BR25A512-3M Datasheet by Rohm Semiconductor

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ROHm ssmKuNuucTnR BR25A512-3M is not designed prmection against radioaclwe rays TSZOZZO1-0R2ROG100750-1-2 “29 6.0ct.2015 Rev.001
Datashee
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Product structureSilicon monolithic integrated circuitThis product is not designed protection against radioactive rays
1/29 TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
©2015 ROHM Co., Ltd. All rights reserved.
TSZ2211114001
www.rohm.com
Serial EEPROM Series Automotive EEPROM
105°C Operation SPI BUS EEPROM
BR25A512-3M
General Description
BR25A512-3M is a 512Kbit Serial EEPROM of SPI BUS Interface.
Features
High Speed Clock Action up to 10MHz (Max)
Wait Function by HOLDB Terminal
Part or Whole of Memory Arrays Settable as
Read only Memory Area by Program
2.5V to 5.5V Single Power Source Operation Most
Suitable for Battery Use
Up to 128 Bytes in Page Write Mode
For SPI Bus Interface (CPOL, CPHA) = (0, 0), (1, 1)
Self-timed Programming Cycle
Low Current Consumption
At Write Action (5V) : 0.7mA (Typ)
At Read Action (5V) : 2.4mA (Typ)
At Standby Action (5V) : 0.1µA (Typ)
Address Auto Increment Function at Read Action
Prevention of Write Mistake
Write Prohibition at Power On
Write Prohibition by Command Code (WRDI)
Write Prohibition by WPB Pin
Write Prohibition Block Setting by Status Registers
(BP1, BP0)
Prevention of Write Mistake at Low Voltage
More than 100 years Data Retention
More than 1 Million Write Cycles
Bit Format 64K×8
Initial Delivery Data
Memory Array : FFh
Status Register : WPEN, BP1, BP0 : 0
Packages W(Typ) x D(Typ) x H(Max)
TSSOP-B8
3.00mm x 6.40mm x 1.20mm
SOP8
5.00mm x 6.20mm x 1.71mm
SOP- J8
4.90mm x 6.00mm x 1.65mm
Figure 1.
Wale” (New
Datasheet
2/29
BR25A512-3M
TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
©2015 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
www.rohm.com
Absolute Maximum Ratings (Ta=25°C)
Parameter Symbol Ratings Unit Remarks
Supply Voltage VCC -0.3 to +6.5 V
Power Dissipation Pd
0.45 (SOP8)
W
When using at Ta=25°C or higher 4.5mW to be reduced per 1°C.
0.45 (SOP-J8) When using at Ta=25°C or higher 4.5mW to be reduced per 1°C.
0.33 (TSSOP-B8) When using at Ta=25°C or higher 3.3mW to be reduced per 1°C.
Storage Temperature Tstg - 65 to +150 °C
Operating Temperature Topr - 40 to +105 °C
Input Voltage /
Output Voltage - 0.3 to Vcc+1.0 V
The Max value of Input Voltage/Output Voltage is not over 6.5V.
When the pulse width is 50ns or less, the Min value of Input
Voltage/Output Voltage is not under -1.0V.
Junction Temperature Tjmax 150 °C Junction temperature at the storage condition
Electrostatic discharge
voltage
(human body model)
VESD -4000 to +4000 V
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Memory Cell Characteristics (Ta=25°C, Vcc=2.5V to 5.5V)
Parameter Limits Unit Condition
Min Typ Max
Write Cycles (Note1) 1,000,000 - - Times Ta25°C
150,000 - - Times Ta105°C
Data Retention (Note1) 100 - - Years Ta25°C
20 - - Years Ta105°C
(Note1) Not 100% TESTED
Recommended Operating Ratings
Parameter Symbol Ratings Unit
Min Max
Power Source Voltage Vcc 2.5 5.5 V
Input Voltage VIN 0 VCC V
Bypass capacitor C 0.1 - µF
Input / Output Capacity (Ta=25°C, frequency=5MHz)
Parameter Symbol Min Max Unit Conditions
Input Capacity (Note1) C
IN - 8 pF VIN=GND
Output Capacity (Note1) C
OUT - 8 VOUT=GND
(Note1) Not 100% TESTED.
DC Characteristics (Unless otherwise specified, Ta=-40°C to +105°C, Vcc=2.5V to 5.5V)
Parameter Symbol Limits Unit Conditions
Min Typ Max
Input High Voltage VIH 0.7 x Vcc - Vcc+1.0 V
Input Low Voltage VIL -0.3
(Note1) - 0.3 x Vcc V
Output Low Voltage VOL 0 - 0.4 V IOL=3.0mA
Output High Voltage VOH Vcc-0.2 - Vcc V IOH=-2.0mA
Input Leakage Current ILI - 1 - 1 µA VIN=0 to Vcc
Output Leakage Current ILO - 1 - 1 µA VOUT=0 to Vcc, CSB=Vcc
Supply Current (Write)
ICC1 - - 1.5 mA Vcc=2.5V, fSCK=5MHz, tE/W=5ms
Byte Write, Page Write, Write Status Register
ICC2 - - 2 mA Vcc=5.5V, fSCK=10MHz, tE/W=5ms
Byte Write, Page Write, Write Status Register
Supply Current (Read) ICC3 - - 4 mA
Vcc=5.5V, fSCK=10MHz, SO=OPEN
Read, Read Status Register
VIH/VIL=0.9Vcc/0.1Vcc
Standby Current ISB - - 10 µA Vcc=5.5V, SO=OPEN
CSB=HOLDB=WPB=Vcc, SCK=SI=Vcc or GND
(Note1) When the pulse width is 50ns or less, it is -1.0V.
