1323x Dev Hardware Ref Manual Datasheet by NXP USA Inc.

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Document Number: 1323xDHRM
Rev. 1.1
07/2011
1323x Development Hardware
Reference Manual
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1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor i
Contents
About This Book
Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii
Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii
Chapter 1
Safety Information
1.1 FCC Guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.1.1 Labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.1.2 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.1.3 Exposure Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.1.4 Antenna Restrictions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.2 Regulatory Approval For Canada (IC RSS 210) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
1.2.1 26 PART 5 – Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
1.3 Electrostatic Discharge Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
1.4 Disposal Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Chapter 2
MC1323x Development Platform Overview and Description
2.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.2 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2.3 Driver Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
2.4 General System Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
Chapter 3
1323x-Modular Reference Board
3.1 1323x-MRB Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3.1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3.1.2 Form Factor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
3.1.3 Board Level Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
3.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
3.2.1 RF Performance and Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
3.2.2 Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7
3.3 Reset and BDM Debug Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8
3.3.1 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9
3.3.2 IO Connectors J2 and J3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11
3.3.3 1323x-MRB Onboard Peripheral Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-13
3.4 Schematic, Board Layout, and Bill of Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-15
3.4.1 Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18
Chapter 4
1323x Development Hardware Reference Manual, Rev. 1.1
ii Freescale Semiconductor
1323x Remote Control Motherboard
4.1 1323x-RCM Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
4.1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
4.1.2 Form Factor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
4.1.3 Board Level Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
4.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4
4.2.1 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
4.2.2 GPIO Connection to 1323x-MRB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7
4.2.3 1323x-RCM Onboard Peripheral Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-10
4.3 Schematic, Board Layout, and Bill of Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-14
4.3.1 1323x-RCM Bill of Materials. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-21
Chapter 5
1323x Remote Extender Motherboard
5.1 1323x-REM Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
5.1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
5.1.2 Form Factor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2
5.1.3 Board Level Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3
5.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4
5.2.1 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-5
5.2.2 GPIO Connection to 1323x-MRB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-7
5.2.3 1323x-REM Onboard Peripheral Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-9
5.2.4 USB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10
5.2.5 IR Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10
5.2.6 Pushbutton 2x4 Switch Matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-11
5.2.7 Blue Indicator LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-11
5.3 Schematic, Board Layout, and Bill of Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-12
5.3.1 1323x-REM Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-16
Chapter 6
PCB Manufacturing Specifications
6.1 Single PCB Construction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1
6.2 Panelization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3
6.3 Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3
6.4 Solder Mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3
6.5 Silk Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4
6.6 Electrical PCB Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4
6.7 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4
6.8 Hole Specification/Tool Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4
6.9 File Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor iii
About This Book
This manual describes Freescale’s MC1323x development platform hardware. The MC1323x
development platform is an IEEE 802.15.4 compliant evaluation environment based on the Freescale
MC1323x device. The heart of the MC1323x platform is Freescale’s low cost System-on-Chip (SoC) for
the IEEE® 802.15.4 Standard that incorporates a complete, low power, 2.4 GHz radio frequency
transceiver with Tx/Rx switch, an 8-bit HCS08 CPU, and a functional set of MCU peripherals into a 48-pin
LGA package. This family of products is targeted for wireless RF remote control and other cost-sensitive
applications ranging from home TV and entertainment systems such as ZigBee BeeStack Consumer
(RF4CE) to low cost, low power, IEEE 802.15.4 and ZigBee end nodes.
Audience
This manual is intended for system designers.
Organization
This document is organized into 6 chapters.
Chapter 1 Safety Information — Highlights some of the FCC requirements.
Chapter 2 HCS08 Development Platform Overview and Description — Provides an
overview of the three boards that comprise the MC1323x development platform.
Chapter 3 Modular Reference Board — This chapter details the 1323x-MRB which is an
IEEE, 802.15.4 compliant evaluation board based on the Freescale MC1323x
device.
Chapter 4 1323x-Remote Control Module — This chapter details the 1323x-RCM
motherboard that accepts the 1323x-Modular Reference Board (1323x-MRB)
plug-in module (daughter card) and supplies a power supply and a rich set of
interface peripherals.
Chapter 5 1323x-Remote Extender Board — This chapter details the 1323x REM
motherboard that accepts the 1323x-Modular Reference Board (1323x-MRB)
plug-in module (daughter card) and supplies a power supply and set of interface
peripherals.
Chapter 6 PCB Manufacturing Specifications — This chapter provides the specifications
used to manufacture the various MC1323x printed circuit boards (PCBs).
Revision History
The following table summarizes revisions to this document since the previous release (Rev 1.0).
Revision History
Location Revision
Chapter 5 Inserted missing page 2 of REM schematic.
1323x Development Hardware Reference Manual, Rev. 1.1
iv Freescale Semiconductor
Definitions, Acronyms, and Abbreviations
The following list defines the acronyms and abbreviations used in this document.
ADC Analog to Digital Converter
AES Advanced Encryption Standard
ARM Advanced RISC Machine
CTS Clear to Send
DAC Digital to Analog Converter
DMA Direct Memory Access
I2C Inter-Integrated Circuit is a multi-master serial computer bus
ISM Industrial Scientific Medical 2.4 GHz radio frequency band
JTAG Joint Test Action Group
LGA Land Grid Array
MAC Media Access Controller
MCU Microcontroller Unit
NEXUS An embedded processor development tool interface that helps design engineers
identify software and hardware-level issues.
PCB Printed circuit board
PiP Platform in Package
PWM Pulse-width modulation
RCM Remote Control Module
REM Remote Extender Board
RTS Request to Send
SMA Connector SubMiniature version “A” connector
SPI Serial Peripheral Interface
SSI Synchronous Serial Interface
TACT Switch A switch that provides a slight “snap” or “click” to the user to indicate function.
TELCO Telephone Company
USB Universal Serial Bus
VCP Virtual Com Port
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 1-1
Chapter 1
Safety Information
1.1 FCC Guidelines
This equipment is for use by developers for evaluation purposes only and must not be incorporated into
any other device or system. This device may not be sold to the general public. Integrators will be
responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC
authorization.
FCC approval of this device only covers the original configuration of this device as supplied. Any
modifications to this product, including changes shown in this manual, may violate the rules of the Federal
Communications Commission and Industry Canada and make operation of the product unlawful.
1.1.1 Labeling
FCC labels are physically located on the back of the board.
1.1.2 Operating Conditions
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
This device may not cause harmful interference.
This device must accept any interference received, including interference that may cause undesired
operation.
1.1.3 Exposure Limits
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
The antenna(s) used for this equipment must be installed to provide a separation distance of at least 8
inches (20cm) from all persons.
1.1.4 Antenna Restrictions
An intentional radiator shall be designed to ensure that no antenna other than that furnished by the
responsible party shall be used with the device. The use of a permanently attached antenna or of an
antenna that uses a unique coupling to the intentional radiator shall be considered sufficient to comply with
the provisions of this Section. The manufacturer may design the unit so that a broken antenna can be
replaced by the user, but the use of a standard antenna jack or electrical connector is prohibited. This
requirement does not apply to carrier current devices or to devices operated under the provisions of
Sections 15.211, 15.213, 15.217, 15.219, or 15.221. Further, this requirement does not apply to intentional
Safety Information
1323x Development Hardware Reference Manual, Rev. 1.1
1-2 Freescale Semiconductor
radiators that must be professionally installed, such as perimeter protection systems and some field
disturbance sensors, or to other intentional radiators which, in accordance with Section 15.31(d), must be
measured at the installation site. However, the installer shall be responsible for ensuring that the proper
antenna is employed so that the limits in this Part are not exceeded.
1.2 Regulatory Approval For Canada (IC RSS 210)
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the
following two conditions:
1. This device may not cause interference, and
2. This device must accept any interference, including interference that may cause undesired
operation of the device.
1.2.1 26 PART 5 – Appendix
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de
licence. L'exploitation est autorisée aux deux conditions suivantes:
1. l'appareil ne doit pas produire de brouillage, et
2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage
est susceptible d'en compromettre le fonctionnement.
1.3 Electrostatic Discharge Considerations
Although damage from electrostatic discharge (ESD) is much less common on these devices than on early
CMOS circuits, normal handling precautions should be used to avoid exposure to static discharge.
Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels
of static without suffering any permanent damage.
All ESD testing is in conformity with the JESD22 Stress Test Qualification for Commercial Grade
Integrated Circuits. During the device qualification ESD stresses were performed for the human body
model (HBM), the machine model (MM) and the charge device model (CDM).
All latch-up test testing is in conformity with the JESD78 IC Latch-Up Test.
When operating or handling the development boards or components, Freescale strongly recommends
using at least the grounding wrist straps plus any or all of the following ESD dissipation methods:
Flexible fabric, solid fixed size, or disposable ESD wrist straps
Static control workstations, static control monitors and table or floor static control systems
Static control packaging and transportation materials and environmental systems
1.4 Disposal Instructions
This product may be subject to special disposal requirements. For product disposal instructions, refer to
www.freescale.com/productdisposal.
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 2-1
Chapter 2
MC1323x Development Platform Overview and Description
2.1 Introduction
The MC1323x development platform is an IEEE 802.15.4 compliant evaluation environment based on the
Freescale MC1323x device. The heart of the MC1323x platform is Freescale’s low cost System-on-Chip
(SoC) for the IEEE® 802.15.4 Standard that incorporates a complete, low power, 2.4 GHz radio frequency
transceiver with Tx/Rx switch, an 8-bit HCS08 CPU, and a functional set of MCU peripherals into a 48-pin
LGA package. This family of products is targeted for wireless RF remote control and other cost-sensitive
applications ranging from home TV and entertainment systems such as ZigBee BeeStack Consumer
(RF4CE) to low cost, low power, IEEE 802.15.4 and ZigBee end nodes.
The MC1323x development platform is comprised of three boards:
1323x-Modular Reference Board (1323x-MRB) - this board contains the MC1323x device with 32
MHz reference oscillator crystal, RF circuitry including antenna, and supporting circuitry. The
board can be used as a simple standalone evaluation platform or as a daughter card to the other
MC1323x development platform boards or to a custom, application specific motherboard. See
Chapter 3, “1323x-Modular Reference Board” for detailed information.
Provides compact reference design for device footprint and RF layout
Provides pre-designed MC1323x hardware (device and function)
Provides access to the MC1323x full set of GPIO
Provides MCU BDM debug port
Provides optional local 2 Mbit serial FLASH, 32.768 kHz oscillator crystal, IR “blaster” LED
and power management.
1323x-Remote Control Motherboard (1323x-RCM) - this board accepts the 1323x-MRB as a
plug-in module (daughter card) and supplies a variety of peripheral functions to the MC1323x
through the IO connectors. The peripheral functions are targeted primarily to a consumer TV or
entertainment remote control application. See Chapter 4, “1323x Remote Control Motherboard”
for detailed information.
Provides 36-switch matrix for remote control pushbuttons
USB <> serial interface for communication to a PC and provides board power
Touchpad for user interface
Onboard 128 x 32 pixel graphic LCD for menus and host feedback - a unique feature to
RF-based remote controls
Accelerometer for motion detection and game play
1323x-Remote Extender Motherboard (1323x-REM) - this board also accepts the 1323x-MRB
plug-in module (daughter card) and supplies a very simple set of peripheral functionality. See
MC1323x Development Platform Overview and Description
1323x Development Hardware Reference Manual, Rev. 1.1
2-2 Freescale Semiconductor
Chapter 5, “1323x Remote Extender Motherboard” for detailed information. A small 8-switch
matrix, IR receiver, and USB interface provides means for communication to the MC1323x for:
Simple keypad-only applications
Connection to a PC
Host connection such as for a remote control extender or remote control receiver
Whether the 1323x-MRB is used in a simple standalone application or in combination with another host
card, Freescale provides a complete software development environment called the Freescale BeeKit
Wireless Connectivity Toolkit (BeeKit). BeeKit is a comprehensive codebase of wireless networking
libraries, application templates, and sample applications. The BeeKit Graphical User Interface (GUI)
allows users to create, modify, and update various wireless networking implementations. A wide range of
software functionality is available to complement the 1323x-MRB and these are provided as codebases
within BeeKit.
2.2 Features
The MC1323x development platform is built around the concept of having a single daughter card
(1323x-MRB) that contains the MC1323x IC and all necessary I/O connections for use as a self-contained
module or for connection to an application motherboard. Figure 2-1 shows a simplified block diagram of
the more powerful Freescale configuration of the 1323x-MRB combined with the 1323x-RCM.
Figure 2-1. Simplified RCM+MRB Block Diagram
Figure 2-2 shows a photo of the combined boards with the 1323x-MRB mounted on the 1323x-RCM.
32 MHz 32.768
KHz
Power
Manage-
ment
DC Supply
2xAA Battery
VDD
MC13233
QFN
BDM
Debug
Port
3-Axis
Acceler-
ometer
USB
Interface
FT232RQ
UARTUSB
Conn
6x6
Switch
Matrix
PCB
F-Antenna
USB
IIC
Touchpad
V_LCD
2 Mbit
Serial
FLASH
GPIO
128x32
Graphic
LCD
Buzzer
4 LED
Indicators
IR
Blaster
SPI
MC1323x Development Platform Overview and Description
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 2-3
Figure 2-2. 1323x-MRB Mounted on the 1323x-RCM
Features of the MC1323x development platform include:
Full IEEE 802.15.4 compliant wireless node; ZigBee capable with Freescale’s BeeStack software
stack
Based on Freescale’s low-cost MC1323x IEEE® 802.15.4 SoC platform which incorporates a
complete, low power, 2.4 GHz radio frequency transceiver with Tx/Rx switch, an 8-bit HCS08
CPU, and a functional set of MCU peripherals into a 48-pin LGA package
Reference design area with small footprint, low cost RF node
Integrated transmit/receive switch
Differential input/output port (typically used with a balun)
Low external component count
Programmable output power with 0 dBm nominal output power, programmable from -30 dBm
to +3 dBm typical
Receive sensitivity of -93 dBm (typical) at 1% PER, 20-byte packet, much better than the IEEE
802.15.4 Standard of -85 dBm
MC1323x Development Platform Overview and Description
1323x Development Hardware Reference Manual, Rev. 1.1
2-4 Freescale Semiconductor
Onboard printed metal F-Antenna
32 MHz reference oscillator
BDM serial MCU debug port
Optional secondary 32.768 kHz crystal oscillator for accurate low power timing
IR blaster
2 Mbit serial FLASH (uses SPI interface)
Master reset switch
Full power regulation and management
1323x-MRB board provides
Required circuitry for MC13233 - crystals and RF circuitry including F-Antenna and optional
SMA connector
Local power supply regulation
Access to all GPIO
Standalone or daughter card use models
Serial FLASH, IR blaster, and BDM functions
1323x-RCM when used with 1323x-MRB provides
USB to UART serial interface that is USB bus-powered and full-speed compatible to the USB
2.0 and 1.1 specifications
Power supply source from two AA batteries, USB connector, or DC source
128x32 pixel graphic LCD
3-axis Accelerometer (uses IIC interface)
Touch pad interface with interrupt capability (uses IIC interface)
6x6 Switch matrix
Single tone buzzer
4 Blue LED indicators
1323x-REM when used with 1323x-MRB provides
USB to UART serial interface that is USB bus-powered and full-speed compatible to the USB
2.0 and 1.1 specifications
Power supply source from two AA batteries, USB connector, or DC source
IR receiver
4x2 Switch matrix
4 Blue LED indicators
MC1323x Development Platform Overview and Description
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 2-5
2.3 Driver Considerations
When users first connect a 1323x-RCM or 1323x-REM based platform to a PC, they may be prompted to
install drivers. If BeeKit is installed and this occurs, do not allow Windows to automatically search for and
install the drivers. Instead, select manual installation and steer Windows to the following directory:
C:\Program Files\Freescale\Drivers
If installing the BeeKit software package to another drive or directory, indicate the Drivers directory
created by the installer in the custom location where BeeKit was installed.
Follow the instructions as they appear on the screen to complete driver installation.
If BeeKit is not installed, be aware of the following:
The boards use the FTDI serial to USB converter, Virtual COM Port (VCP) driver for Windows,
available at www.ftdichip.com/ftdrivers.htm.
(Direct (D2XX) drivers are also available.)
The FTDI web site offers drivers for other platforms including Windows® (98 through Vista x64
and CE), MAC OS (8 through X) and Linux.
Download the appropriate driver and follow the instructions to complete driver installation.
2.4 General System Specifications
Table 2-1. MC1323x Platform Specifications
Parameter Units Notes/Conditions
MIN TYP MAX
Power
Voltage supply (DC) 2.5 5 6 V When using REM or RCM
Voltage supply (USB) 4.4 5 5.25 V USB 2.0/1.1 standard specification
Voltage supply (Batteries) 2.8 3.2 V
Temperature
Operating temperature; non-battery
operation (see note)
-20 +25 +70 °C Operating temperature is limited to +70 °C due to
switches. Basic circuit is good for a maximum
temperature of +85 °C.
Operating temperature; battery
operation (see note)
0 +25 +50 °C Operating temperature is limited by battery
temperature range
Storage temperature -30 +25 +70 °C
USB interface USB 2.0 and 1.1 full-speed compatible
RF (1323x-MRB)
802.15.4 Frequency range 2405 2480 MHz All 16 channels in the 2450 MHz band
Range (outdoor / line of sight) 300 Meter <1% PER for 20-byte packets (point-to-point in
communications with 1322X Sensor Reference
Board)
MC1323x Development Platform Overview and Description
1323x Development Hardware Reference Manual, Rev. 1.1
2-6 Freescale Semiconductor
RF Transmitter
802.15.4 Output power -30 0 +3 dBm Over range of Pout from IC control in 2 dB steps.
Note: On channel 26, output power should not
exceed -5 dBm (power setting 0x0E) to meet
FCC Part 15 requirements.
Harmonics
2nd harmonics
3rd harmonics
-30?
-30?
dBm
dBm
Harmonics are compliant to ETSI and FCC
regulatory approval standards
RF Receiver
802.15.4 sensitivity -93 dBm <1% PER for 20-byte packets
Regulatory Approval
FCC Not yet certified.
CE (ETSI) Product is approved accordingly to the EN 300 328
V1.7.1 (2006-10) standard
CE (EMC) Product is approved accordingly to the EN 301 489-1
V1.6.1 (2005-09) and EN 301 489-17 V1.2.1
(2002-08) standards
Safety
UL Product is approved accordingly to the IEC 60950-1
and EN 60950-1, First Edition standards
Environment
RoHS Product complies with the EU Directive 2002/95/EC
of 27 January 2003
WEEE Product complies with the EU Directive 2002/95/EC
of 27 January 2003
Table 2-1. MC1323x Platform Specifications
Parameter Units Notes/Conditions
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 3-1
Chapter 3
1323x-Modular Reference Board
3.1 1323x-MRB Overview
The 1323x-Modular Reference Board (1323x-MRB) is an IEEE 802.15.4 compliant evaluation board
based on the Freescale MC1323x device. The 1323x-MRB provides a platform to evaluate the MC1323x
device, develop software and applications, and demonstrate IEEE 802.15.4 based networking capabilities.
