
1© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard V0002_VC • 4/30/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
One world. One KEMET
Benefits
• AEC–Q200qualifiedGrade1
• Surface mount form factor
• Operatingambienttemperatureof−55°Cto+125°C
• Operating voltage range of 11 – 170 VDC
• Available case sizes: 0603, 0805, 1206, 1210, 1812, 2220
• Short response time
• Broad range of current and energy handling capabilities
• Low clamping voltage – Uc
• Non-sensitivetomildlyactivatedfluxes
• Barrier type and terminations solderable with Pb-free
solders according to JEDEC J–STD–020C and
IEC 60068–2–58
• RoHS 2 2011/65/EC, REACH compliant
Overview
KEMET's VC series of low voltage varistors are designed
to protect sensitive electronic devices against high voltage
surgesinthelowvoltageregion.VCvaristorsofferexcellent
transient energy absorption due to improved energy volume
distribution and power dissipation.
Applications
Typical applications include mobile phones and
telecommunication infrastructure, I/O ports and controllers.
The protection of integrated circuits and other components
at the circuit board level including the suppression of
inductive switching or other transient events such as surge
voltage. ESD protection for components sensitive to IEC
1000–4–2, MILSTD 883C Method 3015.7 and other industry
specifications.Replacementoflargersurfacemount
TVS Zeners in many applications. Designed to achieve
electromagnetic compliance of end products and provide
on-board transient voltage protection of ICs and transistors.
Surface Mount Varistors
VC Low Voltage 125°C
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2© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard V0002_VC • 4/30/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Varistors
VC Low Voltage 125°C
Ordering Information
VC 0603 M 300 R 002
Series Chip
Size Code Tolerances Rated Peak Single Pulse
Transient Current (A)
Packaging/
Termination
MaximumContinuous
Working Voltage
(Vrms AC)
Varistor
SMD125°C
Low Voltage
Multilayer Chip
0603 = 0603
0805 = 0805
1206 = 1206
1210 = 1210
1812 = 1812
2220 = 2220
K = ±10%
L = ±15%
M = ±20%
300 = 30
101 = 100
121 = 120
151 = 150
201 = 200
251 = 250
301 = 300
401 = 400
501 = 500
601 = 600
801 = 800
102 = 1,000
122 = 1,200
(First two digits represent
significantfigures.Thirddigit
specifiesnumberofzeros.)
R = Reel 180 mm/Ni Sn
Barrier Terminations
008 = 8
011 = 11
014 = 14
017 = 17
020 = 20
025 = 25
030 = 30
035 = 35
040 = 40
050 = 50
060 = 60
075 = 75
095 = 95
115 = 115
130 = 130
Dimensions – Millimeters
W
L
0.5±0.25
t
Size Code L Wtmax
0603 1.6±0.20 0.80±0.10 0.95
0805
2.0±0.25
1.25±0.20
0.80
1206
3.2±0.30
1.60±0.20
0.85
1210
3.2±0.30
2.50±0.25
0.85
1812
4.7±0.40
3.20±0.30
1.25
2220
5.7±0.50
5.00±0.40
1.25

3© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard V0002_VC • 4/30/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Varistors
VC Low Voltage 125°C
Environmental Compliance
RoHS 2 2011/65/EC, REACH
Performance Characteristics
Continuous Units Value
Steady State Applied Voltage
DC Voltage Range (Vdc) V 11 – 170
AC Voltage Range (Vrms) V 8 – 130
Transient
Peak Single Pulse Surge Current, 8/20 µs Waveform (Imax) A 30 – 1,200
Single Pulse Surge Energy, 10/1,000 µs Waveform (Wmax) J 0.1 – 12.2
Operating Ambient Temperature °C −55to+125
Storage Temperature Range (mounted components) °C −55to+150
ThresholdVoltageTemperatureCoefficient %/°C <+0.05
Response Time ns < 2
Climatic Category 55/125/56
Qualifications
Reliability Parameter Test Tested According to Condition to be Satisfied
after Testing
AC/DC Bias Reliability AC/DC Life Test CECC 42200, Test 4.20 or IEC 1051–1, Test 4.20.
AEC–Q200 Test 8 – 1,000 hours at UCT |δVn (1 mA)| < 10%
Pulse Current Capability Imax 8/20 µs
CECC 42200, Test C 2.1 or IEC 1051–1, Test 4.5.
