MPXH(Z)6400A Datasheet by NXP USA Inc.

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improvements in the design of its products.
NXP Semiconductors Document Number: MPXH6400A
Data Sheet: Technical Data Rev. 6, 03/2017
© NXP B.V. 2017
MPXH6400A, 20 to 400 kPa, Absolute,
Integrated Pressure Sensor
The NXP MPXxx6400A series sensor integrates on-chip, bipolar op amp circuitry
and thin film resistor networks to provide a high output signal and temperature
compensation. The small form factor and high reliability of on-chip integration
make this pressure sensor a logical and economical choice for the system
designer.
The MPXxx6400A series piezoresistive transducer is a state-of-the-art,
monolithic, signal conditioned, silicon pressure sensor. This sensor combines
advanced micromachining techniques, thin film metallization, and bipolar
semiconductor processing to provide an accurate, high level analog output signal
that is proportional to applied pressure.
Features
Improved accuracy at high temperature
Available in super small outline package
1.5% maximum error over 0 °C to 85 °C
Fully calibrated and compensated
Ideally suited for microprocessor or microcontroller-based systems
Temperature compensated from -40 °C to +125 °C
Durable thermoplastic surface mount package
Package porting and mounting options enable tube attachment for liquefied
natural gas (LPG) or remote sensing applications
Typical applications
Fuel injected car engines
Vehicles powered by green gases (for example LPG and CNG)
Small engines
Industrial controls
Ordering information
Part number Shipping Package
# of Ports Pressure type Device
marking
None Single Dual Gauge Differential Absolute
Super Small Outline Package (Media resistant gel)
MPXH6400AC6U Rail 98ARH99089A • MPXH6400A
MPXH6400AC6T1 Tape and Reel 98ARH99089A MPXH6400A
MPXHZ6400A6T1 Tape and Reel 98ARH99066A MPXHZ6400A
MPXHZ6400AC6T1 Tape and Reel 98ARH99089A MPXHZ6400A
MPXH6400A
Super small outline package
Top view
Pinout
Pin 1 identification,
chamfered corner.
1
2
3
45
6
7
8
DNC
DNC
DNC DNC
DNC V
S
GND
V
OUT
MPXH6400AC6U/6T1/
MPXHZ6400AC6T1
Case 98ARH99089A
MPXHZ6400A6T1
Case 98ARH99066A
MPXH6400A
Sensors
2NXP B.V.
Related Documentation
The MPXxx6400A device features and operations are described in a variety of reference manuals, user guides, and application
notes. To find the most-current versions of these documents:
1. Go to the MPXx6400 web page at http://www.nxp.com/products/:MPXx6400.
2. Click the Documentation tab.
Contents
1 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 On-chip Temperature Compensation and Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.1 Minimum recommended footprint for surface mounted applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.2 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Pm 1 Idemlflcahon‘
MPXH6400A
Sensors
NXP B.V. 3
1 General Description
1.1 Block diagram
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
Figure 1. Integrated pressure sensor block diagram
1.2 Pinout
Figure 2. Device pinout (top view)
Table 1. Pin functions
Pin Name Function
1 DNC Do not connect to external circuitry or ground. Pin 1 is notated by chamfered corner.
2V
SVoltage supply
3 GND Ground
4V
OUT Output voltage
5 DNC Do not connect to external circuitry or ground.
6 DNC Do not connect to external circuitry or ground.
7 DNC Do not connect to external circuitry or ground.
8 DNC Do not connect to external circuitry or ground.
VOUT
VS
Sensing
Element
GND
Thin Film
Temperature
Compensation
and Gain
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Pins 1, 5, 6, 7, and 8 are internal device connections.
Do not connect to external circuitry or ground.
Stage #1
Pin 1 identification,
chamfered corner.
1
2
3
45
6
7
8
DNC
DNC
DNC DNC
DNC V
S
GND
V
OUT
MPXH6400A
Sensors
4NXP B.V.
2 Mechanical and Electrical Specifications
2.1 Maximum ratings
2.2 Operating characteristics
Table 2. Maximum ratings(1)
1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Parametrics Symbol Value Units
Maximum pressure (P1 > P2) PMAX 1600 kPa
Storage temperature TSTG -40° to +125°°C
Operating temperature TA-40° to +125°°C
Output source current @ full-scale output(2)
2.Maximum output current is controlled by effective impedance from VOUT to GND or VOUT to VS in the application circuit.
IO+0.5mAdc
Output sink current @ minimum pressure offset(2) IO--0.5mAdc
Table 3. Operating characteristics (VS = 5.0 VDC, TA = 25 °C unless otherwise noted, P1 > P2.)
Characteristic Symbol Min Typ Max Unit
Pressure range POP 20 400 kPa
Supply voltage(1)
1.Device is ratiometric within this specified excitation range.