The core device is accompanied by the 32 MHz reference oscillator crystal, RF circuitry including
antenna, and supporting circuitry.
This basic board is intended as the core module for MC1323x evaluation and application development and
can be used in the following modes:
Simple standalone evaluation platform
Daughtercard to the other MC1323x Development Platform boards (1323x-RCM or 1323x-REM)
Daughtercard to an application specific motherboard.
3.1.1 Features
The 1323x-MRB provides the following features:
Small form factor (2 x 2 inches)
4-Layer metal, 0.034 inch thick FR4 board
MC1323x reference design area
LGA footprint and power supply bypass
32 MHz reference oscillator crystal
RF components and layout
Low cost RF node
Integrated transmit/receive switch
Differential input/output port (typically used with a balun)
Programmable output power with 0 dBm nominal output power, programmable from -30 dBm
to +3 dBm typical
Receive sensitivity of -93 dBm (typical) at 1% PER, 20-byte packet
Printed metal F-Antenna
32.768 kHz crystal provided for optional timing oscillator
Two connectors provided daughter card mounting
20-Pin primary connector
nd freescale
1323x-Modular Reference Board
1323x Development Hardware Reference Manual, Rev. 1.1
3-2 Freescale Semiconductor
18-Pin secondary connector
Provide main supply voltage to board
Provide access to all MC1323x GPIO
Flexible board power supply
3.3 V LDO series regulator supplied
Regulator bypass jumper option
Separate external voltage source option
Power-on green LED
Jumpers allow various block current measurements
6-Pin BDM serial MCU debug port
MC1323x reset switch
Onboard peripheral functions
IR blaster (The MC1323x CMT port is employed as a GPIO to drive large IR blasters. For IR
blasters under 20ma, use the CMT port directly.)
2 Mbit serial FLASH (uses SPI interface)
3.1.2 Form Factor
Figure 3-1 shows the 1323x-MRB connector and header locations.
Figure 3-1. 1323x-Modular Reference Board (1323x-MRB)
BDM Port
Reset Sw
Primary 20-Pin IO
Connector (J2)
J6
(J4) J5
Secondary 18-Pin IO
Connector (J3)
J9
J8
F-Antenna
IR Diode D2
1323x-Modular Reference Board
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 3-3
Figure 3-2 shows a footprint of the 1323x-MRB with the location of the IO Headers J2 and J3. The user
may desire to create a motherboard on which the 1323x-MRB would be mounted, and headers J2 and J3
are used for connection to the motherboard:
Both headers have standard 0.10in / 2.54 mm pin spacing
J2 is 20-pin and J3 is 18-pin
Both are pin headers mounted on the bottom side of the 1323x-MRB and are intended to plug into
matching receptacles on the motherboard.
It is recommended that 1323x-MRB be located such that it extends beyond edge of the
motherboard (see Figure 3-2) so that the entire F-Antenna is exposed with no motherboard ground
or voltage plane beneath it. This is to allow best results transmitting and receiving with the radio.
With the 1323x-MRB oriented as shown in Figure 3-2, the IR blaster transmits to the right.
Figure 3-2. 1323x-MRB Top Side (Component Side) Footprint
2.01 in
2.01 in
0.45 in
0.10 in
0.49 in
0.55 in
1323x-Modular Reference Board
1323x Development Hardware Reference Manual, Rev. 1.1
3-4 Freescale Semiconductor
3.1.3 Board Level Specifications
Table 3-1. 1323x-MRB Specifications
Parameter Units Notes/Conditions
MIN TYP MAX
General
Size (PCB: X, Y) 51 x 51
2.01 x 2.01
mm
inches
Layer build (PCB) 0.8
0.034
mm
inches
4-Layer
Dielectric material (PCB) FR4
Power
Voltage supply (DC)
With 3.3 V regulator in use
Not using regulator with serial
FLASH and IR
Not using regulator with
MC1323x only
3.50
2.7
1.8
16
3.6
3.6
V Full module use
Not regulated - using all features
Lower voltage usable only by MC1323x
Current consumption TBD mA
Temperature
Operating temperature (see note) -20 +25 +70 °C Operating temperature is limited to +70
°C due to switches. Basic circuit is good
for a maximum temperature of +85 °C.
Operating temperature may also be
further limited when used in conjunction
with REM or RCM having a battery
supplied voltage source. See Ta b l e 4 - 1
and Table 5-1.
Storage temperature -30 +25 +70 °C
IR Transmitter
Current 63 mA
Range 10 m
RF
802.15.4 Frequency range 2405 2480 MHz All 16 channels in the 2450 MHz band
Range (outdoor / line of sight) 300 Meter <1% PER for 20-byte packets (point-to-point
in communications with 1323x Sensor
Reference Board)
RF Transmitter
802.15.4 Output power -30 0 +3 dBm
1323x-Modular Reference Board
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 3-5
3.2 Functional Description
The 1323x-MRB is built around Freescale’s MC1323x 48-pin LGA IEEE 802.15.4 platform. Figure 3-2
shows a simple block diagram. This board is intended as a simple evaluation platform and as a building
block for application development. The 4-layer board provides the MC1323x with its required RF
circuitry, 32 Mhz reference oscillator crystal, and power supply bypassing. The layout for this base level
functionality can be used as a reference layout by the user target board.
In additional to the base MC1323x functionality, the 1323x-MRB provides features to assist in debug, an
IR blaster, a 2 Mbit serial FLASH, reset button, simple power manager, and expansion connectors for the
GPIO. In the following sections, refer to:
Figure 3-1 for location of connectors and features
Figure 3-3 for the functional blocks
Figure 3-11 for the board schematic
Harmonics
2nd harmonics
3rd harmonics
-38
-35
dBm
dBm
Harmonics are compliant to ETSI and FCC
regulatory approval standards
RF Receiver
802.15.4 sensitivity -93 dBm <1% PER for 20-byte packets
Regulatory Approval
FCC Product is approved accordingly to the FCC
part 15 standard
CE (ETSI) Product is approved accordingly to the EN
300 328 V1.7.1 (2006-10) standard
CE (EMC) Product is approved accordingly to the EN
301 489-1 V1.6.1 (2005-09) and EN 301
489-17 V1.2.1 (2002-08) standards
Safety
UL Product is approved accordingly to the IEC
60950-1 and EN 60950-1, First Edition
standards
Environment
RoHS Product complies with the EU Directive
2002/95/EC of 27 January 2003
WEEE Product complies with the EU Directive
2002/95/EC of 27 January 2003
Table 3-1. 1323x-MRB Specifications (continued)
Parameter Units Notes/Conditions
1323x-Modular Reference Board
1323x Development Hardware Reference Manual, Rev. 1.1
3-6 Freescale Semiconductor
Figure 3-3. 1323x-MRB Block Diagram
3.2.1 RF Performance and Considerations
The MC1323x transceiver includes a low noise amplifier, 1mW nominal output power, PA with internal
voltage controlled oscillator (VCO), integrated transmit/receive switch, on-board power supply regulation,
and full spread-spectrum encoding and decoding.
Nominal output power is 0 dBm, with +3 dBm max
Typical sensitivity is -93 dBm
Frequency range is 2405 to 2480 MHz
Typical range (outdoors, line of sight) is 130 meters
The 1323x Modular Reference Board utilizes a minimum number of components while providing good
RF performance:
Uses a minimum number of RF matching components and external 50:100 balun
“F” printed metal antenna for a small footprint, low cost design
An external 50 (unbal):100 (bal) balun connects a single-ended 50-Ω port to the differential RF port of the
MC1323x radio. The layout has provision for out-of-band signal suppression (components L2 and C7) if
required. Also note that control pin CT_Bias switches reference voltage to the balun as required for TX
(CT_Bias = 1.5V) or RX (CT_Bias = ground).
The default RF mode is use of the “F” antenna coupled through 10 pF C3 to the single-end RF port. An
alternative mode is to connect an SMA RF connector (not provided; must be mounted). This is useful for
connected measurements to test radio performance.
NOTE
See the MC1323x Data Sheet and Reference Manual for more RF design
information.
32 MHz 32.768
KHz
MC13233
QFN
BDM
Debug
Port
CMT
GPIO
SPI
IR
Blaster
LED
2 Mbit
Serial
FLASH
Reset
Button
GPIO
Headers
J2 & J3
Optional
SMA
Conn
F-Ant
Power
Manage-
ment
"’”° fl znrp u unnaaw Visas) 2 a; u Arm Unm-
1323x-Modular Reference Board
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 3-7
Figure 3-4. 1323x-MRB RF Circuitry
3.2.2 Clocks
The MC1323x provides for two clocks:
32 MHz Reference Oscillator - Figure 3-5 shows the external 32 MHz external crystal Y2. This
mounted crystal must meet the MC1323x specifications. The IEEE 802.15.4 Standard requires that
the frequency be accurate to less that +/-40 ppm.
Capacitors C10 and C11 provide the bulk of the crystal load capacitance. Onboard trim
capacitors can be programmed to center the frequency. At 25°C, it is desired to have the
frequency accurate to +/-10 ppm or less to allow for temperature variation.
To measure the 32 MHz oscillator frequency, signal PTD7/XTAL_32MOUT can optionally be
programmed to provide a buffered output clock signal
The 1323x-MRB has provision for injecting an external 32 MHz clock source as an alternative
to use of the onboard crystal:
The crystal Y2 should be removed
Resistors R23, R24, R19, and R20 must be mounted
C23 must be mounted
The external 32 MHz source is connected to 2-pin header J8; the frequency accuracy of the
external source must meet the +/-40 ppm of the IEEE 802.15.4
Optional 32.768 kHz Crystal Oscillator - Provision is also made for a secondary 32.768 kHz crystal
X2 (see Figure 3-6). This oscillator can be used for a low power accurate time base.
The module comes provided with this Y1 crystal and its load capacitors C4 and C15.
Load capacitors C4 and C15 provide the entire crystal load capacitance; there is no onboard
trim capacitance.
The 32 kHz oscillator components are supplied, but un-enabled. Zero-ohm resistors R11 and
R13 enable use of IO signals PTA0 and PTA1 via the IO connector and are supplied as mounted.
These must be unmounted and moved to resistor sites R10 and R12 to enable the 32.768 kHz
crystal and disable PTAO and PTA1.
> >> <>> 4‘ amn<> w a >> L 2 §i§§3§ Figure 3-7. 1323x-MRB Reset Switch an 1323x Development Hardware Reference Ma 3-8
1323x-Modular Reference Board
1323x Development Hardware Reference Manual, Rev. 1.1
3-8 Freescale Semiconductor
Figure 3-5. 1323x-MRB 32 MHz Reference Oscillator Circuit
Figure 3-6. 1323x-MRB 32.768 kHz Optional Oscillator Circuit
3.3 Reset and BDM Debug Port
The reset circuit and BDM port connector are shown in Figure 3-7. See Figure 3-1 for switch and header
locations.
Reset switch RST2 is active low and provides a hardware reset to the MC1323x
The 6-pin BDM 2x3 header J10 is provided to connect the MC1323x serial debug port to a standard
HC9S08 debug module.
Figure 3-7. 1323x-MRB Reset Switch and BDM Port
32MHz XTAL
V_IC
V_IC
XTAL_32M
EXTAL_32M
C10
12PF
C10
12PF
C11
12PF
C11
12PF
R24
1K
DNP
R24
1K
DNP
R19
1K
DNP
R19
1K
DNP
R20
1K
DNP
R20
1K
DNP
Y2
32MHZ
Y2
32MHZ
1 4
32
C23
10PF
DNP
C23
10PF
DNP
J8
HDR 1X2
J8
HDR 1X2
1
2
R23
1K
DNP
R23
1K
DNP
32kHz XTAL
MRB-PTA1MRB-PTA0
PTA1/EXTAL_32KPTA0/XTAL_32K
R13 0R13 0
Y1
32.768KHZ
Y1
32.768KHZ
21
C4
12PF
C4
12PF
R10
0
DNP
R10
0
DNP
R11 0R11 0
R12
0
DNP
R12
0
DNP
C5
12PF
C5
12PF
BDM
V_IC
BKGD
MRB-RSTb
BH1
125
BH1
125
TL1TL1 BH3
125
BH3
125
J4
HDR 2X3
J4
HDR 2X3
1 2
3 4
65
BH2
125
BH2
125
TL2TL2 BH4
125
BH4
125
TL3TL3
J5: Exmxmu. suppm Vi“ VJNREG u J5 ‘ m2 \ 2 40 40 o 2 \ H mm ‘ ‘ vruNREE “no 4. T W T g M \ L i ‘ 2m IN N ‘ ' 2 END ' mm; J5: »snum 27>) UNREGULATED :xmzmu. suppm vinxT > 3.3V »snum 27>2 mum IF vith 3v moist-(Um WHEN vixaRD USED A5 suppu mxouen J9, pm: 3 s A snuman Pawnk Mnmemnm
1323x-Modular Reference Board
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 3-9
3.3.1 Power Management
The 1323x-MRB power management circuit is shown in Figure 3-8.
Figure 3-8. 1323x-MRB Power Management Circuit
Power to the 1323x-MRB can be configured in several ways and the circuit has the following features:
Board can be supplied through the IO headers (V_BRD)
Board can be supplied from an external DC supply (J5)
The external supply can be unregulated (V_UNREG) and make use of the onboard 3.3 V LDO
regulator
The external supply voltage can be used directly without use of the LDO
8-Pin 2x4 header J9 provides means to supply current to various board components and also
measure current if desired
Green LED D1 is available as a power indicator.
Table 3-2 shows the header configuration information for the various power supply modes.
NOTE
The Freescale 1323x-RCM and 1323x-REM development boards
generate the system power supply on the motherboard and supply the
voltage to the 1323x-MRB through the V_BRD pin of Headers J2 and
J3. In this mode, the current flows to the 1323x-MRB through the pins.
If an external supply is used via 1323x-MRB header J5, current flows to
the motherboard through the V_BRD pin of Headers J2 and J3. THE
MOTHERBOARD SUPPLY SHOULD NOT BE USED.
In all modes, the IO voltage supply of peripherals on a motherboard
must be the same voltage as V_BRD, which is also the voltage applied
to the IC MC1323x.
POWER ON
3.3V LDO REGULATOR
J6:
»SHUNT 2->1 UNREGULATED EXTERNAL SUPPLY V_EXT > 3.3V
»SHUNT 3->2 ONLY IF V_EXT = 3V
»NO-SHUNT WHEN V_BRD USED AS SUPPLY THROUGH J9, PINS 3 & 4 SHUNTED
J5: EXTERNAL SUPPLY
POWER MANAGEMENT
VDD
V_LED
V_EXT
V_LDO
V_UNREG
V_LED
V_MEM
V_BRD
V_IC
V_UNREG
TP3TP3
TP6TP6
D1
GREEN
D1
GREEN
AC
TP13TP13
C12
1UF
C12
1UF
TP2TP2
TP5TP5
C13
2.2UF
C13
2.2UF
TP12TP12
J6
HDR TH 1X3
J6
HDR TH 1X3
1
2
3
TP1TP1
J9
HDR_2X4
J9
HDR_2X4
1 2
3 4
65
7 8
TP4TP4
R7
330
R7
330
D4
MBR0520LT1G
D4
MBR0520LT1G
2 1
U3
LP2985AIM5-3.3
U3
LP2985AIM5-3.3
VIN
1
GND
2
ON/OFF
3
BYP
4
VOUT 5
R4 0R4 0
C14
0.01UF
C14
0.01UF
D3
MBR0520LT1G
D3
MBR0520LT1G
2 1
J5
HDR 1X2
J5
HDR 1X2
1
2
The 1323erRB main suggly is sugglied by the momerboard ‘hrough me J2 and J3 Headers
1323x-Modular Reference Board
1323x Development Hardware Reference Manual, Rev. 1.1
3-10 Freescale Semiconductor
Header J9 provides means to disable different sub-circuits or measure current and connections are
described in Table 3-3. Current measurements can be made by inserting a current meter in place of a
designated jumper.
Table 3-2. 1323x-MRB Power Configurations
Mode Voltage
Range
External
Source
J5
Ext Mode
Select
J6
Current Enable
J9 Description
Source V_BRD 2.7 - 3.6 V1
1The MC1323x can run as low as 1.8 V, however, the serial FLASH and IR blaster require 2.7 V or greater
Not used Not used - all
pins open
Short Pins 3-4 -
short other desired
supplies
Normal Operation -
The 1323x-MRB main supply is
supplied by the motherboard
through the J2 and J3 Headers
External Source
- Using LDO
3.5 - 16 V Connected -
supplies
DC Voltage
Short Pins 1-2 Short pins for all
desired supplies
External voltage w/regulation -
Input range is set by the LDO
regulator.
3.3 V is supplied to 1323x-MRB;
do not use motherboard supply
J2 and J3 Headers supply
voltage to V_BRD pins when J9,
Pins 3-4 are shorted
External Source
- Not Using LDO
2.7 - 3.6 V1Connected -
supplies
DC Voltage
Short Pins 2-3 Short pins for all
desired supplies
External voltage w/o regulation -
Input range is set by the onboard
circuitry
2.7 - 3.3 V is supplied to
1323x-MRB
J2 and J3 Headers supply
voltage to V_BRD pins
Table 3-3. Power Distribution Header J9
Supply
Designation
Header
Pins Description
V_MEM 1 - 2 Supply voltage to serial FLASH memory -
Jumper pins to supply memory.
If memory is not powered, it can load MC1323x SPI port
V_BRD 3 - 4 Supply voltage connected to IO Connectors J2 and J3 -
This supplies J2 and J3 if an external MRB supply is used
This voltage supplies the MRB if the motherboard is the main power
This connection is normally always jumpered
V_IC 5 - 6 Supply voltage to MC1323x -
Normally jumpered
Supplies only the MC1323x IC
Normally always same voltage as V_BRD
V_LED 7 - 8 Supply voltage to power indicator LED and IR blaster LED -
Jumper to use indicator or IR blaster
Leave open for lowest power
1323x-Modular Reference Board
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 3-11
3.3.2 IO Connectors J2 and J3
The two IO connectors J2 and J3 are standard 100 mil pin headers mounted on the back (non-component
side) of the 1323x-MRB. The primary header J2 is 20-pin and the secondary header J3 is 18-pin, and they
are mounted physically in such a manner as to prevent reverse insertion of the 1323x-MRB into a
motherboard receptacle (see Figure 3-2). When the 1323x-RCM or 1323x-REM or custom motherboard
is plugged into these connectors, they allow access to MC1323x MCU GPIO.
V_BRD is the connector supply voltage.
Depending on power supply configuration, this voltage may supply the 1323x-MRB from the
motherboard or the 1323x-MRB may supply this voltage to the motherboard. See
Section 3.3.1, “Power Management”.