10 pulses in the same direction at 2 pulses per minute
atmaximumpeakcurrentfor10pulses
|δVn (1 mA)| < 10%
no visible damage
Pulse Energy Capability Wmax 10/1,000 µs
CECC 42200, Test C 2.1 or IEC 1051–1, Test 4.5. 10
pulses in the same direction at 1 pulses every 2
minutesatmaximumpeakcurrentfor10pulses
|δVn (1 mA)| < 10%
no visible damage
WLD Capability WLDx10 ISO 7637, Test pulse 5, 10 pulses at rate 1 per minute
|δ
Vn
(1 mA)| < 15%
no visible damage
Vjump Capability Vjump 5 minutes IncreaseofsupplyvoltagetoV≥Vjump for 1 minute
|δ
Vn
(1 mA)| < 15%
no visible damage

4© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard V0002_VC • 4/30/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Varistors
VC Low Voltage 125°C
Qualifications cont'd
Reliability Parameter Test Tested According to Condition to be Satisfied
after Testing
Environmental and
Storage Reliability
Climatic Sequence
CECC 42200, Test 4.16 or IEC 1051–1, Test 4.17.
a) Dry heat, 16 hours, UCT, Test Ba, IEC 68–2–2
b)Dampheat,cyclic,thefirstcycle:55°C,93%RH,
24 hours, Test Db 68–2–4
c) Cold, LCT, 2 hours Test Aa IEC 68–2–1
d)Dampheatcyclic,remaining5cycles:55°C,93%
RH, 24 hour/cycle, Test Bd, IEC 68–2–30
|δVn (1 mA)| < 10%
Thermal Shock CECC 42200, Test 4.12, Test Na, IEC 68–2–14,
AEC–Q200 Test 16, 5 cycles UCT/LCT, 30 minutes
|δVn (1 mA)| < 10%
no visible damage
Steady State Damp Heat
CECC 42200, Test 4.17, Test Ca, IEC 68–2–3,
AEC–Q200Test6,56days,40°C,93%RH.
AEC–Q200 Test 7: Bias, RH, T all at 85.
|δVn (1 mA)| < 10%
Storage Test IEC 68–2–2, Test Ba, AEC–Q200 Test 3,
1,000hoursatmaximumstoragetemperature
|δVn (1 mA)| < 5%
Mechanical Reliability
Solderability
CECC 42200, Test 4.10.1, Test Ta IEC 68–2–20
solderbathandreflowmethod
Solderable at shipment
and after 1 year of storage,
criteria > 95% must be
coveredbysolderforreflow
meniscus
Resistance to Soldering
Heat
CECC 42200, Test 4.10.2, Test Tb, IEC 68–2–20 solder
bathandreflowmethod
|δVn (1 mA)| < 5%
Terminal Strength JIS–C–6429, App. 1, 18 N for 60 seconds – same for
AEC–Q200 Test 22 no visual damage
BoardFlex JIS–C–6429, App. 2, 2 mm minimum
AEC–Q200test21–Boardflex:2mmflexminimum
|δVn (1 mA)| < 2%
no visible damage
Vibration
CECC 42200, Test 4.15, Test Fc, IEC 68–2–6,
AEC–Q200 Test 14.
Frequency range 10 – 55 Hz (AEC: 10 – 2,000 Hz)
Amplitude 0.75 m/s2 or 98 m/s2
(AEC:5Gfor20minutes)
Totalduration6hours(3x2hours)
(AEC: 12 cycles each of 3 directions)
Waveshape – half sine
|δVn (1 mA)| < 10%
no visible damage
Mechanical Shock
CECC 42200, Test 4.14, Test Ea, IEC 68–2–27,
AEC–Q200 Test 13.
Acceleration = 490 m/s2
(AEC: MIL-STD–202–Method 213),
Pulse duration = 11 ms,
Waveshape–halfsine;Numberofshocks=3x6
|δVn (1 mA)| < 10%
no visible damage
Electrical Transient
Conduction ISO–7637–1 Pulses AEC–Q200 Test 30: Test pulses 1 to 3.
