BHxxPB1WHFV Series Datasheet by Rohm Semiconductor

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‘ Technical Note ' I f F1122 Rigs w mm ...........................
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CMOS LDO Regulators for Portable Equipments
1ch 150mA
CMOS LDO Regulators
BH□□PB1WHFV Series
Description
The BH□□PB1WHFV regulator series can respond to changes in output current by switching to a state in which regulator
characteristics are ideal. The regulators cut power consumption by lowering their own current consumption to approximately
2 A when the application is operating in the standby state. During normal-current operation it will automatically switch to
high-speed operating mode. The IC's soft start function reduce the rush current that flows to the output capacitors during
startup. The HVSOF5 package, which features excellent heat dissipation, contributes to space-saving application designs.
Features
1) Automatic switching between low-consumption and high-speed modes
2) Built-in rush current prevention circuit
3) Low-voltage 1.7 V operation
4) High accuracy output voltage: ± 1%
5) Circuit current during low-consumption operation: 2 A
6) Stable with a ceramic capacitor (0.47 µF)
7) Built-in temperature and overcurrent protection circuits
8) Built-in output discharge during standby operation function
9) Ultra-small HVSOF5 power package
Applications
Battery-driven portable devices, etc.
Product lineup
150 mA BH□□PB1WHFV Series
Product name 1.2 1.5 1.8 2.5 2.8 2.9 3.0 3.1 3.3 Package
BH□□PB1WHFV HVSOF5
Model name: BH□□PB1W
a b
Symbol Description
a
Output voltage specification
□□ Output voltage (V) □□ Output voltage (V)
12 1.2 V (Typ.) 29 2.9 V (Typ.)
15 1.5 V (Typ.) 30 3.0 V (Typ.)
18 1.8 V (Typ.) 31 3.1 V (Typ.)
25 2.5 V (Typ.) 33 3.3 V (Typ.)
28 2.8 V (Typ.)
b Package HFV: HVSOF5
No.11020EBT05
Technical Note
BH□□PB1WHFV Series
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Absolute maximum ratings (Ta = 25°C)
Parameter Symbol Ratings Unit
Power supply voltage VMAX 0.3 to +6.5 V
Power dissipation Pd 410 *1 mW
Operating temperature range Topr 40 to +85 °C
Storage temperature range Tslg 55 to +125 °C
Junction temperature Tjmax 125 °C
*1: Reduced by 4.1 mW/°C over 25°C, when mounted on a glass epoxy board (70 mm 70 mm 1.6 mm)
Recommended operating ranges (not to exceed Pd)
Parameter Symbol Ratings Unit
Power supply voltage VIN 1.7 to 5.5 V
Output MAX current IMAX 0 to 150 mA
Recommended operating conditions
Parameter Symbol
Ratings Unit Conditions
Min. Typ. Max.
Input capacitor CIN 0.33
*2 0.47 µF
The use of ceramic capacitors is
recommended.
Output capacitor CO 0.33
*2 0.47 µF
The use of ceramic capacitors is
recommended.
*2: Make sure that the output capacitor value is not kept lower than this specified level across a variety of temperature, DC bias characteristic.
And also make sure that the capacitor value can not change as time progresses.
Technical Note
BH□□PB1WHFV Series
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Electrical characteristics
(Unless otherwise specified, Ta = 25°C, VIN = VOUT + 1.0 V, STBY = 1.5 V, SEL = 0 V, CIN = 0.47 µF, CO = 0.47 µF)
Parameter Symbol Limits Unit Conditions
Min. Typ. Max..
