MCP1630/V Datasheet by Microchip Technology

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2004-2013 Microchip Technology Inc. DS21896C-page 1
MCP1630/MCP1630V
Features
High-Speed PWM Operation (12 ns Current
Sense to Output Delay)
Operating Temperature Range:
- -40°C to +125°C
Precise Peak Current Limit (±5%) (MCP1630)
Voltage Mode and Average Current Mode Control
(MCP1630V)
CMOS Output Driver (drives MOSFET driver or
low-side N-channel MOSFET directly)
External Oscillator Input
(from PIC® Microcontroller (MCU))
External Voltage Reference Input (for adjustable
voltage or current output application)
Peak Current Mode Operation > 1 MHz
Low Operating Current: 2.8 mA (typ.)
Fast Output Rise and Fall Times: 5.9 ns and
6.2 ns
Undervoltage Lockout (UVLO) Protection
Output Short Circuit Protection
Overtemperature Protection
Applications
Intelligent Power Systems
Smart Battery Charger Applications
Multiple Output/Multiple Phase Converters
Output Voltage Calibration
AC Power Factor Correction
VID Capability (programmed and calibrated by
PIC® microcontroller)
Buck/Boost/Buck-Boost/SEPIC/Flyback/Isolated
Converters
Parallel Power Supplies
Related Literature
“MCP1630 NiMH Demo Board Users Guide”,
Microchip Technology Inc., DS51505, 2004
“MCP1630 Low-Cost Li-Ion Battery Charger
User’s Guide”, Microchip Technology Inc.,
DS51555, 2005
“MCP1630 Li-Ion Multi-Bay Battery Charger
User’s Guide”, Microchip Technology Inc.,
DS51515, 2005
“MCP1630 Dual Buck Demo Board User’s Guide”,
Microchip Technology Inc., DS51531, 2005
Description
The MCP1630/V is a high-speed Pulse Width Modula-
tor (PWM) used to develop intelligent power systems.
When used with a microcontroller unit (MCU), the
MCP1630/V will control the power system duty cycle to
provide output voltage or current regulation. The MCU
can be used to adjust output voltage or current, switch-
ing frequency, maximum duty cycle and other features
that make the power system more intelligent.
Typical applications include smart battery chargers,
intelligent power systems, brick dc/dc converters, ac
power-factor correction, multiple output power supplies,
multi-phase power supplies and more.
The MCP1630/V inputs were developed to be easily
attached to the I/O of a MCU. The MCU supplies the
oscillator and reference to the MCP1630/V to provide
the most flexible and adaptable power system. The
power system switching frequency and maximum duty
cycle are set using the I/O of the MCU. The reference
input can be external, a D/A Converter (DAC) output or
as simple as an I/O output from the MCU. This enables
the power system to adapt to many external signals
and variables in order to optimize performance and
facilitate calibration.
When operating in Current mode, a precise limit is set
on the peak current. With the fast comparator speed
(typically 12 ns), the MCP1630 is capable of providing a
tight limit on the maximum switch current over a wide
input voltage range when compared to other high-speed
PWM controllers.
For Voltage mode or Average Current mode
applications, the MCP1630V provides a larger range for
the external ramp voltage.
Additional protection features include: UVLO,
overtemperature and overcurrent.
Package Type
8-Lead DFN
1
2
3
4
8
7
6
5
FB
CS
OSC IN
COMP
VIN
VREF
VEXT
GND
1
2
3
4
8
7
6
5
FB
CS
OSC IN
COMP
VIN
VREF
VEXT
GND
8-Lead MSOP
(2 mm x 3 mm)
High-Speed, Microcontroller-Adaptable,
Pulse Width Modulator
MCP1630/MCP1630V
DS21896C-page 2 2004-2013 Microchip Technology Inc.
Functional Block Diagram – MCP1630
MCP1630 High-Speed PWM
R
SQ
Q
EA
+
VREF
FB
Comp
+
CS
OSC IN
VIN
COMP
GND
VEXT
2R
R
VIN
2.7V Clamp
Overtemperature
UVLO
100 k
0.1 µA
0.1 µA
VIN
VIN
Latch Truth Table
SRQ
00Qn
011
100
111
Note: During overtemperature, VEXT driver is high-impedance.
Note
2004-2013 Microchip Technology Inc. DS21896C-page 3
MCP1630/MCP1630V
Functional Block Diagram – MCP1630V
MCP1630V High-Speed PWM
R
SQ
Q
EA
+
VREF
FB
Comp
+
CS
OSC IN
VIN
COMP
GND
VEXT
VIN
2.7V Clamp
Overtemperature
UVLO
100 k
0.1 µA
0.1 µA
VIN
VIN
Latch Truth Table
SRQ
00Qn
011
100
111
Note: During overtemperature, VEXT driver is high-impedance.
Note
SZ
MCP1630/MCP1630V
DS21896C-page 4 2004-2013 Microchip Technology Inc.