VS4.64 5.0 5.36 VDC
Supply current IO 6.0 10 mAdc
Minimum pressure offset(2) (0 to 85 °C) @ VS = 5.0 Volts
2.Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
VOFF 0.133 0.2 0.267 VDC
Full-scale output(3) (0 to 85 °C) @ VS = 5.0 Volts
3.Full-scale output (VFSO) is defined as the output voltage at the maximum or full-rated pressure.
VFSO 4.733 4.8 4.866 VDC
Full-scale span(4) (0 to 85 °C) @ VS = 5.0 Volts
4.Full-scale span (VFSS) is defined as the algebraic difference between the output voltage at full-rated pressure and the output voltage at the
minimum rated pressures
VFSS 4.467 4.6 4.733 VDC
Accuracy(5) (0 to 85 °C)
5.Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at
25 °C due to all sources of error including the following:
Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum
or maximum rated pressure at 25 °C
TcSpan: Output deviation over the temperature range of 0 to 85 °C, relative to 25 °C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85 °C, relative to 25 °C.
Variation from Nominal: The variation from nominal values, for offset or full-scale span, as a percent of VFSS, at 25 °C.
———±1.5 %VFSS
Sensitivity V/P 12.1 — mV/kPa
Response time(6)
6.Response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
tR—1.0—ms
Warm-up time(7)
7.Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
——20ms
Offset stability(8)
8.Offset stability is the product's output deviation when subjected to 1000 cycles of pulsed pressure, temperature cycling with bias test.
——±0.25 — %VFSS
MPXH6400A
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NXP B.V. 5
3 On-chip Temperature Compensation and Calibration
Figure 3 illustrates the absolute sensing chip in the basic super small outline chip carrier (case 98ARH99066A).
Figure 4 shows a typical application circuit (output source current operation).
Figure 5 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for
operation over 0 to 85 °C temperature range. The output will saturate outside of the rated pressure range.
A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be
transmitted to the silicon diaphragm. The MPXH6400A/MPXHZ6400A pressure sensor operating characteristics, internal
reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse
effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your
application.
Figure 3. Cross-sectional diagram (not-to-scale)
Figure 4. Recommended power supply decoupling and output filtering
Fluorosilicone
Gel Die Coat
Sealed Vacuum
Reference
Stainless
Steel Cap
P1
Absolute
Die Bond
Die
Thermoplastic
Case
Lead
Frame
Wire
Bond
VS
+5.1 V
GND
VOUT To ADC
1 μF
51 K47 pF
100 nF
MPXH6400A
Sensors
6NXP B.V.
Figure 5. Output vs. absolute pressure
Figure 6. Transfer function
Figure 7. Temperature error band
Output (Volts)
Pressure (Reference to Sealed Vacuum) in kPa
20
40
60
80
100
120
140
160
180
200
220
240
260
280
300
320
340
360
380
400
Transfer Function:
VOUT = VS x (0.002421xP–0.00842 ± Error
VS = 5.0 VDC
Temperature = 0 to 85 °C
MIN
TYP
MAX
4.5
0
4.0
5.0
1.0
1.5
2.0
2.5
3.0
3.5
0.5
Normal Transfer Value: VOUT = VS x (0.002421 x P – 0.00842)
± Pressure Error x Temp. Factor x 0.002421 x VS
VS = 5.0 ± 0.36 VDC
Break Points
Temp Multiplier
- 40 3
0 to 85 1
1 2 5 1 . 7 5
Temperature in °C
4.0
3.0
2.0
0.0
1.0
-40 -20 0 20 40 60 14012010080
Temperature Error Factor
NOTE: The Temperature Multiplier is a linear response from 0 °C to -40 °C and from 85 °C to 125 °C
MPXH6400A
Sensors
NXP B.V. 7
Figure 8. Pressure error band
Error Limits for Pressure
± 5.5 (kPa)
3.0
2.0
1.0
-1.0
-2.0
-4.0
0.0
4.0
-3.0
- 5.0
- 6.0
5.0
6.0
20
Pressure (in kPa)
Pressure Error (kPa)
Pressure Error (Max)
20 to 400 (kPa) ±5.5 (kPa)
40 60 80 100 120 140 160 180 200 220 240 260 280 300 320 340 360 380 400
\ DEED
MPXH6400A
Sensors
8NXP B.V.
4 Package Information
4.1 Minimum recommended footprint for surface mounted applications
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the
correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry,
the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder
mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts.
Figure 9. SSOP footprint
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
0.387
9.83
0.150
3.81
0.050
1.27
TYP
2X Emc .500 A180 F' :éij & _.oo4®l H ——‘300—— Pm 1 f '250 \DENTWER fDETAH. "D" ‘\\,// SEAT‘NG PLANE Q MECHANICAL OUTLINE PRINT VERS‘ON NOT TO SCALE T‘TLE. 8 LEAD DOCUMENT NO: QBARHQQOSSA REV: J SSOP STANDARD: NONiJEDEC 301170971 01 FEB 2016
MPXH6400A
Sensors
NXP B.V. 9
4.2 Package Dimensions
This drawing is located at http://cache.nxp.com/assets/documents/data/en/package-information/98ARH99066A.pdf.