Peripherals IO to the MC1323x and the MC1323x supply should use this same voltage
NOTE
The 1323x-RCM and 1323x-REM and 1323x-MRB are supplied configured
for the motherboard to supply main power.
Some of the GPIO are shared with onboard devices. Check for the 1323x-MRB schematic and
Table 3-4 and Table 3-5 for any conflict.
BDM port signal PTA7/BKGD is NOT connected to the IO headers to prevent possible interference
with the debug port.
Table 3-4. 20 Pin Connector
Header Pin
Number MC1323x Pin Name Description
1 V_BRD VDD supply to module
2 PTC5/SS SPI Bus Slave Select (SS) - shared with serial FLASH
3 GND Module ground
4 PTC7/MOSI SPI Bus MOSI signal - shared with serial FLASH
5 PTD5/RXD UART RXD input to MCU
6 PTC6/MISO SPI Bus MISO signal - shared with serial FLASH
7 PTD6/TXD UART TXD Output from MCU
8 PTC4/SPICLK SPI Clock (SPISCK) - shared with serial FLASH
9 PTD0/TPM0 GPIO / Timer IO
10 RESET Reset
11 PTA5/SDA I2C Bus data signal (SDA)
12 PTB7/KBI1P7 UART flow control RTS input into MCU (implemented in Freescale software)
13 PTA6/SCL I2C Bus clock signal (SCL)
14 PTD2/TPM2 UART flow control CTS output from MCU (implemented in Freescale software)
15 GND Module ground
16 PTD7/XTAL_32MOUT Port D Bit 7
1323x-Modular Reference Board
1323x Development Hardware Reference Manual, Rev. 1.1
3-12 Freescale Semiconductor
17 PTB0/KBI1P0 Port B Bit 0 / KBI1 Input Bit 0
18 PTB1/KBI1P1 Port B Bit 1 / KBI1 Input Bit 1
19 PTB2/KBI1P2 Port B Bit 2 / KBI1 Input Bit 2
20 PTB3/KBI1P3 Port B Bit 3 / KBI1 Input Bit 3
Table 3-5. 18 Pin Connector
Header Pin
Number MC1323x Pin Name Description
1 V_BRD VDD supply to module
2 PTA1/EXTAL_32K Port A Bit 1 - signal shared with 32.768 kHz oscillator
3 PTA0/XTAL_32K Port A Bit 0 - signal shared with 32.768 kHz oscillator
4 GND Module Ground
5 PTA2 Port A Bit 2 - MC1323x test mode enable; SPECIAL SIGNAL REFER TO
MC1323x Reference Manual
6 PTA3/IRQ Port A Bit 3 / IRQ (active low)
7 PTA4/XTAL_32KOUT Port A Bit 4 / optional buffered 32.768 kHz clock output
8 PTB4/KBI1P4 Port B Bit 4 / KBI1 Input Bit 4
9 PTB5/KBI1P5 Port B Bit 5 / KBI1 Input Bit 5
10 PTB6/KBI1P6 Port B Bit 6 / KBI1 Input Bit 6
11 PTC0/KBI2P0 Port C Bit 0 / KBI2 Input Bit 0
12 PTC1/KBI2P1 Port C Bit 1 / KBI2 Input Bit 1
13 PTC2/KBI2P2 Port C Bit 2 / KBI2 Input Bit 2
14 PTC3/KBI2P3 Port C Bit 3 / KBI2 Input Bit 3
15 PTD1/TPM1 Port D Bit 1/ TPM1
16 PTD3/TPM3 Port D Bit 3/ TPM3
17 PTD4/CMT Port D Bit 4/ CMT output - signal shared with IR blaster
18 GND Module ground
Table 3-4. 20 Pin Connector
Header Pin
Number MC1323x Pin Name Description
1323x-Modular Reference Board
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 3-13
3.3.3 1323x-MRB Onboard Peripheral Functions
The 1323x-MRB has two onboard peripheral functions to assist in implementing targeted applications.
NOTE
To use the peripherals, a minimum power supply voltage of 2.7 V must be
maintained.
3.3.3.1 2 Mbit Serial FLASH (SPI Interface)
Component U2 is an Atmel AT45DB021D 2 Mbit (256 kbyte) serial FLASH memory with SPI interface.
The memory is useful for over-the-air programming (OTAP) and for storage of non-volatile system data
or parameters. Figure 3-9 shows the memory circuit.
Memory power supply is V_MEM (Header J9, Pin 1-2)
Disabling the memory supply V_MEM may load the MC1323x SPI port through the U2 ESD
diodes
Discrete pullup resistors for the SPI port are provided
The SPI can be shared with another peripheral - an additional IO signal would be required as a chip
enable (CS or SS) for the peripheral. The normal SPI_SS and the second chip select should NOT
be active at the same time.
Figure 3-9. AT45DB021D 2 Mbit (256 kbyte) Serial FLASH memory
2MBit (256KB) FLASH
V_MEM
V_MEM V_MEMV_MEM
MRB-SPI_MISOMRB-SPI_MOSI
MRB-SPI_CLK
MRB-SPI_SS
R21
10K
R21
10K
R18
10K
R18
10K
U2
AT45DB021D
U2
AT45DB021D
SCK
2
VCC 6
WP 5
RESET
3
GND 7
CS
4
SI
1SO 8
R17
10K
R17
10K
R22
10K
R22
10K
a
1323x-Modular Reference Board
1323x Development Hardware Reference Manual, Rev. 1.1
3-14 Freescale Semiconductor
3.3.3.2 IR Transmitter (Blaster)
An IR transmitter or blaster is provided to control IR legacy components (see Figure 3-10).
The IR power supply is V_LED (Header J9, Pin 7-8)
The IR transmitter has approximately a 10 meter range.
Current draw is approximately 80 mA when active.
To reduce the peak current consumption, it is recommended that the IR transmitter only be active
when the MC1323x RF transceiver is in-active.
When using the blaster in an application, observe proper orientation (see Figure 3-2)
Figure 3-10. IR Transmitter Circuit
INFRARED LED
V_LED
MRB-PTD4/CMT
R2
18.2
R2
18.2
TP9TP9
D2
VSLB3940
D2
VSLB3940
AC
R9
27K
R9
27K
R6
1.5K
R6
1.5K
TP8TP8
Q1
MMBT3904LT1G
Q1
MMBT3904LT1G
2 3
1
TP7TP7
W W ‘w‘WWwW \ W W ‘ WL ‘ W T I. W W > w W W W W W W » W 1,, W W W, ,. . W l, W n _ W W . . W I, W “W W W a W l, W W \ ‘‘‘‘‘‘‘‘‘‘‘‘‘‘ £33 fl! 1, W > W W‘ “““““““ W W W W W NEE WEEgE « WWWWW ‘‘‘‘‘‘‘‘‘‘‘‘‘‘‘‘‘‘‘‘‘‘‘‘‘‘‘‘‘‘‘‘‘‘
1323x-Modular Reference Board
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 3-15
3.4 Schematic, Board Layout, and Bill of Material
Figure 3-11. 1323x-MRB Schematic
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
RESET
20-PIN GPIO
STANDARD HEADER
GPIO
POWER ON
3.3V LDO REGULATOR
INFRARED LED2MBit (256KB) FLASH
BDM
J6:
»SHUNT 2->1 UNREGULATED EXTERNAL SUPPLY V_EXT > 3.3V
»SHUNT 3->2 ONLY IF V_EXT = 3V
»NO-SHUNT WHEN V_BRD USED AS SUPPLY THROUGH J9, PINS 3 & 4 SHUNTED
HARMONIC TRAP
J5: EXTERNAL SUPPLY
POWER MANAGEMENT GPIO MAPPING
32MHz XTAL
32kHz XTAL
C8 & C28 PLACE
CLOSE TO U1.39
C18 & C26 PLACE
CLOSE TO U1.47
RF_SMA
RF_N
Z_RF_P
Z_RF_N
RF_ANT
RF_P
MRB-PTA2/LCD_CTL0
RF_50
V_IC
VDD
V_IC
V_LED
V_LED
V_IC
V_MEM
V_EXT V_BRD
V_BRD
V_LDO
V_UNREG
V_IC V_IC
V_MEM
V_IC
V_MEM
V_IC
V_IC
V_LED
V_MEM
V_BRD
V_IC
V_MEM
V_IC
V_UNREG
MRB-RSTb
XTAL_32M
BKGD
MRB-RSTb
MRB-SPI_MISOMRB-SPI_MOSI
MRB-SPI_CLK
MRB-SPI_SS
MRB-PTA1MRB-PTA0
PTA1/EXTAL_32KPTA0/XTAL_32K
RF_BIAS
RF_BIAS
MRB-KBI2P3
MRB-KBI2P2
PTA0/XTAL_32K
MRB-KBI2P1
MRB-KBI2P0
BKGD
MRB-I2C_SDA
MRB-RSTb
MRB-PTA4/32K_OUT
MRB-SPI_CLK
MRB-SPI_MOSI
MRB-I2C_SCL
MRB-PTA2/LCD_CTL0
MRB-SPI_MISO
MRB-SPI_SS
PTA1/EXTAL_32K
MRB-PTA3/IRQb
MRB-KBI1P0
MRB-KBI1P1
MRB-KBI1P2
MRB-KBI1P3
MRB-KBI1P4
MRB-KBI1P5
MRB-KBI1P6
MRB-UART_RTS/KBI1P7
MRB-PTD4/CMT
EXTAL_32M
XTAL_32M
MRB-PTD1/TPM1
MRB-UART_CTS/TPM2
MRB-PTD7
MRB-UART_TXD
MRB-UART_RXD
MRB-PTD3/TPM3
MRB-TPM0
EXTAL_32M
MRB-I2C_SCL
MRB-SPI_MOSI
MRB-SPI_SS
MRB-I2C_SDA
MRB-UART_RXD
MRB-UART_TXD
MRB-UART_CTS/TPM2
MRB-UART_RTS/KBI1P7
MRB-KBI1P2
MRB-KBI1P0
MRB-TPM0 MRB-RSTb
MRB-PTD7
MRB-SPI_CLK
MRB-KBI1P1
MRB-KBI1P3
MRB-SPI_MISO
MRB-PTD4/CMT
MRB-KBI1P5
MRB-PTA4/32K_OUT
MRB-KBI2P0
MRB-KBI1P4
MRB-KBI1P6
MRB-KBI2P1
MRB-KBI2P3
MRB-PTA3/IRQb
MRB-KBI2P2
MRB-PTA1
MRB-PTD1/TPM1
MRB-PTA0
MRB-PTA2/LCD_CTL0
MRB-PTD3/TPM3
MRB-PTD4/CMT
Drawing Title:
Size Document Number Rev
Date: Sheet of
Page Title:
ICAP Classification: FCP: FIUO: PUBI:
SCH-26115 PDF: SPF-26115 E4
1323X MODULAR REFERENCE BOARD
C
Thursday, February 10, 2011
MAIN SCHEMATIC
33
X ______
Drawing Title:
Size Document Number Rev
Date: Sheet of
Page Title:
ICAP Classification: FCP: FIUO: PUBI:
SCH-26115 PDF: SPF-26115 E4
1323X MODULAR REFERENCE BOARD
C
Thursday, February 10, 2011
MAIN SCHEMATIC
33
X ______
Drawing Title:
Size Document Number Rev
Date: Sheet of
Page Title:
ICAP Classification: FCP: FIUO: PUBI:
SCH-26115 PDF: SPF-26115 E4
1323X MODULAR REFERENCE BOARD
C
Thursday, February 10, 2011
MAIN SCHEMATIC
33
X ______
C10
12PF
C10
12PF
BH1
125
BH1
125
TP14TP14
C7
1PF
C7
1PF
L1
0.0033UH
L1
0.0033UH
12
TL1TL1
TP3TP3
BH3
125
BH3
125
R2
18.2
R2
18.2
C26
8.2PF
C26
8.2PF
C1
1000pF
C1
1000pF
R13 0R13 0
C25
8.2PF
C25
8.2PF
C22
0.22UF
C22
0.22UF
C11
12PF
C11
12PF
C3
10PF
C3
10PF
Y1
32.768KHZ
Y1
32.768KHZ
21
U1
MC1323X
U1
MC1323X
PTA0/XTAL_32K
1
PTA1/EXTAL_32K
2
RESET
3
PTA2
4
PTA3/IRQ
5
PTA4/XTAL_32K_OUT
6
PTA5/SDA
7
PTA6/SCL
8
PTA7/BKGD/MS
9
PTB0/KBI1P0
10
PTB1/KBI1P1
11
PTB2/KBI1P2
12
PTB3/KBI1P3
13
PTB4/KBI1P4
14
PTB5/KBI1P5
15
PTB6/KBI1P6
16
PTB7/KBI1P7
17
PTC0/KBI2P0
18
PTC1/KBI2P1
20
PTC2/KBI2P2
21
PTC3/KBI2P3
22
PTC4/SPICLK
23
PTC5/SS
24
PTC6/MISO
25
PTC7/MOSI
26
PTD0/TPM0 27
PTD1/TPM1 28
PTD2/TPM2 29
PTD3/TPM3 30
PTD4/CMT 31
PTD5/TXD 32
PTD6/RXD 33
PTD7/XTAL_32M_OUT 34
XTAL_32M 35
EXTAL_32M 36
RF_P 42
RF_N 41
NC 40
NC/TINJ_N 45
RF_BIAS/TINJ_P 43
PAD 49
VBATT_1 48
VBATT_2 44
VBATT_3 37
VBATT_4 19
VREG_VCO 38
VDD_ANA 39
VREG_LO2 46
VREG_ANA 47
TP10TP10
TP6TP6
D1
GREEN
D1
GREEN
AC
R25 0R25 0
R21
10K
R21
10K
J4
HDR 2X3
J4
HDR 2X3
1 2
3 4
65
C6
10PF
C6
10PF
J2
HDR_10X2
J2
HDR_10X2
1 2
3 4
65
7 8
910
11 12
13 14
15 16
17 18
19 20
TP13TP13
TP9TP9
C4
12PF
C4
12PF
C17
10PF
DNP
C17
10PF
DNP
C18
0.22UF
C18
0.22UF
D2
VSLB3940
D2
VSLB3940
AC
C12
1UF
C12
1UF
TP2TP2 BH2
125
BH2
125
RST1
SW_MOM
RST1
SW_MOM
12
3
4
R15
10K
R15
10K
R24
1K
DNP
R24
1K
DNP
R9
27K
R9
27K
TP16TP16
R1
15K
R1
15K
L2
0.0039UH
DNP
L2
0.0039UH
DNP
12
R19
1K
DNP
R19
1K
DNP
R20
1K
DNP
R20
1K
DNP
TP5TP5
Y2
32MHZ
Y2
32MHZ
1 4
32
C23
10PF
DNP
C23
10PF
DNP
R10
0
DNP
R10
0
DNP
R11 0R11 0
R6
1.5K
R6
1.5K
R14
10K
R14
10K
TL2TL2
C8
0.22UF
C8
0.22UF
C13
2.2UF
C13
2.2UF
J1
SMA_EDGE
J1
SMA_EDGE
1
G1 G3
G2 G4
TP12TP12
TP8TP8R18
10K
R18
10K
J6
HDR TH 1X3
J6
HDR TH 1X3
1
2
3
TP1TP1
C16
0.1UF
C16
0.1UF
C20
0.01UF
C20
0.01UF
C2
10PF
DNP
C2
10PF
DNP
R26 0R26 0
BH4
125
BH4
125
TP15TP15
R12
0
DNP
R12
0
DNP
ANT1
F_Antenna
ANT1
F_Antenna
U2
AT45DB021D
U2
AT45DB021D
SCK
2
VCC 6
WP 5
RESET
3
GND 7
CS
4
SI
1SO 8
Q1
MMBT3904LT1G
Q1
MMBT3904LT1G
2 3
1
Z1
50/100 OHMS
Z1
50/100 OHMS
5
1
6
2
3
4
R16
10K
R16
10K
R17
10K
R17
10K
J9
HDR_2X4
J9
HDR_2X4
1 2
3 4
65
7 8
TP4TP4
C5
12PF
C5
12PF
R7
330
R7
330
D4
MBR0520LT1G
D4
MBR0520LT1G
2 1
C15
10UF
C15
10UF
J8
HDR 1X2
J8
HDR 1X2
1
2
U3
LP2985AIM5-3.3
U3
LP2985AIM5-3.3
VIN
1
GND
2
ON/OFF
3
BYP
4
VOUT 5
TL3TL3
TP11TP11
TP7TP7
C9
0.22UF
C9
0.22UF
J3
HDR 2X9
J3
HDR 2X9
1 2
3 4
65
7 8
910
11 12
13 14
15 16
17 18
R4 0R4 0
R23
1K
DNP
R23
1K
DNP
C14
0.01UF
C14
0.01UF
R22
10K
R22
10K
D3
MBR0520LT1G
D3
MBR0520LT1G
2 1
J5
HDR 1X2
J5
HDR 1X2
1
2
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1323x-Modular Reference Board
1323x Development Hardware Reference Manual, Rev. 1.1
3-16 Freescale Semiconductor
Figure 3-12. Modular Reference Board PCB Component Location (Top View)
Figure 3-13. Modular Reference Board PCB Test Points
1323x-Modular Reference Board
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 3-17
Figure 3-14. Modular Reference Board PCB Layout (Top View)
Figure 3-15. Modular Reference Board PCB Layout (Bottom View)
1323x-Modular Reference Board
1323x Development Hardware Reference Manual, Rev. 1.1
3-18 Freescale Semiconductor
3.4.1 Bill of Materials
Table 3-6. Bill of Materials
Item Qty Reference Value Description Mfg Name Mfg Part Number
1 1 ANT1 F_Antenna PCB F ANTENNA, NO PART
ORDER
Not A Part NOT A PART
2 4 BH1,BH2,BH3,
BH4
125 NON-PLATED MOUNTING
HOLE 125 DRILL / 160
KEEPOUT NO PART TO
ORDER
3 1 C1 1000pF CAP CER 1000PF 50V 5%
C0G 0402
Murata GRM1555C1H102JA01
D
4 3 C2,C17,C23
(No Not {Place)
10PF CAP CER 10PF 50V 5% C0G
0402
Murata GJM1555C1H100JB01
5 2 C3,C6 10PF CAP CER 10PF 50V 5% C0G
0402
Murata GJM1555C1H100JB01
6 4 C4,C5,C10,C1
1
12PF CAP CER 12PF 50V 5% C0G
0402
Murata GRM1555C1H120JZ01
D
7 1 C7 1PF CAP CER 1.0PF 50V
+/-0.25PF C0G 0402
Murata GJM1555C1H1R0CB01
D
8 4 C8,C9,C18,C2
2
0.22UF CAP CER 0.22UF 10V 10%
X5R 0402
Murata GRM155R61A224KE19
B
9 1 C12 1UF CAP CER 1.0UF 10V 10%
X7R 0603
Murata GRM188R71A105KA61
D
10 1 C13 2.2UF CAP CER 2.2UF 10V 10%
X7R 0603
Murata GRM188R71A225KE15
D
11 2 C14,C20 0.01UF CAP CER 0.01UF 50V 10%
X7R 0402
Murata GCM155R71H103KA55
D
12 1 C15 10UF CAP CER 10UF 10V 10% X5R
0805
Murata GRM21BR61A106KE19
_
13 1 C16 0.1UF CAP CER 0.1UF 16V 10%
X7R 0402
Tdk C1005X7R1C104KT
14 2 C25,C26 8.2PF CAP CER 8.2PF 50V 0.25PF
C0G 0402
Avx 04025A8R2CAT2A
15 1 D1 GREEN LED GRN SGL 30MA SMT
0805
Lite On LTST-C171KGKT
16 1 D2 VSLB3940 LED IR SGL 100MA RA TH Vishay
Intertechnology
VSLB3940
17 2 D3,D4 MBR0520LT1G DIODE SCH 0.5A 20V
SOD-123
On
Semiconductor
MBR0520LT1G
18 1 J1 SMA_EDGE CON 1 SKT SMA EDGE 34MIL
BOARD SMT 50 OHM -- 171H
AU 104L
Johnson
Components Inc
142-0701-881
1323x-Modular Reference Board
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 3-19
19 1 J2 HDR_10X2 HDR 2X10 TH 100MIL CTR
330H AU 100L
Samtec TSW-110-07-S-D
20 1 J3 HDR 2X9 HDR 2X9 TH 100MIL CTR
330H AU
Samtec TSW-109-07-S-D
21 1 J4 HDR 2X3 HDR 2X3 TH 100MIL CTR
335H AU 95L
Samtec TSW-103-07-S-D
22 2 J5,J8 HDR 1X2 HDR 1X2 TH 100MIL SP 330H
SN 115L
Samtec TSW-102-07-T-S
23 1 J6 HDR TH 1X3 HDR 1X3 TH 100MIL SP 339H
AU 100L
Samtec TSW-103-07-G-S
24 1 J9 HDR_2X4 HDR 2X4 TH 100MIL CTR
330H AU 100L
Samtec TSW-104-07-S-D
25 1 L1 0.0033UH IND -- 0.0027UH@100MHZ
300MA +/-0.3NH 0402
Murata LQG15HS2N7S02D
26 1 L2
(No Not {Place)
0.0039UH IND -- 0.0039UH@100MHZ
300MA +/-0.3NH 0402
Murata LQG15HN3N9S02D
27 1 Q1 MMBT3904LT1G TRAN NPN GEN 200MA 40V
SOT-23
On
Semiconductor
MMBT3904LT1G
28 1 RST1 SW_MOM SW SPST MOM PB 50MA 12V
SMT
Alps Electric
(Usa) Inc.