w P 9 fi
Datasheet
3/29
BR25A512-3M
TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
©2015 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
www.rohm.com
AC Characteristics (Ta=-40°C to +105°C, 2.5VVcc<4.0V CL=30pF, 4.0VVcc5.5V CL=50pF)
Parameter Symbol 2.5VVcc5.5V 4.0VVcc5.5V Unit
Min Typ Max Min Typ Max
SCK Frequency fSCK 0.01 - 5 0.01 - 10 MHz
SCK High Time tSCKWH 80 - - 40 - - ns
SCK Low Time tSCKWL 80 - - 40 - - ns
CSB High Time tCS 40 - - 40 - - ns
CSB Setup Time tCSS 30 - - 30 - - ns
CSB Hold Time tCSH 30 - - 30 - - ns
SCK Setup Time tSCKS 20 - - 20 - - ns
SCK Hold Time tSCKH 20 - - 20 - - ns
SI Setup Time tDIS 10 - - 10 - - ns
SI Hold Time tDIH 10 - - 10 - - ns
Data Output Delay Time tPD - - 70 - - 40 ns
Output Hold Time tOH 0 - - 0 - - ns
Output Disable Time tOZ - - 40 - - 40 ns
HOLDB Setting Setup Time tHFS 0 - - 0 - - ns
HOLDB Setting Hold Time tHFH 20 - - 10 - - ns
HOLDB Release Setup Time tHRS 0 - - 0 - - ns
HOLDB Release Hold Time tHRH 20 - - 10 - - ns
Time from HOLDB to Output High-Z tHOZ - - 40 - - 40 ns
Time from HOLDB to Output change tHPD - - 40 - - 40 ns
SCK Rise Time (Note1) t
RC - - 2 - - 2 µs
SCK Fall Time (Note1) t
FC - - 2 - - 2 µs
OUTPUT Rise Time (Note1) t
RO - - 40 - - 40 ns
OUTPUT Fall Time (Note1) t
FO - - 40 - - 40 ns
Write Cycle Time tE/W - - 5 - - 5 ms
(Note1) NOT 100% TESTED
AC Timing Characteristics Conditions
Parameter Symbol Limits Unit Condition
Min Typ Max
Load Capacity CL - - 30 pF 2.5VVcc<4.0V
- - 50 pF 4.0VVcc5.5V
Input Voltage - 0.2Vcc/0.8Vcc V
Input / Output Judgment Voltage - 0.3Vcc/0.7Vcc V
Serial Input / Output Timing
Figure 2-(a). Input timing Figure 2-(b). Input / Output timing
CSB
SCK
SI
SO
tCS tCSS
tSCKS tSCKWL tSCKWH
tDIS tDIH
tRC tFC
High-Z
CSB
SCK
SI
SO
tPD tOH tRO,tFO tOZ
tCSH tSCKH
tCS
Hi
g
h-Z
Figure 2-(c). HOLD timing
CSB
SC
K
SI n+1
"H"
"L"
n
Dn
n-1
Dn Dn-1
HOLDB
SO Dn+1
tHFS tHFH
tHOZ
tHRS tHRH
tDIS
tHPD
High-Z
SI is taken into IC inside in sync with data rise edge of
SCK. Input address and data from the most significant bit
MSB.
SO is output in sync with data fall edge of SCK. Data is
output from the most significant bit MSB.
BR25A512—3M Block Diagram V CSE I VOLYAGE :l INSYRUCTION DECODE DETEcTIoN CONTROL CLOCK ¢ —> GENERAYION _) WRITE _> HIGH VOLTAGE SO 2 1 ‘ INHIBIYION GENERAYOR :l INSYRUCTION _) REGISTER smus REGISTER WPB :I " ADDRESS ADDRESS \ :| REGISTER DECODER J 511K EEPROM _> DATA h READ/WRIYE GND 4 REGISTER “ AMP |—:| Figure 3. Block Diagram Pin Configuration figure 4. PM ConiIguratIon Pin Descriptions TermInaI Input . name IOutput FunctIon Vcc - Power source to be connected GND - All input / output reference voltage‘ UV 085 Input CnIp seIect Input SCK Input SerIaI clock Input SI Input Ope code, address, and seriaI data input SO Output Serial data output Hold input HOLDB Input Command commumcations may be suspended temporarily (HOLD status) Write protect input WPB Input Write status register command is prohibited www mnmmm ©2015 ROHM Co , Ltd, AII fights reserved 4/29 13202201 'ORZR Tszzzm-Ia-um 6.0ct
Datasheet
4/29
BR25A512-3M
TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
©2015 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
www.rohm.com
Block Diagram
Pin Configuration
Pin Descriptions
Terminal
name
Input
/Output Function
Vcc - Power source to be connected
GND - All input / output reference voltage, 0V
CSB Input Chip select input
SCK Input Serial clock input
SI Input Ope code, address, and serial data input
SO Output Serial data output
HOLDB Input
Hold input
Command communications may be suspended
temporarily (HOLD status)
WPB Input Write protect input
Write status register command is prohibited
Figure 3. Block Diagram
Figure 4. Pin Configuration
INSTRUCTION DECODE
CONTROL CLOCK
GENERATION
VOLTAGE
DETECTION
WRITE
INHIBITION
HIGH VOLTAGE
GENERATOR
INSTRUCTION
REGISTER
512K
EEPROM
ADDRESS
REGISTER
DATA
REGISTER
ADDRESS
DECODER
READ/WRITE
AMP
8bit
STATUS
REGISTER
1
CSB
2
SO
3
WPB
4
GND
8
Vcc
7
HOLDB
6
SCK
5
SI
16bit
8bit
16bit
(TOP VIEW)
Vcc HOLDB SCK SI
CSB SO WPB GND
/ ’ / / /(—"—“
Datasheet
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BR25A512-3M
TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
©2015 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
www.rohm.com
Figure 7. Output Low Voltage vs Output Current
(Vcc=2.5V)
Figure 5. Input High Voltage vs Supply Voltage
(CSB,SCK,SI,HOLDB,WPB)
Figure 6. Input Low Voltage vs Supply Voltage
(CSB,SCK,SI,HOLDB,WPB)
Figure 8. Output High Voltage vs Output Current
(Vcc=2.5V)
Typical Performance Curves
(The following characteristic data are Typ Values.)
