LCB716 Datasheet by IXYS Integrated Circuits Division

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DS-LCB716-R04 1
LCB716
Single-Pole, Normally Closed
OptoMOS® Relay
Part # Description
LCB716 6-Pin DIP (50/Tube)
LCB716S 6-Pin Surface Mount (50/Tube)
LCB716STR 6-Pin Surface Mount (1000/Reel)
Parameter Rating Units
Load Voltage 60 VP
Load Current 500 mArms / mADC
On-Resistance (max) 2
Applications
Features
Description
Approvals
Ordering Information
Pin Configuration
Switching Characteristics
of Normally Closed Devices
LCB716 is a single-pole, normally closed (1-Form-B)
solid state relay that uses optically coupled relay
technology to provide an enhanced 3750Vrms
isolation barrier between the input and the output
of the relay. The efficient MOSFET output switch
uses IXYS Integrated Circuits' patented OptoMOS
architecture. The optically coupled output is controlled
by a highly efficient infrared LED.
Sensor Circuitry
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (gas, oil, electric and water)
Medical Equipment-Patient/Equipment Isolation
Security
Aerospace
Industrial Controls
3750Vrms Input/Output Isolation
Low Drive Power Requirements
High Reliability
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Small 6-Pin Package
Flammability Rating UL 94 V-0
Tape & Reel, Surface Mount Version Available
Form-B
IF
10% 90%
ILOAD
toff ton
1
3
2
4
5
6
+ Control
– Control
Do Not Use
Load
Do Not Use
Load
AC/DC Configuration
1
3
2
4
5
6
+ Control
– Control
Do Not Use
+ Load
– Load
DC-Only Configuration
UL Recognized Component: File E76270
CSA Certified Component: Certificate 1175739
EN/IEC 60950-1 Certified Component:
Certificate available on our website
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2R04
LCB716
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
AC/DC Configuration, Continuous -
IL
- - 500 mArms / mADC
DC Configuration, Continuous - - - 1000 mADC
Peak t < 10ms ILPK - - ±1.2 AP
On-Resistance
IL=500mA - 1.63 2 AC/DC Configuration RON
DC Configuration IL=1000mA - 0.4 0.5
Off-State Leakage Current IF=2mA, VL=60V ILEAK --1 A
Output Capacitance IF=2mA, VL=50V, f=1MHz COUT - 280 - pF
Switching Speeds
Turn-On ton - 0.58 3
IF=5mA, VL=10V ms
Turn-Off toff - 0.76 3
Input Characteristics
Input Control Current to Activate IL=500mA IF--2 mA
Input Control Current to Deactivate - IF0.1 - - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.5 V
Reverse Input Current VR=5V IR--10 A
Common Characteristics
Capacitance, Input to Output VIO=0V, f=1MHz CIO -3- pF
Parameter Ratings Units
Blocking Voltage 60 VP
Reverse Input Voltage 5 V
Input Control Current
Peak (10ms)
50 mA
1A
Input Power Dissipation 1100 mW
Total Power Dissipation 2800 mW
Isolation Voltage, Input to Output 3750 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / ºC
2 Derate linearly 6.67 mW / ºC
Absolute Maximum Ratings @ 25ºC
Electrical Characteristics @ 25ºC
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LED Forward Voltage Drop (V)
1.220 1.225 1.230 1.235 1.240 1.245
Device Count (N)
0
5
10
15
20
25
30
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
Turn-On Time (ms)
0.507 0.530 0.553 0.576 0.599 0.622
Device Count (N)
0
5
10
15
20
Typical Turn-On Time
(N=50, IF=5mA, IL=100mA)
Turn-Off Time (ms)
0.63 0.67 0.71 0.75 0.79 0.83
Device Count (N)
0
5
10
15
20
25
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mA)
LED Forward Current (mA)
0.16 0.17 0.18 0.19 0.20 0.21
Device Count (N)
0
5
10
15
20
25
Typical IF for Switch Operation
(N=50, IL=200mA)
On-Resistance (:)
1.49 1.53 1.57 1.61 1.65 1.69
Device Count (N)
0
5
10
15
20
Typical On-Resistance
(N=50, IF=0mA, IL=5mA)
Blocking Voltage (VP)
75 76 77 78 79 80
Device Count (N)
0
5
10
15
20
Typical Blocking Voltage
(N=50, IF=2mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-On Time (Ps)
100
200
300
400
500
600
700
800
Typical Turn-On Time
vs. Temperature
(IL=100mA)
IF=2mA
IF=5mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-Off Time (ms)
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
Typical Turn-Off Time
vs. Temperature
(IL=100mA)
IF=2mA
IF=5mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-Resistance (:)
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
