TC4426A-28A Datasheet by Microchip Technology

View All Related Products | Download PDF Datasheet
6‘ MICROCHIP
2002-2014 Microchip Technology Inc. DS20001423J-page 1
TC4426A/TC4427A/TC4428A
Features:
High Peak Output Current: 1.5A
Wide Input Supply Voltage Operating Range:
- 4.5V to 18V
High Capacitive Load Drive Capability: 1000 pF in
25 ns (typical)
Short Delay Times: 30 ns (typical)
Matched Rise, Fall and Delay Times
Low Supply Current:
- With Logic ‘1’ Input – 1 mA (typical)
- With Logic ‘0’ Input – 100 µA (typical)
Low Output Impedance: 7(typical)
Latch-Up Protected: Will Withstand 0.5A Reverse
Current
Input Withstands Negative Inputs Up to 5V
Electrostatic Discharge (ESD) Protected: 2 kV
Pin-compatible with TC426/TC427/TC428 and
TC4426/TC4427/TC4428
Space-saving 8-Pin MSOP and 8-Pin 6x5 DFN-S
Packages
Applications:
Switch Mode Power Supplies
Line Drivers
Pulse Transformer Drive
General Description:
The TC4426A/TC4427A/TC4428A are improved
versions of the earlier TC4426/TC4427/TC4428 family
of MOSFET drivers. In addition to matched rise and fall
times, the TC4426A/TC4427A/TC4428A devices have
matched leading and falling edge propagation delay
times.
These devices are highly latch-up resistant under any
conditions within their power and voltage ratings. They
are not subject to damage when up to 5V of noise
spiking (of either polarity) occurs on the Ground pin.
They can accept, without damage or logic upset, up to
500 mA of reverse current (of either polarity) being
forced back into their outputs. All terminals are fully
protected against Electrostatic Discharge (ESD) up
to 2 kV.
The TC4426A/TC4427A/TC4428A MOSFET drivers
can easily charge/discharge 1000 pF gate
capacitances in under 30 ns. These devices provide
low enough impedances in both the On and Off states
to ensure the MOSFET’s intended state will not be
affected, even by large transients.
Package Types
8-Pin 6x5 DFN-S*
NC
IN A
GND
IN B
1
2
3
4
NC
5
6
7
8
OUT A
OUT B
NC
IN A
GND
IN B VDD
NC
OUT A
OUT B
VDD
NC
OUT A
OUT B
VDD
NC
OUT A
OUT B
VDD
NC
OUT A
OUT B
VDD
NC
OUT A
OUT B
VDD
8-Pin MSOP/
PDIP/SOIC TC4426A
TC4427A TC4428A TC4427A
TC4426A TC4428A
1
2
3
4
8
7
6
5
EP
9
* Includes Exposed Thermal Pad (EP); see Table 3-1.
1.5A Dual High-Speed Power MOSFET Drivers
TC4426A/TC4427A/TC4428A
DS20001423J-page 2 2002-2014 Microchip Technology Inc.
Functional Block Diagram
Effective
Input C = 12 pF
(Each Input) TC4426A/TC4427A/TC4428A
Output
Input
GND
VDD
300 mV
4.7V
Inverting
Non-Inverting
Note 1: TC4426A has two inverting drivers, while the TC4427A has two non-inverting
drivers. The TC4428A has one inverting and one non-inverting driver.
2: Ground any unused driver input.
500 A
2002-2014 Microchip Technology Inc. DS20001423J-page 3
TC4426A/TC4427A/TC4428A
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
Supply Voltage ................................................................+22V
Input Voltage, IN A or IN B..........(VDD + 0.3V) to (GND – 5V)
Package Power Dissipation (TA +70°C)