Case 98ARH99066A, super small outline package, surface mount
CAGE .014 PLANE l7 .0087 W .000 10. .025_ 0' .048 DETA‘L "D” 9 "“‘jLL MECHANICAL OUTLINE PR‘NT VERS‘ON NOT TO SCALE UTLE: DOCUMENT N0:95ARH99066A REV: J STANDARD: NON’JEDEC SOT170971 01 FEB 2016
MPXH6400A
Sensors
10 NXP B.V.
Case 98ARH99066A, super small outline package, surface mount
NOTES: T. ALL DTMENSTONS IN INCHES. 2V DIMENSTONTNG AND TOLERANCTNG PER ASME YT4.5M71994. & DIMENSTONS DO NOT TNCLUDE MOLD FLASH UR PROTR’USIONS. MOLD FLASH 0R PROTRUSION SHALL NOT EXCEED .006 TNCHES PER STDE, 4 ALL VERTTCAL SURFACES TO BE 5' MAXTMUM. @‘ DIMENSTON DOES NOT INCLUDE DAMBAR PROTRUSTON‘ ALLOWABLE DAMBAR PROTRUSION SHALL BE .005 TNCHES MAXTMUM. MECHANICAL OUTLINE PRTNT VERSTON NOT TO SCALE DOCUMENT NO: 98ARH99066A REV: J STANDARD: NONmJEDEC SOTT70971 U‘T FEB 2016
MPXH6400A
Sensors
NXP B.V. 11
Case 98ARH99066A, super small outline package, surface mount
.420 .400 —— .1625 5E1, ‘ 7‘ 4 .025 E' E7 43' .325 2X 8 @112 C A E ¢ .130 0 .110 390 370 \DETATL E GAGE PLANE J_ .008 .000 DETAIL E MECHANICAL OUTLINE PRINT VERSION NOT TO SCALE TITLE: DOCUMENT N0: SEARHSQDBQA REV: H 8 LD, PORTED SSOP STANDARD: NONrJEDEC SOTl710i1 01 FEB 2016
MPXH6400A
Sensors
12 NXP B.V.
This drawing is located at http://cache.nxp.com/assets/documents/data/en/package-information/98ARH99089A.pdf.
Case 98ARH99089A, small outline package, surface mount
NOTES: ‘L ALL DTMENSTONS TN \NCHES, 2. DIMENSTONTNG AND TOLERANCTNG PER ASME Y145M71994. DIMENSTONS DO NOT \NCLUDE MOLD FLASH 0R PROTRUSTONSV MOLD FLASH OR PROTRUSTON SHALL NOT EXCEED .006 INCHES PER STDE. 4 ALL VERTTCAL SURFACES TO BE 5' MAXTMUM DIMENSTON DOES NOT \NCLUDE DAMEAR PROTRUSION. ALLOWABLE DAMBAR PROTRUS‘DN SHALL BE .008 \NCHES MAXTMUM. _LL 5;,” I MECHANICAL OUTLINE PRINT VERSION NOT TO SCALE TITLE: DOCUMENT N0: SSARHQQOBQA REV: H 8 LD, PORTED SSOP STANDARD: NONrJEDEC SOT1710H1 01 FEB 2016
MPXH6400A
Sensors
NXP B.V. 13
Case 98ARH99089A, small outline package, surface mount
MPXH6400A
Sensors
14 NXP B.V.
5 Revision History
Table 4. Revision history
Document ID Release Date Data sheet status Change notice Supersedes
MPXH6400A Rev. 6 2017 March Technical data MPXH6400A Rev. 5.0
Modifications
•Revised V
S = 10.0 VDC value to VS = 5.0 VDC in Table 3.
The format of this data sheet has been redesigned to comply with current identity guidelines of NXP
Semiconductors. Legal texts have been adapted to the new company name where appropriate.
Updated package outlines Section 4.2, “Package Dimensions” to comply with current identity guidelines of NXP
Semiconductors.
MPXH6400A Rev. 5.0 2015 September Technical data MPXH64-00A Rev.
Document Number: MPXH6400A
Rev. 6
03/2017
Information in this document is provided solely to enable system and software
implementers to use NXP products. There are no expressed or implied copyright
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information in this document. NXP reserves the right to make changes without further
notice to any products herein.
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liability, including without limitation, consequential or incidental damages. "Typical"
parameters that may be provided in NXP data sheets and/or specifications can and do
vary in different applications, and actual performance may vary over time. All operating
parameters, including "typicals," must be validated for each customer application by the
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