Also other pulses – freestyle.
|δVn (1 mA)| < 10%
no visible damage

5© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard V0002_VC • 4/30/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Varistors
VC Low Voltage 125°C
Reliability
In general, reliability is the ability of a component to perform and maintain its functions in routine circumstances, as well as
hostileorunexpectedcircumstances.Themeanlifeofseriescomponentsisafunctionof:
• Factor of Applied Voltage
• Ambient temperature
Mean life is closely related to Failure rate (formula).
Mean life (ML) is the arithmetic mean (average) time to failure of a component.
Failurerateisthefrequencywithwhichanengineeredsystemorcomponentfails,expressedforexampleinfailuresper
hour.Failurerateisusuallytimedependent,anintuitivecorollaryisthattheratechangesovertimeversustheexpected
life cycle of a system.
Failure rate formula – calculation
Λ= 109
[fit]
ML[h]
FAV – Factor of Applied Voltage
Λ= Vapl
Vmax
Vapl = applied voltage
Vmax=maximumoperatingvoltage
Years
Mean Life on Arrhenius model
1,000
100
10
103
104
105
106
107
108
1
h
120 100 80 60 40 20 °C
Ta
Mean life (ML)
FAV
0,7
0,8
0,9
1,0

6© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard V0002_VC • 4/30/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Varistors
VC Low Voltage 125°C
Table 1 – Ratings & Part Number Reference
KEMET Part
Number
L
(mm)
W
(mm)
tmax
(mm) Vrms VDC Vn
1 mA Vc
Ic
8/20 µs
(A)
Wmax
10/1000 µs
(J)
Pmax
(W)
Imax
8/20 µs
(A)
Ctyp
at 1 kHz
(pF)
Ltyp
100 mA/ns
(nH)
VC0603L300R008 1.6±0.20 0.80±0.10 0.95 811 15 25 10.1 0.003 30 240 1.0
VC0805L121R008 2.0±0.25 1.25±0.20 0.80 811 15 25 10.2 0.005 120 475 1.5
VC1206L201R008 3.2±0.30 1.60±0.20 0.85 811 15 25 10.6 0.008 200 2,000 1.8
VC1210L401R008 3.2±0.30 2.50±0.25 0.85 811 15 25 31.1 0.010 400 3,400 1.8
VC1812L501R008 4.7±0.40 3.20±0.30 1.25 811 15 25 51.9 0.015 500 6,300 2.5
VC2220L122R008 5.7±0.50 5.00±0.40 1.25 811 15 25 10 4.3 0.020 1,200 15,000 3.0
VC0603K300R011 1.6±0.20 0.80±0.10 0.95 11 14 18 33 10.2 0.003 30 210 1.0
VC0805K121R011 2.0±0.25 1.25±0.20 0.80 11 14 18 33 10.3 0.005 120 400 1.5
VC1206K201R011 3.2±0.30 1.60±0.20 0.85 11 14 18 33 10.6 0.008 200 1,300 1.8
VC1210K401R011 3.2±0.30 2.50±0.25 0.85 11 14 18 33 31.3 0.010 400 2,600 1.8
VC1812K801R011 4.7±0.40 3.20±0.30 1.25 11 14 18 33 52.0 0.015 800 5,100 2.5
VC2220K122R011 5.7±0.50 5.00±0.40 1.25 11 14 18 33 10 5.5 0.020 1,200 12,000 3.0
VC0603K300R014 1.6±0.20 0.80±0.10 0.95 14 18 22 38 10.3 0.003 30 195 1.0
VC0805K121R014 2.0±0.25 1.25±0.20 0.80 14 18 22 38 10.4 0.005 120 355 1.5
VC1206K201R014 3.2±0.30 1.60±0.20 0.85 14 18 22 38 10.6 0.008 200 950 1.8
VC1210K401R014 3.2±0.30 2.50±0.25 0.85 14 18 22 38 31.6 0.010 400 2,000 1.8
VC1812K801R014 4.7±0.40 3.20±0.30 1.25 14 18 22 38 52.4 0.015 800 4,200 2.5
VC2220K122R014 5.7± 0.50 5.00±0.40 1.25 14 18 22 38 10 6.0 0.020 1,200 9,400 3.0
