SP2555NUTG Datasheet by Littelfuse Inc.

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HFEI®CI
©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 03/01/17
Lightning Surge Protection - SP3374NUTG
Description
Applications
The SP2555NUTG is a low-capacitance, TVS Diode Array
designed to provide protection against ESD (electrostatic
discharge), CDE (cable discharge events), EFT (electrical
fast transients), and lightning induced surges for high-
speed, differential data lines. It’s packaged in a μDFN
package (3.0 x 2.0mm) and each device can protect up
4 channels or 2 differential pairs, up to 45A (IEC 61000-
4- 5 2nd edition,) and up to 30kV ESD (IEC 61000-4-2). The
“flow-through” design minimizes signal distortion, reduces
voltage overshoot, and provides a simplified PCB design.
The SP2555NUTG with its low capacitance and low
clamping voltage makes it ideal for high-speed data
interfaces such as 1GbE applications found in notebooks,
switches, etc.
Features
• ESD,IEC61000-4-2,
±30kV contact, ±30kV air
• EFT,IEC61000-4-4,40A
(5/50ns)
• Lightning,IEC61000-
4-5 2nd edition, 45A
(tP=8/20μs)
• Lowcapacitanceof
2.5pF@0V (TYP) per I/O
• Lowleakagecurrentof
0.1μA (TYP) at 2.5V
• μDFN-10packageis
optimized for high-speed
data line routing
• Providesprotectionfor
two differential data pairs
(4 channels) up to 45A
• Lowoperatingand
clamping voltage
•AEC-Q101qualified
•Halogenfree,Leadfree
andRoHScompliant
Pinout
10 9 8 7 6
1 2 3 4 5
Functional Block Diagram
GND
LINE1 IN (Pin 1) LINE1 OUT (Pin 10)
LINE2 IN (Pin 2) LINE2 OUT (Pin 9)
LINE3 IN (Pin 4) LINE3 OUT (Pin 7)
LINE4_IN (Pin 5) LINE4_OUT (Pin 6)
GND
LifeSupportNote:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
RoHS
Pb
GREEN
Application Example
SP2555NUTG 2.5V 45A Diode Array
•10/100/1000Ethernet
•WAN/LANEquipment
•Desktops,Serversand
Notebooks
•LVDSInterfaces
•IntegratedMagnetics
•SmartTV
SP2555NUTG
RJ-45 Connector Ethernet PHY
SP2574N
TP0+
TP0-
TP1+
TP1-
TP2+
TP2-
TP3+
TP3-
SP2555
% 'tleltuse" ExpemxaADnllzd \ Anxwux Damn
©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 03/01/17
Lightning Surge Protection - SP3374NUTG
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Absolute Maximum Ratings
Symbol Parameter Value Units
IPP Peak Current (tp=8/20μs) 45 A
PPk Peak Pulse Power (tp=8/20μs) 1000 W
TOP Operating Temperature -40 to 125 °C
TSTOR Storage Temperature -55 to 150 °C
Electrical Characteristics (TOP=25ºC)
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Standoff Voltage VRWM IR ≤ 1µA 2.5 V
ReverseLeakageCurrent IRVRWM = 2.5V, T = 25°C 0.1 0.5 µA
Snap Back Voltage VSB ISB = 50mA 2.0 V
Clamp Voltage VC
IPP = 1A, tp = 8/20μs, Any I/O to Ground 4.5
V
IPP = 10A, tp = 8/20μs, Any I/O to Ground 7. 5
IPP = 25A, tp = 8/20μs, Any I/O to Ground 12
IPP = 45A, tp = 8/20μs,
Line-to-Line1, two I/O Pins
connected together on each line
19
Dynamic Resistance2RDYN TLP,tp=100ns, Any I/O to Ground 0.1
ESDWithstandVoltage VESD
IEC 61000-4-2 (Contact) ±30 kV
IEC 61000-4-2 (Air) ±30 kV
Diode Capacitance CI/O to GND
Between I/O Pins and Ground
VR=0V,f=1MHz 2.5 pF
CI/O to I/O
Between I/O Pins
VR=0V,f=1MHz 1. 2 pF
Notes:
1. Rating with 2 pins connected together per sugguested diagram ( For example, pin1 is connected to pin 10,
pin 2 is connected to Pin 9, Pin 4 is connected to pin 7 and pin 5 is connected to pin 6)
2.TransmissionLinePulse(TLP)with100nswidth,2nsrisetime,andaveragewindowt1=70nstot2=90ns
SP2555NUTG
% tleltuse" ExpemxaADnllzd \ Anxwux Damn
©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 03/01/17
Lightning Surge Protection - SP3374NUTG
Capacitance vs. Reverse Bias
0.0
1.0
2.0
3.0
4.0
5.0
00.5 11.5 22.5
Capacitance (pF)
Bias Voltage (V)
0
3
6
9
12
15
0.05.0 10.015.020.025.0
Clamp Voltage (V
C
)
Peak Pulse Current-I
PP
(A)
Clamping Voltage vs. IPP (I/O to GND)
8/20μS Pulse Waveform
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.05.0 10.015.020.025.030.0
Time (μs)
Percent of IPP
0
2
4
6
8
10
12
14
16
18
20
0510 15 20 25 30 35 40 45
Clamp Voltage (V
C
)
Peak Pulse Current-I
PP
(A)
Clamping Voltage vs. IPP (Line-to-Line)
0
2
4
6
8
10
12
14
16
18
20
012345678
TLP Voltage (V)
TLP Current (A)
Transmission Line Pulsing(TLP) Plot
SP2555NUTG
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©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 03/01/17
Lightning Surge Protection - SP3374NUTG
Product Characteristics
Lead Plating Pre-Plated Frame
Lead Material Copper Alloy
Lead Coplanarity 0.004 inches(0.102mm)
Substrate material Silicon
Body Material MoldedEpoxy
Flammability UL94V-0
MSL Rating Level1
Part Number Package Marking Min.OrderQty.
