STPS2H100ZF Datasheet by STMicroelectronics

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E] hiegugmented
August 2016
DocID029645 Rev 1
1/8
This is information on a product in full production.
www.st.com
STPS2H100ZF
Power Schottky rectifier
Datasheet - production data
Features
High junction temperature capability
Low leakage current
Negligible switching losses
Avalanche capability specified
ECOPACK®2 compliant component
Description
Single chip Schottky rectifiers suited to surface
mounting and especially intended for use in high
frequency converters, free-wheeling and reverse
polarity protection..
Table 1: Device summary
Symbol
IF(AV)
2 A
VRRM
100 V
VF (typ.)
0.60 V
Tj (max.)
175 °C
K
A
SOD123Flat
A
K
Characteristics
STPS2H100ZF
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1 Characteristics
Table 2: Absolute ratings (limiting values at 25 °C, unless otherwise specified)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
100
V
IF(AV)
Average forward current
TL = 140 °C/
δ = 0.5, square wave
2
A
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
50
A
PARM
Repetitive peak avalanche power
tp = 10 µs, Tj = 125 °C
105
W
Tstg
Storage temperature range
-65 to +175
°C
Tj
Maximum operating junction temperature(1)
-40 to +175
Notes:
(1)(dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.
Table 3: Thermal parameters
Symbol
Parameter
Max. value
Unit
Rth(j-l)
Junction to lead
20
°C/W
Table 4: Static electrical characteristics
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
IR(1)
Reverse leakage current
Tj = 25 °C
VR = VRRM
-
1
µA
Tj = 125 °C
-
0.2
0.5
mA
VF(2)
Forward voltage drop
Tj = 25 °C
IF = 2 A
-
0.86
V
Tj = 125 °C
-
0.65
0.70
Tj = 25 °C
IF = 4 A
-
0.96
Tj = 125 °C
-
0.75
0.83
Notes:
(1)Pulse test: tp = 5 ms, δ < 2%
(2)Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses, use the following equation:
P = 0.57 x IF(AV) + 0.065 x IF2(RMS)
For more information, please refer to the following application notes related to the power
losses.
AN604 (Calculation of conduction losses in a power rectifier)
AN4021 (Calculation of reverse losses in a power diode)
mu
STPS2H100ZF
Characteristics
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1.1 Characteristics (curves)
Figure 1: Average forward power dissipation
versus average forward current
Figure 2: Average forward current versus ambient
temperature (δ = 0.5)
Figure 3: Normalized avalanche power derating
versus pulse duration (Tj = 125 °C)
Figure 4: Relative variation of thermal impedance
junction to lead versus pulse duration
Figure 5: Reverse leakage current versus reverse
voltage applied (typical values)
Figure 6: Junction capacitance versus reverse
voltage applied (typical values)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
δ= 0.05 δ= 0.1 δ= 0.2 δ= 0.5 δ= 1
T
δ= tp/T tp
IF(AV)(A)
PF(AV)(W)
0
1
2
3
4
5
6
7
0 25 50 75 100 125 150 175
Rth(j-a) = Rth(j-l)
T
δ= tp/T tp
IF(AV)(A)
Tamb(°C)
P (tp)
P (10 µs)
ARM
ARM
0.001
0.01
0.1
1
1 10 100 1000
t (µs)
p
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
Single pulse
Zth(j-l)/Rth(j-l)
tp(s)
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
0 10 20 30 40 50 60 70 80 90 100
Tj= 150 °C
Tj= 125 °C
Tj= 25 °C
Tj= 100 °C
Tj= 50 °C
Tj= 75 °C
VR(V)
IR(µA)
10
100
1 10 100
F = 1 MHz
VOSC = 30 mVRMS
Tj= 25 °C
VR(V)
C(pF)
Characteristics
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Figure 7: Forward voltage drop versus forward
current (typical values)
Figure 8: Thermal resistance junction to ambient
versus copper surface under each lead
(typical values)
0.01
0.10
1.00
10.00
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
Tj= 25 °C
Tj= 125 °C
Tj= 75 °C
VF(V)
IF(A)
0
50
100
150
200
250
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SOD123Flat
SCu(cm²)
Rth(j-a)(C/W)
Epoxy printed board FR4, eCu = 35 µm
STPS2H100ZF
Package information
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2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Epoxy meets UL94, V0
Cooling method: by conduction (C)
2.1 SOD123Flat package information
Figure 9: SOD123Flat package outline
C1
C
L
L
E
b
A
D
HD
Package information
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Table 5: SOD123Flat package mechanical data
Ref.
Dimensions
Millimeters
Min.
Typ.
Max.
A
0.86
0.98
1.10
b
0.80
0.90
1.00
c
0.08
0.15
0.25
c1
0.00
0.10
D
2.50
2.60
2.70
E
1.50
1.60
1.80
HD
3.30
3.50
3.70
L
0.45
0.65
0.85
Figure 10: SOD123Flat footprint dimensions (mm)
1.30 1.60
1.40
STPS2H100ZF
Ordering information
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3 Ordering information
Table 6: Ordering information
Order code
Marking
Package
Weight
Base qty.
Delivery mode
STPS2H100ZF
2H1
SOD123Flat
12.5 mg
3000
Tape and reel
4 Revision history
Table 7: Document revision history
Date
Revision
Changes
19-Aug-2016
1
Initial release.
STPS2H100ZF
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DocID029645 Rev 1
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