MCP1623,24 Datasheet by Microchip Technology

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‘ Mlcgcmp MCP1623/24
2010-2016 Microchip Technology Inc. DS40001420D-page 1
MCP1623/24
Features
Up to 96% Typical Efficiency
425 mA Typical Peak Input Current Limit:
-I
OUT >50mA @ 1.2V V
IN, 3.3V VOUT
-I
OUT > 175 mA @ 2.4V VIN, 3.3V VOUT
-I
OUT > 175 mA @ 3.3V VIN, 5.0V VOUT
Low Start-Up Voltage: 0.65V, 3.3V VOUT @ 1 mA
(typical)
Low Operating Input Voltage: 0.35V, typical
3.3VOUT @ 1 mA
Adjustable Output Voltage Range: 2.0V to 5.5V
Maximum Input Voltage VOUT < 5.5V
Automatic PFM/PWM Operation (MCP1624)
PWM-Only Operation (MCP1623)
PWM Operation: 500 kHz
Low Device Quiescent Current: 19 µA, typical
PFM Mode
Internal Synchronous Rectifier
Internal Compensation
Inrush Current Limiting and Internal Soft Start
True Load Disconnect
Shutdown Current (All States): <1 µA
Low Noise, Anti-Ringing Control
Overtemperature Protection
Available Packages:
- 6-Lead SOT-23
- 8-Lead 2 x 3 DFN
Applications
One, Two and Three-Cell Alkaline and NiMH/NiCd
Low-Power PIC® Microcontroller Applications
General Description
The MCP1623/24 is a compact, high-efficiency,
fixed-frequency, synchronous step-up DC-DC
converter. It provides an easy-to-use power supply
solution for PIC® microcontroller applications powered
by either single-cell, two-cell, or three-cell alkaline,
NiCd, NiMH, and single-cell Li-Ion or Li-Polymer
batteries.
Low-voltage technology allows the regulator to start up
without high inrush current or output voltage overshoot
from a low 0.65V input. High efficiency is accomplished
by integrating the low-resistance N-Channel Boost
switch and synchronous P-Channel switch. All
compensation and protection circuitry are integrated to
minimize external components. For standby
applications, the MCP1624 operates and consumes
only 19 µA while operating at no load.
A “true” Load Disconnect mode provides input to output
isolation while disabled (EN = GND) by removing the
normal boost regulator diode path from input to output.
This mode consumes less than 1 µA of input current.
Output voltage is set by a small external resistor
divider.
Package Types
3
2
1
4
6VIN
VFB
SW
GND
EN
5VOUT
MCP1623/24
6-Lead SOT-23
MCP1623/24
2x3 DFN*
PGND
SGND
EN
VOUTS
VOUTP
1
2
3
4
8
7
6
5SW
VIN
VFB
EP
9
* Includes Exposed Thermal Pad (EP); see Table 3-1.
Low-Voltage Input Boost Regulator
for PIC® Microcontrollers
MCP1623/24
DS40001420D-page 2 2010-2016 Microchip Technology Inc.
Typical Application
FIGURE 1: Typical Application Circuit.
FIGURE 2: MCP1624 Efficiency vs. IOUT, VOUT =3.3V.
VIN
GND
VFB
SW
VIN
0.9V to 1.7V
VOUT
3.3V
COUT
10 µF
CIN
4.7 µF
L1
4.7 µH
VOUT
+
-
976 k
562 k
ALKALINE
EN PIC® MCU
VDD
VSS
MCP1623/24
20
30
40
50
60
70
80
90
100
0.01 0.1 1 10 100
1000
Efficiency (%)
IOUT (mA)
VIN = 0.8V
VIN = 1.2V
VIN = 2.5V
OUT VOUT Vw VFB Vour
2010-2016 Microchip Technology Inc. DS40001420D-page 3
MCP1623/24
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
EN, FB, VIN, VSW, VOUT – GND ...............................................................................................................................+6.5V
EN, FB ...........................................................................................................<maximum of VOUT or VIN > (GND – 0.3V)
Output Short-Circuit Current ...........................................................................................................................Continuous
Power Dissipation .................................................................................................................................Internally Limited
Storage Temperature ..............................................................................................................................-65°C to +150°C
Ambient Temperature with Power Applied................................................................................................-40°C to +85°C
Operating Junction Temperature.............................................................................................................-40°C to +125°C
ESD Protection on All Pins:
HBM.............................................................................................................................................................3 kV
MM..............................................................................................................................................................300V
Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
DC CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT =3.3V,
IOUT =15mA, T
A = +25°C.
Boldface specifications apply over the TA range of -40°C to +85°C.
