PF2512 Power Enhance Series Datasheet by Yageo

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DATA SHEET ®®®® www. yageo. com
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DATA SHEET
Current Sensing Chip Resistor
PF2512
(RoHS Compliant)
2W
YAGEO CORPORATION
350, Zhongzheng Rd., Dashe Shiang, Kaohsiung 815, Taiwan
Tel: 886-7-351-4117 Fax: 886-7-351-2075
Headquarters: 3F., 233-1, Baoqiao Rd., Xindian, Taipei 231, Taiwan
Tel: 886-2-2917-7555 Fax: 886-2-2917-4286
ORDERING INFORMATION XXXXXXXXXXL ®©©® MARKING C3 W ORDERING EXAMPLE www. yageo. com
Chip Resistor Surface Mount PF SERIES 2512(RoHS Compliant)
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SCOPE
This specification describes PF2512 series chip resistors with lead-free terminations.
ORDERING INFORMATION
Part number is identified by the series, size, tolerance, packing style, temperature coefficient of resistance, taping reel, power
rating and resistance value.
PF2512
X
X
X
X
X
XXXXX
L
(1)
(2)
(3)
(4)
(5)
(6) (7)
MARKING
(1) TOLERANCE
F = ±1%
J = ±5%
(2) PACKAGING STYLE
K = Embossed taping reel
(3) TEMPERATURE COEFFICIENT OF
RESISTANCE
M=±75ppm/
Fig. 1 Value=10mΩ
The R is used as decimal point; the other 3digits are significant.
For further marking information, please see special data sheet Chip
resistors marking.
F=±100ppm/
(4) TAPING REEL
7 = 7 inch dia. Reel
(5) Power rating
W = 2 x standard power (a)
(6) RESISTANCE VALUE
6 mΩ/ 7 mΩ/ 10 mΩ/ 15mΩ/ 20 mΩ/ 25 mΩ
33 mΩ/ 50 mΩ
(7) Default Code
Letter L is system default code for order
only (NOTE)
ORDERING EXAMPLE
The ordering code for a PF2512 2W chip resistor, TC 100 value 10mΩ
with ±1% tolerance, supplied in 7-
inch tape reel with 4Kpcs quantify is:
PF2512FKF7W0R01L.
NOTE
1. All our RSMD products meet RoHS compliant and Halogen
Free. "LFP" of the internal 2D reel label mentions "Lead Free
Process".
2. On customized label, "LFP" or specific symbol can be
printed.
PF2512
O r \ \ | | DIMENSION '_T C3 -I24 ceramic substrate end termination 1- ‘ 1 H ‘ v Resistor layer Protective coat +‘ur ELECTRICAL CHARACTERISTICS ,7 ®©©® www.yageo.com
Chip Resistor Surface Mount PF SERIES 2512(RoHS Compliant)
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DIMENSION
Table 1 For dimension see Table 1
PR2512
6 mΩ 7 mΩ/10 mΩ
15 mΩ
20 mΩ/25mΩ/
33 mΩ/50 mΩ
L (mm)
W (mm)
H (mm)
I1 (mm)
I2 (mm)
6.45±0.25
3.25±0.25
0.70±0.25
0.75±0.25
1.85±0.25
6.45±0.25
3.25±0.25
0.70±0.25
0.75±0.25
1.55±0.25
6.45±0.25
3.25±0.25
0.70±0.25
0.75±0.25
1.30±0.25
Fig. 2 Chip resistor outlines
Table 3 Packing style and packaging quantity.
PACKING STYLE REEL DIMENSION
2512
Embossed Taping Reel (K) 7" (178 mm) 4,000
Note :
1. For embossed tape and reel specification/dimensions, please see the special data sheet Packing
document.
ELECTRICAL CHARACTERISTICS
Table 2
CHARACTERISTICS PF2512 2W
Operating Temperature Range 55 to +155
Maximum Working Voltage )* ( RP
Resistance Range 6mΩ/ 7mΩ/ 10mΩ/ 15mΩ/ 20mΩ
25mΩ/33mΩ/ 50mΩ
Temperature Coefficient ±75ppm/
±100ppm/
O ‘ FUNCTIONAL DESCRIPTION P mm mum; m: x x ‘ x 1 5: x 1 x x r, 7 n a so 79 ml) ‘3 1mm Mammm dxsmpatm'w ("V m pe‘v‘entaga c‘m‘ad poweras a fmcuon Mme Qpex dung, ambxent (er era: ‘_ \ _H M ®©©® C3 www.yageo. com
Chip Resistor Surface Mount PF SERIES 2512(RoHS Compliant)
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FUNCTIONAL DESCRIPTION
POWER RATING
PF2512 rated power at 70°C is 2W
RATED VOLTAGE
The DC or AC (rms) continuous working voltage corresponding
to the rated power is determined by the following formula:
V= )* ( RP
Where
V=Continuous rated DC
or AC (rms) working voltage (v)
P=Rated power
R=Resistance value (Ω)
Fig. 3
TESTS AND REQUIREMENTS C3 or: ms IV ®©©® www. yageo. com
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TESTS AND REQUIREMENTS
TEST TEST METHOD PROCEDURE REQUIREMENT
Life IEC 60115-1 4.25.1 At 70±5 for 1,000 hours; RCWV applied for 1.5 hours
on and 0.5 hour off,still air required
±(1%+0.0005Ω)
High
Temperature
Exposure
IEC 60068-2-2
1,000 hours at 155±5 °C,unpowered ±(1%+0.0005Ω)
Moisture
Resistance
Heat
MIL-STD-202 Method
106G
Each temperature / humidity cycle is defined at 8
hours (method 106F), 3 cycles / 24 hours for 10d
with 25 °C / 65 °C 95% R.H, without steps 7a &
7b, unpowered
Parts mounted on test-boards, without
condensation on parts
Measurement at 24±2 hours after test conclusion
±(0.5%+0.0005Ω)
No visible damage
Thermal
Shock
MIL-STD-202G Method
107G -55/+125
Note Number of cycles required is 300 Devices
unmounted
Maximum transfer time is 20 seconds Dwell time is
15 minutes. Air - Air
±(0.5%+0.0005Ω)
Short Time
Overload
IEC 60115-1 4.13 2.5 times RCWV or maximum overload voltage
which is less for 5 seconds at room temperature
±(0.5%+0.0005Ω)
No visible damage
Board Flex/
Bending
IEC 60068-2-21
Device mounted or as described only
1 board bending required
2 mm bending time: 60±5 seconds
Ohmic value checked during bending
±(1%+0.0005Ω)
No visible damage
Solderability
- Wetting
IPC/JEDEC
J-STD-002B test B
Electrical Test not required
Magnification 50X
SMD conditions:
1st step: method B, aging 4 hours at 155 °C
dry heat
2nd step: leadfree solder bath at 245±3 °C
Dipping time: 3±0.5 seconds
Well tinned (>95%
covered)
No visible damage
-Leaching IPC/JEDEC
J-STD-002B test D
Solder bath at 260±5
Dipping time : 30±1 seconds
No visible damage
-Resistance
to Soldering
Heat
IEC 60068-2-58 Condition B, no pre-heat of samples
Leadfree solder, 260 °C ±5, 10 ±1 seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
±(0.5%+0.0005Ω)
No visible damage
O ‘ REVISION HISTORY C3 ®©©® www.yageo.com
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REVISION HISTORY
REVISION DATE CHANGE NOTIFICATION DESCRIPTION
Version 0 2008/4/29 - First issue of this specification
Version 1 2009/3/31 - TCR Upgraded
- Dimensions modified

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