VC0603K300R017 1.6±0.20 0.80±0.10 0.95 17 22 27 44 10.3 0.003 30 185 1.0
VC0805K121R017 2.0±0.25 1.25±0.20 1.05 17 22 27 44 10.4 0.005 120 315 1.5
VC1206K201R017 3.2±0.30 1.60±0.20 1.25 17 22 27 44 10.7 0.008 200 740 1.8
VC1210K401R017 3.2±0.30 2.50±0.25 1.35 17 22 27 44 31.8 0.010 400 1,700 1.8
VC1812K801R017 4.7±0.40 3.20±0.30 1.25 17 22 27 44 52.8 0.015 800 3,500 2.5
VC2220K122R017 5.7±0.50 5.00±0.40 1.25 17 22 27 44 10 7.5 0.020 1,200 7,700 3.0
VC0603K300R020 1.6±0.20 0.80±0.10 0.95 20 26 33 54 10.3 0.003 30 175 1.0
VC0805K121R020 2.0±0.25 1.25±0.20 1.05 20 26 33 54 10.4 0.005 120 290 1.5
VC1206K201R020 3.2±0.30 1.60±0.20 1.25 20 26 33 54 10.8 0.008 200 620 1.8
VC1210K401R020 3.2±0.30 2.50±0.25 1.35 20 26 33 54 32.0 0.010 400 1,400 1.8
VC1812K801R020 4.7±0.40 3.20±0.30 1.55 20 26 33 54 53.0 0.015 800 3,000 2.5
VC2220K122R020 5.7±0.50 5.00±0.40 1.45 20 26 33 54 10 8.0 0.020 1,200 6,500 3.0
VC0603K300R025 1.6±0.20 0.80±0.10 0.95 25 31 39 65 10.1 0.003 30 165 1.0
VC0805K121R025 2.0±0.25 1.25±0.20 1.05 25 31 39 65 10.2 0.005 120 260 1.5
VC1206K201R025 3.2±0.30 1.60±0.20 1.25 25 31 39 65 11.0 0.008 200 510 1.8
VC1210K401R025 3.2±0.30 2.50±0.25 1.45 25 31 39 65 31.8 0.010 400 1,060 1.8
VC1812K801R025 4.7±0.40 3.20±0.30 1.55 25 31 39 65 53.9 0.015 800 2,300 2.5
VC2220K122R025 5.7±0.50 5.00±0.40 1.45 25 31 39 65 10 9.5 0.020 1,200 5,000 3.0
VC0603K300R030 1.6±0.20 0.80± 0.10 0.95 30 38 47 77 10.1 0.003 30 160 1.0
VC0805K121R030 2.0±0.25 1.25±0.20 1.05 30 38 47 77 10.2 0.005 120 230 1.5
VC1206K201R030 3.2±0.30 1.60±0.20 1.25 30 38 47 77 11.2 0.008 200 450 1.8
VC1210K301R030 3.2±0.30 2.50±0.25 1.45 30 38 47 77 32.1 0.010 300 850 1.8
VC1812K801R030 4.7±0.40 3.20±0.30 1.55 30 38 47 77 54.4 0.015 800 1,800 2.5
VC2220K122R030 5.7±0.50 5.00±0.40 1.45 30 38 47 77 10 12.2 0.020 1,200 4,000 3.0
VC1206K121R035 3.2±0.30 1.60±0.20 1.25 35 45 56 90 10.6 0.008 120 400 1.8

7© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard V0002_VC • 4/30/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Varistors
VC Low Voltage 125°C
Table 1 – Ratings & Part Number Reference (cont'd)
KEMET Part
Number
L
(mm)
W
(mm)
tmax
(mm) Vrms VDC Vn
1 mA Vc
Ic
8/20 µs
(A)
Wmax
10/1000 µs
(J)
Pmax
(W)
Imax
8/20 µs
(A)
Ctyp
at 1 kHz
(pF)
Ltyp
100 mA/ns
(nH)
VC1210K251R035 3.2±0.30 2.50±0.25 1.45 35 45 56 90 32.2 0.010 250 670 1.8
VC1812K601R035 4.7±0.40 3.20±0.30 1.55 35 45 56 90 54.2 0.015 600 1,340 2.5
VC2220K102R035 5.7±0.50 5.00±0.40 1.45 35 45 56 90 10 7.6 0.020 1,000 3,000 3.0
VC1206K121R040 3.2±0.30 1.60±0.20 1.25 40 56 68 110 10.8 0.008 120 370 1.8
VC1210K251R040 3.2±0.30 2.50±0.25 1.45 40 56 68 110 32.4 0.010 250 570 1.8
VC1812K601R040 4.7±0.40 3.20±0.30 1.55 40 56 68 110 54.8 0.015 600 1,000 2.5
VC2220K102R040 5.7±0.50 5.00±0.40 1.45 40 56 68 110 10 9.2 0.020 1,000 2,200 3.0