Parameters Sym. Min. Typ. Max. Units Conditions
Input Characteristics
Minimum Start-Up Voltage VIN —0.65 0.8 VNote 1
Minimum Input Voltage after
Start-Up VIN —0.35 — VNote 1
Output Voltage Adjust Range VOUT 2.0 5.5 VV
OUT VIN (Note 2)
Maximum Output Current IOUT 50 ——mA1.5V V
IN, 3.3V VOUT
Feedback Voltage VFB 1.120 1.21 1.299 V
Feedback Input Bias Current IVFB —10 —pA
Quiescent Current – PFM mode IQPFM 19 30 µA Measured at VOUT = 4.0V;
EN = VIN, IOUT = 0 mA
(Note 3)
Quiescent Current – PWM mode IQPWM 220 µA Measured at VOUT; EN =
VIN IOUT = 0 mA (Note 3)
Quiescent Current – Shutdown IQSHDN —0.7 2.3µAV
OUT = EN = GND;
Includes N-Channel and
P-Channel switch leakage
NMOS Switch Leakage INLK —0.3 —µAV
IN =V
SW =5V; V
OUT =
5.5V VEN =V
FB =GND
PMOS Switch Leakage IPLK —0.05 — µAV
IN =VS
W= GND;
VOUT =5.5V
NMOS Switch ON Resistance RDS(ON)N —0.6 VIN = 3.3V, ISW = 100 mA
Note 1: 3.3 k resistive load, 3.3VOUT (1 mA).
2: For VIN > VOUT, VOUT will not remain in regulation.
3: IQ is measured from VOUT; VIN quiescent current will vary with boost ratio. VIN quiescent current can be
estimated by: (IQPFM * (VOUT/VIN)), (IQPWM * (VOUT/VIN)).
4: Peak current limit determined by characterization, not production tested
5: 220 resistive load, 3.3VOUT (15 mA).
S2 our Vw MAX m Vw our Vour SDHVS TA 0AA
MCP1623/24
DS40001420D-page 4 2010-2016 Microchip Technology Inc.
TEMPERATURE SPECIFICATIONS
PMOS Switch ON Resistance RDS(ON)P —0.9 VIN = 3.3V, ISW = 100 mA
NMOS Peak Switch Current
Limit IN(MAX) 300 425 mA Note 4
VOUT Accuracy VOUT%-7.4 +7.4 % Includes line and load
regulation; VIN = 1.5V,
IOUT = 50 mA
Line Regulation VOUT/
VOUT)/
VIN|
—0.01 —%/VV
IN = 1.5V to 3V
IOUT = 25 mA
Load Regulation VOUT/
VOUT|—0.01 — %I
OUT = 25 mA to 50 mA;
VIN = 1.5V
Maximum Duty Cycle DCMAX —90 —%
Switching Frequency fSW 370 500 630 kHz
EN Input Logic High VIH 90 ——%of V
IN IOUT = 1 mA
EN Input Logic Low VIL —— 20 %of VIN IOUT = 1 mA
EN Input Leakage Current IENLK 0.005 µA VEN = 5V
Soft Start Time tSS 750 µS EN Low-to-High, 90% of
VOUT (Note 5)
Thermal Shutdown Die
Temperature TSD —150 C
Die Temperature Hysteresis TSDHYS —10 —C
Electrical Specifications: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT =3.3V,
IOUT =15mA, T
A = +25°C.
Boldface specifications apply over the TA range of -40°C to +85°C.
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Operating Junction Temperature
Range TJ-40 +125 °C Steady state
Storage Temperature Range TA-65 +150 °C
Maximum Junction Temperature TJ +150 °C Transient
Package Thermal Resistance
Thermal Resistance, 6LD-SOT-23 JA — 190.5 °C/W
Thermal Resistance, 8LD-2x3 DFN JA —75 —°C/W
DC CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT =3.3V,
IOUT =15mA, T
A = +25°C.
Boldface specifications apply over the TA range of -40°C to +85°C.
Parameters Sym. Min. Typ. Max. Units Conditions
Note 1: 3.3 k resistive load, 3.3VOUT (1 mA).
2: For VIN > VOUT, VOUT will not remain in regulation.
3: IQ is measured from VOUT; VIN quiescent current will vary with boost ratio. VIN quiescent current can be
estimated by: (IQPFM * (VOUT/VIN)), (IQPWM * (VOUT/VIN)).
4: Peak current limit determined by characterization, not production tested
5: 220 resistive load, 3.3VOUT (15 mA).
2010-2016 Microchip Technology Inc. DS40001420D-page 5
MCP1623/24
2.0 TYPICAL PERFORMANCE CURVES
Note: Unless otherwise indicated, VIN =EN=1.2V, C
OUT =C
IN =1F, L
= 4.7 µH, VOUT =3.3V, I
LOAD =15mA,
TA=+25°C.
FIGURE 2-1: MCP1624 VOUT IQ vs.
Ambient Temperature in PFM Mode, VIN =1.2V.
FIGURE 2-2:
MCP1623 V
OUT
I
Q
vs.
Ambient Temperature in PWM Mode, V
IN
=1.2V.
FIGURE 2-3: IOUTMAX vs. VOUT.
FIGURE 2-4: MCP1624 Efficiency vs.
IOUT, VOUT = 2.0V.
FIGURE 2-5: MCP1624 Efficiency vs.
IOUT, VOUT = 3.3V.
FIGURE 2-6: MCP1624 Efficiency vs.