0
1
2
3
4
5
6
0123456
Vcc [V]
V
IH
[V]
Ta= -40°C
Ta= 25°C
Ta= 105°C
SPEC
0
1
2
3
4
5
6
0123456
Vcc [V]
V
IL
[V]
SPEC
Ta= -40°C
Ta= 25°C
Ta= 105°C
0
0.2
0.4
0.6
0.8
1
0123456
IOL [mA]
VOL [V]
SPEC
Ta= -40°C
Ta= 25°C
Ta= 105°C
2.2
2.3
2.4
2.5
2.6
00.511.522.5
IOH [mA]
VOH [V]
SPEC
Ta= - 40°C
Ta= 25°C
Ta= 105°C
Datasheet
6/29
BR25A512-3M
TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
©2015 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
www.rohm.com
Figure 10. Output Leakage Current vs Supply Voltage
(SO)
Figure 9. Input Leakage Current vs Supply Voltage
(CSB,SCK,SI,HOLDB,WPB)
Figure 11. Supply Current (Write) vs Supply Voltage
(fSCK=5MHz) Figure 12. Supply Current (Write) vs Supply Voltage
(fSCK=10MHz)
Typical Performance CurvesContinued
0
0.2
0.4
0.6
0.8
1
1.2
0123456
Vcc [V]
I
LI
[uA]
SPEC
Ta=-4C
Ta= 25°C
Ta= 105°C
0
0.2
0.4
0.6
0.8
1
1.2
0123456
Vcc [V]
I
LO
[uA]
SPEC
Ta=-40°C
Ta= 25°C
Ta= 105°C
0
1
2
3
4
0123456
Vcc [V]
I
CC2
[mA]
SPEC
Ta= - 40°C
Ta= 25°C
Ta= 105°C
0
1
2
3
4
0123456
Vcc [V]
ICC1 [mA]
SPEC
Ta= - 40°C
Ta= 25°C
Ta= 105°C
Datasheet
7/29
BR25A512-3M
TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
©2015 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
www.rohm.com
Figure 14. Standby Current vs Supply Voltage Figure 15. SCK Frequency vs Supply Voltage
Figure 13. Supply Current (Read) vs Supply Voltage
(fSCK=10MHz)
Typical Performance CurvesContinued
0
2
4
6
8
10
12
0123456
Vcc [V]
ISB [uA]
SPEC
Ta= -40°C
Ta= 25°C
Ta= 105°C
0
2
4
6
8
10
0123456
Vcc [V]
I
CC2
[mA]
Ta= - 40°C
Ta= 25°C
Ta= 105°C
SPEC
0.1
1
10
100
0123456
Vcc [V]
f
SCK
[MHz]
Ta= -40°C
Ta= 25°C
Ta= 105°C
SPEC
SPEC
Datasheet
8/29
BR25A512-3M
TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
©2015 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
www.rohm.com
Figure 16. SCK High Time vs Supply Voltage Figure 17. SCK Low Time vs Supply Voltage
Typical Performance CurvesContinued
0
10
20
30
40
50
60
70
80
90
100
0123456
Vcc [V]
t
SCKW H
[ns]
Ta= - 40°C
Ta= 2C
Ta= 105°C
SPEC
SPEC
0
10
20
30
40
50
60
70
80
90
100
0123456
Vcc [V]
t
SCKWL
[ns]
Ta=-40°C
Ta= 25°C
Ta= 105°C
SPEC
SPEC
Datasheet
9/29
BR25A512-3M
TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
©2015 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
www.rohm.com
Figure 18. CSB High Time vs Supply Voltage Figure 19. CSB Setup Time vs Supply Voltage
Figure 20. CSB Hold Time vs Supply Voltage Figure 21. SI Setup Time vs Supply Voltage
Typical Performance CurvesContinued
0
10
20
30
40
50
60
0123456
Vcc [V]
t
CS
[ns]
Ta=-40°C
Ta= 25°C
Ta= 105°C
SPEC
0
10
20
30
40
50
0123456
Vcc [V]
t
CSS
[ns]
Ta= - 40°C
Ta= 2C
Ta= 105°C
SPEC
0
10
20
30
40
50
0123456
Vcc [V]
t
CSH
[ns]
Ta=-40°C
Ta= 25°C
Ta= 105°C
SPEC
-5
0
5
10
15
20
25
30
0123456
Vcc [V]
t
DIS
[ns]
Ta= - 40°C
Ta= 25°C
Ta= 105°C
SPEC
Datasheet
10/29
BR25A512-3M
TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
©2015 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
www.rohm.com
Figure 23. Data Output Delay Time vs Supply Voltage
Figure 24. Output Disable Time vs Supply Voltage Figure 25. HOLDB Setting Hold Time vs Supply Voltage
Figure 22. SI Hold Time vs Supply Voltage
Typical Performance CurvesContinued
-5
0
5
10
15
20
25
30
0123456
Vcc [V]
t
DIH
[ns]
Ta= - 40°C
Ta= 25°C
Ta= 105°C
SPEC
0
10
20
30
40
0123456
Vcc [V]
t
HFH
[ns]
SPEC
SPEC
Ta=-40°C
Ta= 25°C
Ta= 105°C
0
10
20
30
40
50
60
0123456
Vcc [V]
t
OZ
[ns]
SPEC
Ta= - 40°C
Ta= 25°C
Ta= 105°C
0
10
20
30
40
50
60
70
80
90
100
0123456
Vcc [V]
t
PD
[ns]
SPEC
Ta=-40°C
Ta= 25°C
Ta= 105°C
SPEC
Datasheet
11/29
BR25A512-3M
TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
©2015 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
www.rohm.com
Figure 26. HOLDB Release Hold Time vs Supply Voltage Figure 27. Time from HOLDB to Output High-Z
vs Supply Voltage
Figure 28. Time from HOLDB to Output change
vs Supply Voltage
Figure 29. OUTPUT Rise Time vs Supply Voltage
Typical Performance CurvesContinued
0
10
20
30
40
0123456
Vcc [V]
t
HRH
[ns]
SPEC
SPEC
Ta= - 40°C