VC1206K121R050 3.2±0.30 1.60±0.20 1.65 50 65 82 135 10.8 0.008 120 340 1.8
VC1210K251R050 3.2±0.30 2.50±0.25 1.75 50 65 82 135 31.7 0.010 250 470 1.8
VC1812K401R050 4.7±0.40 3.20±0.30 1.85 50 65 82 135 54.8 0.015 400 710 2.5
VC2220K801R050 5.7±0.50 5.00±0.40 1.85 50 65 82 135 10 5.8 0.020 800 1,500 3.0
VC1206K121R060 3.2±0.30 1.60±0.20 1.65 60 85 100 165 10.9 0.008 120 330 1.8
VC1210K251R060 3.2±0.30 2.50±0.25 1.75 60 85 100 165 32.2 0.010 250 390 1.8
VC1812K401R060 4.7±0.40 3.20±0.30 1.85 60 85 100 165 55.8 0.015 400 580 2.5
VC2220K801R060 5.7± 0.50 5.00±0.40 1.85 60 85 100 165 10 6.2 0.020 800 1,000 3.0
VC1812K401R075 4.7±0.40 3.20±0.30 1.90 75 100 120 200 55.8 0.015 400 440 2.5
VC2220K801R075 5.7±0.50 5.00±0.40 1.90 75 100 120 200 10 6.2 0.020 800 700 3.0
VC1812K301R095 4.7±0.40 3.20±0.30 1.90 95 125 150 250 55.2 0.015 300 340 2.5
VC2220K501R095 5.7±0.50 5.00±0.40 1.90 95 125 150 250 10 7.4 0.020 500 600 3.0
VC1812K301R115 4.7±0.40 3.20±0.30 1.90 115 150 180 300 55.2 0.015 300 310 2.5
VC2220K501R115 5.7±0.50 5.00±0.40 1.90 115 150 180 300 10 7.4 0.020 500 560 3.0
VC2220K501R130 5.7±0.50 5.00±0.40 1.90 130 170 205 340 10 7.4 0.020 500 500 3.0

8© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard V0002_VC • 4/30/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Varistors
VC Low Voltage 125°C
Soldering
PopularsolderingtechniquesusedforsurfacemountedcomponentsareWaveandInfraredReflowprocesses.Bothprocessescanbe
performed with Pb-containing or Pb-free solders. The termination option available for these soldering techniques is Barrier Type End
Terminations.
End Termination Designation Recommended and
Suitable for
Component RoHS
Compliant
Ni Sn Barrier Type End
Termination
Ni R1 Pb-containing and
Pb-free soldering
Yes
Wave Soldering – this process is generally associated with discrete components mounted on the underside of printed circuit boards, or
for large top-side components with bottom-side mounting tabs to be attached, such as the frames of transformers, relays, connectors,
etc.SMDvaristorstobewavesolderedarefirstgluedtothecircuitboard,usuallywithanepoxyadhesive.Whenallcomponentsonthe
PCB have been positioned and an appropriate time is allowed for adhesive curing, the completed assembly is then placed on a conveyor
and run through a single, double wave process.
Infrared Reflow Soldering–thesereflowprocessesaretypicallyassociatedwithtop-sidecomponentplacement.Thistechniqueutilizes
amixtureofadhesiveandsoldercompounds(andsometimesfluxes)thatareblendedintoapaste.ThepasteisthenscreenedontoPCB
solderingpadsspecificallydesignedtoacceptaparticularsizedSMDcomponent.Therecommendedsolderpastewetlayerthickness
is100to300µm.OncethecircuitboardisfullypopulatedwithMDcomponents,itisplacedinareflowenvironment,wherethepasteis
heatedtoslightlyaboveitseutectictemperature.Whenthesolderpastereflows,theSMDcomponentsareattachedtothesolderpads.
