LQG15HSyyyy02D Series Spec Datasheet by Murata Electronics

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SQeC Na JELF24SBVOOI 05701
Spec No. JELF243B-0010S-01 P.1/11
MURATA MFG.CO., LTD
Reference Only
CHIP COIL (CHIP INDUCTORS) LQG15HS□□□□02D REFERENCE SPECIFICATION
1. Scope
This reference specification applies to LQG15HS_02 series, for Chip Coil (Chip Inductors).
2. Part Numbering
(ex) LQ G 15 H S 1N0 S 0 2 D
Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging
(L×W) and D:Taping
Characteristics *B:BULK
*Bulk packing (B) also available
3. Rating
Operating Temperature Range –55°C to +125°C
Storage Temperature Range –55°C to +125°C
Customer
Part Number
MURATA
Part Number
Inductance
(nH) Tolerance Q
(min.)
DC
Resistance
(Ω max. )
Self Resonant
Frequency
(MHz min. )
Rated
Current
(mA)
LQG15HS1N0B02D
1.0
B:±0.1nH
C:±0.2nH
S:±0.3nH 8
0.07
10000
1000
LQG15HS1N0C02D
LQG15HS1N0S02D
LQG15HS1N1B02D
1.1
6000
LQG15HS1N1C02D
LQG15HS1N1S02D
LQG15HS1N2B02D
1.2
LQG15HS1N2C02D
LQG15HS1N2S02D
LQG15HS1N3B02D
1.3
LQG15HS1N3C02D
LQG15HS1N3S02D
LQG15HS1N5B02D
1.5
LQG15HS1N5C02D
LQG15HS1N5S02D
LQG15HS1N6B02D
1.6
LQG15HS1N6C02D
LQG15HS1N6S02D
LQG15HS1N8B02D
1.8 0.08 950
LQG15HS1N8C02D
LQG15HS1N8S02D
LQG15HS2N0B02D
2.0
0.09 900
LQG15HS2N0C02D
LQG15HS2N0S02D
LQG15HS2N2B02D
2.2
LQG15HS2N2C02D
LQG15HS2N2S02D
LQG15HS2N4B02D
2.4 0.11 850
LQG15HS2N4C02D
LQG15HS2N4S02D
LQG15HS2N7B02D
2.7 0.12
800
LQG15HS2N7C02D
LQG15HS2N7S02D
LQG15HS3N0B02D
3.0
0.125
LQG15HS3N0C02D
LQG15HS3N0S02D
LQG15HS3N3B02D
3.3
LQG15HS3N3C02D
LQG15HS3N3S02D
LQG15HS3N6B02D
3.6 0.14 750
LQG15HS3N6C02D
LQG15HS3N6S02D
SQeC Na JELF24SBVOOI 05701
Spec No. JELF243B-0010S-01 P.2/11
MURATA MFG.CO., LTD
Reference Only
Customer
Part Number
MURATA
Part Number
Inductance
(nH) Tolerance Q
(min.)