IOUT, VOUT = 5.0V.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
10.0
12.5
15.0
17.5
20.0
22.5
25.0
27.5
-40 -25 -10 5 20 35 50 65
80
IQ PFM Mode (µA)
Ambient Temperature (°C)
VOUT = 2.0V
VOUT = 5.0V
VOUT = 3.3V
150
175
200
225
250
275
300
-40 -25 -10 5 20 35 50 65 80
IQ PWM Mode (µA)
Ambient Temperature (°C)
VOUT = 3.3V
VOUT = 5.0V
0
100
200
300
400
500
600
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5
5
IOUT (mA)
VIN (V)
VOUT = 3.3V
VOUT = 2.0V
VOUT = 5.0V
V
IN
= 0.8V
V
IN
= 1.2V
V
IN
= 1.6V
10
20
30
40
50
60
70
80
90
100
0.01 0.1 1 10 100
1000
Efficiency (%)
IOUT (mA)
VIN = 2.5
VIN = 1.2
VIN = 0.8
10
20
30
40
50
60
70
80
90
100
0.01 0.1 1 10 100
IOUT (mA)
VIN = 1.2
VIN = 1.8
VIN = 3.6
10
20
30
40
50
60
70
80
90
100
0.01 0.1 1 10 100
1000
Efficiency (%)
IOUT (mA)
flflfl
MCP1623/24
DS40001420D-page 6 2010-2016 Microchip Technology Inc.
Note: Unless otherwise indicated, VIN =EN=1.2V, C
OUT =C
IN =1F, L =4.H, V
OUT =3.3V, I
LOAD =15mA,
TA=+25°C.
FIGURE 2-7: MCP1623 Efficiency vs.
IOUT, VOUT = 2.0V.
FIGURE 2-8: MCP1623 Efficiency vs.
IOUT, VOUT = 3.3V.
FIGURE 2-9: MCP1623 Efficiency vs.
IOUT, VOUT = 5.0V.
FIGURE 2-10: Minimum Start-Up and
Shutdown VIN into Resistive Load vs. IOUT,
VOUT =3.3V.
FIGURE 2-11: FOSC vs. Ambient
Temperature, VOUT =3.3V.
FIGURE 2-12: MCP1623 PWM Pulse
Skipping Mode Threshold vs. IOUT.
VIN = 0.8
VIN = 1.2
VIN =1.6
10
20
30
40
50
60
70
80
90
100
0.01 0.1 1 10 100
1000
Efficiency (%)
I
OUT
(mA)
VIN = 0.8
VIN = 1.2
VIN = 2.5
10
20
30
40
50
60
70
80
90
100
0.01 0.1 1 10 100 1000
Efficiency (%)
IOUT (mA)
VIN = 1.2
VIN = 1.8
VIN = 3.6
10
20
30
40
50
60
70
80
90
100
0.01 0.1 1 10 100
1000
Efficiency (%)
IOUT (mA)
0.25
0.40
0.55
0.70
0.85
020406080
IN
IOUT (mA)
Startup
Shutdown
480
485
490
495
500
505
510
515
520
525
-40 -25 -10 5 20 35 50 65
Ambient Temperature (°C)
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
0123456789
10
VIN (V)
IOUT (mA)
VOUT = 3.3V
VOUT = 5.0V
VOUT = 2.0V
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2010-2016 Microchip Technology Inc. DS40001420D-page 7
MCP1623/24
Note: Unless otherwise indicated, VIN =EN=1.2V, C
OUT =C
IN =1F, L =4.H, V
OUT =3.3V, I
LOAD =15mA,
TA=+25°C.
FIGURE 2-13: Input No Load Current vs.
VIN.
FIGURE 2-14: N-Channel and P-Channel
RDSON vs. > of VIN or VOUT.
FIGURE 2-15: MCP1624 PFM/PWM
Threshold Current vs. VIN.
FIGURE 2-16: MCP1624 3.3V VOUT PFM
Mode Waveforms.
FIGURE 2-17: MCP1623 3.3V VOUT
PWM Mode Waveforms.
FIGURE 2-18: High Load Waveforms.
10
100
1000
10000
0.8 1.1 1.4 1.7 2 2.3 2.6 2.9 3.2
3.5
IIN (µA)
VIN (V)
VOUT = 3.3V VOUT = 5.0V
VOUT = 2.0V
VOUT = 2.0V VOUT = 3.3V
VOUT = 5.0V
PWM/PFM
PWM ONLY
0
1
2
3
4
5
1 1.5 2 2.5 3 3.5 4 4.5
5
Switch Resistance (Ohms)
> VIN or VOUT
P-Channel
N-Channel
0
2
4
6
8
10
12
14
16
0 0.5 1 1.5 2 2.5 3 3.5
4
IOUT (mA)
VIN (V)
V
OUT
= 2.0V V
OUT
= 3.3V
V
OUT
= 5.0V
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MCP1623/24
DS40001420D-page 8 2010-2016 Microchip Technology Inc.
Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT =C
IN =10µF, L
=4.H, V
OUT =3.3V, I
LOAD =15mA, T
A= +25°C.
FIGURE 2-19: 3.3V Start-Up after Enable.
FIGURE 2-20: 3.3V Start-Up when
VIN =V
ENABLE.
FIGURE 2-21: MCP1624 3.3V VOUT Load
Transient Waveforms.
FIGURE 2-22: MCP1623 3.3V VOUT Load
Transient Waveforms.
FIGURE 2-23: MCP1623 2.0V VOUT Load
Transient Waveforms.
FIGURE 2-24: 3.3V VOUT Line Transient
Waveforms.
MCP1623 PWM
2010-2016 Microchip Technology Inc. DS40001420D-page 9
MCP1623/24
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
3.1 Switch Node Pin (SW)
Connects the inductor from the input voltage to the SW
pin. The SW pin carries inductor current and can be as
high as 425 mA peak. The integrated N-Channel switch
drain and integrated P-Channel switch source are
internally connected at the SW node.
