SOP8 Taping Spec Datasheet by Rohm Semiconductor

Molding Resin Die Bonding Wire Lead / Die Attach Die Pad

Package Information : SOP8

1.　Package Information

　　Package Name SOP8

　　　　Type 　　　SOP

　　　　Pin Count 　　　8

　　　　Outline Dimension

Drowing No. 　　　EX112-5001-2

　　　　Package Weight [g] 　　　0.084

　　　　Lead Finish 　　　Pure Tin

　　　　MSL Level 　　　Level1

2.　Package Structure

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Direction oHeed Pocket Quadrants —> Reel Hg 1 Quadrant Aes-gnments (or PW 1 onentatxon m Tape E2 PIN1 we placed (othetopleﬂ corner TR PW! us p‘aced tethetopugm comer TL PW! vs placed wme \owerleﬂ E1 PM ‘5 p‘aced tome lower ngm Pee‘back 16510 130’ Pee‘back speed 300i10mm/mvn $5

SOP8 　　　　　　　　　　　　　　　　　　　　　　 Package Information

3.　Packing Specification

3.1 Packing form, Quantity, PIN1 Orientation

Packing Form Tape&Reel

Packing Quantity [pcs] 2,500

PIN 1 Orientation E2

3.2 Use material

　Item Material

　Embossed carrier tape PS

Cover tape PET+PE

Reel PS

Air cap PE

Unit box Cardboard

　Shipping box Cardboard

3.3 Leader specification

No component pockets are 320 mm or more.

3.4 Trailer specification

No component pockets are 80 mm or more. Tape is free from reel.

3.5 Peelback strength

Cover tape peelback strength is 0.2 N to 0.7 N.

Fig. 2 Test method

3.6 Missing Ics

(1) No consecutive dropouts.

(2) A maximun 0.1 % of specified number of products in each packing may be missing.

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(unitzmm) Tape Dimension Tape Tolerance 6.80 5.50 (p15 $1.5 1,75 5.50 2.00 4.00 8.00 2.00 0.30 12.0 10.1 10.1 +0.1/-0 MIN 10.1 10.1 10.1 10.1 10.1 10.1 10.3

SOP8 　　　　　　　　　　　　　　　　　　　　　　 Package Information

3.7 Tape and Reel Specification

3.7.1 Tape Dimension

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SOP8 　　　　　　　　　　　　　　　　　　　　　　 Package Information

3.7.2 Reel Dimension

(unit:mm)

　　　　　 Reel Dimension 　　　　　 Reel Tolerance 　　　

　A　330 　　　　　 ±2.0 　　　

B 80 ±1.0

C 13 ±0.2

D 21 ±0.8

E 2 ±0.5

W1 13.5 ±1.0

　W2 　17.5 　　　　　 ±1.0 　　　

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Unit box (Unitzmm) R | ee Labe‘ Aircap |:> o 0 ﬂ 0 O O O O O O 000 r) “I 346 355 Product No. Oul going inspeclion stamp BX1234XXX- XX ( ) E _ E Quanli1y \ ‘UIIIIIHHHIIMIIIIWHIWW 2 Doopcs 0124 A5110F BX1234XXX xx W1 ( ) Lol number MNo «24 n2: pcs Pb MND 12} 324 pas @ MADE «4 PMUPMES _ Imemal produd code Markmg lot number Pb Free Mark

SOP8 　　　　　　　　　　　　　　　　　　　　　　 Package Information

3.8 Packing Method

1reel(s) or less per unit box

3.9 Packing Style

5unit boxes or less per shipping box

(unit:mm)

Shipping Box Dimension

X 372

Y 368

　Z　　305

3.10 Label Specification

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4.6 0.76 1.1

SOP8 　　　　　　　　　　　　　　　　　　　　　　 Package Information

4.　Footprint dimensions

(unit:mm)

In actual design, please optimize in accordance with the situation of your board design and soldering

condition.