DC
Resistance
(Ω max. )
Self Resonant
Frequency
(MHz min. )
Rated
Current
(mA)
LQG15HS3N9B02D
3.9
B:±0.1nH
C:±0.2nH
S:±0.3nH
8
0.14
6000
750
LQG15HS3N9C02D
LQG15HS3N9S02D
LQG15HS4N3B02D
4.3
LQG15HS4N3C02D
LQG15HS4N3S02D
LQG15HS4N7B02D
4.7 0.16 700
LQG15HS4N7C02D
LQG15HS4N7S02D
LQG15HS5N1B02D
5.1
0.18
5300
650
LQG15HS5N1C02D
LQG15HS5N1S02D
LQG15HS5N6B02D
5.6
4500
LQG15HS5N6C02D
LQG15HS5N6S02D
LQG15HS6N2B02D
6.2 0.20
600
LQG15HS6N2C02D
LQG15HS6N2S02D
LQG15HS6N8G02D
6.8
G:±2%
H:±3%
J:±5%
0.22
LQG15HS6N8H02D
LQG15HS6N8J02D
LQG15HS7N5G02D
7.5
0.24
4200
550
LQG15HS7N5H02D
LQG15HS7N5J02D
LQG15HS8N2G02D
8.2 3700
LQG15HS8N2H02D
LQG15HS8N2J02D
LQG15HS9N1G02D
9.1
0.26 3400
500
LQG15HS9N1H02D
LQG15HS9N1J02D
LQG15HS10NG02D
10
LQG15HS10NH02D
LQG15HS10NJ02D
LQG15HS12NG02D
12 0.28 3000
LQG15HS12NH02D
LQG15HS12NJ02D
LQG15HS15NG02D
15 0.32 2500 450
LQG15HS15NH02D
LQG15HS15NJ02D
LQG15HS18NG02D
18 0.36 2200 400
LQG15HS18NH02D
LQG15HS18NJ02D
LQG15HS22NG02D
22 0.42 1900
350
LQG15HS22NH02D
LQG15HS22NJ02D
LQG15HS27NG02D
27 0.46 1700
LQG15HS27NH02D
LQG15HS27NJ02D
LQG15HS33NG02D
33 0.58 1600
LQG15HS33NH02D
LQG15HS33NJ02D
LQG15HS39NG02D
39 0.65 1200 300
LQG15HS39NH02D
LQG15HS39NJ02D
SQeC Na JELF24SBVOOI 05701 Electrode F I
Spec No. JELF243B-0010S-01 P.3/11
MURATA MFG.CO., LTD
Reference Only
Customer
Part Number
MURATA
Part Number
Inductance
(nH) Tolerance Q
(min.)
DC
Resistance
(Ω max. )
Self Resonant
Frequency
(MHz min. )
Rated
Current
(mA)
LQG15HS47NG02D
47
G:±2%
H:±3%
J:±5%
8
0.72 1000 300
LQG15HS47NH02D
LQG15HS47NJ02D
LQG15HS56NG02D
56 0.82 800 250
LQG15HS56NH02D
LQG15HS56NJ02D
LQG15HS68NG02D
68 0.92 800 250
LQG15HS68NH02D
LQG15HS68NJ02D
LQG15HS82NG02D
82 1.20 700
200
LQG15HS82NH02D
LQG15HS82NJ02D
LQG15HSR10G02D
100 1.25
600
LQG15HSR10H02D
LQG15HSR10J02D
LQG15HSR12G02D
120 1.30
LQG15HSR12H02D
LQG15HSR12J02D
LQG15HSR15G02D
150 2.99 550
150
LQG15HSR15H02D
LQG15HSR15J02D
LQG15HSR18G02D
180 3.38 500
LQG15HSR18H02D
LQG15HSR18J02D
LQG15HSR22G02D
220 3.77 450 120
LQG15HSR22H02D
LQG15HSR22J02D
LQG15HSR27G02D
270 4.94 400 110
LQG15HSR27H02D
LQG15HSR27J02D
4. Testing Conditions
Unless otherwise specified In case of doubt
Temperature : Ordinary Temperature / 15°C to 35°C Temperature : 20°C ± 2°C
Humidity : Ordinary Humidity / 25%(RH) to 85%(RH) Humidity : 60%(RH) to 70%(RH)
Atmospheric Pressure : 86kPa to 106 kPa
5. Appearance and Dimensions
Unit Mass (Typical value)
0.001g
(in mm)
Electrode
Polarity Marking
1.0±0.05
0.5±0.05
0.25±0.1
0.5±0.0.5
0.5±0.05
$95!: No. JELF24SBVOO‘ 05701 0U© . 7. Mechanical Performance
Spec No. JELF243B-0010S-01 P.4/11
MURATA MFG.CO., LTD
Reference Only
6. Electrical Performance
No. Item Specification Test Method
6.1
Inductance Inductance shall meet item 3. Measuring Equipment:
KEYSIGHT E4991A or equivalent
Measuring Frequency: 100MHz
Measuring Condition:
Test signal level/ about 0dBm
Electrode spaces / 0.5mm
Electricallength/ 10mm
Weight/about 1N to 5N
Measuring Fixture: KEYSIGHT 16197A
Position coil under test as shown in below and
contact coil with each terminal by adding weight.