Typical Application Circuit – MCP1630
+VBATT
MCP1630
+5V Bias
PIC16LF818
1/2 MCP6042
+8V to +15V Input Voltage
MCP1630 NiMH Battery Charger and Fuel Gauge Application Diagram
4 NiMH Cells
N-channel
1:1
SEPIC Converter
Cin COUT
A/D
PWM OUT
A/D
VDD
I2C™ To System
+VBATT
IBATT
ISW
5.7V
+
VDD
CC
+
+5V Bias
3V
0V
1/2 MCP6042
VDD
+
MOSFET
MCP1700
3.0V
SOT23
GND
CS
VEXT
VIN
COMP
FB
OSC IN
VREF
2004-2013 Microchip Technology Inc. DS21896C-page 5
MCP1630/MCP1630V
Typical Application Circuit - MCP1630V
Bidirectional Power Converter/Battery Charger for 4-Series Cell Li-Ion Batteries
+
+
Battery
Protection
and
Monitor
+VBATT
-VBATT
Bidirectional Buck/Boost
L
COUT
CIN
DC Bus
Voltage
SMBus
4-Cell Li-Ion
Battery Pack
Battery Protection
Switches
RSENSE
+
Boost Buck
Boost
Switch
Buck
Switch
SMBus
ISENSE
VSENSE
Fuse
GND
Sync.
FET
Driver
Comp
FB
CS
VREF
OSC GND
VEXT
VIN
+
+
+2.5 VREF
Charge Current Loop
DC bus Voltage Loop
0V to 2.7V
IREF Voltage (PWM) +
Filter
+DC Bus VREF
PIC16F88
MCP1630V
PS501
(1/2) MCP6021
(1/2) MCP6021
(1/2) MCP6021
MCP1630/MCP1630V
DS21896C-page 6 2004-2013 Microchip Technology Inc.
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
VDD...................................................................................6.0V
Maximum Voltage on Any Pin .. (VGND - 0.3)V to (VIN + 0.3)V
VEXT Short Circuit Current ...........................Internally Limited
Storage temperature .....................................-65°C to +150°C
Maximum Junction Temperature, TJ...........................+150°C
Continuous Operating Temperature Range ..-40°C to +125°C
ESD protection on all pins, HBM 3kV
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
AC/
AC/DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 µF,
VIN for typical values = 5.0V, TA= -40°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
Input Voltage
Input Operating Voltage VIN 3.0 — 5.5 V
Input Quiescent Current I(VIN)—2.84.5mAI
EXT =0mA, F
OSC IN =0Hz
Oscillator Input
External Oscillator Range FOSC —— 1MHzNote 1
Min. Oscillator High Time
Min. Oscillator Low Time
TOH_MIN
TOL_MIN
—10 ns
Oscillator Rise Time TRISE 0.01 10 µs Note 2
Oscillator Fall Time TFALL 0.01 10 µs Note 2
Oscillator Input Voltage Low VL——0.8V
Oscillator Input Voltage High VH2.0 — V
Oscillator Input Capacitance COSC 5pf
External Reference Input
Reference Voltage Input VREF 0—V
IN VNote 2, Note 3
Error Amplifier
Input Offset Voltage VOS -4 0.1 +4 mV
Error Amplifier PSRR PSRR 80 99 dB VIN = 3.0V to 5.0V, VCM =1.2V
Common Mode Input Range VCM GND - 0.3 VIN VNote 2, Note 3
Common Mode Rejection Ratio 80 dB VIN =5V, V
CM = 0V to 2.5V
Open-loop Voltage Gain AVOL 85 95 dB RL=5k to VIN/2, 100 mV < VEAOUT
< VIN - 100 mV, VCM =1.2V
Low-level Output VOL 25 GND + 50 mV RL = 5 k to VIN/2
Gain Bandwidth Product GBWP 3.5 MHz VIN =5V
Error Amplifier Sink Current ISINK 511mAV
IN =5V, V
REF = 1.2V, VFB =1.4V,
VCOMP =2.0V
Error Amplifier Source Current ISOURCE -2 -9 mA VIN =5V, V
REF = 1.2V, VFB =1.0V,
VCOMP = 2.0V, Absolute Value
Note 1: Capable of higher frequency operation depending on minimum and maximum duty cycles needed.
2: External oscillator input (OSC IN) rise and fall times between 10 ns and 10 µs used for characterization testing. Signal
levels between 0.8V and 2.0V with rise and fall times measured between 10% and 90% of maximum and minimum
values. Not production tested.
3: The reference input of the internal amplifier is capable of rail-to-rail operation.
2004-2013 Microchip Technology Inc. DS21896C-page 7
MCP1630/MCP1630V
TEMPERATURE SPECIFICATIONS
Current Sense Input
Maximum Current Sense Signal
MCP1630
VCS_MAX 0.85 0.9 0.95 V Set by maximum error amplifier
clamp voltage, divided by 3.