Solder Fluxes–solderfluxesaregenerallyappliedtopopulatedcircuitboardstocleanoxidesformingduringtheheatingprocessandto
facilitatetheflowingofthesolder.Solderfluxescanbeeitherapartofthesolderpastecompoundorcanbeseparatematerials,usually
fluids.Recommendedfluxesare:
•Non-activated(R)fluxes,wheneverpossible
•Mildlyactivated(RMA)fluxesofclassL3CN
• Class ORLO
Activated (RA),watersolubleorstrongacidicfluxeswithachlorinecontent>0.2wt.%areNOTRECOMMENDED.Theuseofsuchfluxes
could create high leakage current paths along the body of the varistor components.
Whenafluxisappliedpriortowavesoldering,itisimportanttocompletelydryanyresidualfluxsolventspriortothesolderingprocess.
Thermal Shock – to avoid the possibility of generating stresses in the varistor chip due to thermal shock, a preheat stage to within
100°Cofthepeaksolderingprocesstemperatureisrecommended.Additionally,SMDvaristorsshouldnotbesubjectedtoatemperature
gradientgreaterthan4°C/second,withanidealgradientbeing2°C/second.Peaktemperaturesshouldbecontrolled.WaveandReflow
solderingconditionsforSMDvaristorswithPb-containingsoldersareshowninFig.1and2respectively,whileWaveandReflowsoldering
conditions for SMD varistors with Pb-free solders are shown in Figures 1 and 3

9© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard V0002_VC • 4/30/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Varistors
VC Low Voltage 125°C
Soldering cont'd
WheneverseveraldifferenttypesofSMDcomponentsarebeingsoldered,eachhavingaspecificsolderingprofile,thesolderingprofile
with the least heat and the minimum amount of heating time is recommended. Once soldering has been completed, it is necessary to
minimizethepossibilityofthermalshockbyallowingthehotPCBtocooltolessthan50°Cbeforecleaning.
Inspection Criteria–theinspectioncriteriatodetermineacceptablesolderjoints,whenWaveorInfraredReflowprocessesareused,will
dependonseveralkeyvariables,principallyterminationmaterialprocessprofiles.
Pb-contining Wave and IR Reflow Soldering – typical “before” and “after” soldering results for Barrier Type End Terminations can be seen
in Fig. 4. Barrier type terminated varistors form a reliable electrical contact and metallurgical bond between the end terminations and the
solderpads.Thebondbetweenthesetwometallicsurfacesisexceptionallystrongandhasbeentestedbybothverticalpullandlateral
(horizontal)pushtests.Theresultsexceedestablishedindustrystandardsforadhesion.
The solder joint appearance of a barrier type terminated varistor shows that solder forms a metallurgical junction with the thin tin-alloy
(over the barrier layer), and due to its small volume “climbs” the outer surface of the terminations, the meniscus will be slightly lower.
This optical appearance should be taken into consideration when programming visual inspection of the PCB after soldering.
Ni Sn Barrier Type End Terminations
Figure4:SolderingCriterionincaseofWaveandIRReflowPb-containingSoldering
Pb-free Wave and IR Reflow Soldering – typical “before” and “after” soldering results for Barrier Type End Terminations are given
in a phenomenon knows as “mirror” or “negative” meniscus. Solder forms a metallurgical junction with the entire volume of the end
termination, i.e. it diffuses from pad to end termination across the inner side, forming a “mirror” or “negative” meniscus. The height of the
solder penetration can be clearly seen on the end termination and is always 30% higher than the chip height.

10© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard V0002_VC • 4/30/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Varistors
VC Low Voltage 125°C
Soldering cont'd
Solder Test and Retained Samples–reflowsolderingtestbasedonJ-STD-020D.1andsolderingtestbydippingbasedonIEC60068-
2 for Pb-free solders are preformed on each production lot as shown in the following chart. Test results and accompanying samples
areretainedforaminimumoftwo(2)years.Thesolderabilityofaspecificlotcanbecheckedatanytimewithinthisperiodshoulda
customer require this information.