3.2 Ground Pin (GND)
The ground or return pin is used for circuit ground
connection. Length of trace from input cap return, output
cap return and GND pin should be made as short as
possible to minimize noise on the GND pin.
3.3 Enable Pin (EN)
The EN pin is a logic-level input used to enable or
disable device switching and lower quiescent current
while disabled. A logic high (greater than 90% of VIN)
will enable the regulator output. A logic low (less than
20% of VIN) will ensure that the regulator is disabled.
3.4 Feedback Voltage Pin (FB)
The FB pin is used to provide output voltage regulation
by using a resistor divider. The FB voltage will be 1.21V
typical with the output voltage in regulation.
3.5 Output Voltage Pin (VOUT)
The output voltage pin connects the integrated
P-Channel MOSFET to the output capacitor. The FB
voltage divider is also connected to the VOUT pin for
voltage regulation.
3.6 Power Supply Input Voltage Pin
(VIN)
Connects the input voltage source to VIN. The input
source should be decoupled to GND with a 4.7 µF
minimum capacitor.
3.7 Signal Ground Pin (SGND)
The signal ground pin is used as a return for the
integrated VREF and error amplifier. In the 2x3 DFN
package, the SGND and power ground (PGND) pins are
connected externally.
3.8 Power Ground Pin (PGND)
The power ground pin is used as a return for the
high--current N-Channel switch. In the 2x3 DFN
package, the PGND and signal ground (SGND) pins are
connected externally.
3.9 Output Voltage Sense Pin (VOUTS)
The output voltage sense pin connects the regulated
output voltage to the internal bias circuits. In the
2x3 DFN package, VOUTS and VOUTP are connected
externally.
3.10 Output Voltage Power Pin (VOUTP)
The output voltage power pin connects the output
voltage to the switch node. High current flows through
the integrated P-Channel and out of this pin to the
output capacitor and output. In the 2x3 DFN package,
VOUTS and VOUTP are connected externally.
3.11 Exposed Thermal Pad (EP)
There is an internal electrical connection between the
Exposed Thermal Pad (EP) and the VSS pin; they must
be connected to the same potential on the Printed
Circuit Board (PCB).
MCP1623/24 Symbol Description
SOT-23 2x3 DFN
1 5 SW Switch Node, Boost Inductor Input Pin
2 GND Ground Pin
3 4 EN Enable Control Input Pin
4 1 FB Feedback Voltage Pin
5—V
OUT Output Voltage Pin
68V
IN Input Voltage Pin
—2S
GND Signal Ground Pin
—3P
GND Power Ground Pin
—7V
OUTS Output Voltage Sense Pin
—6V
OUTP Output Voltage Power Pin
9 EP Exposed Thermal Pad (EP); must be connected to VSS.
MCP1623/24
DS40001420D-page 10 2010-2016 Microchip Technology Inc.
NOTES:
2010-2016 Microchip Technology Inc. DS40001420D-page 11
MCP1623/24
4.0 DETAILED DESCRIPTION
4.1 Device Option Overview
The MCP1623/24 family of devices is capable of low
start-up voltage and delivers high efficiency over a wide
load range for single-cell, two-cell, three-cell alkaline,
NiMH, NiCd and single-cell Li-Ion battery inputs. A high
level of integration lowers total system cost, eases
implementation and reduces board area. The devices
feature low start-up voltage, adjustable output voltage,
PWM/PFM mode operation, low IQ, integrated
synchronous switch, internal compensation, low noise
anti-ringing control, inrush current limit and soft start.
There is one feature option for the MCP1623/24 family:
PWM/PFM mode or PWM mode only.
4.1.1 PWM/PFM MODE OPTION
The MCP1624 devices use an automatic switchover
from PWM to PFM mode for light load conditions to
maximize efficiency over a wide range of output current.
During PFM mode, higher peak current is used to pump
the output up to the threshold limit. While operating in
PFM or PWM mode, the P-Channel switch is used as a
synchronous rectifier, turning off when the inductor
current reaches 0 mA to maximize efficiency. In PFM
mode, a comparator is used to terminate switching when
the output voltage reaches the upper threshold limit.
Once switching has terminated, the output voltage will
decay or coast down. During this period, very low IQ is
consumed from the device and input source, which
keeps power efficiency high at light load. The
disadvantages of PWM/PFM mode are higher output
ripple voltage and variable PFM mode frequency. The
PFM mode frequency is a function of input voltage,
output voltage and load. While in PFM mode, the boost
converter pumps the output up at a switching frequency
of 500 kHz.
4.1.2 PWM MODE ONLY OPTION
The MCP1623 devices disable PFM mode switching,
and operate only in PWM mode over the entire load
range. During periods of light load operation, the
MCP1623 continues to operate at a constant 500 kHz
switching frequency, keeping the output ripple voltage
lower than PFM mode. During PWM-only mode, the
MCP1623 P-Channel switch acts as a synchronous
rectifier by turning off to prevent reverse current flow
from the output cap back to the input in order to keep
efficiency high. For noise immunity, the N-Channel
MOSFET current sense is blanked for approximately
100 ns. With a typical minimum duty cycle of 100 ns,
the MCP1623 continues to switch at a constant
frequency under light load conditions. Figure 2-12
represents the input voltage versus load current for the
pulse-skipping threshold in PWM-only mode. At lighter
loads, the MCP1623 device begins to skip pulses.
