SD2943 Datasheet by STMicroelectronics

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K ’I hiegugmented ,9 @- M177 epoxy sealed 9% 999 1 Draw 2‘ 4 5 Source 3 Game
December 2016
DocID11584 Rev 5
1/13
This is information on a product in full production.
www.st.com
SD2943
HF/VHF/UHF RF power N-channel MOSFET
Datasheet - production data
Figure 1: Pin connection
Features
High power capability
POUT = 350 W min. with 22 dB gain@30 MHz
PSAT = 450 W
Low RDS(on)
Thermally enhanced packing for lower
junction temperatures
Gold metallization
Excellent thermal stability
Common source configuration
Description
The SD2943 is a gold metallized N-channel MOS
field-effect RF power transistor. It is used for 50 V
DC large signal applications up to 150 MHz. The
SD2943 offers a 20% higher power saturation
than the SD2933, and is ideal for ISM
applications where reliability and ruggedness are
critical factors.
Table 1: Device summary
Order code
Package
Packing
SD2943W
SD2943(1)
M177
Plastic tray
Notes:
(1)For more details please refer to Section 6: "Marking, packing and shipping specifications".
Contents
SD2943
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Contents
1 Electrical data .................................................................................. 3
1.1 Maximum ratings ............................................................................... 3
1.2 Thermal data ..................................................................................... 3
2 Electrical characteristics ................................................................ 4
3 Impedance data ............................................................................... 5
4 Typical performance ....................................................................... 6
5 Test circuit (175 MHz) ...................................................................... 8
6 Marking, packing and shipping specifications ............................ 10
7 Package information ..................................................................... 11
7.1 M177 (.550 DIA 4L NHERM WFLG) package information .............. 11
8 Revision history ............................................................................ 12
SD2943
Electrical data
DocID11584 Rev 5
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1 Electrical data
1.1 Maximum ratings
TCASE = 25 °C
Table 2: Absolute maximum ratings
Symbol
Parameter
Value
Unit
V(BR)DSS(1)
Drain source voltage
130
V
VDGR
Drain-gate voltage (RGS = 1 MΩ)
130
V
VGS
Gate-source voltage
±40
V
ID
Drain current
40
A
PDISS
Power dissipation
648
W
TJ
Max. operating junction temperature
+200
°C
EAS
Avalanche energy, single pulse (ID = 53 A, 800
μH coil)
1100
mJ
TSTG
Storage temperature
-65 to +150
°C
Notes:
(1)TJ = 150 °C
1.2 Thermal data
Table 3: Thermal data
Symbol
Parameter
Value
Unit
RthJC
Junction-to-case thermal resistance
0.27
°C/W
Electrical characteristics
SD2943
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2 Electrical characteristics
TCASE = 25 °C
Table 4: Static
Symbol
Test conditions
Min.
Typ.
Max.
Unit
V(BR)DSS(1)
VGS = 0 V IDS = 200 mA
130
V
IDSS
VGS = 0 V VDS = 50 V
200
µA
IGSS
VGS = 20 V VDS = 0 V
500
nA
VGS(Q)
VDS = 10 V ID = 250 mA
2
4
V
VDS(ON)
VGS = 10 V I D = 20 A
2
V
GFS
VDS = 10 V I D = 10 A
10
mho
CISS
VGS = 0 V VDS = 50 V f = 1 MHz
830
pF
COSS
VGS = 0 V VDS = 50 V f = 1 MHz
470
pF
CRSS
VGS = 0 V VDS = 50 V f = 1 MHz
35
pF
Notes:
(1)TJ = 150 °C
Table 5: Dynamic
Symbol
Test conditions
Min.
Typ.
Max.
Unit
POUT
VDD = 50 V IDQ = 250 mA f = 30 MHz
350
450
W
GPS
VDD = 50 V IDQ = 250 mA POUT = 350 W
f = 30 MHz
22
25
dB
ηD
VDD = 50 V IDQ = 250 mA POUT = 350 W
f = 30 MHz
60
65
%
Load
mismatch
VDD = 50 V IDQ = 250 mA POUT = 350 W
f = 30 MHz
All phase angles
3:1
VSWR
Table 6: GFS sorts
Symbol
Value
A
10 to 10.99
B
11 to 11.99
C
12 to 12.99
D
13 to 13.99
E
14 to 14.99
F
15 to 15.99
G
16 to 16.99
H
17 to 18
SD2943
Impedance data
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3 Impedance data
Figure 2: Impedance data
Table 7: Impedance data
f
ZIN(Ω)
ZDL(Ω)
30 MHz
1.3 - j 2.9
3.1 + j 2.3
108 MHz
1.4 - j 2.4
1.9 + j 1.4
175 MHz
1.4 - j 2.2
1.7 + j 1.6
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Typical performance
SD2943
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4 Typical performance
Figure 3: Capacitance vs. drain voltage
Figure 4: Drain current vs. gate voltage
Figure 5: Gate-source voltage vs. case temperature
Figure 6: Maximum thermal resistance vs. case
temperature
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SD2943
Typical performance
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Figure 7: Output power vs. input power
Figure 8: Output power vs. input power (at different
temperature)
Figure 9: Power gain vs. output power
Figure 10: Efficiency vs. output power
Figure 11: Output power vs. supply voltage
Figure 12: Output power vs. gate voltage
Test circuit (175 MHz)
SD2943
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5 Test circuit (175 MHz)
Figure 13: 30 MHz test circuit schematic
Dimensions at component symbols are references for component placement. Gap
between ground and transmission files are 0.056[1.42] (typ.). Transmission line is
not 1:1 scale. Input and output transmission line are 50 Ω.