Regulator
Output voltage
(high-speed mode) VOUT1
VOUT1
×0.99 - VOUT1
×1.01 V VOUT2.5V,IOUT=0.1mA,SEL=1.5V
VOUT1
-0.025 - VOUT1
+0.025 V VOUT1.8V,IOUT=0.1mA,SEL=1.5V
Output voltage
(low-consumption mode) VOUT2
VOUT2
×0.97 - VOUT2
×1.038 V VOUT2.5V,IOUT=0.1mA,SEL=0V
VOUT2
×0.967 - VOUT2
×1.043 V VOUT1.8V,IOUT=0.1mA,SEL=0V
Circuit current
(high-speed mode) ICC1 - 20 40
μA IOUT=0mA, VIN pin
monitor,SEL=1.5V
Circuit current
(low-consumption mode) ICC2 - 2 4
μA IOUT=0mA, VIN pin monitor, SEL=0V
Circuit current (STBY) ISTBY - - 1.0
μA STBY=0V
Ripple rejection ratio
(high-speed mode) RR1 42 60 - dB VRR=-20dBv, fRR=1kHz,
IOUT=10mA, SEL=1.5V
Dropout voltage 1 *1 VSAT1 - 100 200
mV VIN=VOUT×0.98,IOUT=50mA
Dropout voltage 2 *1 VSAT2 - 210 400
mV VIN=VOUT×0.98,IOUT=100mA
Dropout voltage 3 *1 VSAT3 - 315 600
mV VIN=VOUT×0.98,IOUT=150mA
Line regulation 1
(high-speed mode) VDL1 - 2 20
mV VIN=VOUT+1V to 5.5V,IOUT=10mA
Line regulation 2
(low-consumption mode) VDL2 - 2 20
mV VIN=VOUT+1V to 5.5V,IOUT=100μA
Load regulation VDLO - 10 40
mV IOUT=10mA to 100mA
Mode switch
Current threshold
(low-consumption mode) ITH1 0.09 0.3 - mA SEL=0V IOUT=3mA0mA sweep
Current threshold
(high-speed mode) ITH2 - 1.2 2.2
mA SEL=0V IOUT=0mA3mA sweep
Over Current Protection 1
Limit Current ILMAX 160 300 500 mA Vo=VOUT×0.90
Short current ISHORT 20 50 100
mA Vo=0V
Stand-by block
STBY pin sink current ISTB - 2 4
μA STBY=1.5V
STBY control voltage ON VSTBH 1.5 - VIN V
OFF VSTBL -0.3 - 0.3
V
Discharge resistance at standby RDCG 1.5 2.2 3.0 k STBY=0V
SEL PIN
Pull-down resistance of SEL pin RSEL 0.5 1.0 2.0
M
SEL control voltage ON VSELH 1.5 - VIN V Fixed high speed mode
OFF VSELL -0.3 - 0.3
V Automatic switch mode
* Note: This IC is not designed to be radiation-resistant. *3: Except at VOUT 1.5 V.
Electrical characteristics of each output voltage
Output Voltage Parameter Min. Typ. Max. Unit Conditions
1.2 V
Max. output
current
70 120
mA
VCC = 1.7 V
150 VCC = 2.0 V
1.5 V 50 100 VCC = 1.8 V
150 VCC = 2.2 V
1.8 V VOUT 75 143 VCC = VOUT + 0.3 V
150 VCC = VOUT + 0.6 V
Technical Note
BH□□PB1WHFV Series
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Typical characteristics
0
100
200
300
400
0 50 100 150
Output Current IOUT [mA]
Input Output Voltage difference VSAT
[mV]
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 100 200 300 400
Output Current IOUT [mA]
Output Voltage VOUT [V]
Fig.2 Output Voltage vs Input Voltage
(BH30PB1WHFV) Fig.3 Output Voltage vs Input Voltage
(BH33PB1WHFV)
(BH33PB1WHFV)
(BH30PB1WHFV)
Fig.6 GND Current vsInput Voltage
(BH33PB1WHFV)
Fig.8 Output Voltage vs Output Current
(BH30PB1WHFV) Fig.9 Output Voltage vs Output Current
(BH33PB1WHFV)
Fig.10 Dropout voltage vs Output Current
(BH18PB1WHFV) Fig.11 Dropout voltage vs Output Current
(BH30PB1WHFV)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
012345
Input Voltage VIN [V]
Output Voltage VOUT [V]
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
01234 5
Input Voltage VIN [V]
Output Voltage VOUT [V]
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
012345
Input Voltage VIN [V]
Output Voltage VOUT [V]
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 100 200 300 400
Output Current IOUT [mA]
O ut pu t Voltage VOUT [V]
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 100 200 300 400
Output Current IOUT [mA]
Output Voltage VOUT [V]
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 100 200 300 400
Output Current IOUT [mA]
Output Voltage VOUT [V]
Fig.12 Dropout voltage vs Output Current
(BH33PB1WHFV)
IO = 10 mA IO = 10 mA IO = 10 mA
SEL = 1.5 V
SEL = 0 V
0
100
200
300
400
050100150
Output Current IOUT [mA]
Input Output Voltage difference VOUT
[mV]
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 100 200 300 400
Output Current IOUT [mA]
Out pu t Voltage VOUT [V ]
0
100
200
300
400
050100150
Output Current IOUT [mA]
Input Output Voltage difference VSAT