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\—. Production lot number Production week code Producxion year code

SOP8 　　　　　　　　　　　　　　　　　　　　　　 Package Information

5.　Marking Specification

6.　Storage conditions

6.1 Storage environment

Recommended storage conditions

　　　　　　　　　 Min. 　Max. 　　 Unit

　Temperature 5 30 °C

　Humidity 40 　70 　　 % RH

6.2 Storage period

　　　　　　　　　Min. 　Max. 　　 Unit

　Storage period - 　1　　 year

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Package surface temperature 26° CMAX Pvehealmglempevamle 130‘c~190”c Preheaung zone 12059:: MAX Soldenng ‘emperzlme 22m ~ 230% Soldenng Empemm Solderlng zone 50sec MAX 1~4“ C/sec iNonce) \. Maxumum 2rumes somenng Preneaung tempevalule \ Time 10secMAX Preheahng Zone Soldenng Zone

SOP8 　　　　　　　　　　　　　　　　　　　　　　 Package Information

7.　Soldering conditions

7.1 Recommended temperature profile for reflow

7.2 Recommended condition for wave soldering

Preheating temperature : 120 °C to 150 °C

Preheating time : 60 sec MAX

Soldering temperature : 260 °C ±3 °C

Soldering time : 12 sec MAX

Notes for wave soldering

(1)Soldering time is provided for total soldering time in case of dual wave soldering.

(2) Do not use other soldering methods with wave soldering.

(3) Recommend to clean the board to eliminate flux, solder waste,

and other impurities for reliability, after soldering.

(4) Optimize soldering condition to prevent solder bridging.

7.3 Recommended condition for solder iron

Solder iron temperature : 380 °C or less

Mounting time : 4 sec or less

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ROHm SEMICONDUCTOR

R1102

A

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Notes

The information contained herein is subject to change without notice.

Before you use our Products, please contact our sales representative

and verify the latest specifica-

tions :

Although ROHM is continuously working to improve product reliability and quality, semicon-

ductors can break down and malfunction due to various factors.

Therefore, in order to prevent personal injury or fire arising from failure, please take safety

measures such as complying with the derating characteristics, implementing redundant and

fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no

responsibility for any damages arising out of the use of our Poducts beyond the rating specified by

ROHM.

Examples of application circuits, circuit constants and any other information contained herein are

provided only to illustrate the standard usage and operations of the Products. The peripheral

conditions must be taken into account when designing circuits for mass production.

The technical information specified herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,

any license to use or exercise intellectual property or other rights held by ROHM or any other

parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of

such technical information.

The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communi-

cation, consumer systems, gaming/entertainment sets) as well as the applications indicated in

this document.

The Products specified in this document are not designed to be radiation tolerant.

For use of our Products in applications requiring a high degree of reliability (as exemplified

below), please contact and consult with a ROHM representative : transportation equipment (i.e.

cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety

equipment, medical systems, servers, solar cells, and power transmission systems.

Do not use our Products in applications requiring extremely high reliability, such as aerospace

equipment, nuclear power control systems, and submarine repeaters.

ROHM shall have no responsibility for any damages or injury arising from non-compliance with

the recommended usage conditions and specifications contained herein.

ROHM has used reasonable care to ensur the accuracy of the information contained in this

document. However, ROHM does not warrants that such information is error-free, and ROHM

shall have no responsibility for any damages arising from any inaccuracy or misprint of such

information.

Please use the Products in accordance with any applicable environmental laws and regulations,

such as the RoHS Directive. For more details, including RoHS compatibility, please contact a

ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting

non-compliance with any applicable laws or regulations.

When providing our Products and technologies contained in this document to other countries,

you must abide by the procedures and provisions stipulated in all applicable export laws and

regulations, including without limitation the US Export Administration Regulations and the Foreign

Exchange and Foreign Trade Act.

This document, in part or in whole, may not be reprinted or reproduced without prior consent of

ROHM.

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SOP8 Taping Spec Datasheet by Rohm Semiconductor

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