Ta= 25°C
Ta= 105°C
0
10
20
30
40
50
60
0123456
Vcc [V]
t
HOZ
[ns]
SPEC
Ta= - 40°C
Ta= 2C
Ta= 105°C
0
10
20
30
40
50
60
0123456
Vcc [V]
t
HPD
[ns]
SPEC
Ta= -40°C
Ta= 25°C
Ta= 105°C
0
10
20
30
40
50
60
0123456
Vcc [V]
t
RO
[ns]
SPEC
Ta= - 40°C
Ta= 25°C
Ta= 105°C
Datasheet
12/29
BR25A512-3M
TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
©2015 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
www.rohm.com
Figure 30. OUTPUT Fall Time vs Supply Voltage Figure 31. Write Cycle Time vs Supply Voltage
Typical Performance CurvesContinued
0
10
20
30
40
50
60
0123456
Vcc [V]
t
FO
[ns]
Ta=-40°C
Ta= 25°C
Ta= 105°C
SPEC
0
1
2
3
4
5
6
0123456
Vcc [V]
t
E/W
[ms]
Ta= - 40°C
Ta= 25°C
Ta= 105°C
SPEC
Datasheet
13/29
BR25A512-3M
TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
©2015 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
www.rohm.com
Features
1. Status Registers
This IC has status register. The status register expresses the following parameters of 8 bits.
BP0 and BP1 can be set by write status register command. These 2 bits are memorized into the EEPROM, therefore are
valid even when power source is turned off.
Rewrite characteristics and data hold time are same as characteristics of the EEPROM.
WEN can be set by write enable command and write disable command. WEN becomes write disable status when power
source is turned off. R/B is for write confirmation, therefore cannot be set externally.
The value of status register can be read by read status register command.
(1) Contexture of Status Register
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
WPEN 0 0 0 BP1 BP0 WEN
R
/B
bit Memory
location Function
WPEN EEPROM
WPB pin enable / disable designation bit
WPEN=0=invalid
WPEN=1=valid
BP1
BP0 EEPROM EEPROM write disable block designation bit
WEN registers
Write and write status register write enable / disable status confirmation bit
WEN=0=prohibited
WEN=1=permitted
R
/B registers
Write cycle status (READY / BUSY) status confirmation bit
R
/B=0=READY
R
/B=1=BUSY
(2) Write Disable Block Setting
BP1 BP0 Write disable block
0 0 None
0 1 C000h-FFFFh
1 0 8000h-FFFFh
1 1 0000h-FFFFh
2. WPB Pin
By setting WPB=LOW, write command is prohibited. And the write command to be disabled at this moment is WRSR.
However, when write cycle is in execution, no interruption can be made.
WRSR WRITE
Prohibition possible
but WPEN bit “1”
Prohibition
impossible
3. HOLDB Pin
By HOLDB pin, data transfer can be interrupted. When SCK=”0”, by making HOLDB from “1” into”0”, data transfer to
EEPROM is interrupted. When SCK = “0”, by making HOLDB from “0” into “1”, data transfer is restarted.
~5an 5‘ . 9 n n . D ‘ MEL Figure 34. Read command By read command, data of EEPROM can be read, As for this command, set CSB LO code, EEPROM starts data output of the designated address. Data output is star from D7 to D0 sequentially. This IC has increment read function. After output of data of SCK. data ofthe next address can be read. Increment read can read aii the addr of the most significant address, by continuing increment read, data of the most insig www rohm.com ©2015 ROHM CO , Ltd, Ali n hts reserved TSZ22||1-15-OO| 9 14/29
Datasheet
14/29
BR25A512-3M
TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
©2015 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
www.rohm.com
Command Mode
Command Contents Ope code
WREN Write Enable Command 0000 0110
WRDI Write Disable Command 0000 0100
READ Read Command 0000 0011
WRITE Write Command 0000 0010
RDSR Read Status Register Command 0000 0101
WRSR Write Status Register Command 0000 0001
Timing Chart
1. Write Enable (WREN) / Disable (WRDI) Command
This IC has write enable status and write disable status. It is set to write enable status by write enable command, and it is
set to write disable status by write disable command. As for these commands, set CSB LOW, and then input the
respective ope codes. The respective commands are accepted at the 7-th clock rise. Even with input over 7 clocks,
command becomes valid.