Delay From CS to VEXT
MCP1630
TCS_VEXT —1225ns
Maximum Current Sense Signal
MCP1630V
VCS_MAX 2.55 2.7 2.85 V VIN > 4.25V
Maximum CS input range limited by
comparator input common mode
range. VCS_MAX =V
IN-1.4V
Delay From CS to VEXT
MCP1630V
TCS_VEXT 17.5 35 ns
Minimum Duty Cycle DCMIN —— 0 %V
FB =V
REF +0.1V,
VCS =GND
Current Sense Input Bias Current ICS_B —-0.1— µAV
IN =5V
Internal Driver
RDSON P-channel RDSon_P —1030
RDSON N-channel RDSon_N —730
VEXT Rise Time TRISE —5.918 nsC
L= 100 pF
Typical for VIN =3V
VEXT Fall Time TFALL —6.218 nsC
L= 100 pF
Typical for VIN =3V
Protection Features
Under Voltage Lockout UVLO 2.7 3.0 V VIN falling, VEXT low state when in
UVLO
Under Voltage Lockout Hysteresis UVLO HYS 50 75 150 mV
Thermal Shutdown TSHD — 150 — °C
Thermal Shutdown Hysteresis TSHD_HYS —18—°C
Electrical Specifications: VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 µF. TA= -40°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Operating Junction Temperature Range TA-40 +125 °C Steady state
Storage Temperature Range TA-65 +150 °C
Maximum Junction Temperature TJ +150 °C Transient
Thermal Package Resistances
Thermal Resistance, 8L-DFN
(2 mm x 3 mm)
JA 50.8 °C/W Typical 4-layer board with two
interconnecting vias
Thermal Resistance, 8L-MSOP JA 208 °C/W Typical 4-layer board
AC/DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 µF,
VIN for typical values = 5.0V, TA= -40°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
Note 1: Capable of higher frequency operation depending on minimum and maximum duty cycles needed.
2: External oscillator input (OSC IN) rise and fall times between 10 ns and 10 µs used for characterization testing. Signal
levels between 0.8V and 2.0V with rise and fall times measured between 10% and 90% of maximum and minimum
values. Not production tested.
3: The reference input of the internal amplifier is capable of rail-to-rail operation.
MCP1630/MCP1630V
DS21896C-page 8 2004-2013 Microchip Technology Inc.
2.0 TYPICAL PERFORMANCE CURVES
Note: Unless otherwise noted, VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 µF, VIN for typical
values = 5.0V, TA= -40°C to +125°C.
FIGURE 2-1: Input Quiescent Current vs.
Input Voltage.
FIGURE 2-2: Input Quiescent Current vs.
Input Voltage.
FIGURE 2-3: Error Amplifier Frequency
Response.
FIGURE 2-4: Error Amplifier Input Bias
Current vs. Input Voltage.
FIGURE 2-5: Error Amplifier Sink Current
vs. Input Voltage.
FIGURE 2-6: Error Amplifier Source
Current vs. Input Voltage.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
0
0.5
1
1.5
2
2.5
3
3.5
3
3.25
3.5
3.75
4
4.25
4.5
4.75
5
5.25
5.5
Input Voltage (V)
VIN Quiescent Current (mA)
FOSC IN = DC
TA = - 40°C TA = + 25°C
TA = + 125°C
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
3
3.25
3.5
3.75
4
4.25
4.5
4.75
5
5.25
5.5
Input Voltage (V)
VIN Quiescent Current (mA)
FOSC IN = 1 MHz
TA = - 40°C TA = + 25°C
TA = + 125°C
-14
-12
-10
-8
-6
-4
-2
0
2
1000000 10000000
Frequency (Hz)
Amplifier Gain (db)
0
50
100
150
200
250
Amplifier Phase Shift
(degrees)
Gain
Phase
VREF = 2V
RLOAD = 4.7 k
CLOAD = 67 pF
1M 10M 5M
-100
0
100
200
300
400
500
600
700
3
3.25
3.5
3.75
4
4.25
4.5
4.75
5
5.25
5.5
Input Voltage (V)
Amplifier Input Bias Current
(pA)
VCM = VIN
T
A
= - 40°C
T
A
= + 25°C
TA = + 125°C
TA = + 85°C
0
2
4
6
8
10
12
14
16
18
3
3.25
3.5
3.75
4
4.25
4.5
4.75
5
5.25
5.5
Input Voltage (V)
Amplifier Sink Current (mA)
TA = - 40°C
TA = + 25°C
TA = + 125°C
-14
-12
-10
-8
-6
-4
-2
0
3
3.25
3.5
3.75
4
4.25
4.5
4.75
5
5.25
5.5
Input Voltage (V)
Amplifier Source Current (mA)
TA = - 40°C
TA = + 25°C
TA = + 125°C
2004-2013 Microchip Technology Inc. DS21896C-page 9
MCP1630/MCP1630V
Note: Unless otherwise noted, VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 µF, VIN for typical
values = 5.0V, TA= -40°C to +125°C.