SKQYPDE010
29 1 R1 15K RES MF 15K 1/16W 5% 0402 Vishay
Intertechnology
CRCW040215K0JNED
30 1 R2 18.2 RES MF 18.2 OHM 1/4W 1%
0805
Rohm ESR10EZPF18R2
31 5 R4,R11,R13,R
25,R26
0 RES MF ZERO OHM 1/16W
5% 0402
Rohm MCR01MZPJ000
32 1 R6 1.5K RES MF 1.5K 1/16W 5% 0402 Vishay
Intertechnology
CRCW04021K50JNED
33 1 R7 330 RES MF 330 OHM 1/16W 5%
0402
Vishay
Intertechnology
CRCW0402330RJNED
34 1 R9 27K RES MF 27K 1/16W 5% 0402 Vishay
Intertechnology
CRCW040227K0JNED
35 2 R10,R12
(No Not {Place)
0 RES MF ZERO OHM 1/16W
5% 0402
Rohm MCR01MZPJ000
36 7 R14,R15,R16,
R17,R18,R21,
R22
10K RES MF 10K 1/16W 5% 0402 Vishay
Intertechnology
CRCW040210K0JNED
37 4 R19,R20,R23,
R24
(No Not {Place)
1K RES MF 1.0K 1/16W 5% 0402 Vishay
Intertechnology
CRCW04021K00JNED
38 3 TL1,TL2,TL3 TESTLOOP TEST POINT PAD SIZE
3.4MM X 1.8MM SMT
Keystone
Electronics
5015
Table 3-6. Bill of Materials
1323x-Modular Reference Board
1323x Development Hardware Reference Manual, Rev. 1.1
3-20 Freescale Semiconductor
39 16 TP1,TP2,TP3,T
P4,TP5,TP6,T
P7,TP8,TP9,T
P10,TP11,TP1
2,TP13,TP14,T
P15,TP16
TPAD_040 TEST POINT PAD 40MIL DIA
SMT, NO PART TO ORDER
Notacomponent NOTACOMPONENT
40 1 U1 MC1323X IC MCU+XCVR 8BITS 2.4GHZ
1.8-3.6V LGA48
Freescale
Semiconductor
PC13233C
41 1 U2 AT45DB021D IC MEM FLASH 256KX8
66MHz 2.7-3.6V 8S1
Atmel AT45DB021D-SSH-T
42 1 U3 LP2985AIM5-3.3 IC VREG LDO 3.3V 150MA
3.8-16V SOT-23-5
National
Semiconductor
LP2985AIM5-3.3/NOPB
43 1 Y1 32.768KHZ XTAL 32.768KHZ SMT ROHS
COMPLIANT
Epson
Electronics
FC-135 32.7680KA-A3
44 1 Y2 32MHZ XTAL 32MHZ 9PF -- SMT
3.2X2.5MM
Ndk EXS00A-CS02368
45 1 Z1 50/100 OHMS XFMR BALUN 2.45GHZ
+/-50MHZ 50/100OHM 3W
SMT
Johanson
Technology
2450BL15B100_
Table 3-6. Bill of Materials
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 4-1
Chapter 4
1323x Remote Control Motherboard
4.1 1323x-RCM Overview
The Remote Control Motherboard (1323x-RCM) is a motherboard that accepts the 1323x-Modular
Reference Board (1323x-MRB) plug-in module (daughter card) and supplies a power supply and a rich set
of interface peripherals. The two boards in combination provide a complete platform to evaluate the
MC1323x, write software, and develop a full featured IEEE 802.15.4 based wireless remote control.
4.1.1 Features
The 1323x-RCM provides the following features:
4-Layer metal, 0.034 inch thick FR4 board
Two connectors provide daughter card mounting
20-Pin primary connector
18-Pin secondary connector
Provide main supply voltage to board
Provide access to all MC13233 GPIO
Handheld battery operation
Flexible power supply
Sources include USB port, two AA batteries, or DC source
Power-On green LED
—On-Off switch
Used in conjunction with 1323x-MRB where MRB provides -
2.4 GHz IEEE 802.15.4 wireless node
2 Mbit serial FLASH for over-the-air programming (OTAP)
IR blaster
USB interface is bus-powered and full-speed compatible to the USB 2.0 and 1.1 specifications
36 Pushbutton 6x6 switch matrix
128x32 pixel monochrome graphic/alphanumeric LCD - uses SPI serial interface
• Synaptics® Touchpad - capacitive touch sensor
3-Axis accelerometer with IIC serial interface
Four application-controlled blue indicator LEDs
Single tone buzzer
1323x Remote Control Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
4-2 Freescale Semiconductor
4.1.2 Form Factor
Figure 4-1 shows a photo of the 1323x-RCM with the location of connectors and headers designated.
Figure 4-1. 1323x-RCM (1323x-MRB)
The1323x-Modular Reference Board (1323x-MRB) mounts on the 1323x-RCM via receptacles J8 and J9.
Figure 4-1 shows an outline of the 1323x-MRB placement when mounted.
Pushbutton
USB
Primary 20-Pin IO
Connector (J8)
On / Off
Secondary 18-Pin IO
Connector (J9)
128x32
Matrix
Connector
J15
Switch
SL1
1323x-MRB Outline
(When mounted)
4 Blue LEDs
External
Supply
J14
Accelerometer
Power-On
GPIO Enable
Pin Header
P1
GPIO Enable
Pin Header
P2
Graphic LCD
LED
Touchpad
Buzzer
(Mounted on
back side)
LCD J10
7.0 Inches
178 mm
3.4 Inches
86 mm
1323x Remote Control Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 4-3
4.1.3 Board Level Specifications
NOTE
Temperature range specifications apply to RCM used in combination with
MRB.
Table 4-1. 1323x-RCM Specifications
Parameter Units Notes/Conditions
MIN TYP MAX
General
Size (PCB: X, Y) 86 x 178
3.40 x 7.00
mm
inches
Layer build (PCB) 0.8
0.034
mm
inches
4-Layer
Dielectric material (PCB) FR4
Power
Voltage supply (DC) 2.3 5 6 V
Voltage supply (USB) 4.4 5 5.25 V USB 2.0/1.1 standard specification
Voltage supply (Batteries) 2.8 3.2 V
Current consumption 100 mA
Temperature
Operating temperature; non-battery
operation (see note)
-20 +25 +70 °C Operating temperature is limited to +70 °C
due to switches. Basic circuit is good for a
maximum temperature of +85 °C.
Operating temperature; battery
operation (see note)
0 +25 +50 °C Operating temperature is limited by battery
temperature range
Storage temperature -30 +25 +70 °C
USB interface USB 2.0 and 1.1 full-speed compatible
Buzzer
CUI #CMI-1240 See data sheet
Touchpad
Synaptics Semi-custom
Tri-axis Low-g Accelerometer
MMA7660FC (Freescale Semi) See data sheet
LCD
CRYSTALFONZ
#CFAG12832A-YGH-N
See data sheet
Regulatory Approval
1323x Remote Control Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
4-4 Freescale Semiconductor
4.2 Functional Description
The 1323x-RCM is a host motherboard for the 1323x-MRB. The two-board combination provides a
powerful evaluation and development platform for the MC13233. Figure 4-2 shows a simple block
diagram. The 4-layer board provides a flexible power supply, 36 pushbutton matrix, 128x32 LCD,
Touchpad sensor, 3-axis accelerometer, four indicator LEDs, buzzer, and a USB <> UART serial port.
As the board name implies this platform is useful to develop an RF remote control application for a DTV,
entertainment console, or similar function. The 1323x-MRB provides the RF node and an IR transmitter
is available to support legacy IR protocol remote controls. The rich set of peripherals of the 1323x-RCM
allows a user to develop a remote control ranging from a simple input device to a higher end unit with
display.
In the following sections, refer to:
Figure 4-1 for location of connectors and features
Figure 4-2 for the functional blocks
Figure 4-10 for the board schematic
CE (ETSI) Product is approved accordingly to the EN
300 328 V1.7.1 (2006-10) standard
CE (EMC) Product is approved accordingly to the EN
301 489-1 V1.6.1 (2005-09) and EN 301
489-17 V1.2.1 (2002-08) standards
Safety
UL Product is approved accordingly to the IEC
60950-1 and EN 60950-1, First Edition
standards
Environment
RoHS Product complies with the EU Directive
2002/95/EC of 27 January 2003
WEEE Product complies with the EU Directive
2002/95/EC of 27 January 2003
Table 4-1. 1323x-RCM Specifications (continued)
Parameter Units Notes/Conditions
HH “HP 4th
1323x Remote Control Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 4-5
Figure 4-2. 1323x-RCM Block Diagram
4.2.1 Power Management
The 1323x-RCM can be powered from two AA batteries, the USB connector 5 V supply, or an external
DC supply and is also intended to power the 1323x-MRB. Figure 4-3 shows the power management
circuit.
Figure 4-3. 1323x-RCM Power Management Circuit
A boost-buck voltage regulator U8 is used in this design to allow operation over a relatively wide, low
voltage input range, i.e., the TPS63001 regulator has an input voltage range from 1.8 V to 5.5V. This
allows a broad range of power supply sources. The regulated output voltage of the TPS63001 is 3.3 V
which delivers about 3.05 V to the board due to the drop across the isolation Schottky diodes.
Attributes of the power management circuit include:
Switch SL1 provides an ON/OFF function for all input voltage sources
Red LED5 provides a POWER-ON indicator for all sources
The 1323x-RCM can derive power from three different sources -
1. USB port Type-B connector J15 - power can be supplied from an actual USB port connection
or from an AC to DC converter that uses the USB connector to supply power.
1323x-MRB
GPIO Header
Receptacles
Buzzer
VCC
USB
2.0
4 Blue
Indicator
LEDs
USB
Type-B
Conn
On/Off
Switch
USB <> UART
Serial IC 6x6 Switch
Matrix
Power
Management GPIO
Pin Headers
On
LED
External DC
2 AA
Battery
Synaptic
Touchpad
IIC
128x32
Graphic/
Alphanumeric
LCD
SPI
2 PB
Switches
D13
MBR 0 520 LT1G
V_BUZ
TP26R42
0
POWER ON
21
LED 5
RE D
V_LED
R39
330
V_MRB
V_ LED
V_DC
V_ TP D
BUZZER
V_ACC
C32
10UF EN
6
GN D
9
L1
4L2 2
PS/ SY NC
7
VOUT 1
VIN
5
VINA
8
FB 10
PGN D 3
PPAD 11
U8
T PS6 30 01
V_BAT
1 2
L3 3.3uH
1
32
Q3
S I 23 05
R38
4. 7 K
R41
10K
TP27
V_U SB VCC
TP 25
TP21
TP22
TP24
R45
0
C33
0.1UF
C43
10UF
R43
0
TP2 3
C42
10 U F
R35
0
R36
0
R37
0
R40
0
LED
TOUCHPAD
ACCELEROMETER
D8
MBR 0 52 0L T1 G
V_MA IN
R46
200K
DNP
MODULAR REFERENCE BOARD
R47
0
V_ 3V3
D9
MBR 0 52 0L T1 G
D10
MB R 05 20 LT 1G
TP1 9
D11
MBR0520LT1G
TP20
D12
MBR0520LT1G
1323x Remote Control Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
4-6 Freescale Semiconductor
2. External DC source via header J14 - a standard 0.1 in. spacing 1x2 pin header allows for
connection of an external DC supply.
3. Battery Operation - a battery holder that accommodates two AA batteries is mounted on the
non-component (back) side of the board and provides for battery operation.
If either the USB or external DC source is present, the battery source is disabled by
MOSFET transistor Q3
The sources are all isolated and protected by Schottky diodes
The minimum effective battery operating voltage is controlled by the use the FTDI
FT232RQ USB <> UART device - leakage current back through the FT232RQ UART
connections to the MC13233 on the MRB can cause the Q3 MOSFET to partially turnoff at
battery voltage below approximately 2.7-2.8 Vdc.
NOTE
To avoid current leakage through the USB device and to have lowest
minimum battery operating voltage for battery-only operation, remove the
following jumpers:
P1, Pins 7-8
P1, Pins 11-12
P1, Pins 17-18
P1, Pins 21-22
NOTE
When battery operation is used, the temperature range of the two board
system should be limited to within the specified temperature range of the
battery technology. Table 4-1 limits temperature range from 0 °C to +50 °C
when battery operation is applied.
Table 4-2 lists the voltage source attributes.
.Table 4-2. 1323x-RCM Voltage Sources
Source Connector Input Voltage
Range Description
USB Port USB Type-B J15 4.4 V - 5.25 V The input voltage range is set the USB Spec
The voltage can be supplied by either a standard USB
cable connection or an AC to DC power adaptor that uses
the USB connector J15
If a power adaptor is in use, the USB serial port cannot be
used
1323x Remote Control Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 4-7
Again referring to Figure 4-3, a number of zero-ohm resistors are provided to isolate different circuits and
to allow current measurement:
VCC (main 1323x-RCM supply) - resistor R35
V_LED (all LEDs supply) - resistor R36
V_TPD (touchpad supply) - resistor R37
V_ACC (accelerometer supply) - resistor R40
V_BUZ (buzzer supply) - resistor R42
V_MRB (1323x-MRB supply) - resistor R43
4.2.2 GPIO Connection to 1323x-MRB
IO Connectors J8 and J9 (see Figure 4-1) are receptacles that accept the 1323x-MRB pin headers to mount
the daughter card. Figure 2-1 shows the 1323x-RCM with the 1323x-MRB mounted. Receptacles J8 and
J9 connect to the MC13233 GPIO.
To provide better access and versatility to the GPIO, a secondary set of pin headers P1 and P2 is connected
in series with the IO signals:
Jumpers must be installed on P1 and P2 to connect 1323x-RCM peripherals and functions
The pin headers provide direct access for connecting custom circuitry to the GPIO
Power and ground to primary connectors J8 and J9 are not enabled though the pin headers
Figure 4-4 shows IO Header P1 andP2 pin mapping.
External DC Supply 1x2 Pin Header
J14
2.3 V - 6 V The input voltage range is determined by the U8 regulator
and the diode isolation circuit
Two AA Batteries Battery Holder 2.0 V - 3.1 V1 The input voltage range reflects the usable range of
alkaline cells and the voltage drop incurred by the diode
isolation circuit.
The battery source is disabled if another source is
connected
1The minimum operating battery voltage is determined by use model, see Note, Section 4.2.1, “Power Management”
Table 4-2. 1323x-RCM Voltage Sources
Source Connector Input Voltage
Range Description
1323x Remote Control Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
4-8 Freescale Semiconductor
Figure 4-4. 1323x-RCM IO Connector J8 and J9 Pin Mapping
Table 4-3 list the P1 and P2 pin header function as it relates to the MC13233.
Table 4-3. 1323x-RCM P1 and P2 Pin Header Function Description
1323x-REM
Header Pins
MC13233
Signal Name Description 1323x-REM Application / Notes
P1-27, P1-28 PTA0/XTAL_32K Port A Bit 2 / 32.768 kHz oscillator output Drives LED1; jumper required
32.768 kHz oscillator can be enabled on
MRB
P1-25, P1-26 PTA1/EXTAL_32K Port A Bit 3 / 32.768 kHz oscillator input Drives Buzzer; jumper required
32.768 kHz oscillator can be enabled on
MRB
P1-13, P1-14 RESET Device asynchronous hardware reset.