TABLE 4-1: PART NUMBER SELECTION
Part Number PWM/PFM PWM
MCP1623 X
MCP1624 X
GN
MCP1623/24
DS40001420D-page 12 2010-2016 Microchip Technology Inc.
4.2 Functional Description
The MCP1623/24 is a compact, high-efficiency,
fixed-frequency, step-up DC-DC converter that
provides an easy-to-use power supply solution for
PIC® microcontroller applications powered by either
single-cell, two-cell, or three-cell alkaline, NiCd, or
NiMH, and single-cell Li-Ion or Li-Polymer batteries.
Figure 4-1 depicts the functional block diagram of the
MCP1623/24.
4.2.1 LOW-VOLTAGE START-UP
The MCP1623/24 is capable of starting from a low input
voltage. Start-up voltage is typically 0.65V for a 3.3V
output and 1 mA resistive load.
When enabled, the internal start-up logic turns the
rectifying P-Channel switch on until the output
capacitor is charged to a value close to the input
voltage. The rectifying switch is current limited during
this time. After charging the output capacitor to the
input voltage, the device starts switching. If the input
voltage is below 1.6V, the device runs open-loop with a
fixed duty cycle of 70% until the output reaches 1.6V.
During this time, the boost switch current is limited to
50% of its nominal value. Once the output voltage
reaches 1.6V, normal closed-loop PWM operation is
initiated.
The MCP1623/24 charges an internal capacitor with a
very weak current source. The voltage on this
capacitor, in turn, slowly ramps the current limit of the
boost switch to its nominal value. The soft-start
capacitor is completely discharged in the event of a
commanded shutdown or a thermal shutdown.
There is no undervoltage lockout feature for the
MCP1623/24. The device will start up at the lowest
possible voltage and run down to the lowest possible
voltage. For typical battery applications, this may result
in “motor-boating” for deeply discharged batteries.
FIGURE 4-1: MCP1623/24 Block Diagram.
Gate Drive
and
Shutdown
Control
Logic
VIN
EN
VOUT
GND
ISENSE
IZERO
ILIMIT
0.3V
0V
Soft Start
Direction
Control
Oscillator Slope
Comp. S
PWM/PFM
Logic
1.21V
Internal
SW
FB
EA
Bias
2010-2016 Microchip Technology Inc. DS40001420D-page 13
MCP1623/24
4.2.2 PWM MODE OPERATION
In normal PWM operation, the MCP1623/24 operates
as a fixed frequency, synchronous boost converter. The
switching frequency is internally maintained with a
oscillator typically set to 500 kHz. The MCP1623
device will operate in PWM-only mode even during
periods of light load operation. By operating in
PWM-only mode, the output ripple remains low and the
frequency is constant. Operating in fixed PWM mode
results in lower efficiency during light load operation
(when compared to PFM mode (MCP1624)).
Lossless current sensing converts the peak current
signal to a voltage to sum with the internal slope
compensation. This summed signal is compared to the
voltage error amplifier output to provide a peak current
control command for the PWM signal. The slope
compensation is adaptive to the input and output
voltage. Therefore, the converter provides the proper
amount of slope compensation to ensure stability, but is
not excessive, which causes a loss of phase margin.
The peak current limit is set to 425 mA typical.
4.2.3 PFM MODE OPERATION
The MCP1624 device is capable of operating in normal
PWM mode and PFM mode to maintain high efficiency
at all loads. In PFM mode, the output ripple has a
variable frequency component that changes with the
input voltage and output current. With no load, the
quiescent current draw from the output is typically
19 µA. The PFM mode can be disabled in selected
device options.
PFM operation is initiated if the output load current falls
below an internally programmed threshold. The output
voltage is continuously monitored. When the output
voltage drops below its nominal value, PFM operation
pulses one or several times to bring the output back
into regulation. If the output load current rises above
the upper threshold, the MCP1624 transitions smoothly
into PWM mode.
4.2.4 ADJUSTABLE OUTPUT VOLTAGE
The MCP1623/24 output voltage is adjustable with a
resistor divider over a 2.0V minimum to 5.5V maximum
range. High-value resistors are recommended to
minimize quiescent current to keep efficiency high at
light loads.
4.2.5 ENABLE/OUTPUT DISCONNECT
The enable pin is used to turn the boost converter on
and off. The enable threshold voltage varies with input
voltage. To enable the boost converter, the EN voltage
level must be greater than 90% of the VIN voltage. To
disable the boost converter, the EN voltage must be
less than 20% of the VIN voltage.
The MCP1623/24 devices incorporate a true output
disconnect feature. With the EN pin pulled low, the
output of the MCP1623/24 is isolated or disconnected
from the input by turning off the integrated P-Channel
switch and removing the switch bulk diode connection.
This removes the DC path typical in boost converters,
which allows the output to be disconnected from the
input. During this mode, less than 1 µA of current is
consumed from the input (battery). True output discon-
nect does not discharge the output; the output voltage
is held up by the external COUT capacitance.