When to carry out write command, it is necessary to set write enable status by the write enable command. If write
command is input in the write disable status, the command is cancelled. And even in the write enable status, once write
command is executed, it gets in the write disable status. After power on, this IC is in write disable status.
2. Read Command (READ)
By read command, data of EEPROM can be read. As for this command, set CSB LOW, then input address after read ope
code. EEPROM starts data output of the designated address. Data output is started from SCK fall of 23-th clock, and
from D7 to D0 sequentially. This IC has increment read function. After output of data for 1 byte (8bits), by continuing input
of SCK, data of the next address can be read. Increment read can read all the addresses of EEPROM. After reading data
of the most significant address, by continuing increment read, data of the most insignificant address is read.
WREN (WRITE ENABLE): Write enable
Figure 32. Write enable command
High-Z
603 712 45
CSB
SCK
SO
SI
00000110
Figure 33. Write disable command
WRDI (WRITE DISABLE): Write disable
High-Z
0000
SI
0100
0312 4 7
CSB
SCK
5 6
SO
Figure 34. Read command
High-Z
11
1 1 0
0 3 7 1 2
D6
SO
CSB
SCK
SI
4 5
A
12
6 8
A
15
A
0
A
1
D7
23 3024
D0
0 0 0 0 0
D2 D1
910
A
13
A
14
30 31
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Datasheet
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BR25A512-3M
TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
©2015 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
www.rohm.com
3. Write Command (WRITE)
By write command, data of EEPROM can be written. As for this command, set CSB LOW, then input address and data
after write ope code. Then, by making CSB HIGH, the EEPROM starts writing. The write time of EEPROM requires time
of tE/W (Max 5ms). During tE/W, other than read status register command is not accepted. Set CSB HIGH between taking
the last data (D0) and rising the next SCK clock. At the other timing, write command is not executed, and this write
command is cancelled. This IC has page write function, and after input of data for 1 byte (8 bits), by continuing data input
without setting CSB HIGH, 2byte or more data can be written for one tE/W. Up to 128 arbitrary bytes can be written. In
page write, the insignificant 7 bit of the designated address is incremented internally at every time when data of 1 byte is
input and data is written to respective addresses. When data of the maximum bytes or higher is input, address rolls over,
and previously input data is overwritten.
4. Write Status Register, Read Status Register Command (WRSR/RDSR)
Write status register command can write data of status register. The data can be written by this command are 3 bits, that
is, WPEN (bit7), BP1 (bit3) and BP0 (bit2) among 8 bits of status register. By BP1 and BP0, write disable block of
EEPROM can be set. As for this command, set CSB LOW, and input ope code of write status register, and input data.
Then, by making CSB HIGH, EEPROM starts writing. Write time requires time of tE/W as same as write. As for CSB rise,
set CSB HIGH between taking the last data bit (bit0) and the next SCK clock rising. At the other timing, command is
cancelled. Write disable block is determined by BP1 BP0, and the block can be selected from 1/4, 1/2, and entire of
memory array (Refer to the write disable block setting table.). To the write disabled block, write cannot be made, and only
read can be made.
Figure 35. Write command
CSB
SCK
High-Z
*=Don't care
0 0 0 0 1 WPEN
0
1 2 4
0
SI
SO
0 3 7 8 5 6
*
9 10 11 12 13 14 15
* *BP1 BP0 * *
bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
0
Figure 36. Write status register
Figure 37. Read status register command
High-Z bit7 bit6 bit5 bit4
00 0
bit3 bit2 bit1 bit0
13
CSB
SCK
SI 1 1
106
0
SO
141 2
WEN R/B
11 153 7 9
0
5 12
0 0 0 0 0
4 8
WPEN BP1 BP0
High-Z
31
D0
0 0 0 0 0 D2 D1D7
23 3024
D6
0
0
1
A
15
1
1 2 4
0
CSB
SCK
SI
SO
0 3 7 85 6
12
11
910
13
14
Figur HOLDB Pin By HOLDB pin, command comm carried ou: when :he HOLDB p HOLDB pin LOW. AL HOLD sla‘ me HOLD s‘alus‘ se‘ me HOLD before me HOLD slams. For ex s‘alus, by s‘aning A4 address CSB:HIGH m HOLD slams, Ihe www mhm.com ©2015 ROHM Co , Ltd, AH rights reserve Tszzzm - 15-001
Datasheet
16/29
BR25A512-3M
TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
©2015 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
www.rohm.com
WPB Cancel Valid Area
WPB is normally fixed to “H” or “L” for use, but when WPB is controlled so as to cancel write status register command, pay
attention to the following WPB valid timing.
While write status register command is executed, by setting WPB = “L” in cancel valid area, command can be cancelled.
The area from command ope code to CSB rise at internal automatic write start becomes the cancel valid area. However,
once write is started, by any input write cycle cannot be cancelled. WPB input becomes Don’t Care, and cancellation
becomes invalid.