Polarity marking should be a topside,and polarity
marking should be in the direction of the fixture
for position of chip coil.
Measuring Method: the endnote
[Electrical Performance:Measuring Method of
Inductance/ Q]
6.2
Q Q shall meet item 3.
6.3 DC Resistance DC Resistance shall meet item 3. Measuring Equipment: Digital multi meter
6.4 Self Resonant
Frequency
(S.R.F)
S.R.F shall meet item 3. Measuring Equipment:
KEYSIGHT 8753C or equivalent
6.5 Rated Current Self temperature rise shall be
limited to 25°C max. The rated current is applied.
7. Mechanical Performance
No. Item Specification Test Method
7.1 Shear Test Chip coil shall not be damaged
after tested as test method. Substrate: Glass-epoxy substrate
(in mm)
Force: 5N
Hold Duration: 5s±1s
Applied Direction: Parallel to PCB
7.2 Bending Test Chip coil shall not be damaged
after tested as test method. Substrate: Glass-epoxy substrate
(100mm×40mm×0.8mm)
Speed of Applying Force: 1mm / s
Deflection: 2mm
Hold Duration: 30s
(in mm)
45
R340
F
Deflection
45 Product
Pressure jig
Polarity Marking
0.5mm
11.5mm
Land
0.4 0.55
0.55
0.5
F
Chip Coil
Substrate
Reference Only SQeC Na JELF24SBVOOI 05701 \_/‘\ 4% W W m LT” m 4 LLH |'|_Y‘|'| 4% H:H
Spec No. JELF243B-0010S-01 P.5/11
MURATA MFG.CO., LTD
Reference Only
No. Item Specification Test Method
7.3 Vibration Appearance: No damage
Inductance Change: within ±10% Oscillation Frequency:
10Hz to 55Hz to 10Hz for 1 min
Total Amplitude: 1.5mm
Testing Time: A period of 2 hours in each of
3 mutually perpendicular directions.
7.4 Solderability The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C / 60s to 90s
Solder Temperature: 240°C±5°C
Immersion Time: 3s±1s
7.5 Resistance to
Soldering Heat Appearance: No damage
Inductance Chang
e: within ±10%
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C / 1 min to 2 min
Solder Temperature: 270°C±5°C
Immersion Time: 10s±1s
Then measured after exposure in the room
condition for 24h±2h.
8. Environmental Performance
It shall be soldered on the substrate.
No. Item Specification Test Method
8.1 Humidity Appearance: No damage
Inductance Change: within ±10%
Temperature: 40°C±2°C
Humidity: 90%(RH) to 95%(RH)
Time: 1000h (+48h,-0h)
Then measured after exposure in the room
condition for 24h±2h.
8.2 Heat Life Temperature: 125°C±2°C
Current: Rated Current (See the 3.)
Time: 1000h (+48h, -0h)
Then measured after exposure in the room
condition for 24h±2h.
8.3 Humidity Load Temperature: 40°C±2°C
Humidity: 90%(RH) to 95%(RH)
Current: Rated Current (See the 3.)
Time: 1000h (+48h, -0h)
Then measured after exposure in the room
condition for 24h±2h.
8.4 Temperature
Cycle 1 cycle:
1 step: -55°C (+0°C, -3°C) / 30 min±3 min
2 step: Ordinary temp. / 2 min to 3 min
3 step: +125°C (+3°C, -0°C) / 30 min±3 min
4 step: Ordinary temp. / 2 min to 3 min
Total of 10 cycles
Then measured after exposure in the room
condition for 24h±2h.