4.2.6 INTERNAL BIAS
The MCP1623/24 gets its start-up bias from VIN. Once
the output exceeds the input, bias comes from the
output. Therefore, once started, operation is
completely independent of VIN. Operation is only
limited by the output power level and the input source
series resistance. Once started, the output will remain
in regulation down to 0.35V typical with 1 mA output
current for low source impedance inputs.
4.2.7 INTERNAL COMPENSATION
The error amplifier, with its associated compensation
network, completes the closed-loop system by
comparing the output voltage to a reference at the
input of the error amplifier, and feeding the amplified
and inverted signal to the control input of the inner
current loop. The compensation network provides
phase leads and lags at appropriate frequencies to
cancel excessive phase lags and leads of the power
circuit. All necessary compensation components and
slope compensation are integrated.
4.2.8 SHORT-CIRCUIT PROTECTION
Unlike most boost converters, the MCP1623/24 allows
its output to be shorted during normal operation. The
internal current limit and overtemperature protection limit
excessive stress and protect the device during periods
of short circuit, overcurrent and overtemperature.
4.2.9 LOW-NOISE OPERATION
The MCP1623/24 integrates a low-noise anti-ringing
switch that damps the oscillations typically observed at
the switch node of a boost converter when operating in
the Discontinuous Inductor Current mode. This
removes the high-frequency radiated noise.
4.2.10 OVERTEMPERATURE
PROTECTION
Overtemperature protection circuitry is integrated in the
MCP1623/24. This circuitry monitors the device junction
temperature and shuts the device off if the junction
temperature exceeds the typical +150oC threshold. If
this threshold is exceeded, the device will automatically
restart once the junction temperature drops by 10oC.
The soft start is reset during an overtemperature
condition.
MCP1623/24
DS40001420D-page 14 2010-2016 Microchip Technology Inc.
NOTES:
2010-2016 Microchip Technology Inc. DS40001420D-page 15
MCP1623/24
5.0 APPLICATION INFORMATION
5.1 Typical Applications
The MCP1623/24 synchronous boost regulator
operates over a wide input voltage and output voltage
range. The power efficiency is high for several decades
of load range. Output current capability increases with
input voltage and decreases with increasing output
voltage. The maximum output current is based on the
N-Channel peak current limit. Typical characterization
curves in this data sheet are presented to display the
typical output current capability.
5.2 Adjustable Output Voltage
Calculations
To calculate the resistor divider values for the
MCP1623/24, Equation 5-1 can be used, where RTOP
is connected to VOUT, RBOT is connected to GND and
both are connected to the FB input pin.
EQUATION 5-1:
EXAMPLE 1:
VOUT = 3.3V
VFB = 1.21V
RBOT = 309 k
RTOP = 533.7 k (Standard Value = 536 k)
EXAMPLE 2:
VOUT = 5.0V
VFB = 1.21V
RBOT = 309 k
RTOP = 967.9 k (Standard Value = 976 k)
There are some potential issues with higher value
resistors. For small surface mount resistors,
environment contamination can create leakage paths
that significantly change the resistor divider that effect
the output voltage. The FB input leakage current can
also impact the divider and change the output voltage
tolerance.
5.3 Input Capacitor Selection
The boost input current is smoothed by the boost
inductor reducing the amount of filtering necessary at
the input. Some capacitance is recommended to
provide decoupling from the source. Low ESR X5R or
X7R are well suited since they have a low-temperature
coefficient and small size. For most applications,
4.7 µF of capacitance is sufficient at the input. For
high-power applications that have high source
impedance or long leads, connecting the battery to the
input 10 µF of capacitance is recommended. Additional
input capacitance can be added to provide a stable
input voltage.
Table 5-1 contains the recommended range for the
input capacitor value.
5.4 Output Capacitor Selection
The output capacitor helps provide a stable output
voltage during sudden load transients and reduces the
output voltage ripple. As with the input capacitor, X5R
and X7R ceramic capacitors are well suited for this
application.
The MCP1623/24 is internally compensated so output
capacitance range is limited. See Table 5-1 for the
recommended output capacitor range.
While the N-Channel switch is on, the output current is
supplied by the output capacitor COUT. The amount of
output capacitance and equivalent series resistance
will have a significant effect on the output ripple
voltage. While COUT provides load current, a voltage
drop also appears across its internal ESR that results
in ripple voltage.
EQUATION 5-2:
Table 5-1 contains the recommended range for the
input and output capacitor value.
RTOP RBOT
VOUT
VFB
-------------1


=
TABLE 5-1: CAPACITOR VALUE RANGE
CIN COUT
Min. 4.7 µF 10 µF
Max. 100 µF
IOUT COUT dV
dt
-------


=
Where:
dV = ripple voltage
dt = On time of the N-Channel switch
(D x 1/FSW)
MCP1623/24
DS40001420D-page 16 2010-2016 Microchip Technology Inc.
5.5 Inductor Selection
The MCP1623/24 is designed to be used with small
surface-mount inductors; the inductance value can
range from 2.2 µH to 10 µH. An inductance value of
4.7 µH is recommended to achieve a good balance
between inductor size, converter load transient
response and minimized noise.
Several parameters are used to select the correct
inductor: maximum rated current, saturation current
and copper resistance (ESR). For boost converters, the
inductor current can be much higher than the output
current. The lower the inductor ESR, the higher the
efficiency of the converter, a common trade-off in size
versus efficiency.