Test Resistance to Flux Solderability
Static leaching
(Simulation of Reflow
Soldering)
Dynamic Leaching
(Simulation of Wave
Soldering)
Parameter
Soldering method Dipping Dipping Dipping Dipping with agitation
Flux L3CN, ORL0 L3CN, ORL0, R L3CN, ORL0, R L3CN, ORL0, R
Pb Solder 62 Sn/36 Pb/2 Ag
PbSolderingtemperature(°C) 235±5 235±5 260±5 235±5
Pb-FREE Solder Sn96/Cu0,4–0,8/3–4Ag
Pb-FREE Soldering
Temperature(°C)
250±5 250±5 280±5 250±5
Soldering Time (s) 2210 10 > 15
Burn-in Conditions VDC
max
, 48 h
Acceptance Criterion dVn < 5%, idc must stay
unchanged
> 95% of end termination
must be covered by solder
> 95% of end termination
must be intact and covered
by solder
> 95% of end termination
must be intact and covered
by solder
Rework Criteria Soldering Iron – unless absolutely necessary, the use of soldering irons is NOT recommended for reworking varistor
chips. If no other means of rework is available, the following criteria must be strictly followed:
• Do not allow the tip of the iron to directly contact the top of the chip
•Donotexceedthefollowingsolderingironspecifications:
OutputPower: 30Wattsmaximum
TemperatureofSolderingIronTip: 280°Cmaximum
SolderingTime: 10Secondsmaximum
Storage Conditions – SMD varistors should be used within 1 year of shipment from factory to avoid possible soldering problems caused
byoxidizedterminals.Thestorageenvironmentshouldbecontrolled,withhumiditylessthan40%andtemperaturebetween-25and45
°C.Varistorchipsshouldalwaysbestoredintheiroriginalpackagedunit.

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Surface Mount Varistors
VC Low Voltage 125°C
Soldering Pad Configuration
W
L
t
M
B C B
A
D
A
Size L (mm) W (mm) h (mm) tmax (mm) A (mm) B (mm) C (mm) D (mm)
0603 1.6±0.20 0.80±0.10 0.5±0.25 1.0 1.0 1.0 0.6 2.6
0805 2.0±0.25 1.25±0.20 0.5±0.25 1.1 1.4 1.2 1.0 3.4
1206 3.2±0.30 1.60±0.20 0.5±0.25 1.6 1.8 1.2 2.1 4.5
1210 3.2±0.30 2.50±0.25 0.5±0.25 1.8 2.8 1.2 2.1 4.5
1812 4.7±0.40 3.20±0.30 0.5±0.25 1.9 3.6 1.5 3.2 6.2
2220 5.7±0.50 5.00±0.40 0.5±0.25 1.9 5.5 1.5 4.2 7.2
Packaging
Voltage
Range (V)
Chip Size
0603
0805
1206
1210
1812
2220
Reel Size
180
180
180
180
180
180
2 – 14
4,000
4,000
4,000
4,000
1,500
1,500
17
3,500
3,500
2,500
2,500
1,500
1,500
20 – 40
3,500
3,500
2,500
2,500
1,000
1,000
50 – 130
2,000
2,000
1,000
1,000

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Surface Mount Varistors
VC Low Voltage 125°C
Construction
Glass Passivation
Detailed Cross Section
Inner Electrodes
(Ag) Terminate
Edge
Terminate
Edge
ZnO Layer
Inner Electrodes
(Ag)
Glass Passivation
Termination
(Ag/Pd, Ni/Sn)
Termination
(Ag/Pd, Ni/Sn)

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Surface Mount Varistors
VC Low Voltage 125°C
Taping & Reel Specifications
Tape Size (mm) 8 mm 12 mm
0603
0805
1206
1210
1812
2220
A0
1.2
1.6
1.9
2.9
3.75
5.6
B0
1.9
2.4
3.75
3.7
5.0
6.25
K0Maximum
1.1
1.1
1.8
2.0
2.0
2.0
B1Maximum
4.35
4.35
4.35
4.35
8.2
8.2
D1 Minimum
0.3
0.3
0.3
0.3
1.5
1.5
E2 Minimum
6.25
6.25
6.25
6.25
10.25
10.25
P1
4.0
4.0
4.0
4.0
8.0
8.0
F
3.5
3.5
3.5
3.5
5.5
5.5
W
8.0
8.0
8.0
8.0
12.0
12.0
T2Maximum
3.5
3.5
3.5
3.5
6.5
6.5
W1
8.4+1.5
8.4+1.5
8.4+1.5
8.4+1.5
12.4+2
12.4+2
W2Maximum
14.4
14.4
14.4
14.4
18.4
18.4
W3
7.9 – 10.9
7.9 – 10.9
7.9 – 10.9
7.9 – 10.9
11.9 – 15.4
11.9 – 15.4
A
180
180
180
180
180
180

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Surface Mount Varistors
VC Low Voltage 125°C
Terms and Definitions
Term Symbol Definition
Rated AC
Voltage Vrms
MaximumcontinuoussinusoidalACvoltage(<5%totalharmonicdistortion)whichmaybe
appliedtothecomponentundercontinuousoperationconditionsat25°C
Rated DC
Voltage
Vdc
MaximumcontinuousDCvoltage(<5%ripple)whichmaybeappliedtothecomponentunder