9. Specification of Packaging
9.1 Appearance and Dimensions of paper tape (8mm-wide)
(in mm)
0.62±0.04
1.12±0.04
2.0±0.052.0±0.05 4.0±0.1
φ
1.
3.5±0.05
8.0±0.2
0.8max.
0.1
0
Direction of feed
Polarity marking
1.75±0.1
SQeC NG.JELF24SB'00105701 0000 XXX
Spec No. JELF243B-0010S-01 P.6/11
MURATA MFG.CO., LTD
Reference Only
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
10,000 pcs. / reel
(2) Packing Method
Products shall be packed in the cavity of the base tape and sealed by top tape and bottom tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Base tape and Top tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater,
and are not continuous. The Specified quantity per reel is kept.
9.3 Pull Strength
Top tape 5N min.
Bottom tape
9.4 Peeling off force of cover tape
Speed of Peeling off 300mm / min
Peeling off force 0.1N to 0.6N
(minimum value is typical)
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows.
(in mm)
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number (1), RoHS marking (2),
Quantity etc ・・・
1) <Expression of Inspection No.> □□ OOOO 
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) <Expression of RoHS marking > ROHS Y ()
(1) (2)
(1)
RoHS regulation conformity parts.
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (2), Quantity, etc ・・・
F
165 to 180 degree Top tape
Bottom tape Base tape
Empty tape
190 min.
Leader
Trailer
2.0±0.5
13.0±0.2
21.0±0.8
180
60
9.0
13.0±1.4
+1
-
0
+0
-3
Direction of feed
210 min.
160 min.
Top tape
+1
-0
Label
Reference Only SQec Na. JELF243B7001 05701 O J
Spec No. JELF243B-0010S-01 P.7/11
MURATA MFG.CO., LTD
Reference Only
9.8. Specification of Outer Case
Outer Case Dimensions
(mm) Standard Reel Quantity
in Outer Case (Reel)
W D H
186 186 93 5
・・
10. Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment (8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
11. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
Please check the mounting condition before using.
Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products
may lead to pick up errors, misalignment, or damage to the product.
11.1 Land pattern designing
a 0.4
b 1.2
c 0.5
(in mm)
11.2 Flux, Solder
Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
Use Sn-3.0Ag-0.5Cu solder.
Standard thickness of solder paste : 100μm to 150μm.
a
b
Chip Coil Land Solder Resist
c
W
D
Label
H
Above Outer Case size is typical. It depends on a quantity of an order.
Reference Only SQeC Na JELF24SBVOOI 05701
Spec No. JELF243B-0010S-01 P.8/11
MURATA MFG.CO., LTD
Reference Only
11.3 Reflow soldering conditions
Inductance value may be changed a little due to the amount of solder.
So, the chip coil shall be soldered by reflow so that the solder volume can be controlled.
Pre-heating should be in such a way that the temperature difference between solder and product surface is
limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature
difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the
deterioration of product quality.
Reflow soldering profile
Standard Profile Limit Profile
Pre-heating 150°C180°C, 90s±30s
Heating above 220°C, 30s60s above 230°C, 60s max.
Peak temperature 245°C±3°C 260°C, 10s
Cycle of reflow 2 times 2 times
11.4 Reworking with soldering iron
The following conditions must be strictly followed when using a soldering iron.
Pre-heating 150°C, 1 min
Tip temperature 350°C max.
Soldering iron output 80W max.
Tip diameter φ3mm max.
Soldering time 3(+1, -0)s
Time 2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the
crack on the products due to the thermal shock.
11.5 Solder Volume
Solder shall be used not to be exceed the upper limits as shown below.