Peak current is the maximum or limit, and saturation
current typically specifies a point at which the
inductance has rolled off a percentage of the rated
value. This can range from a 20% to 40% reduction in
inductance. As inductance rolls off, the inductor ripple
current increases as does the peak switch current. It is
important to keep the inductance from rolling off too
much, causing switch current to reach the peak limit.
5.6 Thermal Calculations
By calculating the power dissipation and applying the
package thermal resistance, (JA), the junction
temperature is estimated. The maximum continuous
junction temperature rating for the MCP1623/24 is
+125oC.
To quickly estimate the internal power dissipation for
the switching boost regulator, an empirical calculation
using measured efficiency can be used. Given the
measured efficiency, the internal power dissipation is
estimated by Equation 5-3.
EQUATION 5-3:
The difference between the first term, input power, and
the second term, power delivered, is the internal
MCP1623/24 power dissipation. This is an estimate
assuming that most of the power lost is internal to the
MCP1623/24 and not CIN, COUT and the inductor.
There is some percentage of power lost in the boost
inductor, with very little loss in the input and output
capacitors. For a more accurate estimation of internal
power dissipation, subtract the IINRMS2 x LESR power
dissipation.
TABLE 5-2: MCP1623/24
RECOMMENDED INDUCTORS
Part Number
Value
(µH)
DCR
(typ)
ISAT
(A)
Size
WxLxH
(mm)
Coilcraft
ME3220 4.7 0.190 1.5 2.5x3.2x2.0
LPS3015 4.7 0.200 1.2 3.0x3.0x1.5
EPL3012 4.7 0.165 1.0 3.0x3.0x1.3
XPL2010 4.7 0.336 0.75 1.9x2.0x1.0
Coiltronics®
SD3110 4.7 0.285 0.68 3.1x3.1x1.0
SD3112 4.7 0.246 0.80 3.1x3.1x1.2
SD3114 4.7 0.251 1.14 3.1x3.1x1.4
Wurth Elektronik®
WE-TPC Type TH 4.7 0.200 0.8 2.8x2.8x1.35
WE-TPC Type S 4.7 0.105 0.90 3.8x3.8x1.65
WE-TPC Type M 4.7 0.082 1.65 4.8x4.8x1.8
Sumida Corporation
CMH23 4.7 0.537 0.70 2.3x2.3x1.0
CMD4D06 4.7 0.216 0.75 3.5x4.3x0.8
CDRH4D 4.7 0.09 0.800 4.6x4.6x1.5
TDK Corporation
B82462A2472M000 4.7 0.084 2.00 6.0x6.0x2.5
B82462G4472M 4.7 0.04 1.8 6.3x6.3x3.0
VOUT IOUT
Efficiency
-------------------------------


VOUT IOUT
PDis
=
2010-2016 Microchip Technology Inc. DS40001420D-page 17
MCP1623/24
5.7 PCB Layout Information
Good printed circuit board layout techniques are
important to any switching circuitry and switching
power supplies are no different. When wiring the
switching high-current paths, short and wide traces
should be used. Therefore, it is important that the input
and output capacitors be placed as close as possible to
the MCP1623/24 to minimize the loop area.
The feedback resistors and feedback signal should be
routed away from the switching node and the switching
current loop. When possible, ground planes and traces
should be used to help shield the feedback signal and
minimize noise and magnetic interference.
FIGURE 5-1: MCP1623/24 SOT-23-6 Recommended Layout.
COUT
LCIN
+VIN
GND
GND
+VOUT
Via to GND Plane
MCP1623/24
Via for Enable
RTOP
RBOT
1
MCP1623/24
DS40001420D-page 18 2010-2016 Microchip Technology Inc.
NOTES:
LJ L; LJ LJ u LJ LJ LJ XXX YWW LN N r1 r: r1 r1 r1r1r1r1 \ PIN1 \ P|N1 NNN my
2010-2016 Microchip Technology Inc. DS40001420D-page 19
MCP1623/24
6.0 PACKAGING INFORMATION
6.1 Package Marking Information (Not to Scale)
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC® designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
6-Lead SOT-23 Example
Part Number Code
MCP1623T-I/CHY HUNN
MCP1623T-I/CH JANN
MCP1623T-I/CH JUNN
MCP1624T-I/CHY CJNN
MCP1624T-I/CH JTNN
8-Lead DFN (2x3x0.9 mm) Example
CJNN
Part Number Code
MCP1623-I/MC AKH
MCP1623T-I/MC AKH
MCP1624-I/MC ALH
MCP1624T-I/MC ALH
AKH
611
25
,‘ V a Hm
MCP1623/24
DS40001420D-page 20 2010-2016 Microchip Technology Inc.
