TEMD6200FX01 Datasheet by Vishay Semiconductor Opto Division

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TEMD6200FX01
www.vishay.com Vishay Semiconductors
Rev. 1.5, 08-Apr-14 1Document Number: 81812
For technical questions, contact: detectortechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Ambient Light Sensor
DESCRIPTION
TEMD6200FX01 is a high speed and high sensitive PIN
photodiode in a miniature flat plastic package. It is spectral
sensitivity is closely matched to the human eye.
FEATURES
Package type: Surface mount
Package form: 0805
Dimensions (L x W x H in mm): 2 x 1.25 x 0.85
Radiant sensitive area (in mm2): 0.27
AEC-Q101 qualified
High photo sensitivity
Adapted to human eye responsivity
Angle of half sensitivity: ϕ = ± 60°
Floor life: 168 h, MSL 3, acc. J-STD-020
Material categorization: For definitions of
compliance please see www.vishay.com/doc?99912
APPLICATIONS
Automotive sensors
Ambient light sensors
Backlight dimming
Mobil phones
• Notebooks
• Computers
Note
Test condition see table “Basic Characteristics
Note
MOQ: Minimum order quantity
PRODUCT SUMMARY
COMPONENT Ira (μA) ϕ (deg) λ0.5 (nm)
TEMD6200FX01 0.04 ± 60 430 to 610
ORDERING INFORMATION
ORDERING CODE PACKAGING REMARKS PACKAGE FORM
TEMD6200FX01 Tape and reel MOQ: 3000 pcs, 3000 pcs/reel 0805
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Reverse voltage VR16 V
Power dissipation Tamb 55 °C PV100 mW
Junction temperature Tj100 °C
Operating temperature range Tamb -40 to +100 °C
Storage temperature range Tstg -40 to +100 °C
Soldering temperature In accordance with fig. 6 Tsd 260 °C
Thermal resistance junction/ambient RthJA 270 K/W
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TEMD6200FX01
www.vishay.com Vishay Semiconductors
Rev. 1.5, 08-Apr-14 2Document Number: 81812
For technical questions, contact: detectortechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Fig. 1 - Reverse Dark Current vs. Ambient Temperature
Fig. 2 - Reverse Light Current vs. Illuminance
Fig. 3 - Diode Capacitance vs. Reverse Voltage
Fig. 4 - Relative Spectral Sensitivity vs. Wavelength
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT
Breakdown voltage IR = 100 μA, E = 0 lx V(BR) 16 V
Reverse dark current VR = 10 V, E = 0 lx Iro 0.1 5 nA
Diode capacitance VR = 0 V, f = 1 MHz, E = 0 lx CD60 pF
VR = 5 V, f = 1 MHz, E = 0 lx CD24 pF
Reverse light current
Ee = 1 mW/cm2, λ = 550 nm,
VR = 5 V Ira A
EV = 100 lx,
CIE illuminant A Ira 0.03 0.04 0.09 μA
Angle of half sensitivity ϕ± 60 deg
Wavelength of peak sensitivity λp540 nm
Range of spectral bandwidth λ0.5 430 to 610 nm
Rise time UR = 5 V, RL = 50 Ω, TLMW3300 tr150 ns
Fall time UR = 5 V, RL = 50 Ω, TLMW3300 tf150 ns
0.01
0.1
1
10
100
1000
18818
020406080 100
Tamb - Ambient Temperature (°C)
Iro - Reverse Dark Current (nA)
VR = 5 V
20093
0.001
0.01
0.1
1
10
10 100 1000 10000
EV - Illuminance (lx)
Ira - Photocurrent (µA)
CIE illuminant A
VR = 5 V
20094
0
10
20
30
40
50
60
70
0102030
VR - Reverse Voltage (V)
CD - Diode Capacitance (pF)
E0 = 0
f = 1 MHz
0.0
0.2
0.4
0.6
0.8
1.0
400 600 800 1000
Wavelength (nm)
Relative Spectral Sensitivity
Photodiode
human eye
20047
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TEMD6200FX01
www.vishay.com Vishay Semiconductors
Rev. 1.5, 08-Apr-14 3Document Number: 81812
For technical questions, contact: detectortechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 5 - Relative Radiant Sensitivity vs. Angular Displacement
SOLDER PROFILE
Fig. 6 - Lead (Pb)-free Reflow Solder Profile
acc. J-STD-020
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Time between soldering and removing from MBB must not
exceed the time indicated in J-STD-020:
Moisture sensitivity: Level 3
Floor life: 168 h
Conditions: Tamb < 30 °C, RH < 60 %
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions:
192 h at 40 °C (+ 5 °C), RH < 5 %
or
96 h at 60 °C (+ 5 °C), RH < 5 %.
0.4 0.2 0
S
rel
- Relative Sensitivity
94 8318
0.6
0.9
0.8
30°
10° 20°
40°
50°
60°
70°
8
0.7
1.0
ϕ - Angular Displacement
0
50
100
150
200
250
300
0 50 100 150 200 250 300
Time (s)
Temperature (°C)
240 °C 245 °C
max. 260 °C
max. 120 s max. 100 s
217 °C
max. 30 s
max. ramp up 3 °C/s max. ramp down 6 °C/s
19841
255 °C
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TEMD6200FX01
www.vishay.com Vishay Semiconductors
Rev. 1.5, 08-Apr-14 4Document Number: 81812
For technical questions, contact: detectortechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKAGE DIMENSIONS in millimeters
BLISTER TAPE DIMENSIONS in millimeters
20018
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TEMD6200FX01
www.vishay.com Vishay Semiconductors
Rev. 1.5, 08-Apr-14 5Document Number: 81812
For technical questions, contact: detectortechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
REEL DIMENSIONS in millimeters
of the wheel is supplier specific.
Form of the leave open
Issue: 2; 26.04.10
Drawing-No.: 9.800-5096.01-4
specifications
according to DIN
technical drawings
Ø 177.8 max.
Ø 55 min.
8.4 +2.5
8.4 +0.15
14.4 max.
Ø 13 + 0.5
- 0.2
1.5 min.
Ø 20.2 min.
Z
Z 2:1
20875
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Revision: 08-Feb-17 1Document Number: 91000
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