HOLDB Pin
By HOLDB pin, command communication can be stopped temporarily (HOLD status). The command communications are
carried out when the HOLDB pin is HIGH. To get in HOLD status, at command communication, when SCK=LOW, set the
HOLDB pin LOW. At HOLD status, SCK and SI become Don’t Care, and SO becomes high impedance (High-Z). To release
the HOLD status, set the HOLDB pin HIGH when SCK=LOW. After that, communication can be restarted from the point
before the HOLD status. For example, when HOLD status is made after A5 address input at read, after release of HOLD
status, by starting A4 address input, read can be restarted. When in HOLD status, keep CSB LOW. When it is set
CSB=HIGH in HOLD status, the IC is reset, therefore communication after that cannot be restarted.
Figure 38. WPB valid timing (At inputting WRSR command)
6 7
Op e Code Data tE/W
Data write time
SCK 15 16
Invalid Va li d In valid
Datasheet ummended m use In when 035 is sel HlGH‘ write slans usmg 083. c . Afler16-lh clock rise, Cancellalion is available by CSB:"H". However‘ if write slans (033 is nsed) ln lhe area b‘ cancellation cannm be made by any means, And‘ by inpuning on SCK clock‘ cancellalion cannot be made. Nerel) If Vcc is made OFF during wrile execuhon designaled address aara Is nor guaranlee NuleZ) if 055 is rised al (be same liming as mar ul me SCK rise, wrrle execullun /cancel be SCK : “L' area As for SCK use, assure liming cf less / lcsu or more 4, WRENIWRDl a . From ope code in 74h clock riser cancellalion is available by 088 : “H" M b . Cancellalion is nm available 74h clock. Figure 43. WR www rohm.com ©2015 ROHM Co , Ltd, All n his reserved T TSZZZm-lS-Dm 9 17/29
Datasheet
17/29
BR25A512-3M
TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
©2015 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
www.rohm.com
Method to Cancel Each Command
1. READ, RDSR
Method to cancel : cancel by CSB = “H”.
2. WRITE, PAGE WRITE
aOpe code or address input area
Cancellation is available by CSB=”H”.
bData input area (D7 to D1 input area)
Cancellation is available by CSB=”H”.
cData input area (D0 area)
In this area, cancellation is not available.
When CSB is set HIGH, write starts.
dtE/W area
In the area c, by rising CSB, write starts.
While writing, by any input, cancellation cannot be made.
Note1) If Vcc is made OFF during write execution, designated address data is not guaranteed, therefore write it once again.
Note2) If CSB is rised at the same timing as that of the SCK rise, write execution / cancel becomes unstable, therefore, it is recommended to rise in
SCK = “L” area. As for SCK rise, assure timing of tCSS / tCSH or more.
3. WRSR
aFrom ope code to 15-th clock rise
Cancellation is available by CSB=”H”.
bFrom 15-th clock rise to 16-th clock rise (write enable area)
In this area, cancellation is not available by CSB=”H”.
When CSB is set HIGH, write starts using CSB.
cAfter 16-th clock rise.
Cancellation is available by CSB=”H”.
However, if write starts (CSB is rised)
In the area b, cancellation cannot be made by any means.
And, by inputting on SCK clock, cancellation cannot be made.
Note1) If Vcc is made OFF during write execution, designated address data is not guaranteed, therefore write it once again
Note2) If CSB is rised at the same timing as that of the SCK rise, write execution / cancel becomes unstable, therefore, it is recommended to rise in
SCK = “L” area. As for SCK rise, assure timing of tCSS / tCSH or more.
4. WREN/WRDI
aFrom ope code to 7-th clock rise, cancellation is available by CSB = “H”.
bCancellation is not available 7-th clock.
Figure 39. READ cancel valid timing Figure 40. RDSR cancel valid timing
Figure 43. WREN/WRDI cancel valid timing
Ope code Address
a
Data tE/W
b d
c
8bits 8bits
16bits
D7
b
D6 D5 D4 D3 D2 D1 D0
SCK
SI
c
Figure 42. WRSR cancel valid timing
Ope code Address
Cancel available in all areas of read mode
Data
8 bits 8 bits
16 bits
Ope code
Cancel available in all
areas of rdsr mode
Data
8 bits 8 bits
Ope code Data tE/W
8 bits
14 15 16 17
D1 D0
a b c
8 bits
a
b
c
SCK
SI
Ope code
8 bits
6 7 8
a b
SCK
Figure 41. WRITE cancel valid timing
Datasheet
18/29
BR25A512-3M
TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
©2015 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
www.rohm.com
I/O Peripheral Circuits
In order to realize stable high speed operations, pay attention to the following input / output pin conditions.
Input pin pull up, pull down resistance
When to attach pull up, pull down resistance to EEPROM input pin, select an appropriate value for the microcontroller VOL,
IOL with considering VIL characteristics of this IC.
1. Pull Up Resistance
And, in order to prevent malfunction or erroneous write at power ON/OFF, be sure to make CSB pull up.
2. Pull Down Resistance
Further, by amplitude VIHE, VILE of signal input to EEPROM, operation speed changes. By inputting Vcc/GND level
amplitude of signal, more stable high speed operations can be realized. On the contrary, when amplitude of 0.8VCC /
0.2Vcc is input, operation speed becomes slow. (Note1)
In order to realize more stable high speed operation, it is recommended to make the values of RPU, RPD as large as
possible, and make the amplitude of signal input to EEPROM close to the amplitude of VCC / GND level.
(Note1) In this case, guaranteed value of operating timing is guaranteed.