Active low. Onboard Pullup
Drives touchpad reset; jumper required
Reset signal driven from MRB
P1-29, P1-30 PTA2 Port A Bit 2. Onboard pull-down for TM Drive LCD_CTL0; jumper required
Application is LCD enable clock
TM enable
P2-13, P2-14 PTA3/IRQ Port A Bit 3 / IRQ. Used; jumper required
Provides interrupt request input IRQ
(active low) from accelerometer and
touchpad
P2-17, P2-18 PTA4/
XTAL_32KOUT
Port A Bit 4 / Buffered 32.768 kHz clock
output
Drives LED2; jumper required
Optional 32.768 kHz output clock for
measuring reference oscillator accuracy
(ppm)
P1-19, P1-20 PTA5/SDA Port A Bit 5 / IIC Bus data Used; jumper required
Connects to accelerometer
Defaults to open drain for IIC
Pullup on MRB
P1-23, P1-24 PTA6/SCL Port A Bit 6 / IIC Bus clock Used; jumper required
Connects to accelerometer
Defaults to open drain for IIC
Pullup on MRB
P2-1, P2-2 PTB0/KBI1P0 Port B Bit 0 / KBI1 Input Bit 0 RCM switch matrix; jumper required
P2-3, P2-4 PTB1/KBI1P1 Port B Bit 1 / KBI1 Input Bit 1 RCM switch matrix; jumper required
MRB-SPI_MISO
MRB-UART_TXD
MRB- KBI2P2
MRB- KBI2P0
MRB-SPI_SS
MRB-SPI_MOSI
MRB-PTA2/LCD_CTL0LCD_CTL0
MRB- PTD1/ TPM1
MRB- KBI1P1
MRB- KBI1P3
MRB- KBI1P4
MRB- KBI1P2
UART_TXD
MRB- PTD3/ TPM3
LED1 MRB-PTA0
MRB- PTD4/ CMT
MRB- KBI1P5
BUZZER MRB-PTA1 MRB-KBI2P3
IRQb
MRB- KBI1P0
MRB- KBI2P1
SPI_CLK MRB-SP I _C LK
UART_RXD MRB-UAR T_R XD
MRB- KBI1P6
MRB-PTA4/32K_OUT
RSTb MRB -R STb MRB- PTA3/ I RQb
LED3 MR B-TPM0
1 2
3 4
65
7 8
910
11 12
13 14
15 16
17 18
19 20
21 22
23 24
25 26
27 28
29 30
31 32
P1
HDR_2X16
UART_RTS MR B -U ART_RTS/KBI 1P7
KMD1
I2C_SDA MRB -I 2C _SD A
KBI1P6
MRB-PTD7/32M_OUT
KMD3
1 2
3 4
65
7 8
910
11 12
13 14
15 16
17 18
19 20
21 22
23 24
25 26
27 28
29 30
31 32
P2
HDR_2X16
MRB-UART_CTS/TPM2UART_CTS
KMD2
KMD0
KBI1P3
LED4
KMD4
KBI1P4
KBI1P2
KBI1P1
KBI1P0
KBI1P5
KMD5
SPI_MOSI
LED2
I2C_SCL MRB-I2C_SCL
1323x Remote Control Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 4-9
P2-5, P2-6 PTB2//KBI1P2 Port B Bit 2 / KBI1 Input Bit 2 RCM switch matrix; jumper required
P2-7, P2-8 PTB3//KBI1P3 Port B Bit 3 / KBI1 Input Bit 3 RCM switch matrix; jumper required
P2-9, P2-10 PTB4//KBI1P4 Port B Bit 4 / KBI1 Input Bit 4 RCM switch matrix; jumper required
P2-11, P2-12 PTB5//KBI1P5 Port B Bit 5 / KBI1 Input Bit 5 RCM switch matrix; jumper required
P2-21, P2-22 PTB6//KBI1P6 Port B Bit 6 / KBI1 Input Bit 6 RCM switch matrix; jumper required
P1-17, P1-18 PTB7//KBI1P7 Port B Bit 7 / KBI1 Input Bit 7 UART flow control RTS input to MCU;
jumper required
Connects to RCM USB <> UART device
P2-15, P2-16 PTC0/KBI2P0 Port C Bit 0 / KBI2 Input Bit 0 RCM switch matrix; jumper required
P2-23, P2-24 PTC1/KBI2P1 Port C Bit 1 / KBI2 Input Bit 1 RCM switch matrix; jumper required
P2-19, P2-20 PTC2/KBI2P2 Port C Bit 2 / KBI2 Input Bit 2 RCM switch matrix; jumper required
P2-25, P2-26 PTC3/KBI2P3 Port C Bit 3 / KBI2 Input Bit 3 RCM switch matrix; jumper required
P1-9, P1-10 PTC4/SPICLK Port C Bit 4 / SPI clock Used; jumper required
Connected to serial FLASH on MRB
Connected to serial LCD interface
P1-2 PTC5/SS Port C Bit 5 / SPI slave select Unused on RCM
Must be in-active for LCD access
Connected to serial FLASH on MRB
P1-6 PTC6/MISO Port C Bit 6 / SPI MISO Unused on RCM
Connected to serial FLASH on MRB
P1-3, P1-4 PTC7/MOSI Port C Bit 7 / SPI MOSI Used; jumper required
Connected to serial FLASH on MRB
Connected to serial LCD interface
P1- 15, P1-16 PTD0/TPM0 Port D Bit 0 / TPM0 signal Drives LED3; jumper required
P2-27, P2-28 PTD1/TPM1 Port D Bit 1/ TPM1 signal Drives LED4; jumper required
P1-21, P1-22 PTD2/TPM2 Port D Bit 2 / TPM2 signal UART flow control CTS output from
MCU; jumper required
Connects to RCM USB <> UART device
P2-29, P2-30 PTD3/TPM3 Port D Bit 3 / TPM3 signal RCM switch matrix; jumper required
P2-32 PTD4/CMT Port D Bit 4/ CMT output Not used on RCM
Connected to IR blaster on MRB
P1-7, P1-8 PTD6/RXD Port D Bit 6 / UART RXD input UART RXD input to MCU; jumper
required
Connects to RCM USB <> UART device
P1-11, P1-12 PTD5/TXD Port D Bit 5 / UART TXD output UART TXD output from MCU; jumper
required
Connects to RCM USB <> UART device
P1-31, P1-32 PTD7/32MOUT Port D Bit 7 RCM switch matrix; jumper required
Table 4-3. 1323x-RCM P1 and P2 Pin Header Function Description (continued)
1323x-REM
Header Pins
MC13233
Signal Name Description 1323x-REM Application / Notes
1323x Remote Control Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
4-10 Freescale Semiconductor
4.2.3 1323x-RCM Onboard Peripheral Functions
The 1323x-RCM has a rich set of peripheral functions useful to evaluate the MC13233 and to implement
a full featured remote control.
4.2.3.1 USB Interface
For many applications or demonstrations it is desirable to connect the 1323x-RCM to a PC or other device.
A USB port is provided with a USB “B” receptacle plug. The port is connected to a FTDI FT232RQ USB
<> UART device that appears as a Virtual COM port (VCP) to the PC. PC drivers are available with the
module.
The USB interface is configured as a "Bus Powered" device and can draw all required power from the USB
interface. The device is USB 2.0 full speed compatible.
The USB connector is designated as J15. Figure 4-5 shows the connector pinout.
Figure 4-5. USB Connector Pinout
4.2.3.2 128x32 Graphic/Alphanumeric LCD
The 1323x-RCM supports a 128x32 pixel STN passive trans-reflective monochrome graphic LCD that
provides for alphanumeric or graphic readout. The LCD module is mounted on top of the main circuit
board and connects via a 16-pin connector. Figure 4-6 shows the LCD interface schematic.
The display is an CRYSTALFONZ #CFAG12832A-YGH-N
Viewing area is 51.0 (W) × 17.8 (H) mm
The LCD operates from 5 Vdc generated from the main operating voltage through a boost
switching regulator. The LCD module requires a highly regulated 5 V so that the high voltages
generated onboard the display are consistent.
The LCD has optional yellow-green LED backlighting
Typical current of 30 mA when full on
Enabled via Jumper J10
Always on when enabled.
LCD interface to the MCU is via the SPI port - although the LCD module only supports a parallel
interface (8-bit or 4-bit modes), the 1323x-RCM uses a serial interface derived from the SPI port
The SPI serial stream is loaded into an 8-bit shift register (74AHCT164) used as a
serial-to-parallel converter
1
2
3
4
S1
S2
1
2
34
+D
-D
G
V
J15
USB_TY PE_B
DATA_P
DATA_M
V_BUS
1323x Remote Control Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 4-11
Nibble (4-bit) parallel mode is used on the LCD and the shift register provides the 4 data bits
and the RS control signal
The 4-data and RS control are strobed into the LCD via the LCD_CTL0 control signal derived
from MC13233 PTA2 output.
LCD write mode only is supported; the LCD cannot be read.
The SPI port is shared with the serial FLASH on the 1323x-MRB. SS must be inactive (high)
when writing to the LCD
The onboard controller is a member of the Sitronix ST7920 Series family with an integrated
display data RAM and alphanumeric character set
Figure 4-6. 1323x-RCM LCD Interface Circuit
4.2.3.3 36 Pushbutton 6x6 Switch Matrix
The1323x-RCM provides an 36 pushbutton 6x6 switch matrix for user application input interface.
The matrix utilizes MC13233 KBI inputs
All switches have interrupt and device wake up capability
For these 36 switches
Includes the pushbutton array
Includes two switches located to the right and two switches to the left of the LCD
Includes switches SW31 and SW32 located on the bottom (non-component) side of the board
Does not support the two switches (KB0 and KB1) located near the touchpad.
4.2.3.4 Synaptics Touchpad
A Synaptics® Touchpad capacitive touch sensor is mounted on the 1323x-RCM for pointing
functionality.
The touchpad is approximately 30mm tall x 45mm wide
Interface to the MCU uses the IIC interface
The touchpad has a separate interrupt request line that is tied to the KBI1P6 MCU input
The MCU reset is tied to the touchpad and resets the touchpad whenever a system reset occurs
The touchpad support two independent KBI signals that are connected to pushbuttons KB0 and
KB1and used for touchpad select functions
The touchpad is soldered to the 1323x-RCM using two SMT headers
C31
0. 1 UF
R3 2
10K
R31
43
R30
1K
1 3
2
R5 3 5K
V_LC D
Q0
Q1
Q2
Q3
Q4
VSS
1
VDD
2
Vo
3
RS
4
R/W
5
E
6
DB0
7
DB1
8
DB2
9
DB3
10
DB4
11
DB5
12
DB6
13
DB7
14
ANODE
15
KATODE
16
DS1
LC D + HD R 1 X16 + CON 1 X16
LC D_ CT L0
1
2
J10
HDR 1X2
8-B IT SHIFT REGI STER
3 5
4
2
1
U7
SN 74 AHC T1G08
Q0 3
Q1 4
Q2 5
Q3 6
Q4 10
Q5 11
Q6 12
Q7 13
VCC 14
GND
7
DSA
1
DSB
2
CP
8
MR 9
U6
74AHCT164
V_LC D
V_LCD
R51 3.3K
DN P
SPI_ MOSI
SPI_CLK
VCC
V_LC D
C-
A1
C+
B1
V_IN
B3
EN
A3
GND
A2
V_OUT C1
C2+ C2
C2 - C3
U10
F AN 5665
C38
2. 2 uF
C44
2 . 2uF
R5 0
0
TP3 3
C45
2.2uF
C46
2. 2 uF
5 V BOOST CHARG E PU MP
LCD
VCC
V_5V
Q0
Q1
Q2
Q3
Q4
CON TRAST ADJUST
V_LC D
V_LCD
iHH 4H1, EH 4H1?
1323x Remote Control Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
4-12 Freescale Semiconductor
Figure 4-7 shows the touchpad circuit.
Figure 4-7. 1323x-RCM Touchpad Circuit
4.2.3.5 3-Axis Accelerometer
The 1323x-RCM contains a Freescale MMA7660 3-axis accelerometer with IIC interface.
Uses a 3mm x 3mm x 0.9mm DFN package
Device interface supports IIC bus and system reset
Supports an auto-wake/sleep feature for Low power consumption.
When the device is in auto-sleep state, if a shake interrupt, tap interrupt, Delta G, or orientation
detection interrupt occurs, the device comes out of sleep mode and generates an interrupt request
via the IRQ signal
Figure 4-8 shows the accelerometer circuit.
Figure 4-8. 1323x-RCM Accelerometer Circuit
4.2.3.6 Buzzer
The 1323x-RCM provides a single tone audio buzzer.
Device LS1, CUI Inc., Part No. CMI-1240
4.0 kHz resonant frequency
Device is buffered by Q2 and active when MCU output PTA1 is high (see Table 4-3)
Figure 4-9 shows the buzzer circuit.
R52
10K
VDD
1
SDA
2
SCL
3
GND
4
IRQ
5
RESET
6
KBI 0
7
KBI 1
8
NC1 9
NC2 10
NC3 11
NC4 12
NC5 13
NC6 14
J11
TOUCHPAD
I2C_SDA
V_TPD
R34
10K
I2C_SCL
R33
10K
KBI1P6
TPKBI 1
TPKBI 0
RSTb
V_TPD
1
4
2
3
KB0
PB switch
TPKBI0 TPKBI1
1
4
2
3
KB1
PB switch
TPKB I 1TPKBI0
RESERVED
1
NC1
2
AVDD
3
AVSS
4
INT
5
NC2 10
DVDD 9
DVSS 8
SDA 7
SC L 6
U5
MMA7660FC
C28
10UF
C26
10UF
C29
0.1U F
C27
0.1UF
I2C_SDA
I2C_SCLIRQb
V_ACC
V_ACC
1323x Remote Control Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 4-13
Figure 4-9. 1323x-RCM Buzzer Circuit
4.2.3.7 Blue Indicator LED
The1323x-RCM provides 4 blue LEDs for user application indicator outputs. Refer to Table 4-3 for
listings of the MC13233 outputs that drive the LEDs.
1323x Development Hardware Reference Manual, Rev. 1.1
4-14 Freescale Semiconductor
1323x Remote Control Motherboard
4.3 Schematic, Board Layout, and Bill of Material
Figure 4-10. 1323x-RCM Schematic (1 of 3)
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
V_MRBV_MRB
V_LED V_LED V_LED V_LED
V_USB
V_ACC
V_ACC
V_BUZ
MRB-I2C_SDA
KBI1P0 KBI1P1 KBI1P2 KBI1P3 KBI1P4 KBI1P5
LED2 LED3 LED4LED1
MRB-RSTb
MRB-SPI_CLK
MRB-SPI_MISO
MRB-SPI_MOSI
MRB-SPI_SS
MRB-UART_RTS/KBI1P7
MRB-UART_CTS/TPM2
MRB-KBI1P0
MRB-KBI1P2
MRB-KBI1P1
MRB-KBI1P3
MRB-I2C_SCL
MRB-UART_TXD
MRB-UART_RXD
BUZZER
I2C_SCL
I2C_SDA
IRQb
MRB-TPM0
MRB-PTD7/32M_OUT
MRB-KBI1P5
MRB-KBI2P0
MRB-KBI2P2
MRB-PTA4/32K_OUT
MRB-PTA2/LCD_CTL0
MRB-KBI1P4
MRB-KBI1P6
MRB-KBI2P1
MRB-KBI2P3
MRB-PTA3/IRQb
MRB-PTD1/TPM1 MRB-PTD3/TPM3
MRB-PTD4/CMT
MRB-KBI1P3
MRB-KBI1P1
MRB-KBI1P2
MRB-KBI1P4
MRB-PTD4/CMT
MRB-SPI_MOSI
MRB-SPI_SS
MRB-KBI1P5
MRB-KBI1P0
MRB-KBI2P0
MRB-KBI2P2
MRB-PTD1/TPM1
MRB-PTD3/TPM3
SPI_MOSI
KMD0
KMD2
LED4
KBI1P3
KBI1P1
KBI1P2
KBI1P4
KMD4
KBI1P5
KBI1P0
DATA_P
DATA_M
UART_TXD
UART_RTS
UART_RXD
UART_CTS
MRB-KBI2P3
MRB-KBI2P1
MRB-KBI1P6
MRB-PTA4/32K_OUT
MRB-PTA3/IRQb
MRB-PTD7/32M_OUTKMD5
MRB-PTA2/LCD_CTL0LCD_CTL0
IRQb
KMD1
KBI1P6
KMD3
LED2
MRB-PTA1
MRB-PTA0
MRB-SPI_MISO
MRB-UART_TXDUART_TXD
MRB-SPI_CLKSPI_CLK
MRB-UART_RXDUART_RXD
MRB-RSTbRSTb
MRB-TPM0LED3
MRB-UART_RTS/KBI1P7UART_RTS
MRB-I2C_SDAI2C_SDA
MRB-UART_CTS/TPM2UART_CTS
MRB-I2C_SCLI2C_SCL
MRB-PTA0LED1
MRB-PTA1BUZZER
KMD0
KMD1
KMD2
KMD3
KMD4
KMD5
Drawing Title:
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1323X REMOTE CONTROL MOTHERBOARD
C
Friday, February 05, 2010
INTERFACE
35
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1323X REMOTE CONTROL MOTHERBOARD
C
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INTERFACE
35
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C
Friday, February 05, 2010
INTERFACE
35
X______
20-PIN GPIO
STANDARD HEADER
P1 & P2:
IO PIN MAPPING
MUST USE SHUNTS TO ENABLE
BOARD FUNCTIONALLITY.