SP2555NUTG µDFN-10
(3.0x2.0mm) SP2555 3000
Ordering Information
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
P
rehea
t
Ramp-up
R
amp-up
Ramp-down
R
amp-d
o
Critical Zone
TL to TP
C
ritical Zon
e
T
to
T
P
Reflow Condition Pb – Free assembly
PreHeat
-TemperatureMin(Ts(min)) 150°C
-TemperatureMax(Ts(max)) 200°C
- Time (min to max) (ts) 60 – 180 secs
Averagerampuprate(Liquidus)Temp(TL)
to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 3°C/second max
Reflow - Temperature (TL)(Liquidus) 217°C
- Temperature (tL) 60 – 150 seconds
Peak Temperature (TP) 260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP)8minutesMax.
Do not exceed 260°C
Soldering Parameters
Part Numbering System
SP2555N U T G
Package
μDFN-10 (3.0x2.0mm)
T= Tape & Reel
G= Green
TVS Diode Arrays
(SPA Diodes)
®
Series
Part Marking System
SP2555NUTG
O O 0' er d+~ M Litleltuse“
©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 03/01/17
Lightning Surge Protection - SP3374NUTG
Tape & Reel Specification — µDFN-10 (3.0x2.0mm)
Package µDFN-10 (3.0x2.0mm)
Symbol Millimeters
A0 2.30 +/- 0.10
B0 3.20 +/- 0.10
E1.75 +/- 0.10
F3.50 +/- 0.05
K0 1.0 +/- 0.10
P4.00 +/- 0.10
P0 4.00 +/- 0.10
P2 2.00 +/- 0.10
T0.3 +/- 0.05
W8.00 +0.30/- 0.10
W
P
P0 P2 ø1.55±0.05
E
F
A0
B0
K0
T
Top
Cover
Tape
5° Max
Pin1 Location
Device Orientation in Tape
ø1.0±0.1
Package Dimensions — µDFN-10 (3.0x2.0mm)
PIN1 INDICATOR
D
E
A
A1A3
b
e
e1
e2
L
b1
L1
1.40mm
1.00mm
0.60mm 0.65mm 0.65mm 0.60mm
0.60mm
0.95mm 0.95mm 0.25mm
1.98mm
0.40mm
1.40mm
0.85mm
0.60mm 0.65mm 0.65mm 0.60mm
0.60mm
0.95mm 0.95mm 0.25mm
1.98mm
Recommended Soldering Pads Layout Recommended Stencil Apertures
0.40mm
Recommended Stencil thickness 5mils
Notes:
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Package µDFN-10 (3.0x2.0mm)
JEDEC MO-229
Symbol
Millimeters Inches
Min Nom Max Min Nom Max
A0.50 0.60 0.65 0.020 0.024 0.026
A1 0.00 0.03 0.05 0.000 0.001 0.002
A3 0.15 Ref 0.006 Ref
b0.15 0.20 0.25 0.006 0.008 0.010
b1 0.25 0.35 0.45 0.010 0.014 0.018
D2.90 3.00 3.10 0.114 0.118 0.122
E1.90 2.00 2.10 0.075 0.079 0.083
e0.60 BSC 0.024 BSC
e1 0.65 BSC 0.026 BSC
e2 0.95 BSC 0.037
L0.25 0.30 0.35 0.010 0.012 0.014
L1 0.95 1. 0 0 1.05 0.037 0.039 0.041
SP2555NUTG

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