3. SO Load Capacity Condition
Load capacity of SO output pin affects upon delay characteristic of SO output (Data output delay time, time from HOLDB
to High-Z, Output rise time, Output fall time.). In order to make output delay characteristic into better, make SO load
capacity small.
4. Other cautions
Make the each wire length from the microcontroller to EEPROM input pin same length, in order to prevent setup / hold
violation to EEPROM, owing to difference of wire length of each input.
EEPROM
SO
CL
Figure 46. SO load capacity
Figure 44. Pull up resistance
Figure 45. Pull down resistance
・・・③
・・・④
Example) When VCC=5V, VOHM=VCC-0.5V, IOHM0.4mA,
V
IHE=VCC×0.7V, from the equation,
・・・①
・・・②
With the value of Rpu to satisfy the above equation, VOLM
becomes 0.4V or lower, and with VILE (=1.5V), the equation is
also satisfied.
VILE :EEPROM VIL specifications
VOLM :Microcontroller VOL specifications
IOLM :Microcontroller IOL specifications
Example) When Vcc=5V, VILE=1.5V, VOLM=0.4V, IOLM=2mA,
from the equation ,
IOLM
VILE VOLM
“L” output “L” input
Microcontroller EEPROM
RPU
IOHM
VIHE VOHM
Microcontroller EEPROM
“H” output “H” input
RPD
ILMOLM VV  
OLM
OLM
PU I
VVcc
R
][3.2
102
4.05
3
kR
R
PU
PU
IHMOLMVV
I
V
ROHM
OHM
PD
 
][3.11
104.0
5.05
3
kR
R
PD
PD
>—‘>R HQ >i Figure 47. SO output equivalent circuit 2 input Circuit Figure 48. CSB input eqmvaient Circuit internal signai Figure 49. SCK input equivalent circuit Figure 50. SI mp internal “”5 signai Figure 51. HOLDB input equivalent circuit Figure 52. WPB www mnm.com ©2015 ROHM Co , Ltd, Ali rights reserved 19/29 T TSZZZHi-iS-DD!
Datasheet
19/29
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TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
©2015 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
www.rohm.com
I/O Equivalence Circuit
1. Output Circuit
2. Input Circuit
Figure 51. HOLDB input equivalent circuit Figure 52. WPB input equivalent circuit
Figure 47. SO output equivalent circuit
Figure 48. CSB input equivalent circuit
Figure 49. SCK input equivalent circuit Figure 50. SI input equivalent circuit
SO
internal
signal
internal
signal
CSB internal
signal
internal
signal
SCK in terna l
signal
SI in terna l
signal
HOLDB in terna l
signal
WPB interna l
signal
Figu A At Power on Malfunction Preventing Fun This K) has a POR (Power On Reset) c status. The FOR Circuit is valid only whe recommended conditions of the followin noises and the likes Vcc Figure 55. Rise wavefo 5 Low Voltage Malfunction Preventing Fun LVCC (Vac-Lockout) Circuit prevents dat At LVCC voltage (Typ : 1.2V) or below, www mhm.com ©2015 ROHM Co , Ltd, All rights reserved Tszzzm - 15-001
Datasheet
20/29
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TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
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Power-Up/Down Conditions
1. At Standby
Set CSB “H”, and be sure to set SCK, SI input “L” or “H”. Do not input intermediate electric potantial.
2. At Power ON/OFF
When Vcc rise or fall, set CSB=”H” (=Vcc).
When CSB is “L”, this IC gets in input accept status (active). If power is turned on in this status, noises and the likes may
cause malfunction, erroneous write or so. To prevent these, at power ON, set CSB “H”. (When CSB is in “H” status, all
inputs are canceled.)
(Good example) CSB terminal is pulled up to Vcc.
At power OFF, take 10ms or more before supply. If power is turned on without observing this condition, the IC
internal circuit may not be reset.
(Bad example) CSB terminal is “L” at power ON/OFF.
In this case, CSB always becomes “L” (active status), and EEPROM may have malfunction or erroneous write owing
to noises and the likes.
Even when CSB input is High-Z, the status becomes like this case.
3. Operating Timing after Power ON
As shown in Figure 54, at standby, when SCK is “H”, even if CSB is fallen, SI status is not read at fall edge. SI status is
read at SCK rise edge after fall of CSB. At standby and at power ON/OFF, set CSB “H” status.
4. At Power on Malfunction Preventing Function
This IC has a POR (Power On Reset) circuit as mistake write countermeasure. After POR action, it gets in write disable
status. The POR circuit is valid only when power is ON, and does not work when power is OFF. When power is ON, if the
recommended conditions of the following tR, tOFF, and Vbot are not satisfied, it may become write enable status owing to
noises and the likes.
Recommended conditions of tR, tOFF, Vbot
tR t
OFF Vbot
10ms or below 10ms or higher 0.3V or below
100ms or below 10ms or higher 0.2V or below
5. Low Voltage Malfunction Preventing Function
LVCC (Vcc-Lockout) circuit prevents data rewrite action at low power, and prevents wrong write.
At LVCC voltage (Typ = 1.2V) or below, it prevent data rewrite.
tR
tOFF Vbot
0
Vcc
Figure 53. CSB timing at power ON/OFF
CSB
Vcc
Bad example Good example
Figure 55. Rise waveform
Figure 54. Operating timing
0 1 2
Command start here. SI is read.
Even if CSB is fallen at SCK=”H”,
SI status is not read at that edge.