GPIO
SOCKETS FOR 1323X-MRB ASSEMBLY
DIGITAL ACCELEROMETER
KEYBOARD MATRIX
USB/UART TRANSCEIVER
LED'S & BUZZER
GUIDE MP3 STOCK MENUPOWER
SK1 SK2 SK3 SK4
VOL+ VOL- CH+MUTE CH-
STOP PAUSE REC RW PLAY FF
TV
ENTERCLEAR9087
123456
R28 4.7KR28 4.7K
TP15TP15
C24
15PF
C24
15PF
SW18
PB switch
SW18
PB switch
1 4
2 3
SW8
PB switch
SW8
PB switch
1 4
2 3
SW32
PB switch
DNP
SW32
PB switch
DNP
1 4
2 3
SW26
PB switch
SW26
PB switch
1 4
2 3
LED4
BLUE
LED4
BLUE
21
LED1
BLUE
LED1
BLUE
21
LED3
BLUE
LED3
BLUE
21
LED2
BLUE
LED2
BLUE
21
C30
0.1UF
C30
0.1UF
TP14TP14
TP32TP32
TP31TP31
SW17
PB switch
SW17
PB switch
1 4
2 3
SW9
PB switch
SW9
PB switch
1 4
2 3
SK2
PB switch
SK2
PB switch
1 4
2 3
SW27
PB switch
SW27
PB switch
1 4
2 3
U5
MMA7660FC
U5
MMA7660FC
RESERVED
1
NC1
2
AVDD
3
AVSS
4
INT
5
NC2 10
DVDD 9
DVSS 8
SDA 7
SCL 6
SW10
PB switch
SW10
PB switch
1 4
2 3
SW25
PB switch
SW25
PB switch
1 4
2 3
SK4
PB switch
SK4
PB switch
1 4
2 3
SW1
PB switch
SW1
PB switch
1 4
2 3
R20 1KR20 1K
SW12
PB switch
SW12
PB switch
1 4
2 3
+
LS1
BUZZER
+
LS1
BUZZER
1
2
SW3
PB switch
SW3
PB switch
1 4
2 3
C28
10UF
C28
10UF
SW5
PB switch
SW5
PB switch
1 4
2 3
R23
390
R23
390
C25
0.1UF
C25
0.1UF
J9
CON_2X9
J9
CON_2X9
1 2
3 4
65
7 8
910
11 12
13 14
15 16
17 18
Q2
MMBT3904LT1G
Q2
MMBT3904LT1G
2 3
1
R22 1KR22 1K
SW28
PB switch
SW28
PB switch
1 4
2 3
SW24
PB switch
SW24
PB switch
1 4
2 3
R24
390
R24
390
R25
390
R25
390
C26
10UF
C26
10UF
R26
390
R26
390
R21 1KR21 1K
SW19
PB switch
SW19
PB switch
1 4
2 3
SW29
PB switch
SW29
PB switch
1 4
2 3
C29
0.1UF
C29
0.1UF
P1
HDR_2X16
P1
HDR_2X16
1 2
3 4
65
7 8
910
11 12
13 14
15 16
17 18
19 20
21 22
23 24
25 26
27 28
29 30
31 32
C23
15PF
C23
15PF
SW30
PB switch
DNP
SW30
PB switch
DNP
1 4
2 3
SW20
PB switch
SW20
PB switch
1 4
2 3
C27
0.1UF
C27
0.1UF
J8
CON_2X10
J8
CON_2X10
1 2
3 4
65
7 8
910
11 12
13 14
15 16
17 18
19 20
R48 0R48 0
R19 1KR19 1K
TP13TP13
R27
0
R27
0
TP30TP30
SW13
PB switch
SW13
PB switch
1 4
2 3
R49 0R49 0
SW21
PB switch
SW21
PB switch
1 4
2 3
TP17TP17
R29
47K
R29
47K
SW22
PB switch
SW22
PB switch
1 4
2 3
SW14
PB switch
SW14
PB switch
1 4
2 3
SW11
PB switch
SW11
PB switch
1 4
2 3
SK1
PB switch
SK1
PB switch
1 4
2 3
SW2
PB switch
SW2
PB switch
1 4
2 3
P2
HDR_2X16
P2
HDR_2X16
1 2
3 4
65
7 8
910
11 12
13 14
15 16
17 18
19 20
21 22
23 24
25 26
27 28
29 30
31 32
SW4
PB switch
SW4
PB switch
1 4
2 3
SW6
PB switch
SW6
PB switch
1 4
2 3
SW23
PB switch
SW23
PB switch
1 4
2 3
SW15
PB switch
SW15
PB switch
1 4
2 3
SW31
PB switch
DNP
SW31
PB switch
DNP
1 4
2 3
TP16TP16
U4 FT232RQU4 FT232RQ
GND1
4AGND
24
RI# 3
DCD# 7
DSR# 6
DTR# 31
3V3OUT
16
VCCIO
1
OSCI
27
RESET#
18
NC6
23
OSCO
28
CBUS4 9
CBUS3 11
CBUS1 21
CBUS0 22
CBUS2 10
NC5
29 NC4
25 NC3
13 NC2
12 NC1
5USBDP
14
USBDM
15
VCC
19
GND4
20 GND2
17
TEST
26
CTS# 8
RTS# 32
RXD 2
TXD 30
EP
33
SW16
PB switch
SW16
PB switch
1 4
2 3
SW7
PB switch
SW7
PB switch
1 4
2 3
SK3
PB switch
SK3
PB switch
1 4
2 3
1323x Remote Control Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 4-15
Figure 4-11. 1323x-RCM Schematic (2 of 3)
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
V_LCD
V_LCD
V_LCD
V_LCD
V_TPD V_TPD
V_LCD VCC
TPKBI0 TPKBI1
Q0
Q1
Q2
Q3
Q4
SPI_MOSI
SPI_CLK
Q0
Q1
Q2
Q3
Q4
LCD_CTL0
I2C_SDA
I2C_SCL
KBI1P6
RSTb
TPKBI0
TPKBI1
Drawing Title:
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1323X REMOTE CONTROL MOTHERBOARD
C
Friday, February 05, 2010
LCD & TOUCHPAD
45
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1323X REMOTE CONTROL MOTHERBOARD
C
Friday, February 05, 2010
LCD & TOUCHPAD
45
X______
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1323X REMOTE CONTROL MOTHERBOARD
C
Friday, February 05, 2010
LCD & TOUCHPAD
45
X______
TPKBI1TPKBI0
LCD
TOUCHPAD
8-BIT SHIFT REGISTER
CONTRAST ADJUST
U6
74AHCT164
U6
74AHCT164
Q0 3
Q1 4
Q2 5
Q3 6
Q4 10
Q5 11
Q6 12
Q7 13
VCC 14
GND
7
DSA
1
DSB
2
CP
8
MR 9
R34
10K
R34
10K
R53 5K
R53 5K
1 3
2
KB1
PB switch
KB1
PB switch
1
4
2
3
U7
SN74AHCT1G08
U7
SN74AHCT1G08
3 5
4
2
1
R33
10K
R33
10K
C31
0.1UF
C31
0.1UF
R32
10K
R32
10K
R30
1K
R30
1K
R31
43
R31
43
J11
TOUCHPAD
J11
TOUCHPAD
VDD
1
SDA
2
SCL
3
GND
4
IRQ
5
RESET
6
KBI0
7
KBI1
8
NC1 9
NC2 10
NC3 11
NC4 12
NC5 13
NC6 14
R51 3.3K
DNP
R51 3.3K
DNP
R52
10K
R52
10K
J10
HDR 1X2
J10
HDR 1X2
1
2
DS1
LCD + HDR 1X16 + CON 1X16
DS1
LCD + HDR 1X16 + CON 1X16
VSS
1
VDD
2
Vo
3
RS
4
R/W
5
E
6
DB0
7
DB1
8
DB2
9
DB3
10
DB4
11
DB5
12
DB6
13
DB7
14
ANODE
15
KATODE
16
KB0
PB switch
KB0
PB switch
1
4
2
3
immate- mmsnzmnx ? 9 9 ? Q § Q 3? $5 '53 71MI'I‘>'I"”I'I"
1323x Remote Control Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 4-16
Figure 4-12. 1323x-RCM Schematic (3 of 3)
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
V_5V
V_3V3
V_LED
V_LED
V_TPD
V_ACC
VCC
V_USB
V_BUS V_SER
V_BAT
V_MRB
V_LCD
V_MAIN
VCC
V_JACK
V_DC
V_USB
V_BHL
V_SER
V_BUS
V_BAT
V_BUZ
V_DC
V_JACK
V_SER
V_BUS
DATA_M
DATA_P
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1323X REMOTE CONTROL MOTHERBOARD
C
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POWER MANAGEMENT
55
X ______
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SCH-26116 PDF: SPF-26116 B1
1323X REMOTE CONTROL MOTHERBOARD
C
Friday, February 05, 2010
POWER MANAGEMENT
55
X ______
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ICAP Classification: FCP: FIUO: PUBI:
SCH-26116 PDF: SPF-26116 B1
1323X REMOTE CONTROL MOTHERBOARD
C
Friday, February 05, 2010
POWER MANAGEMENT
55
X ______
LED
TOUCHPAD
ACCELEROMETER
POWER ON
3.3V BUCK/BOOST REGULATOR
TO USE TPS63000,
REPLACE RESISTORS WITH
THE FOLLOWING VALUES:
R45 = 100 OHM, R47 = 1.24M
AND POPULATE R46.
OUTPUT VOLTAGE WILL BE 3.6V
MODULAR REFERENCE BOARD
5V BOOST CHARGE PUMP
LCD
3.3V POWER NETWORK
5V POWER NETWORK
EXTERNAL SUPPLY.
NEVER SHUNT!!!
BUZZER
F1
0.5A
F1
0.5A
1 2
TP22TP22
BH2
125
BH2
125
R39
330
R39
330
L3 3.3uHL3 3.3uH
1 2
TL4TL4
C33
0.1UF
C33
0.1UF
BT1
BATTERY HOLDER
BT1
BATTERY HOLDER
12
D8
MBR0520LT1G
D8
MBR0520LT1G
R37
0
R37
0
C32
10UF
C32
10UF
R46
200K
DNP
R46
200K
DNP
FID1
FID
FID1
FID
R35
0
R35
0
BH6
125
BH6
125
TL1TL1
D11
MBR0520LT1G
D11
MBR0520LT1G
C42
10UF
C42
10UF
D9
MBR0520LT1G
D9
MBR0520LT1G
TL5TL5
U9
FAN5665
U9
FAN5665
C-
A1
C+
B1
V_IN
B3
EN
A3
GND
A2
V_OUT C1
C2+ C2
C2- C3
LED5
RED
LED5
RED
21
BH3
125
BH3
125
R42
0
R42
0
TP24TP24
D12
MBR0520LT1G
D12
MBR0520LT1G
C34
2.2uF
C34
2.2uF
R41
10K
R41
10K
C39
0.1UF
C39
0.1UF
SL1
4P2T SWITCH
SL1
4P2T SWITCH
1
2
3
4
5
6 7
8
9
10
11
12
C37
2.2uF
C37
2.2uF
1
2
34
+D
-D
G
V
J15
USB_TYPE_B
1
2
34
+D
-D
G
V
J15
USB_TYPE_B
1
2
3
4
S1
S2
C43
10UF
C43
10UF
TP26TP26
R38
4.7K
R38
4.7K
R45
0
R45
0
FID2
FID
FID2
FID
L4
60OHM
L4
60OHM
1 2
TL2TL2
TP28TP28
U8
TPS63001
U8
TPS63001
EN
6
GND
9
L1
4L2 2
PS/SYNC
7
VOUT 1
VIN
5
VINA
8
FB 10
PGND 3
PPAD 11
TP25TP25
BH4
125
BH4
125
R43
0
R43
0
R40
0
R40
0
TP29TP29
D10
MBR0520LT1G
D10
MBR0520LT1G
R47
0
R47
0
TP27TP27
TP19TP19
R36
0
R36
0
BH7
125
BH7
125
TP23TP23
D13
MBR0520LT1G
D13
MBR0520LT1G
BH1
125
BH1
125
TP21TP21
TP20TP20
C40
4.7uF
C40
4.7uF
FID3
FID
FID3
FID
TL3TL3
R44
0
R44
0
C41
0.01UF
C41
0.01UF
C35
2.2uF
C35
2.2uF
BH5
125
BH5
125
J14
HDR 1X2
J14
HDR 1X2
1
2
C36
2.2uF
C36
2.2uF
TL6TL6
Q3
SI2305
Q3
SI2305
1
32
1323x Remote Control Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 4-17
Figure 4-13. 1323x-RCM PCB Component Location (Top View)
f': : 8“ We D + ,,
1323x Remote Control Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
4-18 Freescale Semiconductor
Figure 4-14. 1323x-RCM PCB Test Points
1323x De Freesca‘e Semiconductor
1323x Remote Control Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 4-19
Figure 4-15. 1323x-RCM PCB Layout (Top View)
1323x Remote Control Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
4-20 Freescale Semiconductor
Figure 4-16. 1323x-RCM PCB Layout (Bottom View)
1323x Remote Control Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 4-21
4.3.1 1323x-RCM Bill of Materials
Table 4-4. Bill of Materials
Item Qty. Reference Value Description Mfg. Name Mfg. Part Number
1 8 BH1,BH2,BH3,BH
4,BH5,BH6,BH7,B
H8
125 NON-PLATED MOUNTING
HOLE 125 DRILL / 160
KEEPOUT NO PART TO
ORDER
21BT1 BATTERY
HOLDER
BATTERY HOLDER 2XAA TH Keystone
Electronics
2462
3 2 C23,C24 15PF CAP CER 15PF 50V 5% C0G
0402
Kemet C0402C150J5GAC
4 4 C25,C30,C33,C39 0.1UF CAP CER 0.1UF 16V 10% X7R
0402
Murata GRM155R71C104KA88D
5 5 C26,C28,C32,C42
,C43
10UF CAP CER 10UF 10V 10% X7R
0805
Murata GRM21BR71A106KE51L
6 3 C27,C29,C31 0.1UF CAP CER 0.1UF 50V 10% X7R
0603
Murata GRM188R71H104KA93D
7 4 C34,C35,C36,C37 2.2uF CAP CER 2.2UF 6.3V 10% X5R
0603
Murata GRM188R60J225KE19D
8 1 C40 4.7uF CAP CER 4.7UF 10V 10% X5R
0603
Taiyo Yuden LMK107BJ475KA-T
9 1 C41 0.01UF CAP CER 0.01UF 10V 20%
X7R 0402
Avx 0402ZC103MAT2A
10 1 DS1 LCD + HDR
1X16 + CON
1X16
SUBASSY LCD 128X32 DOT
4.5-5V TH + HDR 1X16 TH
100MIL SP 330H AU + CON
1X16 SKT TH 100MIL SP 335
AU
Freescale
Semiconductor
370-76474, 210-75955,
210-77812
11 6 D8,D9,D10,D11,D
12,D13
MBR0520LT
1G
DIODE SCH 0.5A 20V
SOD-123
On
Semiconductor
MBR0520LT1G
12 3 FID1,FID2,FID3 FID FIDUCIAL 060 MIL PAD W/120
SOLDERMASK AND 040 MIL
PAD W/90 MIL SOLDERMASK
NO PART TO ORDER
Generic FID-040
13 1 F1 0.5A FUSE FAST 0.5A 63V SMT
1206
Littelfuse 0437.500WR
14 1 J8 CON_2X10 CON 2X10 SKT TH 100MIL
CTR 335H AU 104L
Samtec SSW-110-01-G-D
15 1 J9 CON_2X9 CON 2X9 SKT TH 100MIL SP
335H AU 194L
Samtec SSW-109-02-G-D
16 2 J10,J14 HDR_1X2 HDR 1X2 TH 100MIL SP 375H
AU
Tyco
Electronics
826629-2
17 1 J11 TOUCHPAD TOUCHPAD SERIAL 3V TH Synaptics, Inc 515-000188-0110
1323x Remote Control Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
4-22 Freescale Semiconductor
18 1 J15 USB_TYPE_
B
CON 2X2 USB_TYPE_B SKT
RA SHLD TH 2.5MM SP 453H
AU
Tyco
Electronics
292304-2
19 35 SW1,SK1,KB1,SW
2,SK2,SW3,SK3,S
W4,SK4,SW5,SW
6,SW7,SW8,SW9,
SW10,SW11,SW1
2,SW13,SW14,S
W15,SW16,SW17,
SW18,SW19,SW2
0,SW21,SW22,S
W23,SW24,SW25,
SW26,SW27,SW2
8,SW29,KB0
PB switch SW SMT 4.0MM FMS 0.1A
MAX 16V MAX ROHS
COMPLIANT
Bourns 7914J-1-000E
20 4 LED1,LED2,LED3,
LED4
BLUE LED BLUE SGL 20MA SMT
0805
Lite On LTST-C171TBKT-5A
21 1 LED5 RED LED RED CLEAR SGL 30MA
SMT 0805
Lite On LTST-C171KRKT
22 1 LS1 BUZZER BUZZER PIEZO AUDIO 83DB
4KHZ 8MA 12V SMT
Cui Stack CMI-1240
23 1 L3 3.3uH IND PWR 3.3UH@100KHZ
3.3A 20% SMT
Vishay
Intertechnology
IHLP2020BZER3R3M01
24 1 L4 60OHM IND FER BEAD
60OHM@100MHZ 500MA --
0603
Murata BLM18PG600SN1_
25 2 P1,P2 HDR_2X16 HDR 2X16 TH 100MIL CTR
330H AU 100L
Samtec TSW-116-07-S-D
26 1 Q2 MMBT3904L
T1G
TRAN NPN GEN 200MA 40V
SOT-23
On
Semiconductor
MMBT3904LT1G
27 1 Q3 SI2305 TRAN PMOS PWR 4.1A 8V
SOT23
Vishay
Intertechnology
SI2305ADS-T1-GE3
28 5 R19,R20,R21,R22
,R30
1K RES MF 1.0K 1/16W 5% 0402 Vishay
Intertechnology
CRCW04021K00JNED
29 4 R23,R24,R25,R26 390 RES MF 390 OHM 1/16W 5%
0402
Bourns CR0402-JW-391GLF
30 2 R27,R45 100 RES MF 100 OHM 1/16W 5%
0402
Vishay
Intertechnology
CRCW0402100RJNED
31 10 R28,R35,R36,R37
,R40,R42,R43,R4
4,R48,R49
0 RES TF ZERO OHM 1/16W
RC0402
Vishay
Intertechnology
CRCW04020000ZS
32 6 R29,R32,R33,R34
,R41,R52
10K RES MF 10K 1/16W 5% 0402 Vishay
Intertechnology
CRCW040210K0JNED
Table 4-4. Bill of Materials
Item Qty. Reference Value Description Mfg. Name Mfg. Part Number
1323x Remote Control Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 4-23
33 1 R31 39 RES MF 39 OHM 1/16W 5%
0402
Smec RC73L2Z390JTF
34 1 R38 4.7K RES MF 4.7K 1/16W 5% 0402 Smec RC73L2Z472JTF
35 1 R39 330 RES MF 330 OHM 1/16W 5%
0402
Vishay
Intertechnology
CRCW0402330RJNED
36 1 R46 200K RES MF 200K 1/16W 5% 0402 Yageo America RC0402JR-07200KL
37 1 R47 1.24M RES MF 1.24M 1/16W 1%
0402
Vishay
Intertechnology
CRCW04021M24FKED
38 1 R50 5K RES POT 5.0K 1/4W 20% SMT Bourns 3314J-1-502E
39 1 R51 3.3K RES MF 3.3K 1/16W 5% 0402 Vishay
Intertechnology
CRCW04023K30JNED
40 1 SL1 4PDT
SWITCH
SW 4PDT SLD TH RA 30V
100MA --
Tyco
Electronics
1-1437575-1
41 3 SW30,SW31,SW3
2
PB switch SW SMT 4.0MM FMS 0.1A
MAX 16V MAX ROHS
COMPLIANT
Bourns 7914J-1-000E
42 19 TP13,TP14,TP15,
TP16,TP17,TP19,
TP20,TP21,TP22,
TP23,TP24,TP25,
TP26,TP27,TP28,
TP29,TP30,TP31,
TP32
TPAD_040 TEST POINT PAD 40MIL DIA
SMT, NO PART TO ORDER
Notacomponent NOTACOMPONENT
43 1 U4 FT232RQ IC XCVR USB TO UART CTLR
3.3-5.25V QFN32
Future
Technology
Devices
International
Ltd.