DFN-S ..................................................................... Note 2
MSOP.....................................................................340 mW
PDIP .......................................................................730 mW
SOIC.......................................................................470 mW
† Notice: Stresses above those listed under “Absolute Maxi-
mum Ratings” may cause permanent damage to the device.
These are stress ratings only and functional operation of the
device at these or any other conditions above those indicated
in the operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V  VDD 18V.
Parameters Sym. Min. Typ. Max. Units Conditions
Input
Logic ‘1’, High Input
Voltage VIH 2.4 — — V
Logic ‘0’, Low Input Voltage VIL ——0.8V
Input Current IIN –1.0 +1.0 µA 0V VIN VDD
–10 — +10
Output
High Output Voltage VOH VDD – 0.025 V DC Test
Low Output Voltage VOL 0.025 V DC Test
Output Resistance RO—79IOUT = 10 mA, VDD = 18V, TA = +25°C
—710 0°CTA+70°C
—811 -40°CTA+85°C
—812 -40°CTA+125°C
Peak Output Current IPK —1.5AV
DD = 18V
Latch-Up Protection
Withstand Reverse Current IREV > 0.5 A Duty cycle 2%, t 300 µs
VDD = 18V
Switching Time (Note 1)
Rise Time tR—2535nsT
A = +25°C
—2740 0°CTA+70°C
—2940 -40°CTA+85°C
—3040 -40°CTA+125°C, Figure 4-1
Fall Time tF—2535nsT
A=+25°C
—2740 0°CTA+70°C
—2940 -40°CTA+85°C
—3040 -40°CTA+125°C, Figure 4-1
Delay Time tD1 —3035nsT
A=+25°C
—3340 0°CTA+70°C
—3545 -40°CTA+85°C
—3850 -40°CTA+125°C, Figure 4-1
Note 1: Switching times ensured by design.
2: Package power dissipation is dependent on the copper pad area on the PCB.
TC4426A/TC4427A/TC4428A
DS20001423J-page 4 2002-2014 Microchip Technology Inc.
Delay Time tD2 —3035nsT
A = +25°C
—3340 0°CTA+70°C
—3545 -40°CTA+85°C
—3850 -40°CTA+125°C, Figure 4-1
Power Supply
Power Supply Current IS—1.02.0mAV
IN = 3V (Both inputs)
—0.10.2 V
IN = 0V (Both inputs), VDD = 18V
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V VDD 18V.
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Specified Temperature Range (C) TA0—+70°C
Specified Temperature Range (E) TA-40 — +85 °C
Specified Temperature Range (V) TA-40 +125 °C
Maximum Junction Temperature TJ——+150°C
Storage Temperature Range TA-65 +150 °C
Package Thermal Resistances
Thermal Resistance, 8L-6x5 DFN-S JA —35.7 —°C/W
Thermal Resistance, 8L-MSOP JA —211 —°C/W
Thermal Resistance, 8L-PDIP JA —89.3 —°C/W
Thermal Resistance, 8L-SOIC JA — 149.5 °C/W
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V  VDD 18V.
Parameters Sym. Min. Typ. Max. Units Conditions
Note 1: Switching times ensured by design.
2: Package power dissipation is dependent on the copper pad area on the PCB.
operating range (e.q. outside specified power suppiy range) and ihereiore ouiside the warranted ranqe cL = 220a pF 2““ PF cL = 1509 pF cL = won [1F c - no pF CL. 5mm: cL=m pF
2002-2014 Microchip Technology Inc. DS20001423J-page 5
TC4426A/TC4427A/TC4428A
2.0 TYPICAL PERFORMANCE CURVES
Note: Unless otherwise indicated, over operating temperature range with 4.5V VDD 18V.
