NC7SZU04 Datasheet by ON Semiconductor

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0N Semiconductor® www.0nsemi.com Thcsc Devices are Pb—Frcc, Halogen FICc/BFR Free and are ROHS SC-BBA I CASE 41 SAC-01 $ $ _ as» $1 Figure 1. Logic Symbol CS, 7ZU4, ZU4 : Specific Dewce Code KK : 2-ngit Lol Run Trac xv : 2-ngit Date Code F 2 : Assemmy Plan: cm T : Die Run Code : Vear Coding Scheme : Mam Code \dermfier : Eight-Week Datacod ORDERING INFORMATID see damned ordenng mavkmg and smppmg m package mmensmns secunn on page a M m n Semxcunduclurcampuwnu \nduslnas‘ LLC was 1 Pubhcation Oldel Num July, 2019 — Rev. 1 NC7SZU
Semiconductor Components Industries, LLC, 1996
July, 2019 Rev. 3
1Publication Order Number:
NC7SZU04/D
NC7SZU04
TinyLogic UHS Unbuffered
Inverter
Description
The NC7SZU04 is a single unbuffered inverter from
ON Semiconductors UltraHigh Speed series of TinyLogic. The
special purpose unbuffered circuit design is primarily intended for
crystal oscillator or analog applications. The device is fabricated with
advanced CMOS technology to achieve ultrahigh speed with high
output drive while maintaining low static power dissipation over a
broad VCC operating range. The device is specified to operate over the
1.65 V to 5.5 V VCC range.
Features
Unbuffered for Crystal Oscillator and Analog Applications
Balanced Output Drive: ±16 mA at 4.5 V VCC
Broad VCC Operating Range: 1.65 V to 5.5 V
Matches Performance of LCX Operated at 3.3 V VCC
Low Quiescent Power: ICC < 2 mA, VCC = 5.5 V, TA = 25°C
UltraSmall MicroPak Packages
SpaceSaving SC74A and SC88A Packages
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
Figure 1. Logic Symbol
YA 1
IEEE / IEC
7ZU4T
C5, 7ZU4, ZU4 = Specific Device Code
KK = 2Digit Lot Run Traceability Code
XY = 2Digit Date Code Format
Z = Assembly Plant Code
T = Die Run Code
= Year Coding Scheme
= Plant Code Identifier
= EightWeek Datacoding Scheme
See detailed ordering, marking and shipping information in the
package dimensions section on page 6 of this data sheet.
ORDERING INFORMATION
MARKING
DIAGRAMS
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SC88A
CASE 419AC01
SIP6
CASE 127EB
UDFN6
CASE 517DP
C5KK
XYZ
C5KK
XYZ
ZU4T
Pin 1
Pin 1
SC74A
CASE 318BQ
II [Em EU I 3: ED www.cnsemi.com
NC7SZU04
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2
Pin Configurations
NC
A
VCC
GND Y
1
2
3
5
4
Figure 2. SC88A and SC74A (Top View)
NC 1 6 VCC
A 2 5 NC
GND 3 4 Y
Figure 3. MicroPak (Top Through View)
PIN DEFINITIONS
Pin # SC88A /
SC74A Pin # MicroPak Name Description
11, 5 NC No Connect
2 2 A Input
3 3 GND Ground
4 4 Y Output
5 6 VCC Supply Voltage
FUNCTION TABLE (Y = /A)
Inputs Output
A Y
L H
H L
H = HIGH Logic Level
L = LOW Logic Level
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ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Min Max Unit
VCC Supply Voltage 0.5 6.0 V
VIN DC Input Voltage 0.5 6.0 V
VOUT DC Output Voltage 0.5 6.0 V
IIK DC Input Diode Current VIN < 0.5 V − −50 mA
VIN > VCC + 5.0 V +20
IOK DC Output Diode Current VOUT < 0.5 V − −50 mA
VOUT > 0.5 V, VCC = GND +20
IOUT DC Output Current ±50 mA
ICC or IGND DC VCC or Ground Current ±100 mA
TSTG Storage Temperature Range 65 +150 °C
TJJunction Temperature Under Bias +150 °C
TLJunction Lead Temperature (Soldering, 10 Seconds) +260 °C
PDPower Dissipation in Still Air SC74A 225 mW
SC88A 190