6-Lead Plastic Small Outline Transistor (CHY) [SOT-23]
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 6
Pitch e 0.95 BSC
Outside Lead Pitch e1 1.90 BSC
Overall Height A 0.90 1.45
Molded Package Thickness A2 0.89 1.30
Standoff A1 0.00 0.15
Overall Width E 2.20 3.20
Molded Package Width E1 1.30 1.80
Overall Length D 2.70 3.10
Foot Length L 0.10 0.60
Footprint L1 0.35 0.80
Foot Angle I – 30°
Lead Thickness c 0.08 0.26
Lead Width b 0.20 0.51
b
E
4
N
E1
PIN 1 ID BY
LASER MARK
D
123
e
e1
A
A1
A2 c
L
L1
φ
Microchip Technology Drawing C04-028B
SlLK¥ SCREEN GX _> E .— RECOMMENDED LAND PATTERN um; MILUMETERS Dimensmn Limus MW \ NOM \ MAX Contact Pitch E 0 95 BSC Comact Fad Spacmg c 2 30 Contact Pad Widm (xs) x 0 so Comad Pad Lengm (x5) v 1.10 Dws‘ance Between Pads 6 1 70 Dwstance Between Pads GX U 35 Overau wmm z 3.90 Nmes. 1 Dimenswoning and (o‘erancing per ASME v14 5M BSC: Basic D‘mension Theoretical‘y exact value shown wuhoul tolerances Microcmp Technology Drawing No CDAVZOZBA
2010-2016 Microchip Technology Inc. DS40001420D-page 21
MCP1623/24
6-Lead Plastic Small Outline Transistor (CHY) [SOT-23]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
V
MCP1623/24
DS40001420D-page 22 2010-2016 Microchip Technology Inc.
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D
N
E
NOTE 1
12
EXPOSED PAD
NOTE 1
21
D2
K
L
E2
N
e
b
A3 A1
A
NOTE 2
BOTTOM VIEW
TOP VIEW
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8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9mm Body [DFN] hwzq ~ mil (:1 T2 SILK SCREEN RECOMMENDED LAND PATTERN Units MlLLlMETERS Dimenslon Limits MIN | NOM | MAX Cuntacl Pitch E D 50 ESC Optional Center Pad Width W2 1 45 Optional Center Pad Length T2 1 75 Contad Pad Spaclng c1 2 90 Contact Pad Wldlh (X8) X1 0 30 Contact Pad Length (xa) Y1 u 75 Dlstance Between Pads (3 D 20 Notes' 1 Dlmensloning and toleranclng per ASME v14 5M ESC Baslc Dlmenslcn. Theorellcally exact value shown wlthout tolerances. Mlcmcmp Technolugy Drawing No 004-21235
2010-2016 Microchip Technology Inc. DS40001420D-page 23
MCP1623/24
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
MCP1623/24
DS40001420D-page 24 2010-2016 Microchip Technology Inc.
NOTES:
2010-2016 Microchip Technology Inc. DS40001420D-page 25
MCP1623/24
APPENDIX A: REVISION HISTORY
Revision D (September 2016)
The following is the list of modifications:
1. Minor modifications in DC Characteristics table
(n-channel and p-channel max. leakage specs).
2. Minor typographical corrections.
Revision C (February 2011)
The following is the list of modifications:
1. Added the 8-lead, 2x3 DFN package and related
information throughout the document.
2. Updated the package marking information and
drawings.
3. Updated the Product Identification System
page.
Revision B (July 2010)
The following is the list of modifications:
1. Updated the packaging specification.
Revision A (May 2010)
Initial release of the document.
MCP1623/24
DS40001420D-page 26 2010-2016 Microchip Technology Inc.
NOTES:
PART NO. DE] /XX 4‘
2010-2016 Microchip Technology Inc. DS40001420D-page 27
MCP1623/24
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X/XX
PackageTemperature
Range
Device
Device: MCP1623: 0.65V, PWM Only True Disconnect,
Sync Boost Regulator
MCP1624: 0.65V, PWM/PFM True Disconnect,
Sync Boost Regulator
Tape and Reel
Option: Blank = Standard packaging (tube or tray)
T = Tape and Reel(1)
Temperature
Range: I= -40C to +85C (Industrial)
Package: CH = Plastic Small Outline Transistor (SOT-23), 6-lead
CHY* = Plastic Small Outline Transistor (SOT-23), 6-lead
MC = Plastic Dual Flat, No Lead (2x3 DFN), 8-lead
Y* = Nickel palladium gold manufacturing designator.
Only available on the SOT-23 package.
Examples:
a) MCP1623T-I/CHY: Tape and Reel,
0.65V, Sync Reg.,
6LD SOT-23 package
b) MCP1624T-I/CHY: Tape and Reel,
0.65V, Sync Reg.,
6LD SOT-23 package
c) MCP1623-I/MC: 0.65V, Sync Reg.,
8LD DFN package
d) MCP1623T-I/MC: Tape and Reel,
0.65V, Sync Reg.,
8LD DFN package
e) MCP1624-I/MC: 0.65V, Sync Reg.,
8LD DFN package
f) MCP1624T-I/MC: Tape and Reel,
0.65V, Sync Reg.,
8LD DFN package
Note 1: Tape and Reel identifier only appears in the
catalog part number description. This identi-
fier is used for ordering purposes and is not
printed on the device package. Check with
your Microchip Sales Office for package
availability with the Tape and Reel option.
[X](1)
Tape and Reel
Option
MCP1623/24
DS40001420D-page 28 2010-2016 Microchip Technology Inc.
NOTES:
YSTEM
2010-2016 Microchip Technology Inc. DS40001420D-page 29
MCP1623/24
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq,
KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,
MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo,
RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O
are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
ETHERSYNCH, Hyper Speed Control, HyperLight Load,
IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,
BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker,
Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2010-2016, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0920-5
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
6‘ ‘MICRDCHIP
DS40001420D-page 30 2010-2016 Microchip Technology Inc.
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06/23/16

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