[mV]
IO = no load
SEL = 1.5 V
SEL = 0 V
SEL = 1.5 V
SEL = 0 V
(BH30PB1WHFV)
(BH12PB1WHFV)
Fig.1 Output Voltage vs Input Voltage
(BH12PB1WHFV)
(BH30PB1WHFV)
(BH12PB1WHFV)
IO = no load
0
10
20
30
40
50
60
70
012345
Input Voltage VIN [V]
GND Current IGND [μA]
IO = no load
BHEIEIPBIWHFV Series :2 Ompul Voltage VOUTM 25 5o 725 n 25 an 75 ion Yele‘C] Figtl 3 Output Voltage vs Temperature (BHSDPB1WHFV) an 7n E5.) I ESD gm: f: I 2n , in ma lk Wk ma TM Frememirnz] Fig.16 Ripple Rejection (BH12PB1WHFV) A A t 1/ l Technical Note E: 9 E2 § 3 o l a an us H) l 5 20 vserM Figt14 Standby Pin Threshold Fig.15 Standby Pin Sink Current (BHBOPB1WHFV) (BHSOPEHWHFV) 5“ at.“ “ mm mm. m ”" mm E . SEL sitzflvmlfi TV A“ gag x 550 gm i3“ vour so mV ’dlv x 2” loznuload in ms ‘div in ma l k mk ma l M Freqmrcy 1H2} Figt17 Ripple Rejection ig.18 Output Voltage Wavelorm (BHSOPB1WHFV) During SEL Switching ‘ (BHSOPBTWHFV) m ‘1”? EEE ‘21, 3:: ‘ am, r.— Fig.19 Load Response (Co : 1‘0 uF) Fig.20 Load Response (00:1.0 uF) Fig.21 (BHSOPEHWHFV) (BHBOPB1WHFV) mm am my ”iii-if“ owl-w we “°" l div m" ”" moan .ser n srav l v ’fllv _ _.u v E (30:30 VF ‘ 09:22“; E c l or g“ V/\ \/c amp 5 vour / Cor: lfluF i lV’fliv ' 2mm m .5 lflms ’fllv unw Fig.22 Output Voltage Rise Time Fig.23 Output Voltage Fall Time Fi (BHBOPB1WHFV) (BHSOPEHWHFV) www.mhmxzem 5/10 © 2011 ROHM Co, Ltd. All rights reserved,
Technical Note
BH□□PB1WHFV Series
5/10
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STBY
VOUT
1 V / div
200 s / div
1 V / div
Co = 0.47 µF
Co = 10 µF
Slow start capacitance Css (F)
Startup time Trise [sec]
0.01µ 0.1 µ 1.0µ
100 µ
100 m
Fig.13 Output Voltage vs Temperature
(BH30PB1WHFV) Fig.14 Standby Pin Threshold
(BH30PB1WHFV)
Fig.15 Standby Pin Sink Current
(BH30PB1WHFV)
Fig.16 Ripple Rejection
(BH12PB1WHFV) Fig.17 Ripple Rejection
(BH30PB1WHFV)
Fig.18 Output Voltage Waveform
During SEL Switching
(BH30PB1WHFV)
2.8
2.9
3.0
3.1
3.2
-50 -25 0 25 50 75 100
Temp[]
Output Volt age VO UT[V ]
0
1
2
3
4
0.00.51.01.52.0
VSTBY[V]
Output Voltage VOUT[V]
10
20
30
40
50
60
70
80
Frequency f[Hz]
Ripple Rejection R.R.[dB]
100 1 k 10 k 100 1 M
10
20
30
40
50
60
70
80
Frequency f[Hz]
Ripple Rejection R.R.[dB]
100 1 k 10 k 100 1 M
Fig.19 Load Response (Co = 1.0 µF)
(BH30PB1WHFV) Fig.20 Load Response (Co=1.0 µF)
(BH30PB1WHFV) Fig.21 Load Response (Co=1.0 µF)
(BH30PB1WHFV)
Fig.22 Output Voltage Rise Time
(BH30PB1WHFV)
STBY
VOUT
1 V / div
10 ms / div
1 V / div
Co = 2.2 µF
Co = 0.47 µF
Co = 1 µF
Fig.23 Output Voltage Fall Time
(BH30PB1WHFV) Fig.24 Soft Start Rise Time
(BH30PB1WHFV)
50 mV / div
VOUT
SEL SEL = 0 V 1.5 1 V / div
10 ms / div
Rss = 10 k,
IO = no load
Co = 0.47 µF
IO = 10 mA IO = no load
1.0µ
10 m
0
1
2
3
4
5
6
0.0 1.0 2.0 3.0 4.0 5.0
VSTBY[V]
Standby Pin Sink Current ISTBY[µA]
Co = 0.47 µF
IO = 10 mA
VOUT
100 mV / div
200 s / div
IOUT = 1 mA 100
VOUT
50 mV / div
200 s / div
SEL = 1.5 V
IOUT = 1 mA 30 mA
VOUT
50 mV / div
100 s / div
SEL = 0 V
(power-saving operation)
IOUT = 0 mA 10 m
A
BHEIIZIPB1WHFV Series Technical Note m a 1 N 3 HVSOF5 J + ' l 1 Power Dissigahon Pd 2. Powerstsxgation/HeatReduction Pd HVSOF5 at
Technical Note
BH□□PB1WHFV Series
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Block diagram, recommended circuit diagram, and pin assignment table
Auto Power-saving Function
Power Dissipation (Pd)
1. Power Dissipation (Pd)
Power dissipation calculations include estimates of power
dissipation characteristics and internal IC power consumption, and
should be treated as guidelines. In the event that the IC is used in
an environment where this power dissipation is exceeded, the
attendant rise in the junction temperature will trigger the thermal
shutdown circuit, reducing the current capacity and otherwise
degrading the IC's design performance. Allow for sufficient margins
so that this power dissipation is not exceeded during IC operation.