FIGURE 2-1: Rise Time vs. Supply
Voltage.
FIGURE 2-2: Delay Time vs. Input
Amplitude.
FIGURE 2-3: Rise and Fall Times vs.
Temperature.
FIGURE 2-4: Fall Time vs. Supply
Voltage.
FIGURE 2-5: Propagation Delay Time vs.
Supply Voltage.
FIGURE 2-6: Propagation Delay Time vs.
Temperature.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
5.0 7.5 10.0 12.5 15.0 17.5
0
20
40
60
80
100
T
A
= +25°C
V
DD
(V)
C
L
= 2200 pF
C
L
= 1500 pF
C
L
= 100 pF
C
L
= 1000 pF
C
L
= 470 pF
t
RISE
(nsec)
12 3 4 5 67 8 9
20
70
60
50
40
30
80
90
100
110
Delay Time (nsec)
Input Amplitude (V)
CL = 1000 pF
VDD = 10V
tD1
tD2
-100 -50 0 50 100 150
24
22
20
18
16
14
26
28
Time (nsec)
C
L
= 1000 pF
V
DD
= 18V
TEMPERATURE (
°
C)
t
FALL
t
RISE
5.0 7.5 10.0 12.5 15.0 17.5
0
20
40
60
80
100
CL= 100pF
T
A
= +25°C
V
DD
(V)
C
L
= 2200pF
C
L
= 2200 pF
C
L
= 1500 pF
C
L
= 100 pF
C
L
= 1000 pF
C
L
= 470 pF
t
FALL
(nsec)
0 5 10 15 20
50
45
40
35
30
25
20
55
60
Delay Time (nsec)
VDD (V)
CL = 1000 pF
tD1
tD2
15
20
25
30
35
40
Delay Time (nsec)
-100 -50 0 50 100 150
C
L
= 1000 pF
V
DD
= 18V
TEMPERATURE (°C)
t
D1
t
D2
TC4426A/TC4427A/TC4428A
DS20001423J-page 6 2002-2014 Microchip Technology Inc.
Note: Unless otherwise indicated, over operating temperature range with 4.5V VDD 18V.
FIGURE 2-7: High-State Output
Resistance.
FIGURE 2-8: Supply Current vs.
Frequency.
FIGURE 2-9: Supply Current vs.
Frequency.
FIGURE 2-10: Low-State Output
Resistance.
FIGURE 2-11: Supply Current vs.
Capacitive Load.
FIGURE 2-12: Supply Current vs.
Capacitive Load.
0 5 10 15 20
25
20
15
10
5
0
30
VDD
(V)
R
DS(ON)
(Ω)
T
A
= +125°C
T
A
= +25°C
0500 1000 1500 2000 2500
0
20
10
30
40
50
60
FREQUENCY (kHz)
I
SUPPLY (mA)
V
DD
= 18V
C
L
= 2200 pF C
L
= 1500 pF
C
L
= 1000 pF C
L
= 100 pF
FREQUENCY (kHz)
0500 1000 1500 2000 2500
70
60
50
40
30
20
10
0
80
I
SUPPLY
(mA)
V
DD
= 12V C
L
= 2200 pF
C
L
= 1500 pF
C
L
= 1000 pF
C
L
= 100 pF
0510 15 20
25
20
15
10
5
0
30
V
DD
(V)
R
DS(ON)
(Ω)
T
A
= +125°C
T
A
= +25°C
0500 1000 1500 2000 2500
0
20
10
30
40
50
60 2 MHz
VDD
= 18V
ISUPPLY
(mA)
C
LOAD
(pF)
900 kHz
600 kHz
200 kHz
20 kHz
0500 1000 1500 2000 2500
70
60
50
40
30
20
10
0
80
ISUPPLY (mA)
C
LOAD
(pF)
V
DD
= 12V
900 kHz
600 kHz
200 kHz
20 kHz
2 MHz
2002-2014 Microchip Technology Inc. DS20001423J-page 7
TC4426A/TC4427A/TC4428A
Note: Unless otherwise indicated, over operating temperature range with 4.5V VDD 18V.
FIGURE 2-13: Supply Current vs.
Frequency.
FIGURE 2-14: Quiescent Supply Current
vs. Voltage.
FIGURE 2-15: Supply Current vs.
Capacitive Load.
FIGURE 2-16: Quiescent Supply Current
vs. Temperature.
0500 1000 1500 2000 2500
30
25
20
15
10
5
0
35
40
FREQUENCY (kHz)
I
SUPPLY
(mA)
V
DD
= 6V C
L
= 2200 pF
C
L
= 1500 pF
C
L
= 1000 pF
C
L
= 100 pF
TA = 25°C
BOTH INPUTS = 1
0 5 10 15 20
800
700
600
500
400
200
100
0
300
900
IQUIESCENT (µA)
V
DD (V)
BOTH INPUTS = 0
0500 1000 1500 2000 2500
30
25
15
10
5
0
35
40
I
SUPPLY
(mA)
C
LOAD
(pF)
V
DD
= 6V
900 kHz
600 kHz
200 kHz
20 kHz
2 MHz
20
-100 -50 0 50 100 150
1000
900
800
700
600
400
300
200
100
0
500
