HTSSOP-B40 Taping Spec Datasheet by Rohm Semiconductor

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ROHm Bonding Wire Molding Resm Die Die Altach Die Pad
Package Information : HTSSOP-B40
    
                                                     
1. Package Information
                    
  Package Name HTSSOP-B40
     Type    SOP
     Pin Count    40
     Outline Dimension
Drowing No.    EX194-5001-2
     Package Weight [g]    0.2
     Lead Finish    Pure Tin
     MSL Level    Level3
                   
   
   
   
                      
                        
                                 
                         
2. Package Structure
                         
     
    
    
    
    
    
   
 
   
   
   
      
     
   
   
   
          
          
               
             
             
             
                        
                        
                        
                           
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Package Information Direction 0! feed Pocket Quadranls —> Reel Hg 1 DuadramAssvgnmentsVor PW 1 Onentanan m Tape E2 PIN1 ‘5 placed «a the top lefl corner TR PW! Is p‘aced to the lap "gm corner TL PW! vs placed wme \owerlefl E1 PM ‘5 p‘aced tome lower ngm Pee‘back 16510 180’ Pee‘back speed 300i10mm/mvn TSZDZZM -HTSSOP—B40-1-2
HTSSOP-B40                           Package Information
3. Packing Specification
3.1 Packing form, Quantity, PIN1 Orientation
Packing Form Tape&Reel
Packing Quantity [pcs] 2,000
PIN 1 Orientation E2
3.2 Use material
 Item Material
Embossed carrier tape PS
Cover tape PET+PE
Reel PS
Desiccant Silicagel
Envelope Aluminum-laminated
Air cap PE
Unit box Cardboard
 Shipping box Cardboard
3.3 Leader specification
No component pockets are480 mm or more.
3.4 Trailer specification
No component pockets are120 mm or more. Tape is free from reel.
3.5 Peelback strength
Cover tape peelback strength is 0.2 N to 0.7 N.
Fig. 2 Test method
3.6 Missing Ics
(1) No consecutive dropouts.
    (2) A maximun 0.1 % of specified number of products in each packing may be missing.      
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(unitzmm) Tape Dimension Tape Tolerance A1 8.50 101 A2 3.00 1005 B1 142 10.1 DO (171.5 +0.1/-0 D1 (92.0 +0.1l-0 E 1.75 10.1 F 11.5 10.1 K‘ 0.85 10.1 KO 150 10.1 P0 400 10.1 P1 12.0 101 P2 200 10.1 T 0.30 10.05 W 24.0 10.3
HTSSOP-B40                           Package Information
3.7 Tape and Reel Specification
3.7.1 Tape Dimension
                         
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HTSSOP-B40                           Package Information
3.7.2 Reel Dimension
(unit:mm)
      Reel Dimension       Reel Tolerance    
 A 330       ±2.0    
B 80 ±1.0
C 13 ±0.2
D 21 ±0.8
E 2 ±0.5
W1 25.5 ±1.0
 W2  29.5       ±1.0    
                         
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Lahe‘ Label Umt box (Unuzmm) Reel Labe‘ Des‘ccant Alummum-Iammaled enve‘ope Product No. Oul going inspeclion stamp \ Bx1234xxx xx ( Quanli1y\ Illlflllfl MINIMUM 2 Doopcs 0124 A5110F BX1234XXX xx m1 Lol number MNo 124 DZ] Dos MND 1274 324 pas MADE ‘4 PH‘L‘PPWES Imemal produd code Markmg lot number Pb Free Mark
HTSSOP-B40                           Package Information
3.8 Packing Method
1reel(s) or less per unit box
3.9 Packing Style
5unit boxes or less per shipping box
(unit:mm)
Shipping Box Dimension
X 372
Y 368
 Z  355
3.10 Label Specification
                         
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0.9. $0.3 ESE—Eggs; g n 0000000000 0 O O O O O O O O O O 6.0 H129 O O O O O O O O O O “““ O O O O O O O O O O O 5.0 1.2 :T-EEESEEEEEEEEEEEEE , , Ty mod mmd
HTSSOP-B40                           Package Information
4. Footprint dimensions
(unit:mm)
In actual design, please optimize in accordance with the situation of your board design and soldering
condition.
                     