Calculating the maximum internal IC power consumption (PMAX)
2. Power Dissipation/Heat Reduction (Pd)
PMAX = (VIN - VOUT) IOUT (MAX.) Fig.27 HVSOF5 Power Dissipation
vs Heat Reduction (Example)
PIN No. Symbol Function
1 STBY Output voltage on/off control(High: ON, Low: OFF)
2 GND Ground
3 VIN Power supply input
4 VOUT Voltage output
5 SEL
Mode switching
(High: Fix in high-speed mode
Low: Automatic low-consumption mode switching)
The IC incorporates a built-in auto power-saving function that
continuously monitors the output current and switches
automatically between a low current consumption regulator
and a high-speed operation regulator. This function reduces
the regulator's own current consumption to approximately 1/10
or lower of normal levels when the output current falls below
approximately 300 A.
To operate only the high-speed operation regulator without
using the auto power-saving function, fix the SEL pin to high.
Fig.26 Auto Power-Saving Function (Example)
Fig.25
Cin … 0.47 µF
Co … 0.47 µF
BH□□PB1WHFV
THERMAL &
OVER CURRENT
PROTECTION
VOLTAGE
REFERENCE
+
-
+
-
CONTROL
BLOCK
DISCHARGE
VOUT
Co
SEL
VIN
GND
STBY
Cin
1
2
3
4
5
CURRENT
MONITOR
CH1
CH2
SOFFT
START
-
-
Rss
Css
( )
( )
Measurement conditions
BH12PB1WHFV
VCC = 2.2 V
VSEL = open,
VSTBY = 1.5 V
0
10
20
30
00.511.522.53
Output current IOUT [mA]
GND current  IGND [μA]
Low-consumption mode
High-speed mode
0
0.2
0.4
0.6
0 25 50 75 100 125
Ta[]
Pd[W]
410 mW
HVSOF5
*Circuit design
should allow a
sufficient
margin for the
temperature
range so tha
t
PMAX < Pd.
VIN : Input voltage
VOUT : Output voltage
IOUT (MAX) : Max. output current
Technical Note
BH□□PB1WHFV Series
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0.01
0.1
1
10
100
0 50 100 150
Output Current Io mA)
ESR ()
Stable region
Input Output capacitors
It is recommended to insert bypass capacitors between input and GND pins, positioning them as close to the pins as
possible. These capacitors will be used when the power supply impedance increases or when long wiring paths are used, so
they should be checked once the IC has been mounted. Ceramic capacitors generally have temperature and DC bias
characteristics. When selecting ceramic capacitors, use X5R or X7R, or better models that offer good temperature and DC
bias characteristics and high tolerant voltages.
Typical ceramic capacitor characteristics
Output capacitors
Mounting input capacitor between input pin and GND(as close to pin as possible), and also output capacitor between output
pin and GND(as close to pin as possible) is recommended. The input capacitor reduces the output impedance of the voltage
supply source connected to the VCC. The higher value the output capacitor goes the more stable the whole operation
becomes. This leads to high load transient response. Please confirm the whole operation on actual application board.
Generally, ceramic capacitor has wide range of tolerance, temperature coefficient, and DC bias characteristic. And also its value goes
lower as time progresses. Please choose ceramic capacitors after obtaining more detailed data by asking capacitor makers.