MicroPak6327
MicroPak26327
ESD Human Body Model, JEDEC: JESD22A114 4000 V
Charge Device Model, JEDEC: JESD22C101 2000
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Conditions Min Max Unit
VCC Supply Voltage Operating 1.65 5.50 V
Supply Voltage Data Retention 1.50 5.50
VIN Input Voltage 0 5.5 V
VOUT Output Voltage 0 VCC V
TAOperating Temperature 40 +85 °C
qJA Thermal Resistance SC74A 555 °C/W
SC88A 659
MicroPak6382
MicroPak26382
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
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DC ELECTICAL CHARACTERISTICS
Symbol Parameter VCC (V) Conditions
TA = +25°C TA = 40 to +85°C
Unit
Min Typ Max Min Max
VIH HIGH Level Input
Voltage
1.8 to 2.7 0.85 VCC 0.85 VCC V
3.0 to 5.5 0.80 VCC 0.80 VCC
VIL LOW Level Input
Voltage
1.8 to 2.7 0.15 VCC 0.15 VCC V
3.0 to 5.5 0.20 VCC 0.20 VCC
VOH HIGH Level
Output Voltage
1.65 VIN = VIL, IOH = 100 mA 1.55 1.65 1.55 V
1.80 1.60 1.80 1.60
2.30 2.10 2.30 2.10
3.00 2.70 3.00 2.70
4.50 4.00 4.40 4.00
1.65 VIN = GND IOH = 4 mA 1.29 1.52 1.29
2.30 IOH = 4 mA 1.90 2.14 1.90
3.00 IOH = 8 mA 2.40 2.75 2.40
3.00 IOH = 12 mA 2.30 2.61 2.30
4.50 IOH = 16 mA 3.80 4.13 3.80
VOL LOW Level
Output Voltage
1.65 VIN = VIH, IOL = 100 mA0.00 0.10 0.10 V
1.80 0.00 0.20 0.20
2.30 0.00 0.20 0.20
3.00 0.00 0.30 0.30
4.50 0.00 0.50 0.50
1.65 VIN = VCC IOL = 4 mA 0.80 0.24 0.24
2.30 IOL = 4 mA 0.10 0.30 0.30
3.00 IOL = 8 mA 0.17 0.40 0.40
3.00 IOL = 12 mA 0.25 0.55 0.55
4.50 IOL = 16 mA 0.226 0.55 0.55
IIN Input Leakage
Current
1.65 to 5.5 VIN = 5.5 V, GND ±1±10 mA
ICC Quiescent Supply
Current
1.65 to 5.50 VIN = 5.5 V, GND − − 220 mA
ICCPEAK Peak Supply
Current in Analog
Operation
1.8 VOUT = Open, VIN = Adjust
for Peak ICC Current
2−−−mA
2.5 4−−−
3.3 10 −−−
5.0 30 −−−
NOTE. °/e 3 CL Includes mad and slray capacnance 4 \anA PRR : 1.0 MHz‘ IW : 500 ns When operahng the NC7SZU04‘5 unbuffered output stage m ms linear range‘ as m oscmalov apphcatlons‘ care musl be taken maximum power rallng tor Ihe dense and package. The high dnve nature (We desugn of the output stage resuhs In subslantlal s DC Elect/[cal Charactensncs www.cnsemi.com 5
NC7SZU04
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5
AC ELECTRICAL CHARACTERISTICS
Symbol Parameter VCC (V) Conditions
TA = +25°C TA = 40 to +85°C
Unit
Min Typ Max Min Max
tPLH, tPHL Propagation Delay
(Figure 4, 5)
1.65 CL = 15 pF,
RL = 1 MW
11.7 12.1 ns
1.80 8.5 9.0
2.50 ±0.20 6.2 6.5
3.30 ±0.30 4.5 4.8
5.00 ±0.50 3.9 4.1
3.30 ±0.30 CL = 50 pF,
RL = 500 W
6.0 6.5
5.00 ±0.50 5.0 5.5
CIN Input Capacitance 0.00 4.5 pF
CPD Power Dissipation Capacitance
(Note 2) (Figure 6)
3.30 6.3 pF
5.00 9.5 − −
2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at
no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression:
ICCD = (CPD) (VCC) (fIN) + (ICCstatic).
NOTE:
3. CL includes load and stray capacitance.
4. Input PRR = 1.0 MHz; tW = 500 ns
Figure 4. AC Test Circuit Figure 5. AC Waveforms
NOTE:
5. When operating the NC7SZU04s unbuffered output stage in its linear range, as in oscillator applications, care must be taken to observe
maximum power rating for the device and package. The high drive nature of the design of the output stage results in substantial simultaneous
conduction currents when the stage is in the linear region. See the ICCPEAK specification in the DC Electrical Characteristics table.
