FP1308R Series Datasheet by Eaton - Electronics Division

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Technical Data 4355 Effective June 2017
Supersedes March 2012
Product features
13.4 x 12.7 x 8.0mm surface mount package
Ferrite core material
High current carrying capacity, Low core losses
Controlled DCR tolerance for sensing circuits
Inductance range from 110nH to 440nH
Current range from 37 to 120 Amps
Frequency range up to 2MHz
Applications
Storage temperature range (component):
-40 °C to +125 °C
Operating temperature range: -40 °C to +125 °C
(ambient plus self-temperature rise)
Solder reflow temperature:
J-STD-020 (latest revision) compliant
FP1308R
High frequency, high current power inductors
Pb
HALOGEN
HF
FREE
Multi-phase regulators
Voltage Regulator Module (VRM)
Desktop and server VRMs and EVRDs
Data networking and storage systems
Graphics cards and battery power systems
Point-of-load modules
DCR sensing
Environmental data
SMD Device
7A
2
Technical Data 4355
Effective June 2017
FP1308R
High frequency, high current power inductors
www.eaton.com/electronics
Packaging information - mm
Dimensions- mm
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0Vrms, 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 1.0Vrms,Isat1.
3Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat
generating components will affect the temperature rise. It is recommended the part temperature not exceed
125°C under worst case operating conditions verified in the end application.
4Isat: Peak current for approximately 20% rolloff at +25°C.
5Isat2: Peak current for approximately 20% rolloff at +125°C.
6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3.Bp-p (Gauss),
K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps).
7 Part Number Definition: FP1308Rx-Rxx-R
• FP1308 = Product code and size
Rx = DCR indicator
• Rxx = Inductance value in μH, R = decimal point.
“-R” suffix = RoHS compliant
Product Specifications
Part OCL
1
FLL
2
Irms
3
Isat1
4
Isat2
5
DCR (m)
Number
7
± 10% (nH) (nH) (Amps) @ 25°C (Amps) @ 125°C (Amps) @ 20°C K-factor
6
R1 Version
FP1308R1-R11-R 110 79 120 105 233
FP1308R1-R21-R 210 152 80 68 233
FP1308R1-R26-R 260 187 57 64 52 0.32 ± 9.4% 233
FP1308R1-R32-R 320 230 52 40 233
FP1308R1-R44-R 440 317 37 28 233
R2 Version
FP1308R2-R11-R 110 79 120 105 233
FP1308R2-R21-R 210 152 80 68 233
FP1308R2-R26-R 260 187 45 64 52 0.53 ± 10% 233
FP1308R2-R32-R 320 230 52 40 233
FP1308R2-R44-R 440 317 37 28 233
R3 Version
FP1308R3-R11-R 110 79 120 105 233
FP1308R3-R21-R 210 152 80 68 233
FP1308R3-R26-R 260 187 68 64 52 0.18 ± 20% 233
FP1308R3-R32-R 320 230 52 40 233
FP1308R3-R44-R 440 317 37 28 233
All soldering surfaces to be coplanar within 0.1016mm.
Part Marking: FP1308R (Rx = DRC indicator) Rxx = Inductance value in μH. (R = Decimal point). wwllyy = Date code R = Revision level
2
a
The nominal DCR is measured from point “a” to point “b”
Top V iew S ide View B o ttom V iew R ec om m ended Pa d Layou t S c he m a tic
5.08
8.0
12.7 m a x ±0.15
m ax 7.62
b
11
2.54 3.18 1
±0.3
13.4 7.5 7.2 2
1308R x
m ax typ.
R xx
wwllyy R
2
4.0
8.2
Supplied in tape-and-reel packaging, 400 parts per reel, 13” diameter reel.
1.5 dia
2.0
1.5 dia
min
A
Section A-A
1.75
1
11.5
24.0
13.9 1308R x ±0.3
R x x
w w ll yy R
2
13.2
A
20.0
User direction of feed
',4_.
3
www.eaton.com/electronics
Technical Data 4355
Effective June 2017
Core loss vs Bp-p
Inductance characteristics
FP1308R
High frequency, high current power inductor
Temperature rise vs total loss
60
50
F P 1308R 2 F P 1308R 1
40
30
F P 1308R 3
20
10
0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
T o ta l L o s s (W )
T e m p e ra tu re R ise C )
1M H z 500kH z 300kH z
200kH z
10
100kH z
1
0.1
0.01
100100010000
Bp
-p
(G auss)
C o re Loss(W )
% of O C L vs % o f I
sat
1
100%
80%
-40°C
60%
40%
+25°C
20%
+125°C
0%
0% 20%40%60%80%100%120%140%
% of I
sat
1
% o f O C L
1H
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved
Printed in USA
Publication No. 4355 BU-SB12178
June 2017
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Technical Data 4355
Effective June 2017
FP1308R
High frequency, high current power inductor
Solder Reflow Profile
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
Ta
ab
bl
le
e
1
1
-
-
S
St
ta
an
nd
da
ar
rd
d
S
Sn
nP
Pb
b
S
So
ol
ld
de
er
r
(
(T
Tc
c)
)
VolumeVolume
Package mm3mm3
Thickness <350 _
>350
<2.5mm 235°C220°C
_
>2.5mm 220°C220°C
T
Ta
ab
bl
le
e
2
2
-
-
L
Le
ea
ad
d
(
(P
Pb
b)
)
F
Fr
re
ee
e
S
So
ol
ld
de
er
r
(
(T
Tc
c)
)
Volume Volume Volume
Package mm3mm3mm3
Thickness <350 350 - 2000 >2000
<1.6mm 26C26C26C
1.6 – 2.5mm 26C250°C245°C
>2.5mm 250°C245°C245°C
Reference JDEC J-STD-020
Standard SnPb Solder Lead (Pb) Free SolderProfile Feature
Preheat and Soak•eTmperature min. (Tsmin) 100°C150°C
• Temperature max. (Tsmax) 150°C200°C
• Time (Tsmin to Tsmax) (ts)60-120 Seconds60-120 Seconds
C/ Second Max. 3°C/ Second Max.
183°C217°C
60-150 Seconds60-150 Seconds
Table 1 able 2T
20 Seconds** 30 Seconds**
6°C/ Second Max. 6°C/ Second Max.
Average ramp up rate Tsmaxto Tp
Liquidous temperature (T
L
)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tpto Tsmax)
Time 25°C to Peak Temperature Minutes Max.68 Minutes Max.
*Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.

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