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
1/3TtT
Tthickness of product
Upper Limit
Recommendable
t
Limit Profile
Standard Profile
90s±30s
230℃
260
245±3
220
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
SQeC No. JELF243 010801 ’1A>Dl5v llaCuttingD (3) Mounting Co wnen a eprnpd tne tigntenlng p ©D:|]->D:|] chew Hole Rem) 11.7 Cleaning Conditions Producis shall be cleaned on the lollo (1) Cleaning ternperature shall be llnr (2) Ulilasonlc cleaning shall epnrply mounted produels and P.C.E. Power : 20 w (3) Cleaner 1. Alcohol type eleaner lsopropyl alcohol UP 2. Aqueous agenl PlNE ALPHA S‘MO (4) There snall be no residual llux a shall be dried eprnplelely after n (5) Other cleaning Please eontac
Spec No. JELF243B-0010S-01 P.9/11
MURATA MFG.CO., LTD
Reference Only
11.6 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
Products direction
Products shall be located in the sideways
direction (Length:ab) to the mechanical
stress.
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation surface. A > C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the
mounted products and P.C.B.
Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max.
(3) Cleaner 1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products
shall be dried completely after rinse with de-ionized water in order to remove the cleaner.
(5) Other cleaning Please contact us.
Poor example
Good example
b
a
Perforation
Slit
A
B
C
D
Screw Hole Recommend
Sgec Nu. JELF243B-001 05-01
Spec No. JELF243B-0010S-01 P.10/11
MURATA MFG.CO., LTD
Reference Only
11.8 Resin coating
The inductance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating/molding products. So please pay your careful attention when you select resin.
In prior to use, please make the reliability evaluation with the product mounted in your application set.
11.9 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
11.10 Storage and Handing Requirements
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature -10°C to 40°C
Humidity
15% to 85% relative humidity No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of
electrode, resulting in poor solderability.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be stored under the airtight packaged condition.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
12
!
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
Reference Only
Spec No. JELF243B-0010S-01 P.11/11
MURATA MFG.CO., LTD
Reference Only
(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.
V