1100
IQUIESCENT (µA)
TEMPERATURE (
°
C)
V
DD = 18V
BOTH INPUTS = 1
BOTH INPUTS = 0
TC4426A/TC4427A/TC4428A
DS20001423J-page 8 2002-2014 Microchip Technology Inc.
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
3.1 Inputs A and B (IN A, IN B)
MOSFET driver inputs A and B are high-impedance,
TTL/CMOS compatible inputs. These inputs also have
300 mV of hysteresis between the high and low
thresholds that prevents output glitching, even when
the rise and fall time of the input signal is very slow.
3.2 Ground (GND)
The Ground pin is the return path for both the bias
current and the high-peak current that discharges the
external load capacitance. The Ground pin should be
tied into a ground plane or have a very short trace to the
bias supply source return.
3.3 Output A and B (OUT A, OUT B)
MOSFET driver outputs A and B are low-impedance,
CMOS push-pull style outputs. The pull-down and
pull-up devices are of equal strength, making the rise
and fall times equivalent.
3.4 Supply Input (VDD)
The VDD input is the bias supply for the MOSFET driver
and is rated for 4.5V to 18V, with respect to the ground
pin. The VDD input should be bypassed with local
ceramic capacitors. The value of these capacitors
should be chosen based on the capacitive load that is
being driven.
3.5 Exposed Metal Pad (EP)
The exposed metal pad of the 6x5 DFN-S package is
not internally connected to any potential. Therefore,
this pad can be connected to a ground plane or other
copper plane on a printed circuit board, to aid in heat
removal from the package.
TABLE 3-1: PIN FUNCTION TABLE (Note 1)
PDIP, MSOP, SOIC 6x5 DFN-S Symbol Description
1 1 NC No connection
2 2 IN A Input A
3 3 GND Ground
4 4 IN B Input B
5 5 OUT B Output B
66V
DD Supply input
7 7 OUT A Output A
8 8 NC No connection
9 EP Exposed Metal Pad
Note 1: Duplicate pins must be connected for proper operation.
NH HHP‘
2002-2014 Microchip Technology Inc. DS20001423J-page 9
TC4426A/TC4427A/TC4428A
4.0 APPLICATIONS INFORMATION
FIGURE 4-1: Switching Time Test Circuit.
CL = 1000 pF
0.1 µF
4.7 µF
Inverting Driver
Non-Inverting Driver
Input
VDD = 18V
Input
Output
tD1 tF
tR
tD2
Input: 100 kHz,
square wave,
tRISE = tFALL 10 ns
Output
Input
Output
tD1 tF
tR
tD2
+5V
10%
90%
10%
90%
10%
90%
VDD
0V
90%
10%
10% 10%
90%
+5V
VDD
0V
0V
0V
90%
3
27
6
45
(TC4426A, ½ TC4428A)
(TC4427A, ½ TC4428A)
XXXXXXX XXXXXXX XXYYWW Q ‘8‘ x x XXXXXX YWWNNN O Q Q G W F”? F”? fl W F”? F”? fl 0442 PA 06‘ 08‘ Li LA LA LJ Ll LA LA LJ H H H H H H H H XXXXXXXX XXXXYYWW A 0% 0% HHHH HHHH NNN
TC4426A/TC4427A/TC4428A
DS20001423J-page 10 2002-2014 Microchip Technology Inc.
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
8-Lead DFN-S (6x5x0.9 mm) Example
PIN 1
NNN
PIN 1
TC4426A
EMF ^^
1330
256
8-Lead MSOP (3x3 mm) Example
4426AE
330256
8-Lead PDIP (300 mil) Example
XXXXXXXX
XXXXXNNN
YYWW
TC4427A
EPA ^^ 256
1330
3
e
8-Lead SOIC (3.90 mm) Example
NNN
TC2248AC
OA ^^ 330
256
3
e
\1\‘\.W//J/fl4/M\
2002-2014 Microchip Technology Inc. DS20001423J-page 11
TC4426A/TC4427A/TC4428A
 !"#
$
 