Typical On-Resistance
vs. Temperature
(IF=0mA, IL=100mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Current (mA)
0.10
0.15
0.20
0.25
0.30
0.35
0.40
Typical IF for Switch Operation
vs. Temperature
(IL=100mA)
LED Forward Current (mA)
0 1020304050
Turn-On Time (Ps)
417
418
419
420
421
422
423
Typical Turn-On Time
vs. LED Forward Current
(IL=100mA)
LED Forward Current (ma)
0 1020304050
Turn-Off Time (ms)
0
0.5
1.0
1.5
2.0
2.5
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mA)
PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
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Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (A)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
Maximum Load Current vs. Temperature
(IF=0mA)
Load Voltage (V)
-1.0 -0.75 -0.5 -0.25 0.0 0.25 0.5 0.75 1.0
Load Current (A)
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
Typical Load Voltage
vs. Load Current
(IF=0mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (VP)
80
82
84
86
88
90
92
94
Typical Blocking Voltage
vs. Temperature
(IF=5mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage Current (nA)
0
50
100
150
200
250
300
350
Typical Leakage vs.Temperature
Measured Across Pins 4&6
(IF=5mA, VL=60V)
Time
10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s
Load Current (A)
0.3
0.5
0.7
0.9
1.1
1.3
1.5
1-Form-B Relay
Energy Rating Curve
PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
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R04
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in the
information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Classifi cation
LCB716 / LCB716S MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum
Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device Classifi cation Temperature (Tc) Dwell Time (tp) Max Refl ow Cycles
LCB716 250ºC 30 seconds 1
LCB716S 250ºC 30 seconds 3
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage
to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow
up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the
variability of the wash parameters used to clean the board, determination of the bake temperature and duration
necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning
or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the
device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
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LCB716
Dimensions
mm
(inches)
PCB Hole Pattern
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
0.254 ± 0.0127
(0.010 ± 0.0005)
9.144 ± 0.508
(0.360 ± 0.020)
7.239 TYP
(0.285 TYP)
7.620 ± 0.254
(0.300 ± 0.010)
3.302 ± 0.051
(0.130 ± 0.002) 4.064 TYP
(0.160 TYP)
0.457 ± 0.076
(0.018 ± 0.003)
8.382 ± 0.381
(0.330 ± 0.015) 2.54 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
1.651 ± 0.254
(0.065 ± 0.010)
Pin 1
Dimensions
mm
(inches)
PCB Land Pattern
0.254 ± 0.0127
(0.010 ± 0.0005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
4.445 ± 0.254
(0.175 ± 0.010)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
8.382 ± 0.381
(0.330 ± 0.015) 2.54 ± 0.127
(0.100 ± 0.005)
9.524 ± 0.508
(0.375 ± 0.020) 6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
1.651 ± 0.254
(0.065 ± 0.010)
1.651 ± 0.254
(0.065 ± 0.010)
Pin 1
LCB716
LCB716S
Mechanical Dimensions
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Specification: DS-LCB716-R04
©Copyright 2018, IXYS Integrated Circuits
OptoMOS® is a registered trademark of IXYS Integrated Circuits
All rights reserved. Printed in USA.
6/26/2018
For additional information please visit our website at: www.ixysic.com
7
LCB716
IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes
to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits'
Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but
not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property
or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice.
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Dimensions
mm
(inches)
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00
(0.63)
B0 = 10.10
(0.398)
A0 = 10.10
(0.398)
P1 = 12.00
(0.472)
K1 = 3.80
(0.15)
K0 = 4.90
(0.19)
User Direction of Feed
LCB716STR Tape & Reel

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