FIGURE 2-7: VEXT Rise Time vs. Input
Voltage.
FIGURE 2-8: VEXT Fall Time vs. Input
Voltage.
FIGURE 2-9: Current Sense to VEXT
Delay vs. Input Voltage (MCP1630).
FIGURE 2-10: Current Sense Clamp
Voltage vs. Input Voltage (MCP1630).
FIGURE 2-11: Undervoltage Lockout vs.
Temperature.
FIGURE 2-12: EXT Output N-channel
RDSON vs. Input Voltage.
0
1
2
3
4
5
6
7
8
9
10
3
3.25
3.5
3.75
4
4.25
4.5
4.75
5
5.25
5.5
Input Voltage (V)
VEXT Rise Time (ns)
TA = - 40°C
TA = + 25°C
TA = + 125°C
CL = 100 pF
0
1
2
3
4
5
6
7
8
9
3
3.25
3.5
3.75
4
4.25
4.5
4.75
5
5.25
5.5
Input Voltage (V)
VEXT Fall Time (ns)
TA = - 40°C
TA = + 25°C
TA = + 125°C
CL = 100 pF
0
5
10
15
20
25
3
3.25
3.5
3.75
4
4.25
4.5
4.75
5
5.25
5.5
Input Voltage (V)
CS to VEXT delay (ns)
TA = - 40°CTA = + 25°C
TA = + 125°C
0.895
0.896
0.897
0.898
0.899
0.9
3
3.25
3.5
3.75
4
4.25
4.5
4.75
5
5.25
5.5
Input Voltage (V)
CS Clamp Voltage (V)
TA = - 40°C
TA = + 25°C
TA = + 125°C
2.84
2.86
2.88
2.90
2.92
2.94
2.96
-40 -25 -10 5 20 35 50 65 80 95 110 125
Ambient Temperature (°C)
UVLO Threshold (V)
Turn On Threshold
Turn Off Threshold
0
2
4
6
8
10
12
3
3.25
3.5
3.75
4
4.25
4.5
4.75
5
5.25
5.5
Input Voltage (V)
EXT Output N-Channel R
DSON
(ohms)
TA = - 40°CTA = + 25°C
TA = + 125°C
MCP1630/MCP1630V
DS21896C-page 10 2004-2013 Microchip Technology Inc.
Note: Unless otherwise noted, VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 µF, VIN for typical
values = 5.0V, TA= -40°C to +125°C.
FIGURE 2-13: EXT Output P-channel
RDSON vs. Input Voltage.
FIGURE 2-14: Error Amplifier Input Offset
Voltage vs. Input Voltage.
FIGURE 2-15: Error Amplifier Input Offset
Voltage vs. Input Voltage.
FIGURE 2-16: Current Sense Common
Mode Input Voltage Range vs. Input Voltage
(MCP1630V).
FIGURE 2-17: Current Sense to VEXT
Delay vs. Input Voltage (MCP1630V).
0
2
4
6
8
10
12
14
16
18
3
3.25
3.5
3.75
4
4.25
4.5
4.75
5
5.25
5.5
Input Voltage (V)
EXT Output P-Channel R
DSON
(Ohms)
TA = - 40°C
TA = + 25°C
TA = + 125°C
-250
-200
-150
-100
-50
0
3
3.25
3.5
3.75
4
4.25
4.5
4.75
5
5.25
5.5
Input Voltage (V)
Error Amp Input Offset Voltage
(µV)
TA = - 40°C
TA = + 25°C
TA = + 125°C
VCM IN = 0V
-200
-150
-100
-50
0
50
100
150
3
3.25
3.5
3.75
4
4.25
4.5
4.75
5
5.25
5.5
Input Voltage (V)
Error Amp Input Offset Voltage
(µV)
TA = - 40°C
TA = + 25°C
TA = + 125°C
VCM IN = 1.2V
1.5
1.8
2.1
2.4
2.7
3
33.544.555.5
Input Voltage (V)
Maximum CS Input (V)
CS Common Mode
Input Range
TA = +25°C
0
5
10
15
20
25
30
3
3.25
3.5
3.75
4
4.25
4.5
4.75
5
5.25
5.5
Input Voltage (V)
CS to VEXT Delay (ns)
TA = +25°C
TA = +125°C
TA = -40°C
2004-2013 Microchip Technology Inc. DS21896C-page 11
MCP1630/MCP1630V
3.0 MCP1630 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
3.1 Error Amplifier Output Pin (COMP)
COMP is an internal error amplifier output pin. External
compensation is connected from the FB pin to the
COMP pin for control-loop stabilization. An internal
voltage clamp is used to limit the maximum COMP pin
voltage to 2.7V (typ.). This clamp is used to set the
maximum peak current in the power system switch by
setting a maximum limit on the CS input for Peak
Current mode control systems.