 
 
 
 
 
$ 

 
   
  
  
    
    
  
  
  
    
    
    
    
  
NOTE 2
A1
A
A3
NOTE 1 12
E
N
D
EXPOSED PAD
NOTE 1
21
E2
L
N
e
b
K
BOTTOM VIEW
TOP VIEW
D2
   
87Lead Plastic Dual Flat, No Lead Package (MF) , 6x5 mm Body [DFNES] T2 4—l‘<7 x1="" -_]uu[_'="" j="" 4800c?="" 4="" e=""><7 silk="" screen="" recommended="" land="" pattern="" note.="" this="" package="" may="" also="" be="" used="" with="" the="" 8l="" 501c="" (3="" 90="" mm)="" land="" pattern="" units="" millimeters="" dimension="" limits="" min="" \="" nom="" \="" max="" comact="" piicn="" e="" 1.27="" bsc="" optionai="" center="" pad="" widlh="" w2="" 2.40="" optionai="" center="" pad="" lengin="" t2="" 4.10="" comaci="" pad="" spacing="" c="" 5.50="" comact="" pad="" widin="" (xa)="" x1="" 0.45="" comact="" pad="" length="" (x3)="" y1="" 1.10="" notes="" 1="" dimensioning="" and="" tolerancing="" per="" asme="" v1a="" sm="" 550'="" basic="" dimenslcn="" theoreflcahy="" exact="" vaiue="" shown="" wllhom="" mlerances="" microchip="" tecnnoiogy="" drawing="" no="" 004-2122a="">
TC4426A/TC4427A/TC4428A
DS20001423J-page 12 2002-2014 Microchip Technology Inc.
$ 