FT232RQ
44 1 U5 MMA7660F
C
IC SENSOR
ACCELEROMETER 2.4-3.6V
DFN10
Freescale
Semiconductor
MMA7660FC
45 1 U6 74AHCT164 IC REG SHIFT SER/PAR 8BIT
4.5-5.5V TSSOP14
Nxp
Semiconductors
74AHCT164PW,112
46 1 U7 SN74AHC
T1G08
IC GATE AND SGL
2-INPUT POSITIVE
4.5-5.5V SOT23-5
Texas Instru-
ments
SN74AHCT1G08DBVR
47 1 U8 TPS63001 IC LIN DCDC SYNC 3.3V
OUTPUT 1250-1800KHZ
1.8-5.5V QFN-10
Texas Instru-
ments
TPS63001DRCT
Table 4-4. Bill of Materials
Item Qty. Reference Value Description Mfg. Name Mfg. Part Number
1323x Remote Control Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
4-24 Freescale Semiconductor
48 1 U9 FAN5665 IC LIN DCDC SWT 5V
2.9-5.5V WLCSP-8
Fairchild FAN5665UCX
Table 4-4. Bill of Materials
Item Qty. Reference Value Description Mfg. Name Mfg. Part Number
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 5-1
Chapter 5
1323x Remote Extender Motherboard
5.1 1323x-REM Overview
The 1323x-Remote Extender Motherboard (1323x-REM) is a motherboard that accepts the
1323x-Modular Reference Board (1323x-MRB) plug-in module (daughtercard) and supplies a power
supply and set of interface peripherals. The two boards in combination provide a simple platform to
evaluate the MC1323x, develop software, and demonstrate IEEE 802.15.4 based networking capabilities.
5.1.1 Features
The 1323x-REM provides the following features:
Small form factor (3.1 x 3.1 inches)
2-Layer metal, 0.034 inch thick FR4 board
Two connectors provide daughter card mounting
20-Pin primary connector
18-Pin secondary connector
Provide main supply voltage to board
Provide access to all MC13233 GPIO
Flexible power supply
Sources include USB port, two AA batteries, or DC source
Power-On LED
—On-Off switch
USB <> UART serial port
2x4 Switch matrix
IR receiver
Four application controlled blue indicator LEDs
Secondary set of pin headers uses jumpers to enable/disable IO connections and allows user
application connection to MC13233 GPIO
1323x Remote Extender Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
5-2 Freescale Semiconductor
5.1.2 Form Factor
Figure 5-1 shows a photo of the 1323x-REM showing the locations of connectors and headers.
Figure 5-1. 1323x-REM
The1323x-MRB mounts on the 1323x-REM via receptacles J8 and J9. Figure 5-1 shows an outline of the
1323x-MRB placement when mounted.
2x4 Switch
USB
Primary 20-Pin IO
Connector (J8)
On / Off
Secondary 18-Pin IO
Connector (J9)
IR Receiver
Matrix
Connector J15
Switch
SL1
1323x-MRB Outline
(When mounted)
4 Blue LEDs
External
Supply
J14
Power-On
LED
GPIO Enable
Pin Header
P1
GPIO Enable
Pin Header
P2
3.1 Inches
79 mm
3.1 Inches
79 mm
1323x Remote Extender Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 5-3
5.1.3 Board Level Specifications
NOTE
Temperature range specifications apply to REM used in combination with
MRB.
Table 5-1. 1323x-REM Specifications
Parameter Units Notes/Conditions
MIN TYP MAX
General
Size (PCB: X, Y) 79 x 79
3.1 x 3.1
mm
inches
Layer build (PCB) 0.8
0.034
mm
inches
2-Layer
Dielectric material (PCB) FR4
Power
Voltage supply (DC) 2.3 5 6 V
Voltage supply (USB) 4.4 5 5.25 V USB 2.0/1.1 standard specification
Voltage supply (Batteries) 2.8 3.2 V
Current consumption 100 mA
Temperature
Operating temperature; non-battery
operation (see note)
-20 +25 +70 °C Operating temperature is limited to +70 °C
due to switches. Basic circuit is good for a
maximum temperature of +85 °C.
Operating temperature; battery
operation (see note)
0 +25 +50 °C Operating temperature is limited by battery
temperature range
Storage temperature -30 +25 +70 °C
USB interface USB 2.0 and 1.1 full-speed compatible
IR Receiver
Carrier frequency 38 kHz
Angle of half transmission distance +/-50 degrees
Regulatory Approval
CE (ETSI) Product is approved accordingly to the EN
300 328 V1.7.1 (2006-10) standard
CE (EMC) Product is approved accordingly to the EN
301 489-1 V1.6.1 (2005-09) and EN 301
489-17 V1.2.1 (2002-08) standards
Safety
1323x Remote Extender Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
5-4 Freescale Semiconductor
5.2 Functional Description
The 1323x-REM is a simple host motherboard for the 1323x-MRB. The two-board combination provides
a simple evaluation and development platform for the MC13233. Figure 5-2 shows a simple block
diagram. The 2-layer board provides a flexible power supply, eight pushbutton matrix, four indicator
LEDs, IR receiver, and a USB <> UART serial port.
As the board name implies this platform is useful to develop the host side (such as a DTV or entertainment
console) of an RF remote control application. The MC13233 provides the RF node and an IR receiver is
available to support legacy IR protocol remotes. Connection to a host is available through the USB port or
any of the other generic MC13233 communications ports.
The 1323x-REM is also recommended for target development of applications where there is little
periphery circuitry. There are switches and indicator LEDs onboard for user interface, and if necessary,
custom circuitry can be connected via the two pin headers that allow access to the MC13233 GPIO.
In the following sections, refer to:
Figure 5-1 for location of connectors and features
Figure 5-2 for the functional blocks
Figure 5-8 and Figure 5-9 for the board schematic
UL Product is approved accordingly to the IEC
60950-1 and EN 60950-1, First Edition
standards
Environment
RoHS Product complies with the EU Directive
2002/95/EC of 27 January 2003
WEEE Product complies with the EU Directive
2002/95/EC of 27 January 2003
Table 5-1. 1323x-REM Specifications (continued)
Parameter Units Notes/Conditions
M n 0—07 ‘IHF A w
1323x Remote Extender Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 5-5
Figure 5-2. 1323x-REM Block Diagram
5.2.1 Power Management
The 1323x-REM can be powered from two AA batteries, the USB connector 5 V supply, or an external
DC supply and is also intended to power the 1323x-MRB. Figure 5-3 shows the power management
circuit.
Figure 5-3. 1323x-REM Power Management Circuit
A boost-buck voltage regulator U8 is used in this design to allow operation over a relatively wide, low
voltage input range, i.e., the TPS63001 regulator has input voltage range from 1.8 V to 5.5V. This allows
a broad range of power supply sources. The regulated output voltage of the TPS63001 is 3.3 V which
delivers about 3.05 V to the board due to the drop across the isolation Schottky diodes.
Attributes of the power management circuit include:
Switch SL1 provides an ON/OFF function for all input voltage sources
Red LED5 provides a POWER-ON indicator for all sources
The 1323x-REM can derive power from three different sources -
1. USB port Type-B connector J15 - power can be supplied from an actual USB port connection
or from an AC to DC converter that uses the USB connector to supply power.
2. External DC source via header J14 - a standard 0.1 in. spacing 1x2 pin header allows for
connection of an external DC supply.
1323x-MRB
GPIO Header
Receptacles
IR
Receiver
(38 kHz)
VCC
USB
2.0
4 Blue
Indicator
LEDs
USB
Type-B
Conn
On/Off
Switch
USB <> UART
Serial IC 8 Switch
Matrix
Power
Management GPIO
Pin Headers
On
LED
External DC
2 AA
Battery
IR
D8
MBR 0 52 0L T1 G
D10
MBR0520LT1G
D11
MBR 05 20 LT1 G
D12
MBR0520LT1G
D13
MBR0520LT1G
21
LED 5
RE D
POWER ON
R39
330
V_LED
V_ MRB
V_ LE D
V_DC
V_I RX
C32
10UF EN
6
GN D
9
L1
4L2 2
PS/SY N C
7
VOUT 1
VIN
5
VINA
8
FB 10
PGND 3
PPAD 11
U8
T PS6 30 01
1 2
L3 3.3uH
V_BAT
R38
4. 7 K
1
32
Q4
S I 23 05
R41
10K
TP27
V_USB VC C
TP21
TP 25 TP24
C33
0.1UF
R45
0
C43
10UF
R43
0
TP2 3
C42
10 U F
R35
0
R36
0
R40
0
INFRARRED RX
LED
V_MA IN
R46
200K
DNP
MODULAR REFERENCE BOARD
R47
0
V_ 3V6
TP1 9 TP20
D9
MBR 0 52 0L T1 G
1323x Remote Extender Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
5-6 Freescale Semiconductor
3. Battery Operation - a battery holder that accommodates two AA batteries is mounted on the
non-component (back) side of the board and provides for battery operation.
If either the USB or external DC source is present, the battery source is disabled by
MOSFET transistor Q3
The sources are all isolated and protected by Schottky diodes
The minimum effective battery operating voltage is controlled by the use the FTDI
FT232RQ USB <> UART device - leakage current back through the FT232RQ UART
connections to the MC13233 on the MRB can cause the Q3 MOSFET to partially turnoff at
battery voltage below approximately 2.7-2.8 Vdc.
NOTE
To avoid current leakage through the USB device and lower minimum
battery operating voltage for battery-only operation, remove the following
jumpers:
P1, Pins 7-8
P1, Pins 11-12
P1, Pins 17-18
P1, Pins 21-22
NOTE
When battery operation is used, the temperature range of the two board
system should be limited to within the specified temperature range of the
battery technology. Table 5-1 limits temperature range from 0 °C to +50 °C
when battery operation is applied.
Table 5-2 lists the voltage source attributes.
Table 5-2. 1323x-REM Voltage Sources
Source Connector Input Voltage
Range Description
USB Port USB Type-B J15 4.4 V - 5.25 V The input voltage range is set to the USB specification value
The voltage can be supplied by either a standard USB cable
connection or an AC to DC power adaptor that uses the USB
connector J15
If a power adaptor is in use, the USB serial port cannot be
used
External DC Supply 1x2 Pin Hdr J14 2.3 V - 6 V The input voltage range is determined by the U8 regulator and
the diode isolation circuit
Two AA Batteries Battery Holder 2.0 V - 3.1 V1
1The minimum operating battery voltage is determined by use model, see Note, Section 5.2.1, “Power Management”
The input voltage range reflects the usable range of alkaline
cells and the voltage drop incurred by the diode isolation
circuit.
The battery source is disabled if another source is connected
1323x Remote Extender Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 5-7
Again referring to Figure 5-3, a number of zero-ohm resistors are provided to isolate different circuits and
to allow current measurement:
VCC (main 1323x-REM supply) - resistor R35
V_LED (all LEDs supply) - resistor R36
V_IRX (IR receiver supply) - resistor R40
V_MRB (1323x-MRB supply) - resistor R43
Figure 5-4. 1323x-MRB Mounted on 1323x-REM
5.2.2 GPIO Connection to 1323x-MRB
IO Connectors J8 and J9 (see Figure 5-1) are receptacles that accept the 1323x-MRB pin headers to mount
the daughtercard. Figure 5-4 shows the 1323x-REM with the 1323x-MRB mounted. Receptacles J8 and
J9 connect to the MC13233 GPIO.
To provide better access and versatility to the GPIO, a secondary set of pin headers P1 and P2 is connected
in series with the IO signals:
Jumpers must be installed on P1 and P2 to connect 1323x-REM peripherals and functions
The pin headers provide direct access for connecting custom circuitry to the GPIO
Power and ground to primary connectors J8 and J9 are not enabled though the pin headers
Figure 5-5 shows IO Header P1 andP2 pin mapping.
mum « umvvnxn > mvfigé umLcrs > $60va |. it [Em « mu: crm mum mm mm mm $2) man) 55:;
1323x Remote Extender Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
5-8 Freescale Semiconductor
Figure 5-5. 1323x-REM IO Connector J8 and J9 Pin Mapping
Table 5-3 list the P1 and P2 pin header function as it relates to the MC13233.
Table 5-3. 1323x-REM P1 and P2 Pin Header Function Description
1323x-REM
Header Pins
MC13233
Signal Name Description Comments
P1-27, P1-28 PTA0/XTAL_32K Port A Bit 2 / 32.768 kHz oscillator output Drives LED1; jumper required
32.768 kHz oscillator can be enabled on
MRB
P1-26 PTA1/EXTAL_32K Port A Bit 3 / 32.768 kHz oscillator input Unused
32.768 kHz oscillator can be enabled on
MRB
P1-14 RESET Device asynchronous hardware reset.
Active low. Onboard Pullup
Unused
Reset signal driven from MRB
P1-30 PTA2 Port A Bit 2. Onboard pullup for TM Unused
TM enable; leave unconnected
P2-14 PTA3/IRQ Port A Bit 3 / IRQ. Unused
Provides interrupt request input IRQ
(active low)
P2-17, P2-18 PTA4/
XTAL_32KOUT
Port A Bit 4 / Buffered 32.768 kHz clock
output
Drives LED2; jumper required
Optional 32.768 kHz output clock for
measuring reference oscillator accuracy
(ppm)
P1-20 PTA5/SDA Port A Bit 5 / IIC Bus data Unused
Defaults to open drain for IIC
Pullup on MRB
P1-24 PTA6/SCL Port A Bit 6 / IIC Bus clock Unused
Defaults to open drain for IIC
Pullup on MRB
P2-1, P2-2 PTB0/KBI1P0 Port B Bit 0 / KBI1 Input Bit 0 REM switch matrix; jumper required
P2-3, P2-4 PTB1/KBI1P1 Port B Bit 1 / KBI1 Input Bit 1 REM switch matrix; jumper required
P2-5, P2-6 PTB2//KBI1P2 Port B Bit 2 / KBI1 Input Bit 2 REM switch matrix; jumper required
P2-7, P2-8 PTB3//KBI1P3 Port B Bit 3 / KBI1 Input Bit 3 REM switch matrix; jumper required
P2-10 PTB4//KBI1P4 Port B Bit 4 / KBI1 Input Bit 4 Unused
1323x Remote Extender Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 5-9
5.2.3 1323x-REM Onboard Peripheral Functions
The 1323x-REM has a simple set of peripheral functions useful to evaluate the MC13233 and to
implement simple node applications, especially a remote control receiver; i.e., interface to host platform.
P2-12 PTB5//KBI1P5 Port B Bit 5 / KBI1 Input Bit 5 Unused
P2-22 PTB6//KBI1P6 Port B Bit 6 / KBI1 Input Bit 6 Unused
P1-17, P1-18 PTB7//KBI1P7 Port B Bit 7 / KBI1 Input Bit 7 UART flow control RTS input to MCU;
jumper required
Connects to REM USB <> UART device
P2-15, P2-16 PTC0/KBI2P0 Port C Bit 0 / KBI2 Input Bit 0 REM switch matrix; jumper required
P2-23, P2-24 PTC1/KBI2P1 Port C Bit 1 / KBI2 Input Bit 1 REM switch matrix; jumper required
P2-20 PTC2/KBI2P2 Port C Bit 2 / KBI2 Input Bit 2 Unused
P2-26 PTC3/KBI2P3 Port C Bit 3 / KBI2 Input Bit 3 Unused
P1-10 PTC4/SPICLK Port C Bit 4 / SPI clock Unused on REM
Connected to serial FLASH on MRB
P1-2 PTC5/SS Port C Bit 5 / SPI slave select Unused on REM
Connected to serial FLASH on MRB
P1-6 PTC6/MISO Port C Bit 6 / SPI MISO Unused on REM
Connected to serial FLASH on MRB
P1-4 PTC7/MOSI Port C Bit 7 / SPI MOSI Unused on REM
Connected to serial FLASH on MRB
P1- 15, P1-16 PTD0/TPM0 Port D Bit 0 / TPM0 signal Unused
P2-27, P2-28 PTD1/TPM1 Port D Bit 1/ TPM1 signal Drives LED4; jumper required
P1-21, P1-22 PTD2/TPM2 Port D Bit 2 / TPM2 signal UART flow control CTS output from
MCU; jumper required
Connects to REM USB <> UART device
P2-29, P2-30 PTD3/TPM3 Port D Bit 3 / TPM3 signal REM IR receiver input; jumper required
Drives timer input
P2-32 PTD4/CMT Port D Bit 4/ CMT output Not used on REM
Connected to IR blaster on MRB
P1-7, P1-8 PTD6/RXD Port D Bit 6 / UART RXD input UART RXD input to MCU; jumper
required
Connects to REM USB <> UART device
P1-11, P1-12 PTD5/TXD Port D Bit 5 / UART TXD output UART TXD output from MCU; jumper
required
Connects to REM USB <> UART device
P1-32 PTD7/32MOUT Port D Bit 7 Unused
Table 5-3. 1323x-REM P1 and P2 Pin Header Function Description (continued)
1323x-REM
Header Pins
MC13233
Signal Name Description Comments
1323x Remote Extender Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
5-10 Freescale Semiconductor
5.2.4 USB Interface
For many applications or demonstrations it is desirable to connect the 1323x-REM to a PC or other device.
A USB port is provided with a USB “B” receptacle plug. The port is connected to a FTDI FT232RQ USB
<> UART device that appears as a Virtual COM port (VCP) to the PC. PC drivers are available with the
module.
The USB interface is configured as a "Bus Powered" device and can draw all required power from the USB
interface. The device is USB 2.0 full speed compatible.
The USB connector is designated as J15. Figure 5-6 shows the connector pinout.
Figure 5-6. USB Connector Pinout
5.2.5 IR Receiver
The 1323x-REM provides an IR receiver that accepts IR signals from the RCM or from any IR based
remote control devices.
The IR receiver is the TSOP85238TR device (Q3)
38 kHz carrier frequency
+/- 50 Degree angle of half tranmission distance
• Drives the PTD3/TPM3 signal.
Figure 5-7 shows the IR receiver schematic.
1
2
3
4
S1
S2
1
2
34
+D
-D
G
V
J15
USB_TY PE_B
DATA_P
DATA_M
V_BUS
1323x Remote Extender Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 5-11
Figure 5-7. IR Receiver Circuit
5.2.6 Pushbutton 2x4 Switch Matrix
The1323x-REM provides an 8 pushbutton 2x4 switch matrix for user application input interface.
The matrix utilizes MC13233 KBI inputs
All switches have interrupt and device wake up capability
5.2.7 Blue Indicator LEDs
The1323x-REM provides 4 blue LEDs for user application indicator outputs. Refer to Table 5-3 for
listings of the MC13233 outputs that drive the LEDs.