3.2 Error Amplifier Inverting Input
(FB)
FB is an internal error amplifier inverting input pin. The
output (voltage or current) is sensed and fed back to
the FB pin for regulation. Inverting or negative
feedback is used.
3.3 Current Sensing Input (CS)
CS is the current sense input pin used for cycle-by-
cycle control for Peak Current mode converters. The
MCP1630 is typically used for sensed current
applications to reduce the current sense signal, thus
reducing power dissipation.
For Voltage mode or Average Current mode
applications, a ramp is used to compare the error
amplifier output voltage with producing the PWM duty
cycle. For applications that require higher signal levels,
the MCP1630V is used to increase the level from a
maximum of 0.9V (MCP1630) to 2.7V (MCP1630V).
The common mode voltage range for the MCP1630V
CS input is VIN-1.4V. For normal PWM operation, the
CS input should be less than or equal to VIN - 1.4V at
all times.
3.4 Oscillator Input (OSC)
OSC is an external oscillator input pin. Typically, a
microcontroller I/O pin is used to generate the OSC
input. When high, the output driver pin (VEXT) is driven
low. The high-to-low transition initiates the start of a
new cycle. The duty cycle of the OSC input pin deter-
mines the maximum duty cycle of the power converter.
For example, if the OSC input is low for 75% of the time
and high for 25% of the time, the duty cycle range for
the power converter is 0% to 75% maximum.
3.5 Ground (GND)
Connect the circuit ground to the GND pin. For most
applications, this should be connected to the analog or
quiet ground plane. Noise on this ground can affect the
sensitive cycle-by-cycle comparison between the CS
input and the error amplifier output.
3.6 External Driver Output Pin (VEXT)
VEXT is an external driver output pin, used to determine
the power system duty cycle. For high-power or high-
side drives, this output should be connected to the logic-
level input of the MOSFET driver. For low-power, low-
side applications, the VEXT pin can be used to directly
drive the gate of an N-channel MOSFET.
3.7 Input Bias Pin (VIN)
VIN is an input voltage pin. Connect the input voltage
source to the VIN pin. For normal operation, the voltage
on the VIN pin should be between +3.0V and +5.5V. A
0.1 µF bypass capacitor should be connected between
the VIN pin and the GND pin.
3.8 Reference Voltage Input (VREF)
VREF is an external reference input pin used to regulate
the output of the power system. By changing the VREF
input, the output (voltage or current) of the power sys-
tem can be changed. The reference voltage can range
from 0V to VIN (rail-to-rail).
DFN/MSOP Name Function
1 COMP Error Amplifier Output pin
2 FB Error Amplifier Inverting Input
3 CS Current Sense Input pin (MCP1630) or Voltage Ramp Input pin (MCP1630V)
4 OSC IN Oscillator Input pin
5 GND Circuit Ground pin
6V
EXT External Driver Output pin
7V
IN Input Bias pin
8V
REF Reference Voltage Input pin
MCP1630/MCP1630V
DS21896C-page 12 2004-2013 Microchip Technology Inc.
4.0 DETAILED DESCRIPTION
4.1 Device Overview
The MCP1630 is comprised of a high-speed compara-
tor, high-bandwidth amplifier and logic gates that can
be combined with a PIC MCU to develop an advanced
programmable power supply. The oscillator and refer-
ence voltage inputs are generated by the PIC MCU so
that switching frequency, maximum duty cycle and out-
put voltage are programmable. Refer to Figure 4-1.
4.2 PWM
The VEXT output of the MCP1630/V is determined by
the output level of the internal high-speed comparator
and the level of the external oscillator. When the oscil-
lator level is high, the PWM output (VEXT) is forced low.
When the external oscillator is low, the PWM output is
determined by the output level of the internal high-
speed comparator. During UVLO, the VEXT pin is held
in the low state. During overtemperature operation, the
VEXT pin is high-impedance (100 k to ground).
4.3 Normal Cycle by Cycle Control
The beginning of a cycle is defined when OSC IN tran-
sitions from a high state to a low state. For normal oper-
ation, the state of the high-speed comparator output
(R) is low and the Q output of the latch is low. On the
OSC IN high-to-low transition, the S and R inputs to the
high-speed latch are both low and the Q output will
remain unchanged (low). The output of the OR gate
(VDRIVE) will transition from a high state to a low state,
turning on the internal P-channel drive transistor in the
output stage of the PWM. This will change the PWM
output (VEXT) from a low state to a high state, turning
on the power-train external switch and ramping current
in the power-train magnetic device.
The sensed current in the magnetic device is fed into
the CS input (shown as a ramp) and increases linearly.
Once the sensed current ramp (MCP1630) reaches the
same voltage level as 1/3 of the EA output, the compar-
ator output (R) changes states (low-to-high) and resets
the PWM latch. The Q output transitions from a low
state to a high state, turning on the N-channel MOSFET
in the output stage, which turns off the VEXT drive to the
external MOSFET driver terminating the duty cycle.
