Laboratory Data Sheet
Product 370(WRAP)
March 2003
NOT FOR PRODUCT SPECIFICATIONS
THE TECHNICAL INFORMATION CONTAINED HEREINARE INTENDED AS REFERENCE ONLY. PLEASE CONTACT LOCTITE
CORPORATION QUALITY DEPARTMENT FOR ASSISTANCE AND RECOMMENDATIONS ON SPECIFICATIONS FOR THIS
Cored Solder Wire RA Type
PRODUCT DESCRIPTION
Multicore 370 (formerly WRAP) solid flux for cored solder
wire has been specially formulated to conform to the QQ-S-
571E Type RA specification. Multicore 370 solid flux is our
most popular flux for TV and electronics soldering in the U.S.
market. It is a non-corrosive activated flux that has good
activity on most surfaces.
TYPICAL PROPERTIES
Alloys:
The alloys used for 370 cored solder wires conform to the
purity requirements of the common national and international
standards (QQ-S-571, J-STD-006A, JIS Z 3282). A range of
wire diameters is available manufactured to close dimensional
tolerances.
Flux:
370 solid flux is based on modified rosin and carefully selected
activators. In practice they exhibit a mild rosin odor and leave
a small quantity of amber residue. Multicore 370 is available as
3 core (2% flux), and 5 core (3% flux) solder wire.
370 Flux Properties
Acid Value, mg KOH/g 164-176
Halide Content, % 0.4
QQ-S-571E
- Solder Spread
- Solder Pool
- Water Extract Resistivity
>90%
Pass
87000
DIN 8516
- Area of Spread
- Corrosion F-SW31 & F-SW32
Pass
Pass
DTD599A
- Corrosion
- Insulation Resistance
Pass
Pass
GENERAL INFORMATION
For safe handling information on this product, consult the
Material Safety Data Sheet, (MSDS).
Directions for Use
Soldering Iron:
Good results should be obtained using a range of tip
temperatures. However, the optimum tip temperature and heat
capacity required for a hand soldering process is a function of
both soldering iron design and the nature of the task and care
should be exercised to avoid unnecessarily high tip
temperatures for excessive times. A high tip temperature will
increase any tendency to flux spitting and it may produce some
residue darkening.
The soldering iron should be properly tinned and this may be
achieved using 370 cored wire. Severely contaminated
soldering iron tips should first be cleaned and pre-tinned using
Multicore Tip Tinner/Cleaner TTC1, then wiped on a clean,
damp sponge before re-tinning with Crystal cored wire.
Soldering Process
Multicore 370 flux cored wires contain a careful balance of
resins and activators to provide amber residues, maximum
activity and high residue reliability, without cleaning in most
situations. To achieve the best results from Multicore 370
solder wire, recommended working practices should be
observed as follows:
Apply the soldering iron tip to the work surface, ensuring
that it simultaneously contacts the base material and the
component termination to heat both surfaces adequately.
This process should only take a fraction of a second.
Apply 370 cored solder wire to a part of the joint surface
away from the soldering iron and allow to flow sufficiently
to form a sound joint fillet – this should be virtually
instantaneous. Do not apply excessive solder or heat to
the joint as this may results in dull, gritty fillets and
excessive or darkened flux residues.
Remove solder wire from the work piece and then remove
the iron tip.
The total process will be very rapid, depending upon thermal
mass, tip temperature and configuration and the solderability of
the surfaces to be joined.
The resin and flux systems are designed to leave relatively low
residues and to minimize residual activity. This is achieved by
ensuring some decomposition and volatilization takes place
during the soldering process. In some situations, this may
generate visible fuming but in all cases, rosin fumes must be
removed from the breathing zone of operators.
Cleaning:
Multicore 370 flux cored solder wire has been formulated to
leave amber flux residues and to resist spitting and fuming. In
most industrial and consumer electronics applications cleaning
will not be required and the product may therefore be used to
complement a No Clean wave soldering or reflow process or to
allow repairs to cleaned boards without the need for a second
cleaning process. In high reliability applications the residues
should be removed.
Should cleaning be required, this is best achieved using
Multicore MCF800 Solvent Cleaner (separate datasheet
available). There are also other commercially available
saponifiers and flux residues that also work well.
Packaging:
370 solid flux for cored solder wire is available in various
diameter and flux percentages, and reel sizes.
LDS 370, March 2003
Loctite Electronics
Henkel Loctite Corporation, 15051 E Don Julian Road, Industry, CA 91746, U.S.A.
U.S.A.: 626.968.6511 Canada: 905.814.6511 Brazil: 011.55.11.4143.7000
Loctite is a Trademark of Henkel Loctite Corp. U.S.A www.loctite.com
Data Ranges
The data contained herein may be reported as a typical value
and/or range. Values are based on actual test data and are
verified on a periodic basis.
Note
The data contained herein are furnished for information only and are
believed to be reliable. We cannot assume responsibility for the
results obtained by others over whose methods we have no control. It
is the user's responsibility to determine suitability for the user's
purpose of any production methods mentioned herein and to adopt
such precautions as may be advisable for the protection of property
and of persons against any hazards that may be involved in the
handling and use thereof. In light of the foregoing, Loctite
Corporation specifically disclaims all warranties expressed or
implied, including warranties of merchantability or fitness for a
particular purpose, arising from sale or use of Loctite
Corporation’s products. Loctite Corporation specifically
disclaims any liability for consequential or incidental damages of
any kind, including lost profits. The discussion herein of various
processes or compositions is not to be interpreted as representation
that they are free from domination of patents owned by others or as a
license under any Loctite Corporation patents that may cover such
processes or compositions. We recommend that each prospective
user test his proposed application before repetitive use, using this data
as a guide. This product may be covered by one or more United
States or foreign patents or patent applications.

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