1 A B V
2
I 1 C D I
2
(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.
V
1 V
2
I
1 I 2
(3) Thus,the relation between Zx and Zm is following;
Zm-β where, α= D / A =1
1-ZmΓ β= B / D =Zsm-(1-Yom Zsm)Zss
Γ= C / A =Yom
Zsm:measured impedance of short chip
Zss:residual impedance of short chip (0nH)
Yom:measured admittance when opening the fixture
(4) Lx and Qx shall be calculated with the following equation.
Im(Zx) Im(Zx) Lx :Inductance of chip coil
2πf Re(Zx) Qx:Q of chip coil
f :Measuring frequency
=
Zm= Zx=
Zx=
Lx= Qx=
AB
CD
Zm Zx
V
12
12
ProductTest fixtureTest Head
II
V
<Electrical Performance:Measuring Method of Inductance/Q>

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FIXED IND 180NH 150MA 3.38 OHM
FIXED IND 220NH 120MA 3.77 OHM
FIXED IND 270NH 110MA 4.94 OHM
FIXED IND 1NH 1A 70 MOHM SMD
FIXED IND 1.2NH 1A 90 MOHM
FIXED IND 1.5NH 1A 100 MOHM
FIXED IND 1.8NH 950MA 100 MOHM
FIXED IND 2.2NH 900MA 120 MOHM
FIXED IND 2.7NH 800MA 150 MOHM
FIXED IND 3.3NH 800MA 170 MOHM
FIXED IND 3.9NH 750MA 180 MOHM
FIXED IND 4.7NH 700MA 180 MOHM
FIXED IND 5.6NH 650MA 200 MOHM
FIXED IND 6.2NH 600MA 220 MOHM
FIXED IND 6.8NH 600MA 240 MOHM
FIXED IND 8.2NH 550MA 240 MOHM
FIXED IND 10NH 500MA 260 MOHM
FIXED IND 12NH 500MA 280 MOHM
FIXED IND 15NH 450MA 320 MOHM
FIXED IND 18NH 400MA 360 MOHM
FIXED IND 22NH 350MA 420 MOHM
FIXED IND 27NH 350MA 460 MOHM
FIXED IND 33NH 350MA 580 MOHM
FIXED IND 39NH 300MA 650 MOHM
FIXED IND 47NH 300MA 720 MOHM
FIXED IND 56NH 250MA 820 MOHM
FIXED IND 68NH 250MA 920 MOHM
FIXED IND 82NH 200MA 1.2 OHM SMD
FIXED IND 100NH 200MA 1.25 OHM
FIXED IND 120NH 200MA 1.3 OHM
FIXED IND 150NH 150MA 2.99 OHM
FIXED IND 180NH 150MA 3.38 OHM
FIXED IND 220NH 120MA 3.77 OHM
FIXED IND 270NH 110MA 4.94 OHM
FIXED IND 7.5NH 550MA 240 MOHM
FIXED IND 7.5NH 550MA 240 MOHM
FIXED IND 10NH 500MA 260 MOHM
FIXED IND 12NH 500MA 280 MOHM
FIXED IND 47NH 300MA 720 MOHM
FIXED IND 68NH 250MA 920 MOHM
FIXED IND 7.5NH 550MA 240 MOHM
FIXED IND 5.6NH 650MA 200 MOHM
FIXED IND 2.2NH 900MA 120 MOHM
FIXED IND 5.1NH 650MA 200 MOHM
FIXED IND 2NH 900MA 100 MOHM SMD
FIXED IND 22NH 350MA 420 MOHM
FIXED IND 120NH 200MA 1.3 OHM
FIXED IND 33NH 350MA 580 MOHM
FIXED IND 8.2NH 550MA 240 MOHM
FIXED IND 180NH 150MA 3.38 OHM
FIXED IND 56NH 250MA 820 MOHM
FIXED IND 2.7NH 800MA 150 MOHM
FIXED IND 18NH 400MA 360 MOHM
FIXED IND 15NH 450MA 320 MOHM
FIXED IND 1.2NH 1A 90 MOHM
FIXED IND 1.5NH 1A 100 MOHM
FIXED IND 4.7NH 700MA 180 MOHM
FIXED IND 6.2NH 600MA 220 MOHM
FIXED IND 1.8NH 950MA 100 MOHM