8-Lead Plastic Micro Small Outline Fackage( ) [MSOF] I? 2X l—l aoon 0/2 '1}? m l H WW 1 E-I NX b d> 013®I-El mp VIEW A A2 I \ Q 0.10 C MHZ? SEATING PLANE M 7 SIDE VIEW 7 if SEE DETAIL c _ % _ _J END VIEW Mlcrochlp Technology Drawing coarmc SheeM 012
2002-2014 Microchip Technology Inc. DS20001423J-page 13
TC4426A/TC4427A/TC4428A
1RWH For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
8$
3-Lead Plastic Micro Small Outline Package ( ) [MSOP] SEATING PLANE DETAIL c Unlls MILLlMETERS Dlmenslon lells MIN NOM MAX Number oi Plns N | a l Pitch e 0.05 BSC Overall Height A . . 1.l0 Molded Package Thickness A2 0 75 0.55 0.95 standoii Al 0 00 . 0.l5 Overall Wldth E 4.90 BSC Molded Package wldih El 3.00 850 Overall Length D 3.00 BSC Fool Length L 0 40 | 0.60 l 0.50 Footprint Ll 0.95 REF FoolAngle w 0“ . a“ Lead Thickness e 0 00 . 0.23 Lead Width 0 0 22 . 0.40 NMEE: l Pm l vlsual Index ieatore may vary, hui must be located wllhln ihe hatched area 2 Dlmenslons D and El do not Include mold flash or prolruslons Mold flash or prolrusions shall not exceed 0.l5mm per side 3 Dimensloning and toleraneing per ASME YM 5M. BSC' Easlc Dlmenslon Theoretlcally exact Value shown wllhuul tolerances REF Refevence Dlmenslun. usually wllhom mlevance, hr Informallon purposes only Mlcmchlp Technology Drawlng c04-1110 Sheet 2 oiz
TC4426A/TC4427A/TC4428A
DS20001423J-page 14 2002-2014 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
UA
x_»‘ <_ elm:="" ’*="" ’="" ’="" ‘="" \="" silk="" .="" screen="" $11-.="" recommended="" land="" pattern="" umls="" m1ll1meters="" d1mens1on="" l1m1ls="" mw="" |="" nom="" |="" max="" contact="" pitch="" e="" 0.55="" 350="" comac!="" pad="" spacmg="" c="" 4="" a0="" oman="" wmm="" z="" 5.85="" contact="" pad="" width="" (x8)="" x1="" 0.45="" contact="" pad="" lenglh="" (x3)="" y1="" 1="" 45="" d1slance="" between="" pads="" g1="" 2="" 95="" d1slance="" between="" pads="" ex="" 0="" 20="" notes="" 1="" d1menslomng="" and="" memnclng="" per="" asme="" y|4.5m="" 855'="" 55519="" dimensmn="" theoyeucauy="" exact="" vame="" shown="" wmmm="" tolerances="" microcmp="" tecnnmogy="" drawmg="" no.="" cd472111a="">
2002-2014 Microchip Technology Inc. DS20001423J-page 15
TC4426A/TC4427A/TC4428A
8-Lead Plastic Micro Small Outline Package (UA) [MSOP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
TC4426A/TC4427A/TC4428A
DS20001423J-page 16 2002-2014 Microchip Technology Inc.
B
A
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1RWH
Microchip Technology Drawing No. C04-018D Sheet 1 of 2
/HDG3ODVWLF'XDO,Q/LQH3$PLO%RG\>3',3@
eB
E
A
A1
A2
L
8X b
8X b1
D
E1
c
C
3/$1(
.010 C
12
N
NOTE 1
TOP VIEW
END VIEWSIDE VIEW
e
2002-2014 Microchip Technology Inc. DS20001423J-page 17
TC4426A/TC4427A/TC4428A
Microchip Technology Drawing No. C04-018D Sheet 2 of 2
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1RWH
/HDG3ODVWLF'XDO,Q/LQH3$PLO%RG\>3',3@
Units INCHES
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e.100 BSC
Top to Seating Plane A - - .210
Molded Package Thickness A2 .115 .130 .195
Base to Seating Plane A1 .015
Shoulder to Shoulder Width E .290 .310 .325
Molded Package Width E1 .240 .250 .280
Overall Length D .348 .365 .400
Tip to Seating Plane L .115 .130 .150
Lead Thickness c.008 .010 .015
Upper Lead Width b1 .040 .060 .070
Lower Lead Width b.014 .018 .022
Overall Row Spacing eB - - .430
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
3.
1.
protrusions shall not exceed .010" per side.
2.
4.
Notes:
§
--
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
Pin 1 visual index feature may vary, but must be located within the hatched area.
§ Significant Characteristic
Dimensioning and tolerancing per ASME Y14.5M
e
DATUM A DATUM A
e
b
e
2
b
e
2
ALTERNATE LEAD DESIGN
(VENDOR DEPENDENT)
8-Lead Plastic Small Outline (0A) - Narrow, 3.90 mm Body [SOIC] NOTE E _ i . 2x N/z TlPS 4» <7an '3="" top="" view="" a=""><— 0="" m="" 7="" 7="" seating="" plane="" 3="" g‘«="" side="" view="" view="" a-a="" mlcrochlp="" technology="" drawmg="" no="" cowsm="" sheet="" 1="" or="" 2="">
TC4426A/TC4427A/TC4428A
DS20001423J-page 18 2002-2014 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
8-Lead Plastic Small Outline (0A) - Narrow, 3.90 mm Body [SOIC] Unlls MILLlMETERS Dlmenslorl lells MIN l NOM | MAX Number 01 Pins N B Pitch e 1 27 BSC Overall Helght A - - 1 75 Molded Package Thickness A2 1.25 . . Slandofl § Al 0.10 . 0.25 Overall wldih E 6.00 BSC Molded Package Wldlh E1 3 90 850 Overall Lenglh D 4 E30 BSC Chamler (Oplianal) h 0.25 . 0.50 Fool Length L 0.40 . 1.27 Footprint L‘l l 04 REF Foot Angle 0 0° . a" Lead Thlnkness C D 17 - Cl 25 Lead Wldlh b D 31 - O 51 Mold Draft Angle Top or 5° . 15° Mold Dran Angle Bollum 5 5° . 15“ Nukes: 1 Pm 1 Vlsual Index fealure may vary,butmu51helocaled wllhln the hatched area 2 §Slgnilicam Characterlsllc 3 DlmenSlons D and El do not include mold llash or proimsrdns Mold llash or prclruslorls shall not exceed 0 15mm per side 4 DlmenSloning and lolerancing per ASME Y14.5M Bsc Basic Dlmenslon. Theoretically exact value shown wilhoul tolerances. REF' Reierence Drmensron, usually wlthoul tolerance. for lniormailon purposes only Microchip Technology Drawmg No c04-057c Sheel 2 ol 2
2002-2014 Microchip Technology Inc. DS20001423J-page 19
TC4426A/TC4427A/TC4428A
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
8-Lead Plastic Small Outline (0A) — Narrow, 3.90 mm Bady [SOIC] 4-1 E / SILK SCREEN M: l LJKJLJ _.l «m RECOMMENDED LAND PATTERN Umls MlLLIMETERS Dlmensmn lells MN | NOM | MAX Comm Pm E 1 27 BSC Comm Fad Spacing c 5 4a Conlact Fad wmm (X8) x1 0 60 Contact Pad Lengm (X8) w 1 55 Noles 1 Dlmensloning and mlerancing per ASME Y14.5M BSC Baslc Dlmenslon Theoretlcally exact value shown wilhoul tolerances Mlcmchlp Technology Drawmg No 004720st
TC4426A/TC4427A/TC4428A
DS20001423J-page 20 2002-2014 Microchip Technology Inc.
"%&%'(()*+,- !"%./#
$ 