Table 8: 30 MHz test circuit part list
Component
Description
C1, C9
0.01 μF / 500 V surface mount ceramic chip capacitor
C2, C3
750 pF ATC 700B surface mount ceramic chip capacitor
C4
300 pF ATC 700B surface mount ceramic chip capacitor
C5, C10, C11,
C14, C16
10000 pF ATC 200B surface mount ceramic chip capacitor
C6
510 pF ATC 700B surface mount ceramic chip capacitor
C7
300 pF ATC 700B surface mount ceramic chip capacitor
C8
175-680 pF type 46 standard trimmer capacitor
C12
47 μF / 63 V aluminum electrolytic radial lead capacitor
C13
1200 pF ATC 700B surface mount ceramic chip capacitor
C15
100 μF / 63 V aluminum electrolytic radial lead capacitor
R1, R3
1 kΩ 1 W surface mount chip resistor
R2
560 Ω 2 W wire-wound axil lead resistor
T1
HF 2-30 MHz surface mount 9:1 transformer
T2
RG - 142B/U 50 Ω coaxial cable OD = 0.165[4.18] L 15”[381.00] covered
with 15”[381.00] tinned copper tubular brand 13/65” [5.1] width
L1
1 3/4 turn air-wound 16 AWG ID = 0.219 [5.56] poly-coated magnet wire
L2
1 3/4 turn air-wound 12 AWG ID = 0.250 [6.34] bus bar wire
RFC1, RFC2
3 turns 14 AWG wire through fair rite toroid
FB1
Surface mount shield bead
ma :JM SD2933 fl LCSV 101 5V ©bono©©noan©
SD2943
Test circuit (175 MHz)
DocID11584 Rev 5
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Component
Description
FB2
Toroid
PCB
ULTRALAM 2000. 0.030” THK, εr = 2.55, 2 Oz ED CU both sides
Figure 14: 30 MHz test circuit
Both the SD2933 and the SD2943 device use the same PCB.
Figure 15: 30 MHz test circuit photomaster
\ O i x w SD2943 CZXXX vv MAR cz yyy J
Marking, packing and shipping specifications
SD2943
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6 Marking, packing and shipping specifications
Table 9: Packing and shipping specifications
Order code
Packing
Pieces
per tray
Dry pack
humidity
GFS code
Lot code
SD2943W
Plastic tray
25
< 10%
Not mixed
Not mixed
Figure 16: SD2943 marking layout
Table 10: Marking specifications
Symbol
Description
W
Wafer process code
X
GFS sort
CZ
Assembly plant
xxx
Last 3 digits of diffusion lot
VY
Diffusion plant
MAR
Country of origin
CZ
Test and finishing plant
y
Assembly year
yy
Assembly week
E] :qwx n cmmn PLANE
SD2943
Package information
DocID11584 Rev 5
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7 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
7.1 M177 (.550 DIA 4L NHERM WFLG) package information
Figure 17: M177 (.550 DIA 4L N/HERM W/FLG) package outline
Table 11: M177 (.550 DIA 4L N/HERM W/FLG) package mechanical data
Dim.
mm
Min.
Typ.
Max.
A
5.72
5.97
B
6.73
6.96
C
21.84
22.10
D
28.70
28.96
E
13.84
14.10
F
0.08
0.18
G
2.49
2.74
H
3.81
4.32
I
7.11
J
27.43
28.45
K
15.88
16.13
Revision history
SD2943
12/13
DocID11584 Rev 5
8 Revision history
Table 12: Document revision history
Date
Revision
Changes
18-Oct-2005
1
First issue.
04-Jan-2006
2
Complete version.
24-Aug-2011
3
Inserted Chapter 7: Marking, packing and shipping
specifications.
Minor text changes.
10-Aug-2015
4
Updated Table 2.: Absolute maximum rating. Minor text
changes.
02-Dec-2016
5
Updated Table 2: "Absolute maximum ratings".
Minor text changes.
SD2943
DocID11584 Rev 5
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