FIXED IND 6.8NH 600MA 240 MOHM
FIXED IND 220NH 120MA 3.77 OHM
FIXED IND 150NH 150MA 2.99 OHM
FIXED IND 270NH 110MA 4.94 OHM
FIXED IND 3.3NH 800MA 170 MOHM
FIXED IND 100NH 200MA 1.25 OHM
FIXED IND 1NH 1A 70 MOHM SMD
FIXED IND 3.9NH 750MA 180 MOHM
FIXED IND 82NH 200MA 1.2 OHM SMD
FIXED IND 39NH 300MA 650 MOHM
FIXED IND 27NH 350MA 460 MOHM
FIXED IND 1.1NH 1A 90 MOHM
FIXED IND 1.3NH 1A 90 MOHM
FIXED IND 1.6NH 1A 100 MOHM
FIXED IND 2.4NH 850MA 150 MOHM
FIXED IND 3NH 800MA 125 MOHM SMD
FIXED IND 3.6NH 750MA 180 MOHM
FIXED IND 4.3NH 750MA 180 MOHM
FIXED IND 9.1NH 500MA 260 MOHM
FIXED IND 1.1NH 1A 90 MOHM
FIXED IND 1.3NH 1A 90 MOHM
FIXED IND 2NH 900MA 100 MOHM SMD
FIXED IND 3NH 800MA 125 MOHM SMD
FIXED IND 3.6NH 750MA 180 MOHM
FIXED IND 4.3NH 750MA 180 MOHM
FIXED IND 5.1NH 650MA 200 MOHM
FIXED IND 1.1NH 1A 90 MOHM
FIXED IND 1.3NH 1A 90 MOHM
FIXED IND 2NH 900MA 100 MOHM SMD
FIXED IND 3NH 800MA 125 MOHM SMD
FIXED IND 3.6NH 750MA 180 MOHM
FIXED IND 4.3NH 750MA 180 MOHM
FIXED IND 5.1NH 650MA 200 MOHM
FIXED IND 1.6NH 1A 100 MOHM
FIXED IND 2.4NH 850MA 150 MOHM
FIXED IND 9.1NH 500MA 260 MOHM
FIXED IND 1.6NH 1A 100 MOHM
FIXED IND 2.4NH 850MA 150 MOHM
FIXED IND 9.1NH 500MA 260 MOHM
FIXED IND 10NH 500MA 260 MOHM
FIXED IND 12NH 500MA 280 MOHM
FIXED IND 15NH 450MA 320 MOHM
FIXED IND 18NH 400MA 360 MOHM
FIXED IND 1NH 1A 70 MOHM
FIXED IND 1.1NH 1A 70 MOHM
FIXED IND 1.2NH 1A 70 MOHM
FIXED IND 1.3NH 1A 70 MOHM
FIXED IND 1.5NH 1A 70 MOHM
FIXED IND 1.6NH 1A 70 MOHM
FIXED IND 1.8NH 950MA 80 MOHM
FIXED IND 22NH 350MA 420 MOHM
FIXED IND 27NH 350MA 460 MOHM
FIXED IND 2NH 900MA 90 MOHM
FIXED IND 2.2NH 900MA 90 MOHM
FIXED IND 2.4NH 850MA 110 MOHM
FIXED IND 2.7NH 800MA 120 MOHM
FIXED IND 33NH 350MA 580 MOHM
FIXED IND 39NH 300MA 650 MOHM
FIXED IND 3NH 800MA 125 MOHM
FIXED IND 3.3NH 800MA 125 MOHM
FIXED IND 3.6NH 750MA 140 MOHM
FIXED IND 3.9NH 750MA 140 MOHM
FIXED IND 47NH 300MA 720 MOHM
FIXED IND 4.3NH 750MA 140 MOHM
FIXED IND 4.7NH 700MA 160 MOHM
FIXED IND 56NH 250MA 820 MOHM
FIXED IND 5.1NH 650MA 180 MOHM
FIXED IND 5.6NH 650MA 180 MOHM
FIXED IND 68NH 250MA 920 MOHM
FIXED IND 6.2NH 600MA 200 MOHM
FIXED IND 6.8NH 600MA 220 MOHM
FIXED IND 7.5NH 550MA 240 MOHM
FIXED IND 82NH 200MA 1.2 OHM
FIXED IND 8.2NH 550MA 240 MOHM
FIXED IND 9.1NH 500MA 260 MOHM
FIXED IND 100NH 200MA 1.25 OHM
FIXED IND 120NH 200MA 1.3 OHM
FIXED IND 150NH 150MA 2.99 OHM
FIXED IND 180NH 150MA 3.38 OHM
FIXED IND 220NH 120MA 3.77 OHM
FIXED IND 270NH 110MA 4.94 OHM
FIXED IND 10NH 500MA 260 MOHM
FIXED IND 12NH 500MA 280 MOHM