2002-2014 Microchip Technology Inc. DS20001423J-page 21
TC4426A/TC4427A/TC4428A
APPENDIX A: REVISION HISTORY
Revision J (July 2014)
The following is the list of modifications:
1. Updated Figure 4-1.
Revision H (September 2013)
The following is the list of modifications:
1. Changed ESD protection value to 2 kV on the
Features page.
2. Updated the package specification drawings in
Section 5.0 “Packaging Information”, to
show all views available.
3. Minor typographical corrections.
TC4426A/TC4427A/TC4428A
DS20001423J-page 22 2002-2014 Microchip Technology Inc.
NOTES:
PART NO. X ><>< x="" 4'="" 41x="">
2002-2014 Microchip Technology Inc. DS20001423J-page 23
TC4426A/TC4427A/TC4428A
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device: TC4426A: 1.5A Dual MOSFET Driver, Inverting
TC4427A: 1.5A Dual MOSFET Driver, Non-Inverting
TC4428A: 1.5A Dual MOSFET Driver, Complementary
Temperature Range: C = 0°C to +70°C (PDIP & SOIC Only)
E = -40°C to +85°C
V = -40ºC to +125°C
Package: MF = Dual, Flat, No-Lead (6X5 mm Body), 8-lead
MF713 = Dual, Flat, No-Lead (6X5 mm Body), 8-lead
(Tape and Reel)
OA = Plastic SOIC, (150 mil Body), 8-lead
OA713 = Plastic SOIC, (150 mil Body), 8-lead
(Tape and Reel)
PA = Plastic DIP (300 mil Body), 8-lead
UA = Plastic Micro Small Outline (MSOP), 8-lead
UA713 = Plastic Micro Small Outline (MSOP), 8-lead
(Tape and Reel)
Examples:
a) TC4426ACOA: 1.5A Dual Inverting
MOSFET driver,
0°C to +70°C,
8LD SOIC package.
b) TC4426AEOA: 1.5A Dual Inverting
MOSFET driver,
-40°C to +85°C,
8LD SOIC package.
c) TC4426AEMF: 1.5A Dual Inverting
MOSFET driver,
-40°C to +85°C,
8LD DFN-S package.
a) TC4427ACPA: 1.5A Dual Non-Inverting
MOSFET driver,
0°C to +70°C,
8LD PDIP package.
b) TC4427AEPA: 1.5A Dual Non-Inverting
MOSFET driver,
-40°C to +85°C,
8LD PDIP package.
c) TC4427AVMF713: 1.5A Dual Non-Inverting
MOSFET driver,
-40°C to +125°C,
8LD DFN-S package,
Tape and Reel.
a) TC4428AEPA: 1.5A Dual Complementary
MOSFET driver,
-40°C to +85°C,
8LD PDIP package.
b) TC4428ACOA713: 1.5A Dual Complementary
MOSFET driver,
0°C to +70°C
8LD SOIC package,
Tape and Reel.
c) TC4428AVMF: 1.5A Dual Complementary
MOSFET driver,
-40°C to +125°C,
8LD DFN-S package.
PART NO. XXX
PackageTemperature
Range
Device
XXX
Tape & Reel
X
PB Free
TC4426A/TC4427A/TC4428A
DS20001423J-page 24 2002-2014 Microchip Technology Inc.
NOTES:
YSTEM
2002-2014 Microchip Technology Inc. DS20001423J-page 25
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2002-2014, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-63276-361-7
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
6‘ ‘MICRDCHIP
DS20001423J-page 26 2002-2014 Microchip Technology Inc.
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Austin, TX
Tel: 512-257-3370
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
ASIA/PACIFIC
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Dusseldorf
Tel: 49-2129-3766400
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Pforzheim
Tel: 49-7231-424750
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Poland - Warsaw
Tel: 48-22-3325737
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Worldwide Sales and Service
03/25/14