CSB
SCK
SI
Datasheet
21/29
BR25A512-3M
TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
©2015 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
www.rohm.com
Noise Countermeasures
1. Vcc Noise (bypass capacitor)
When noise or surge gets in the power source line, malfunction may occur, therefore, for removing these, it is
recommended to attach a bypass capacitor (0.1µF) between IC Vcc and GND. At that time, attach it as close to IC as
possible.
And, it is also recommended to attach a bypass capacitor between board Vcc and GND.
2. SCK Noise
When the rise time of SCK (tRC) is long, and a certain degree or more of noise exists, malfunction may occur owing to
clock bit displacement. To avoid this, a Schmitt trigger circuit is built in SCK input. The hysteresis width of this circuit is set
about 0.2V, if noises exist at SCK input, set the noise amplitude 0.2Vp-p or below. And it is recommended to set the rise
time of SCK (tRC) 100ns or below. In the case when the rise time is 100ns or higher, take sufficient noise
countermeasures. Make the clock rise, fall time as small as possible.
3. WPB Noise
During execution of write status register command, if there exist noises on WPB pin, mistake in recognition may occur
and forcible cancellation may result. To avoid this, a Schmitt trigger circuit is built in WPB input. In the same manner, a
Schmitt trigger circuit is built in CSB input, SI input and HOLDB input too.
Datasheet
22/29
BR25A512-3M
TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
©2015 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
www.rohm.com
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
Datasheet
23/29
BR25A512-3M
TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
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TSZ2211115001
www.rohm.com
Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The
operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical
damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an
input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when
no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins
have voltages within the values specified in the electrical characteristics of this IC.
Datasheet
24/29
BR25A512-3M
TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
©2015 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
www.rohm.com
Ordering Information
B R 2 5 A 5 1 2 x x x - 3 M G E 2
Lineup
Capacity Package Orderable Part Number
Type Quantity
512K
SOP8 Reel of 2500 BR25A512F -3MGE2
SOP-J8 BR25A512FJ -3MGE2
TSSOP-B8 Reel of 3000 BR25A512FVT -3MGE2
BUS Type
25 : SPI
Operating Temperature
/
V
oltage
-40°C to +105°C / 2.5V to 5.5V
Process Code
Packaging and Forming Specification
E2 : Embossed tape and reel
Capacity
512 = 512
G : Halogen free
Package
F : SOP8
FJ : SOP-J8
FVT : TSSOP-B8
Product Rank
M : for Automotive
o 42+0 Ms \M .i + ; OHm A ‘~‘.o ? OOOOOOOOOOOOOOOO fififlfiflfififi 2/
Datasheet
25/29
BR25A512-3M
TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
©2015 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
www.rohm.com
Physical Dimension, Tape and Reel Information
Package Name SOP8
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1
(Max 5.35 (include.BURR))
4. 9+0 2 Max5.25\1nu1udc.EURR) 4 ,4 z 2 a v 0. 545 1 ‘375i0 Kr KL (L'NIT:mm) H ‘ __ _ T _ 3 ‘ PKG:SOP—JB _ \ Drawing N\LEX111*5002 , 1. 27 o AZLO l C ‘
Datasheet
26/29
BR25A512-3M
TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
©2015 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
www.rohm.com
Physical Dimension, Tape and Reel Information
Package Name SOP-J8
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
3 0+0 | GHX'K as (”mm mm: f MM 2 u «V4 n |:EE ’E]: VI:EE |:EE mm mm V #0 mm (UH ” . W manger n5 . u (H u 143‘”; H mm Draw)“: .\o. 900573001 ] o o o o o o o o o o E. j :- 3 E‘ j E. j :- j E j E j j E j E j E j E j E j E j E j E j E 9 E j E j E j \—1
Datasheet
27/29
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TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
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TSZ2211115001
www.rohm.com
Physical Dimension Tape and Reel Information - continued
Package Name TSSOP-B8
Direction of feed
Reel
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
3000pcs
E2
()
1pin
BR25A512—3M Marking Diagrams SOP8(TOP VIEW) Pan Number Marking Parl Number Markmg A/ A/ LOT Number VLOT Number A/ k 0\ 1P|N MARK O\ 1P|N MARK Pan Number Markin LOT Number to L/ < o”="" —="" 1p\n="" mark="" www="" mhm.com="" ©2015="" rohm="" co,l1u.anngms="" reserved="" 13222111-15-001="" 28/29="">
Datasheet
28/29
BR25A512-3M
TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
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TSZ2211115001
www.rohm.com
Marking Diagrams
SOP8(TOP VIEW)
5A51
Part Number Marking
LOT Number
1PIN MARK
SOP-J8(TOP VIEW)
5A51
Part Number Marking
LOT Number
1PIN MARK
TSSOP-B8 (TOP VIEW)
Part Number Marking
5 A 5 1
LOT Numbe
r
1PIN MARK
Datasheet
29/29
BR25A512-3M
TSZ02201-0R2R0G100750-1-2
6.Oct.2015 Rev.001
©2015 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
www.rohm.com
Revision History
Date Revision Changes
6.Oct.2015 001 New Release
Datasheet
Datasheet
Datasheet
Notice-PAB-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASS CLASS CLASSb CLASS
CLASS CLASS
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Datasheet
Notice-PAB-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods are fallen under listed items of export control prescribed by Foreign exchange and Foreign trade
act, the permission based on the act is necessary in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred by you or third parties resulting from inaccur acy or errors of or
concerning such information.

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