6. Input = AC Waveform; tr = tf = 1.8 ns; PRR = Variable; Duty Cycle = 50%.
A
INPUT
VCC
Figure 6. ICCD Test Circuit
VCC
CLRL
INPUT OUTPUT
tr = 3 ns
50%
50%
90%
10%
90%
10%
INPUT
OUTPUT
tf = 3 ns
VCC
GND
VOH
VOL
50%
50%
tPLH tPHL
tW
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ORDERING INFORMATION
Part Number Top Mark Packages Shipping
NC7SZU04M5X 7ZU4 SC74A 3000 / Tape & Reel
NC7SZU04P5X ZU4 SC88A 3000 / Tape & Reel
NC7SZU04L6X C5 SIP6, MicroPak 5000 / Tape & Reel
NC7SZU04FHX C5 UDFN6, MicroPak2 5000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
2x 5- C (1) ,_‘ [.(0254) EIE 58:9 7' E E T T - I I PIN fiENTIFIERJ w 0. 50:0. 05 j (030) PIN ’I 6X 0'05 RECOMMENED I _I: 000 LAND PATTERN E I Q 0'05 C 0.35:0.05 1.45:0.05 DETAILA W — 0.20:0.05 6X \ ‘4‘ a} o.1o® c BIAI / I o.os® c K :I III __ 7 0.30:0.05 5x 1. 00:0. 05 4F I 7 : I __ 0.40:0.05 — i 0.35:0.05 5x DETAM 41— I ——__ ' gflffléggo PIN ‘I TERMINAL (.0050) I—I—I» hams) 6x 4x BOTTOM VIEW NOTES 1 CONFORMS TO JEDEC STANDARD M0-252 VARIATION UAAD Z DIMENSIONS ARE IN MILLIMETERS DRAWING CONFORMS TO ASME VI4.5M-2009 APIN ONE IDENTIFIER IS 2X LENGTH OF ANY OTHER LINE IN THE MARK CODE LAYOUT. www.0nse
NC7SZU04
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7
PACKAGE DIMENSIONS
SIP6 1.45X1.0
CASE 127EB
ISSUE O
NC7SZU04
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8
PACKAGE DIMENSIONS
SC74A
CASE 318BQ
ISSUE B
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
DIM MIN MAX
MILLIMETERS
D
E1
A0.90 1.10
b0.25 0.50
e0.95 BSC
A1 0.01 0.10
c0.10 0.26
L0.20 0.60
M0 10
E2.50 3.00
123
54
E
D
E1
b
A
c
__
0.20
5X
CAB
CSEATING
PLANE
L
M
DETAIL A
TOP VIEW
SIDE VIEW
A
B
END VIEW
1.35 1.65
2.85 3.15
2.40
0.70
5X
DIMENSIONS: MILLIMETERS
RECOMMENDED
0.95
PITCH
1.00
5X
e
A1
0.05
DETAIL A
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9
PACKAGE DIMENSIONS
SC88A (SC70 5 Lead), 1.25x2
CASE 419AC01
ISSUE A
E1
D
A
L
L1 L2
ee
bA1
A2
c
TOP VIEW
SIDE VIEW END VIEW
q1
q1
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-203.
E
q
SYMBOL MIN NOM MAX
θ
A
A1
b
c
D
E
E1
e
L
0º 8º
L2
0.00
0.15
0.10
0.26
1.80
1.80
1.15
0.65 BSC
0.15 BSC
1.10
0.10
0.30
0.18
0.46
2.20
2.40
1.35
L1
0.80
θ1 4º 10º
A2 0.80 1.00
0.42 REF
0.36
2.00
2.10
1.25
kmooxoosoar—I PIN 1 MIN 250uM 1.00:0.050 \ - Q 0.05 0 TOP VIEW IZX—I—I—I RECOMMENDED LAND PATTERN FOR SPACE CONSTRAINED PCB // 0.05 C I 0.50:0.05 :I :I I: I SIDE VIEW (0.08) 4x a .— 6X 0.14:0.05 DETAILA 1 5X ”I I<— 0.20="" 6x="" alternative="" land="" pattern="" for="" universal="" application="" £(005)="" ex="" 0.10®="" c="" b="" a="" i="" .05="" c="" 03020.05="" 4="" 0.60i—="" 0.35="" i="" (0.00)="" 4x="" bottom="" view="" notes="" a.="" complies="" to="" jedec="" m07252="" standard="" b="" dimensions="" are="" in="" millimeters.="" c="" dimensions="" and="" tolerances="" per="" asme="" yia.5mi="" 2009="" www.cnsemi.com="" 0.35:0.050="" 0.075x45°="" detail="" a="" chamfer="" pin="" 1="" lead="" scale:="" 2x="">
NC7SZU04
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10
PACKAGE DIMENSIONS
UDFN6 1.0X1.0, 0.35P
CASE 517DP
ISSUE O
a a e Mademavks m Semxcunduclm Cnmpnnems In "sine \ghlsmanumhernlpalems \rademavks Dav www mm cumrsuerguwaxem Mavkmg gm
NC7SZU04
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11
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PUBLICATION ORDERING INFORMATION
N. American Technical Support: 8002829855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
NC7SZU04/D
MicroPak and MicroPak2 are trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other
countries.
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