The OSC IN will transition from a low state to a high
state while the VEXT pin remains unchanged. If the CS
input ramp had never reached the same level as 1/3 of
the error amplifier output, the low-to-high transition on
OSC IN would terminate the duty cycle and this would
be considered maximum duty cycle. In either case,
while OSC IN is high, the VEXT drive pin is low, turning
off the external power-train switch. The next cycle will
start on the transition of the OSC IN pin from a high
state to a low state.
For Voltage mode or Average Current mode applica-
tions that utilize a large signal ramp at the CS input, the
MCP1630V is used to provide more signal (2.7V typ.).
The operation of the PWM does not change.
4.4 Error Amp/Comparator Current
Limit Function
The internal amplifier is used to create an error output
signal that is determined by the external VREF input and
the power supply output fed back into the FB pin. The
error amplifier output is rail-to-rail and clamped by a
precision 2.7V. The output of the error amplifier is then
divided down 3:1 (MCP1630) and connected to the
inverting input of the high-speed comparator. Since the
maximum output of the error amplifier is 2.7V, the max-
imum input to the inverting pin of the high-speed com-
parator is 0.9V. This sets the peak current limit for the
switching power supply.
For the MCP1630V, the maximum error amplifier out-
put is still 2.7V. However, the resistor divider is
removed, raising the maximum input signal level at the
high-speed comparator inverting input (CS) to 2.7V.
As the output load current demand increases, the error
amplifier output increases, causing the inverting input
pin of the high-speed comparator to increase.
Eventually, the output of the error amplifier will hit the
2.7V clamp, limiting the input of the high-speed com-
parator to 0.9V max (MCP1630). Even if the FB input
continues to decrease (calling for more current), the
inverting input is limited to 0.9V. By limiting the inverting
input to 0.9V, the current-sense input (CS) is limited to
0.9V, thus limiting the output current of the power
supply.
For Voltage mode control, the error amplifier output will
increase as input voltage decreases. A voltage ramp is
used instead of sensed inductor current at the CS input
of the MCP1630V. The 3:1 internal error amplifier out-
put resistor divider is removed in the MCP1630V option
to increase the maximum signal level input to 2.7V
(typ.).
4.5 0% Duty Cycle Operation
The duty cycle of the VEXT output is capable of reach-
ing 0% when the FB pin is held higher than the VREF pin
(inverting error amplifier). This is accomplished by the
rail-to-rail output capability of the error amplifier and the
offset voltage of the high-speed comparator. The mini-
mum error amplifier output voltage, divided by three, is
less than the offset voltage of the high-speed compar-
ator. In the case where the output voltage of the con-
verter is above the desired regulation point, the FB
input will be above the VREF input and the error ampli-
fier will be pulled to the bottom rail (GND). This low
voltage is divided down 3:1 by the 2R and 1R resistor
(MCP1630) and connected to the input of the high-
speed comparator. This voltage will be low enough so
that there is no triggering of the comparator, allowing
narrow pulse widths at VEXT.
2004-2013 Microchip Technology Inc. DS21896C-page 13
MCP1630/MCP1630V
4.6 Undervoltage Lockout (UVLO)
When the input voltage (VIN) is less than the UVLO
threshold, the VEXT is held in the low state. This will
ensure that, if the voltage is not adequate to operate
the MCP1630/V, the main power supply switch will be
held in the off state. When the UVLO threshold is
exceeded, there is some hysteresis in the input voltage
prior to the UVLO off threshold being reached. The
typical hysteresis is 75 mV. Typically, the MCP1630 will
not start operating until the input voltage at VIN is
between 3.0V and 3.1V.
4.7 Overtemperature Protection
To protect the VEXT output if shorted to VIN or GND, the
MCP1630/V VEXT output will be high-impedance if the
junction temperature is above the thermal shutdown
threshold. There is an internal 100 k pull-down resis-
tor connected from VEXT to ground to provide some
pull-down during overtemperature conditions. The
protection is set to 150°C (typ.), with a hysteresis of
18°C.
1? T \ T \ T T \ T 1 T T T 1
MCP1630/MCP1630V
DS21896C-page 14 2004-2013 Microchip Technology Inc.
FIGURE 4-1: Cycle-by-Cycle Timing Diagram (MCP1630).
OSC IN
S
COMP
Q
MCP1630 High-Speed PWM Timing Diagram
CS
R
VDRIVE
VEXT
R
SQ
Q
EA
+
VREF
FB
Comp
+
CS
OSC IN
VIN
COMP
GND
VEXT
2R
R
VIN
2.7V Clamp
Overtemperature
UVLO
100 k
0.1 µA
0.1 µA
VIN
VIN
Latch Truth Table
SRQ
00Qn
011
100
111
Note: During overtemperature, VEXT driver is high-impedance.
Note
4‘4!
2004-2013 Microchip Technology Inc. DS21896C-page 15
MCP1630/MCP1630V
FIGURE 4-2: Cycle-by-Cycle Timing Diagram (MCP1630V).