continuousoperatingconditionsat25°C
Supply
Voltage VThe voltage by which the system is designated and to which certain operating characteristics of
the system are referred; V
rms
=1,1xV
Leakage Current Idc
ThecurrentpassingthroughthevaristoratVdcandat25°Coratanyotherspecified
temperature
Varistor Voltage
Vn
Voltage across the varistor measured at a given reference current In
Reference Current
In
Reference current = 1 mA DC
Clamping Voltage
Protection Level
Vc
The peak voltage developed across the varistor under standard atmospheric conditions, when
passingan8/20μsclasscurrentpulse
Class Current Ic
Apeakvalueofcurrentwhichis1/10ofthemaximumpeakcurrentfor100pulsesattwoper
minuteforthe8/20μspulse
Voltage
Clamping
Ratio
Vc/Vapp
Afigureofmeritmeasureofthevaristorclampingeffectivenessasdefinedbythesymbols
Vc/Vapp, where (Vapp = Vrms or Vdc)
Jump
Start
Transient
Vjump
Thejumpstarttransientresultingfromthetemporaryapplicationofanovervoltageinexcess
of the rated battery voltage. The circuit power supply may be subjected to a temporary
overvoltage condition due to the voltage regulation failing or it may be deliberately generated
when it becomes necessary to boost start the car
Rated Single Pulse
Transient Energy
Wmax
Energywhichmaybedissipatedforasingle10/1,000μspulseofamaximumratedcurrent,
with rated AC voltage or rated DC voltage also applied, without causing device failure
Load
Dump
Transient
WLD
LoadDumpisatransientwhichoccursinanautomotiveenvironment.Itisanexponentially
decaying positive voltage which occurs in the event of a battery disconect while the alternator
is still generating charging current with other loads remaining on the alternator circuit at the
time of battery disconect
Rated Peak Single
Pulse Transient
Current
Imax
Maximumpeakcurrentwhichmaybeappliedforasingle8/20μspulse,with,ratedline
voltage also applies, without causing device failure
Rated Transient
Average Power
Dissipation
PMaximumaveragepowerwhichmaybedissipatedduetoagroupofpulsesoccurringwithina
specifiedisolatedtimeperiod,withoutcausingdevicefailureat25°C
Capacitance
C
Capacitance between two terminals of the varistor measured at 1 kHz
Response Time
tr
The time lag between application of a surge and varistor's "turn-on" conduction action
Varistor Voltage
Temperature
Coefficient
TC (Vnat85°C–Vnat25°C)/(Vnat25°C)x60°C)x100
Insulation Resistance IR Minimum resistance between shorted terminals and varistor surface
Isolation
Voltage
Themaximumpeakvoltagewhichmaybeappliedundercontinuousoperatingconditions
between the varistor terminations and any conducting mounting surface
Operating
Temperature
The range of ambient temperature for which the varistor is designed to operate continuously as
definedbythetemperaturelimitsofitsclimaticcategory
Climatic Category LCT/UCT/DHD
UCT=UpperCategoryTemperature–themaximumambienttemperatureforwhichavaristor
has been designed to operate continuously, LCT = Lower Category Temperature – the minimum
ambient temperature at which a varistor has been designed to operate continuously
DHD = Dump Heat Test Duration
Storage Temperature
Storage temperature range without voltage applied

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Surface Mount Varistors
VC Low Voltage 125°C
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checkingandverifyingtheextenttowhichtheInformationcontainedinthispublicationisapplicabletoanorderatthetimetheorderisplaced.AllInformationgiven
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technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes
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Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
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