FIXED IND 15NH 450MA 320 MOHM
FIXED IND 18NH 400MA 360 MOHM
FIXED IND 1NH 1A 70 MOHM
FIXED IND 1.1NH 1A 70 MOHM
FIXED IND 1.2NH 1A 70 MOHM
FIXED IND 1.3NH 1A 70 MOHM
FIXED IND 1.5NH 1A 70 MOHM
FIXED IND 1.6NH 1A 70 MOHM
FIXED IND 1.8NH 950MA 80 MOHM
FIXED IND 22NH 350MA 420 MOHM
FIXED IND 27NH 350MA 460 MOHM
FIXED IND 2NH 900MA 90 MOHM
FIXED IND 2.2NH 900MA 90 MOHM
FIXED IND 2.4NH 850MA 110 MOHM
FIXED IND 2.7NH 800MA 120 MOHM
FIXED IND 33NH 350MA 580 MOHM
FIXED IND 39NH 300MA 650 MOHM
FIXED IND 3NH 800MA 125 MOHM
FIXED IND 3.3NH 800MA 125 MOHM
FIXED IND 3.6NH 750MA 140 MOHM
FIXED IND 3.9NH 750MA 140 MOHM
FIXED IND 47NH 300MA 720 MOHM
FIXED IND 4.3NH 750MA 140 MOHM
FIXED IND 4.7NH 700MA 160 MOHM
FIXED IND 56NH 250MA 820 MOHM
FIXED IND 5.1NH 650MA 180 MOHM
FIXED IND 5.6NH 650MA 180 MOHM
FIXED IND 68NH 250MA 920 MOHM
FIXED IND 6.2NH 600MA 200 MOHM
FIXED IND 6.8NH 600MA 220 MOHM
FIXED IND 7.5NH 550MA 240 MOHM
FIXED IND 82NH 200MA 1.2 OHM
FIXED IND 8.2NH 550MA 240 MOHM
FIXED IND 9.1NH 500MA 260 MOHM
FIXED IND 100NH 200MA 1.25 OHM
FIXED IND 120NH 200MA 1.3 OHM
FIXED IND 150NH 150MA 2.99 OHM
FIXED IND 180NH 150MA 3.38 OHM
FIXED IND 220NH 120MA 3.77 OHM
FIXED IND 270NH 110MA 4.94 OHM
FIXED IND 10NH 500MA 260 MOHM
FIXED IND 12NH 500MA 280 MOHM
FIXED IND 15NH 450MA 320 MOHM
FIXED IND 18NH 400MA 360 MOHM
FIXED IND 1NH 1A 70 MOHM
FIXED IND 1.1NH 1A 70 MOHM
FIXED IND 1.2NH 1A 70 MOHM
FIXED IND 1.3NH 1A 70 MOHM
FIXED IND 1.5NH 1A 70 MOHM
FIXED IND 1.6NH 1A 70 MOHM
FIXED IND 1.8NH 950MA 80 MOHM
FIXED IND 22NH 350MA 420 MOHM
FIXED IND 27NH 350MA 460 MOHM
FIXED IND 2NH 900MA 90 MOHM
FIXED IND 2.2NH 900MA 90 MOHM
FIXED IND 2.4NH 850MA 110 MOHM
FIXED IND 2.7NH 800MA 120 MOHM
FIXED IND 33NH 350MA 580 MOHM
FIXED IND 39NH 300MA 650 MOHM
FIXED IND 3NH 800MA 125 MOHM
FIXED IND 3.3NH 800MA 125 MOHM
FIXED IND 3.6NH 750MA 140 MOHM
FIXED IND 3.9NH 750MA 140 MOHM
FIXED IND 47NH 300MA 720 MOHM
FIXED IND 4.3NH 750MA 140 MOHM
FIXED IND 4.7NH 700MA 160 MOHM
FIXED IND 56NH 250MA 820 MOHM
FIXED IND 5.1NH 650MA 180 MOHM
FIXED IND 5.6NH 650MA 180 MOHM
FIXED IND 68NH 250MA 920 MOHM
FIXED IND 6.2NH 600MA 200 MOHM
FIXED IND 6.8NH 600MA 220 MOHM
FIXED IND 7.5NH 550MA 240 MOHM
FIXED IND 82NH 200MA 1.2 OHM
FIXED IND 8.2NH 550MA 240 MOHM
FIXED IND 9.1NH 500MA 260 MOHM
FIXED IND 100NH 200MA 1.25 OHM
FIXED IND 120NH 200MA 1.3 OHM
FIXED IND 150NH 150MA 2.99 OHM
FIXED IND 180NH 150MA 3.38 OHM
FIXED IND 220NH 120MA 3.77 OHM
FIXED IND 270NH 110MA 4.94 OHM
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