OSC IN
S
COMP
Q
MCP1630V High-Speed PWM Timing Diagram
CS
R
VDRIVE
VEXT
R
SQ
Q
EA
+
VREF
FB
Comp
+
CS
OSC IN
VIN
COMP
GND
VEXT
VIN
2.7V Clamp
Overtemperature
UVLO
100 k
0.1 µA
0.1 µA
VIN
VIN
Latch Truth Table
SRQ
00Qn
011
100
111
Note
VDRIVE
Note: During overtemperature, VEXT driver is high-impedance.
MCP1630/MCP1630V
DS21896C-page 16 2004-2013 Microchip Technology Inc.
5.0 APPLICATION
CIRCUITS/ISSUES
5.1 Typical Applications
The MCP1630/V high-speed PWM can be used for any
circuit topology and power-train application when
combined with a microcontroller. Intelligent, cost-
effective power systems can be developed for applica-
tions that require multiple outputs, multiple phases,
adjustable outputs, temperature monitoring and
calibration.
5.2 NiMH Battery Charger Application
A typical NiMH battery charger application is shown in
the “Typical Application Circuit – MCP1630” of this
data sheet. In that example, a Single-Ended Primary
Inductive Converter (SEPIC) is used to provide a
constant charge current to the series-connected
batteries. The MCP1630 is used to regulate the charge
current by monitoring the current through the battery
sense resistor and providing the proper pulse width.
The PIC16F818 monitors the battery voltage to provide
a termination to the charge current. Additional features
(trickle charge, fast charge, overvoltage protection,
etc.) can be added to the system using the programma-
bility of the microcontroller and the flexibility of the
MCP1630.
5.3 Bidirectional Power Converter
A bidirectional Li-Ion charger/buck regulator is shown
in the “Typical Application Circuit” of the this data
sheet. In this example, a synchronous, bidirectional
power converter example is shown using the
MCP1630V. In this application, when the ac-dc input
power is present, the bidirectional power converter is
used to charge 4-series Li-Ion batteries by boosting the
input voltage. When ac-dc power is removed, the
bidirectional power converter bucks the battery voltage
down to provide a dc bus for system power. By using
this method, a single power train is capable of charging
4-series cell Li-Ion batteries and efficiently converting
the battery voltage down to a low, usable voltage.
5.4 Multiple Output Converters
By using additional MCP1630 devices, multiple output
converters can be developed using a single MCU. If a
two-output converter is desired, the MCU can provide
two PWM outputs that are phased 180° apart. This will
reduce the input ripple current to the source and
eliminate beat frequencies.
HHHH Emu HHHH Emu NNN
2004-2013 Microchip Technology Inc. DS21896C-page 17
MCP1630/MCP1630V
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
8-Lead MSOP
Example:
XXXXX
YWWNNN
1630E
522256
Example:
1630VE
522256
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
8-Lead DFN (2 mm x 3 mm) Example:
XXX
YWW
NN
ABC
522
25
For DFN samples, contact your Microchip Sales Office for availability..
MCP1630/MCP1630V
DS21896C-page 18 2004-2013 Microchip Technology Inc.
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
D
A
A1
L
c
(F)
α
A2
E1
E
p
B
n 1
2
φ
β
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
.037 REFFFootprint (Reference)
exceed .010" (0.254mm) per side.
Notes:
Drawing No. C04-111
*Controlling Parameter
Mold Draft Angle Top
Mold Draft Angle Bottom
Foot Angle
Lead Width
Lead Thickness
β
α
c
B
φ
.003
.009
.006
.012
Dimension Limits
Overall Height
Molded Package Thickness
Molded Package Width
Overall Length
Foot Length
Standoff
Overall Width
Number of Pins
Pitch
A
L
E1
D
A1
E
A2
.016 .024
.118 BSC
.118 BSC
.000
.030
.193 TYP.
.033
MIN
p
n
Units
.026 BSC
NOM
8
INCHES
0.95 REF
-
-
.009
.016
0.08
0.22
0.23
0.40
MILLIMETERS*
0.65 BSC
0.85
3.00 BSC
3.00 BSC
0.60
4.90 BSC
.043
.031
.037
.006
0.40
0.00
0.75
MIN
MAX NOM
1.10
0.80
0.15
0.95
MAX
8
--
-
15°5° -
15°5° -
JEDEC Equivalent: MO-187
- 8°
5° -
-
15°
15°
--
--
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
2004-2013 Microchip Technology Inc. DS21896C-page 19
MCP1630/MCP1630V
8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated
L
E2
A3
A1
A
TOP VIEW
D
E
EXPOSED
PAD
METAL
D2
BOTTOM VIEW
2 1
b
p
n
(NOTE 1)
EXPOSED
TIE BAR
PIN 1
(NOTE 2)
ID INDEX
AREA
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package may have one or more exposed tie bars at ends.