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Production lot number Production week code Produc‘ion year code
HTSSOP-B40                           Package Information
5. Marking Specification
6. Storage conditions
6.1 Storage environment
Recommended storage conditions
          Min.  Max.     Unit
 Temperature 5 30 °C
 Humidity 40  70     % RH
6.2 Storage period
         Min.  Max.     Unit
 Storage period -  1    year
6.3 Specified storage period until soldering
          Min.  Max.     Unit
 Acceptable time -  168     hour
The above value is a time from opening the moisture-proof packaging until the soldering.
Cases where it is necessary to perform the drying process is the following.
Case 1 : in excess of the above-mentioned "Acceptable time"
Case 2 : it has passed more than a year not open
Recommended the dry process conditions
                 TemperatureC]     Time [hour]  
Reel(Note1) 60  48
Other Heat-proof container  125     24  
(Note1) When carrying out the dry process in a "Reel" state, the peelback strength will change.
Please refer to the following values:
             Min. Max.     Unit
 Peelback strength 0.2 0.9     N
The drying process is the impact on the solderability because the oxidation of the terminal portion
will occur. Therefore, specify the maximum times of the dry processing as follows:
Recommended execution count of the dry process
          Min.     Max.  Unit
 Execution count -     2 times
                         
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Package surface temperature 26° CMAX Pvehealmglempevamle 130‘c~190”c Preheaung zone 12059:: MAX Soldenng ‘emperzlme 22m ~ 230% Soldenng Empemm Solderlng zone 50sec MAX 1~4“ C/sec iNonce) \. Maxumum 2rumes somenng Preneaung tempevalule \ Time 10secMAX Preheahng Zone Soldenng Zone
HTSSOP-B40                           Package Information
7. Soldering conditions
7.1 Recommended temperature profile for reflow
7.2 Recommended condition for wave soldering
Preheating temperature : 120 °C to 150 °C
Preheating time : 60 sec MAX
Soldering temperature : 260 °C ±3 °C
Soldering time : 12 sec MAX
Notes for wave soldering
(1)Soldering time is provided for total soldering time in case of dual wave soldering.
(2) Do not use other soldering methods with wave soldering.
(3) Recommend to clean the board to eliminate flux, solder waste,
and other impurities for reliability, after soldering.
(4) Optimize soldering condition to prevent solder bridging.
(5) The heatsink may not be connected using wave soldering methods.
7.3 Recommended condition for solder iron
Solder iron temperature : 380 °C or less
Mounting time : 4 sec or less
Notes for solder iron
(1)The heatsink may not be connected using solder iron.
                                 
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ROHm SEMICONDUCTOR
R1102
A
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© 201 ROHM Co., Ltd. All rights reserved.
Notice
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Notes
The information contained herein is subject to change without notice.
Before you use our Products, please contact our sales representative
and verify the latest specifica-
tions :
Although ROHM is continuously working to improve product reliability and quality, semicon-
ductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safety
measures such as complying with the derating characteristics, implementing redundant and
fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no
responsibility for any damages arising out of the use of our Poducts beyond the rating specified by
ROHM.
Examples of application circuits, circuit constants and any other information contained herein are
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
any license to use or exercise intellectual property or other rights held by ROHM or any other
parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of
such technical information.
The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communi-
cation, consumer systems, gaming/entertainment sets) as well as the applications indicated in
this document.
The Products specified in this document are not designed to be radiation tolerant.
For use of our Products in applications requiring a high degree of reliability (as exemplified
below), please contact and consult with a ROHM representative : transportation equipment (i.e.
cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety
equipment, medical systems, servers, solar cells, and power transmission systems.
Do not use our Products in applications requiring extremely high reliability, such as aerospace
equipment, nuclear power control systems, and submarine repeaters.
ROHM shall have no responsibility for any damages or injury arising from non-compliance with
the recommended usage conditions and specifications contained herein.
ROHM has used reasonable care to ensur the accuracy of the information contained in this
document. However, ROHM does not warrants that such information is error-free, and ROHM
shall have no responsibility for any damages arising from any inaccuracy or misprint of such
information.
Please use the Products in accordance with any applicable environmental laws and regulations,
such as the RoHS Directive. For more details, including RoHS compatibility, please contact a
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non-compliance with any applicable laws or regulations.
When providing our Products and technologies contained in this document to other countries,
you must abide by the procedures and provisions stipulated in all applicable export laws and
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This document, in part or in whole, may not be reprinted or reproduced without prior consent of
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