0
20
40
60
80
100
120
01234
DC bias Vdc (V)
Capacitance rate of change (%)
70
75
80
85
90
95
100
01234
DC bias Vdc (V)
Capacitance rate of change (%)
0
20
40
60
80
100
120
-25 0 25 50 75
Temp[]
Capacitance rate of change (%)
10V
rated voltage
50 V rated voltage
16 V rated voltage
10 V
rated voltage
Fig.28 Capacitance vs Bias
(Y5V) Fig.29 Capacitance vs Bias
(X5R, X7R) Fig.30 Capacitance vs Temperature
(
X5R, X7R, Y5V
)
Fig.31 Stable Operation Region (Example)
COUT = 0.47 µF
Ta = +25°C
BH□□PB1WHFV
16 V rated voltage
50 V rated voltage
X7R
X5R
Y5V
Technical Note
BH□□PB1WHFV Series
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Notes for use
1. Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break
down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated
values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses.
2. Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
3. Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
4. Thermal shutdown circuit (TSD)
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit is designed only to shut
the IC off to prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. Do not
continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is
assumed.
5. Ground wiring patterns
The power supply and ground lines must be as short and thick as possible to reduce line impedance. Fluctuating voltage
on the power ground line may damage the device.
6. Overcurrent protection circuit
The IC incorporates a built-in overcurrent protection circuit that operates according to the output current capacity. This
circuit serves to protect the IC from damage when the load is shorted. The protection circuit is designed to limit current
flow by not latching in the event of a large and instantaneous current flow originating from a large capacitor or other
component. These protection circuits are effective in preventing damage due to sudden and unexpected accidents.
However, the IC should not be used in applications characterized by the continuous operation or transitioning of the
protection circuits. At the time of thermal designing, keep in mind that the current capability has negative characteristics to
temperatures.
7. Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
8. Back current
In applications where the IC may be exposed to back current flow, it is recommended to create a path to dissipate this
current by inserting a bypass diode between the VIN and VOUT pins.
Fig.32 Example Bypass Diode Connection
9. I/O voltage difference
Using the IC in automatic switching mode when the I/O voltage differential becomes saturated (VIN - VOUT < 150 mV)
may result in a large output noise level. If the noise level becomes problematic, use the IC with the SEL pin in the high
state when the voltage differential is saturated.
10. GND Voltage
The potential of GND pin must be minimum potential in all operating conditions.
VIN
STBY GND
OUT
Back current
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Technical Note
BH□□PB1WHFV Series
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0.01 0.1 1.0
100
1.0 m
10
100
Frequency f[Hz]
起動時間 Trise [sec]
Startup time
Rss = 10 k
IO = no load
Slow start capacitance Css (F)
11. Preventing Rush Current
By attaching the Rss and Css time constants to the STBY pin, sudden rises in the regulator output voltage can be
prevented, dampening the flow of rush current to the output capacitors. The larger the time constant used, the greater the
resulting reduction. However, large time constants also result in longer startup times, so the constant should be selected
after considering the conditions in which the IC is to be used.
12. Regarding input Pin of the IC (Fig.34)
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example, the relation between each potential is as follows:
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes
operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.
Fig.34
Resistor Transistor (NPN)
N
N N P+ P
+
P
P substrate
GND
Parasitic element
Pin A
N
N P+ P+
P
P substrate
GND
Parasitic element
Pin B C B
E
N
GND
Pin A
Parasitic
element
Pin B
Other adjacent elements
E
B C
GND
Parasitic
element
Fig.33 VOUT Startup Time vs CSS Capacitance (Reference)
0000000000
Technical Note
BH□□PB1WHFV Series
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Ordering part number
B H 3 0 P B 1 W H F V - T R
Part No. Output voltage
12: 1.2 V
15: 1.5 V
18: 1.8 V
25: 2.5 V
28: 2.8 V
29: 2.9 V
30: 3.0 V
31: 3.1 V
33: 3.3 V
Series
PB1:Auto power-
saving type
Shutdown
switch
W : Includes
switch
Package
HFV : HVSOF5 Packaging and forming specification
TR: Embossed tape and reel
(Unit : mm)
HVSOF5
S
0.08
M
0.1 S
4
321
5
(0.05)
1.6±0.05
1.0±0.05
1.6±0.05
1.2±0.05
(MAX 1.28 include BURR)
45
321
(0.8)
(0.91)
(0.3)
(0.41)
0.2MAX
0.13±0.05
0.22±0.05
0.6MAX
0.5
0.02 +0.03
–0.02
Direction of feed
Reel
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
3000pcs
TR
()
1pin
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASS CLASS CLASSb CLASS
CLASS CLASS
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.

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