.031
.000
.055
.047
.008
.012
A3Contact Thickness
Exposed Pad Length
Exposed Pad Width
Overall Length
Overall Width
Contact Width
Contact Length
(Note 3)
(Note 3)
b
L
E2
D2
E
D
Number of Pins
Pitch
Overall Height
Standoff
Dimension Limits
Units
p
A1
A
n
MIN
0.20 REF..008 REF.
.010
.016
.059
.079 BSC
.118 BSC
.065
.012
.061
.020
.067
1.50
1.65
2.00 BSC
3.00 BSC
0.25
0.40
0.20
0.30
1.20
1.39
0.30
0.50
1.55
1.70
MIN
.020 BSC
.001
.035
NOM
INCHES
8
.039
.002
MAX
0.90
MILLIMETERS*
0.50 BSC
0.020.00
0.80
NOM
0.05
1.00
MAX
8
2. REF: Reference Dimension, usually without tolerance, for information purposes only.
1. BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Exposed pad varies according to die attach paddle size.
Drawing No. C04-123, Revised 05-05-05
*Controlling Parameter
See ASME Y14.5M
See ASME Y14.5M
JEDEC equivalent: M0-229
Notes:
For DFN samples, contact your Microchip Sales Office for availability..
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
MCP1630/MCP1630V
DS21896C-page 20 2004-2013 Microchip Technology Inc.
NOTES:
2004-2013 Microchip Technology Inc. DS21896C-page 21
MCP1630/MCP1630V
APPENDIX A: REVISION HISTORY
Revision C (January 2013)
Added a note to each package outline drawing.
Revision B (June 2005)
The following is the list of modifications:
1. Added MCP1630V device information
throughout data sheet
2. Added DFN package information throughout
data sheet.
3. Added Appendix A: Revision History.
Revision A (June 2004)
Original Release of this Document.
MCP1630/MCP1630V
DS21896C-page 22 l 2004-2013 Microchip Technology Inc.
NOTES:
PART NO. IXX
2004-2013 Microchip Technology Inc. DS21896C-page 23
MCP1630/MCP1630V
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device: MCP1630: High-Speed, Microcontroller-Adaptable,
PWM
MCP1630T: High-Speed, Microcontroller-Adaptable,
PWM (Tape and Reel)
Temperature Range: E = -40°C to +125°C
Package: MC *= Dual Flat, No Lead (2x3mm Body), 8-lead
MS = Plastic MSOP, 8-lead
* For DFN samples, contact your Microchip Sales Office for
availability.
PART NO. X/XX
PackageTemperature
Range
Device
Examples:
a) MCP1630-E/MS: Extended Temperature,
8LD MSOP package.
b) MCP1630T-E/MS: Tape and Reel
Extended Temperature,
8LD MSOP package.
c) MCP1630-E/MC: Extended Temperature,
8LD DFN package.
a) MCP1630V-E/MS: Extended Temperature,
8LD MSOP package.
b) MCP1630VT-E/MS: Tape and Reel
Extended Temperature,
8LD MSOP package.
c) MCP1630V-E/MC: Extended Temperature,
8LD DFN package.
MCP1630/MCP1630V
DS21896C-page 24 2004-2013 Microchip Technology Inc.
NOTES:
YSTEM <2>
2004-2013 Microchip Technology Inc. DS21896C-page 25
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2004-2013, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620769140
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
6‘ ‘MICRDCHIP
DS21896C-page 26 2004-2013 Microchip Technology Inc.
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IC REG CTRLR MULT TOPOLOGY 8MSOP
IC REG CTRLR MULT TOPOLOGY 8MSOP
IC REG CTRLR MULT TOPOLOGY 8MSOP
IC REG CTRLR MULT TOPOLOGY 8DFN
IC REG CTRLR MULT TOPOLOGY 8MSOP
BOARD DEMO FOR MCP1630 LI-ION
BOARD DEMO MCP1630 BIAS SUPPLY
DEV REF DESIGN LED DVR MCP1630
IC REG CTRLR MULT TOPOLOGY 8MSOP
BOARD DEMO FOR MCP1630
BOARD DEMO FOR MCP1630
REFERENCE DESIGN FOR MCP1630
IC REG CTRLR MULT TOPOLOGY 8MSOP
IC REG CTRLR MULT TOPOLOGY 8DFN
IC REG CTRLR MULT TOPOLOGY 8DFN
BOARD DEMO BOOST AUTO INPUT
EVAL BOARD FOR MCP1630
BOARD CONV DEMO MCP1630 TRPL-OUT
REF DESIGN MCP1630V BI-DIR 4CELL
REF DESIGN MCP1630 NIMH BATT CHG
IC REG CTRLR MULT TOPOLOGY 8DFN
IC REG CTRLR MULT TOPOLOGY 8MSOP
HIGH SPEED PULSE WIDTH MODULATOR
HIGH SPEED PULSE WIDTH MODULATOR
HIGH SPEED PULSE WIDTH MODULATOR
IC REG CTRLR MULT TOPOLOGY 8MSOP