Products related to this Datasheet

IC GATE DRVR LOW-SIDE 8SOIC
IC GATE DRVR LOW-SIDE 8SOIC
IC GATE DRVR LOW-SIDE 8SOIC
IC GATE DRVR LOW-SIDE 8SOIC
IC GATE DRVR LOW-SIDE 8MSOP
IC GATE DRVR LOW-SIDE 8MSOP
IC GATE DRVR LOW-SIDE 8SOIC
IC GATE DRVR LOW-SIDE 8SOIC
IC GATE DRVR LOW-SIDE 8SOIC
IC GATE DRVR LOW-SIDE 8SOIC
IC GATE DRVR LOW-SIDE 8SOIC
IC GATE DRVR LOW-SIDE 8DIP
IC GATE DRVR LOW-SIDE 8DIP
IC GATE DRVR LOW-SIDE 8DIP
IC GATE DRVR LOW-SIDE 8SOIC
IC GATE DRVR LOW-SIDE 8SOIC
IC GATE DRVR LOW-SIDE 8DIP
IC GATE DRVR LOW-SIDE 8SOIC
IC GATE DRVR LOW-SIDE 8DIP
IC GATE DRVR LOW-SIDE 8SOIC
IC GATE DRVR LOW-SIDE 8SOIC
IC GATE DRVR LOW-SIDE 8MSOP
IC GATE DRVR LOW-SIDE 8DIP
IC GATE DRVR LOW-SIDE 8DIP
IC GATE DRVR LOW-SIDE 8SOIC
IC GATE DRVR LOW-SIDE 8SOIC
IC GATE DRVR LOW-SIDE 8MSOP
IC GATE DRVR LOW-SIDE 8SOIC
IC GATE DRVR LOW-SIDE 8SOIC
IC GATE DRVR LOW-SIDE 8MSOP