Ill §§§5§ 2% $5 § 1111'”? gnaw-Ir menu-u
1323x Development Hardware Reference Manual, Rev. 1.1
5-12 Freescale Semiconductor
1323x Remote Extender Motherboard
5.3 Schematic, Board Layout, and Bill of Material
Figure 5-8. 1323x-REM Schematic (1 of 2)
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
V_3V6
V_DC
V_LED
V_BHL
V_MRB
V_JACK
V_LED
V_DC
V_SER
V_JACK
V_BUS
V_SER
V_BUS
V_IRX
V_BAT
V_USB VCC
V_BAT
V_USB
V_BUS
V_MAIN
V_SER
DATA_M
DATA_P
Drawing Title:
Size Document Number Rev
Date: Sheet of
Page Title:
ICAP Classification: FCP: FIUO: PUBI:
SCH-26117 PDF: SPF-26117 B
1323X REMOTE EXTENDER MOTHERBOARD
C
Friday, October 02, 2009
POWER MANAGEMENT
44
X______
Drawing Title:
Size Document Number Rev
Date: Sheet of
Page Title:
ICAP Classification: FCP: FIUO: PUBI:
SCH-26117 PDF: SPF-26117 B
1323X REMOTE EXTENDER MOTHERBOARD
C
Friday, October 02, 2009
POWER MANAGEMENT
44
X______
Drawing Title:
Size Document Number Rev
Date: Sheet of
Page Title:
ICAP Classification: FCP: FIUO: PUBI:
SCH-26117 PDF: SPF-26117 B
1323X REMOTE EXTENDER MOTHERBOARD
C
Friday, October 02, 2009
POWER MANAGEMENT
44
X______
POWER ON
EXTERNAL SUPPLY.
NEVER SHUNT!!!
3.3V BUCK/BOOST REGULATOR
TO USE TPS63000,
REPLACE RESISTORS WITH
THE FOLLOWING VALUES:
R45 = 100 OHM, R47 = 1.24M
AND POPULATE R46.
OUTPUT VOLTAGE WILL BE 3.6V
LED
INFRARRED RX
3.3V POWER NETWORK
MODULAR REFERENCE BOARD
R47
0
R47
0
TL2TL2
SL1
4P2T SWITCH
SL1
4P2T SWITCH
1
2
3
4
5
6 7
8
9
10
11
12
TL5TL5
D11
MBR0520LT1G
D11
MBR0520LT1G
TP21TP21
R43
0
R43
0
TP20TP20
1
2
34
+D
-D
G
V
J15
USB_TYPE_B
1
2
34
+D
-D
G
V
J15
USB_TYPE_B
1
2
3
4
S1
S2
C42
10UF
C42
10UF
C43
10UF
C43
10UF
R46
200K
DNP
R46
200K
DNP
TP27TP27
D12
MBR0520LT1G
D12
MBR0520LT1G
F1
0.5A
F1
0.5A
1 2
C41
0.01UF
C41
0.01UF
BH4
125
BH4
125
C33
0.1UF
C33
0.1UF
FID2
FID
FID2
FID
L4
60OHM
L4
60OHM
1 2
BT1
BATTERY HOLDER
BT1
BATTERY HOLDER
12
TL3TL3
Q4
SI2305
Q4
SI2305
1
32
R40
0
R40
0
D13
MBR0520LT1G
D13
MBR0520LT1G
TP29TP29
R36
0
R36
0
D9
MBR0520LT1G
D9
MBR0520LT1G
R45
0
R45
0
BH3
125
BH3
125
TL4TL4
TP25TP25
R39
330
R39
330
C32
10UF
C32
10UF
FID1
FID
FID1
FID
D8
MBR0520LT1G
D8
MBR0520LT1G
BH2
125
BH2
125
LED5
RED
LED5
RED
21
BH1
125
BH1
125
TP19TP19
TP24TP24
J14
HDR 1X2
J14
HDR 1X2
1
2
TL1TL1
R38
4.7K
R38
4.7K
C40
4.7uF
C40
4.7uF
L3 3.3uHL3 3.3uH
1 2
C39
0.1UF
C39
0.1UF
R41
10K
R41
10K
D10
MBR0520LT1G
D10
MBR0520LT1G
FID3
FID
FID3
FID
TP23TP23
U8
TPS63001
U8
TPS63001
EN
6
GND
9
L1
4L2 2
PS/SYNC
7
VOUT 1
VIN
5
VINA
8
FB 10
PGND 3
PPAD 11
R35
0
R35
0
1323x Remote Extender Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 5-13
Figure 5-9. 1323x-REM Schematic (2 of 2)
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
V_IRX
V_USB
V_MRBV_MRB
V_LED V_LED V_LED V_LED
IRRx
DATA_P
DATA_M
UART_TXD
UART_RTS
UART_RXD
UART_CTS
MRB-SPI_MISO
MRB-PTD4/CMT
MRB-I2C_SCL
MRB-SPI_MOSI
MRB-UART_TXD
MRB-KBI2P0
MRB-KBI2P2
MRB-SPI_MOSI
MRB-SPI_SS
MRB-SPI_SS
MRB-PTA2/LCD_CTL0
MRB-PTD1/TPM1
MRB-KBI1P3
MRB-KBI1P1
MRB-KBI1P2
MRB-KBI1P4
MRB-I2C_SDA
UART_TXD
MRB-PTD3/TPM3
MRB-KBI1P5
MRB-PTA0LED1
MRB-UART_TXD
MRB-UART_RXD
MRB-PTD4/CMT
MRB-KBI1P5
MRB-PTA4/32K_OUT
MRB-PTA1 MRB-KBI2P3
MRB-UART_RTS/KBI1P7
MRB-UART_CTS/TPM2
MRB-KBI1P0
MRB-KBI2P0
MRB-KBI2P1
MRB-SPI_CLK
MRB-UART_RXDUART_RXD
MRB-KBI1P6
MRB-KBI1P4
MRB-KBI1P6
MRB-KBI2P1
MRB-KBI2P3
MRB-PTA3/IRQb
MRB-PTA4/32K_OUT
MRB-KBI2P2
MRB-PTA1
MRB-RSTb MRB-PTA3/IRQb
MRB-TPM0LED3
MRB-KBI1P0
MRB-KBI1P2
MRB-TPM0
MRB-PTD1/TPM1
MRB-PTA0
MRB-UART_RTS/KBI1P7
KMD1
MRB-RSTb
MRB-PTD7/32M_OUT
MRB-I2C_SDA
MRB-SPI_CLK
MRB-PTA2/LCD_CTL0
MRB-PTD3/TPM3
MRB-KBI1P1
MRB-KBI1P3
MRB-PTD7/32M_OUT
MRB-UART_CTS/TPM2
KMD0
UART_CTS
LED4
KBI1P3
KBI1P1
KBI1P2
KBI1P0
MRB-SPI_MISO
LED2
MRB-I2C_SCL
LED2 LED3 LED4LED1
KBI1P0 KBI1P1 KBI1P2 KBI1P3
KMD0
KMD1
IRRx
UART_RTS
Drawing Title:
Size Document Number Rev
Date: Sheet of
Page Title:
ICAP Classification: FCP: FIUO: PUBI:
SCH-26117 PDF: SPF-26117 B
1323X REMOTE EXTENDER MOTHERBOARD
C
Friday, October 02, 2009
INTERFACE
44
X ______
Drawing Title:
Size Document Number Rev
Date: Sheet of
Page Title:
ICAP Classification: FCP: FIUO: PUBI:
SCH-26117 PDF: SPF-26117 B
1323X REMOTE EXTENDER MOTHERBOARD
C
Friday, October 02, 2009
INTERFACE
44
X ______
Drawing Title:
Size Document Number Rev
Date: Sheet of
Page Title:
ICAP Classification: FCP: FIUO: PUBI:
SCH-26117 PDF: SPF-26117 B
1323X REMOTE EXTENDER MOTHERBOARD
C
Friday, October 02, 2009
INTERFACE
44
X ______
INFRARED RECEIVER
USB/UART TRANSCEIVER SOCKETS FOR 1323X-MRB ASSEMBLY
20-PIN GPIO
STANDARD HEADER
GPIO
P1 & P2:
IO PIN MAPPING
MUST USE SHUNTS TO ENABLE
BOARD FUNCTIONALLITY.
LED'S
KEYBOARD MATRIX
P1
HDR_2X16
P1
HDR_2X16
1 2
3 4
65
7 8
910
11 12
13 14
15 16
17 18
19 20
21 22
23 24
25 26
27 28
29 30
31 32
R25
390
R25
390
R48 0R48 0
TP14TP14
R23
390
R23
390
J9
CON_2X9
J9
CON_2X9
1 2
3 4
65
7 8
910
11 12
13 14
15 16
17 18
J8
CON_2X10
J8
CON_2X10
1 2
3 4
65
7 8
910
11 12
13 14
15 16
17 18
19 20
SW2
PB switch
SW2
PB switch
1 4
2 3
C24
15PF
C24
15PF
SW6
PB switch
SW6
PB switch
1 4
2 3
R33
330
R33
330
SW4
PB switch
SW4
PB switch
1 4
2 3
LED3
BLUE
LED3
BLUE
21
LED1
BLUE
LED1
BLUE
21
TP31TP31
SW7
PB switch
SW7
PB switch
1 4
2 3
C23
15PF
C23
15PF
C25
0.1UF
C25
0.1UF
C53
2.2UF
C53
2.2UF
TP30TP30
R20 1KR20 1K
R26
390
R26
390
R49 0R49 0
R24
390
R24
390
TP15TP15
P2
HDR_2X16
P2
HDR_2X16
1 2
3 4
65
7 8
910
11 12
13 14
15 16
17 18
19 20
21 22
23 24
25 26
27 28
29 30
31 32
C30
0.1UF
C30
0.1UF
TP32TP32
SW3
PB switch
SW3
PB switch
1 4
2 3
U4 FT232RQU4 FT232RQ
GND1
4AGND
24
RI# 3
DCD# 7
DSR# 6
DTR# 31
3V3OUT
16
VCCIO
1
OSCI
27
RESET#
18
NC6
23
OSCO
28
CBUS4 9
CBUS3 11
CBUS1 21
CBUS0 22
CBUS2 10
NC5
29 NC4
25 NC3
13 NC2
12 NC1
5USBDP
14
USBDM
15
VCC
19
GND4
20 GND2
17
TEST
26
CTS# 8
RTS# 32
RXD 2
TXD 30
EP
33
R21 1KR21 1K
LED4
BLUE
LED4
BLUE
21
Q3
TSOP85238TR
Q3
TSOP85238TR
VCC 2
OUT 3
GND2
4
GND3
5
GND1
1
SW5
PB switch
SW5
PB switch
1 4
2 3
LED2
BLUE
LED2
BLUE
21
TP13TP13 TP16TP16
R22 1KR22 1K
SW8
PB switch
SW8
PB switch
1 4
2 3
SW1
PB switch
SW1
PB switch
1 4
2 3
R19 1KR19 1K
lazaxruna ASSEMBLY ‘ YLZ z [u m Wm |:| . JJZJXVREM a RELEASE a; o 1a 2 49 m 2 w 1w 1 32 n v2 7,” rMs o o 02’" NM xm AEH xXXXXAHDs Aau 1“‘xlool 7va we) 0 O O szs vpzv on o mg + ’ DYNA 523 p; 2 “4 an H
1323x Remote Extender Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
5-14 Freescale Semiconductor
Figure 5-10. 1323x-REM PCB Component Location (Top View)
Figure 5-11. 1323x-REM PCB Test Points
1323x Remote Extender Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 5-15
Figure 5-12. 1323x-REM PCB Layout (Top View)
Figure 5-13. 1323x-REM PCB Layout (Bottom View)
1323x Remote Extender Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
5-16 Freescale Semiconductor
5.3.1 1323x-REM Bill of Materials
Table 5-4. Bill of Materials
Item Qty. Reference Value Description Mfg. Name Part Number
1 4 BH1, BH2, BH3,
BH4
125 NON-PLATED MOUNTING
HOLE 125 DRILL / 160
KEEPOUT NO PART TO
ORDER
21BT1 BATTERY
HOLDER
BATTERY HOLDER 2XAA TH KEYSTONE
ELECTRONICS
2462
3 2 C23,C24 15PF CAP CER 15PF 50V 5% C0G
0402
KEMET C0402C150J5GAC
4 4 C25,C30,C33,
C39
0.1UF CAP CER 0.1UF 16V 10%
X7R 0402
MURATA GRM155R71C104KA88D
5 3 C32,C42,C43 10UF CAP CER 10UF 10V 10% X7R
0805
Murata GRM21BR71A106KE51L
6 1 C40 4.7uF CAP CER 4.7UF 10V 10%
X5R 0603
TAIYO YUDEN LMK107BJ475KA-T
7 1 C41 0.01UF CAP CER 0.01UF 10V 20%
X7R 0402
AVX 0402ZC103MAT2A
8 1 C53 2.2UF CAP CER 2.2UF 6.3V 20%
X5R 0402
MURATA GRM155R60J225ME15D
9 6 D8,D9,D10,D11
,D12,D13
MBR0520L
T1G
DIODE SCH 0.5A 20V
SOD-123
ON
SEMICONDUCTOR
MBR0520LT1G
10 3 FID1,FID2,FID3 FID FIDUCIAL 060 MIL PAD
W/120 SOLDERMASK AND
040 MIL PAD W/90 MIL
SOLDERMASK NO PART TO
ORDER
GENERIC FID-040
11 1 F1 0.5A FUSE FAST 0.5A 63V SMT
1206
LITTELFUSE 0437.500WR
12 1 J8 CON_2X1
0
CON 2X10 SKT TH 100MIL
CTR 335H AU 104L
SAMTEC SSW-110-01-G-D
13 1 J9 CON_2X9 CON 2X9 SKT TH 100MIL SP
335H AU 194L
SAMTEC SSW-109-02-G-D
14 1 J14 HDR_1X2 HDR 1X2 TH 100MIL SP 375H
AU
TYCO
ELECTRONICS
826629-2
15 1 J15 USB_TYP
E_B
CON 2X2 USB_TYPE_B SKT
RA SHLD TH 2.5MM SP 453H
AU
TYCO
ELECTRONICS
292304-2
16 4 LED1,LED2,LE
D3,LED4
BLUE LED BLUE SGL 20MA SMT
0805
LITE ON LTST-C171TBKT-5A
17 1 LED5 RED LED RED CLEAR SGL 30MA
SMT 0805
LITE ON LTST-C171KRKT
1323x Remote Extender Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 5-17
18 1 L3 3.3uH IND PWR 3.3UH@100KHZ
3.3A 20% SMT
VISHAY
INTERTECHNOLO
GY
IHLP2020BZER3R3M01
19 1 L4 60OHM IND FER BEAD
60OHM@100MHZ 500MA --
0603
MURATA BLM18PG600SN1_
20 2 P1,P2 HDR_2X1
6
HDR 2X16 TH 100MIL CTR
330H AU 100L
SAMTEC TSW-116-07-S-D
21 1 Q3 TSOP8523
8TR
TRAN PHOTO 0.45MA 5.5V
950NM SMT
VISHAY
INTERTECHNOLO
GY
TSOP85238TR
22 1 Q4 SI2305 TRAN PMOS PWR 4.1A 8V
SOT23
VISHAY
INTERTECHNOLO
GY
SI2305ADS-T1-GE3
23 4 R19,R20,R21,R
22
1K RES MF 1.0K 1/16W 5% 0402 VISHAY
INTERTECHNOLO
GY
CRCW04021K00JNED
24 4 R23,R24,R25,R
26
390 RES MF 390 OHM 1/16W 5%
0402
BOURNS CR0402-JW-391GLF
25 2 R33,R39 330 RES MF 330 OHM 1/16W 5%
0402
VISHAY
INTERTECHNOLO
GY
CRCW0402330RJNED
26 6 R35,R36,R40,R
43,R48,R49
0 RES TF ZERO OHM 1/16W
RC0402
VISHAY
INTERTECHNOLO
GY
CRCW04020000ZS
27 1 R38 4.7K RES MF 4.7K 1/16W 5% 0402 SMEC RC73L2Z472JTF
28 1 R41 10K RES MF 10K 1/16W 5% 0402 VISHAY
INTERTECHNOLO
GY
CRCW040210K0JNED
29 1 R45 100 RES MF 100 OHM 1/16W 5%
0402
VISHAY
INTERTECHNOLO
GY
CRCW0402100RJNED
30 1 R46 200K RES MF 200K 1/16W 5% 0402 YAGEO AMERICA RC0402JR-07200KL
31 1 R47 1.24M RES MF 1.24M 1/16W 1%
0402
VISHAY
INTERTECHNOLO
GY
CRCW04021M24FKED
32 1 SL1 4PDT
SWITCH
SW 4PDT SLD TH RA 30V
100MA --
TYCO
ELECTRONICS
1-1437575-1
33 8 SW1,SW2,SW3
,SW4,SW5,SW
6,SW7,SW8
PB switch SW SMT 4.0MM FMS 0.1A
MAX 16V MAX ROHS
COMPLIANT
BOURNS 7914J-1-000E
Table 5-4. Bill of Materials
Item Qty. Reference Value Description Mfg. Name Part Number
1323x Remote Extender Motherboard
1323x Development Hardware Reference Manual, Rev. 1.1
5-18 Freescale Semiconductor
34 15 TP13,TP14,TP1
5,TP16,TP19,T
P20,TP21,TP23
,TP24,TP25,TP
27,TP29,TP30,
TP31,TP32
TPAD_040 TEST POINT PAD 40MIL DIA
SMT, NO PART TO ORDER
NOTACOMPONEN
T
NOTACOMPONENT
35 1 U4 FT232RQ IC XCVR USB TO UART
CTLR 3.3-5.25V QFN32
FUTURE TECH-
NOLOGY
DEVICES INTER-
NATIONAL LTD.
FT232RQ
36 1 U8 TPS6300
1
IC LIN DCDC SYNC 3.3V
OUTPUT 1250-1800KHZ
1.8-5.5V QFN-10
TEXAS INSTRU-
MENTS
TPS63001DRCT
Table 5-4. Bill of Materials
Item Qty. Reference Value Description Mfg. Name Part Number
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 6-1
Chapter 6
PCB Manufacturing Specifications
This chapter provides the specifications used to manufacture the 1323x Development hardware printed
circuit boards (PCB) described in this manual.
The 1323x Development hardware PCBs must comply with the following:
The PCB must comply with Perfag10/3C (http://www.perfag.dk/Uk/ukindex.htm)
The PCB manufacturers logo is required
The PCB production week and year code is required
The manufacturers logo and week/year code must be stamped on the back of the PCB solder
mask
The PCB manufacturer can not insert text on the PCB either in copper or in silkscreen without
written permission from Freescale Semiconductor, Inc.
The required Underwriters Laboratory (UL) Flammability Rating
The level is 94V-0 (http://www.ul.com/plastics/flame.html)
The UL information must be stamped on the back of the PCB solder mask
NOTE
A complete set of design files is available for the 1323x Development
hardware at the Freescale web site (http:www.freescale.com/802154)
under reference designs. It is recommended that this design or one of a
number of other reference designs be used as a starting point for a
custom application.
The Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout
Considerations Reference Manual, (ZHDCRM) is also available at the
same web site to provide additional design guidance.
6.1 Single PCB Construction
This section describes individual PCB construction details.
The MRB and RCM PCBs are four-layer, multi layer designs
The REM PCB is a two layer design
The PCBs contains no blind, buried, or micro vias
PCB data:
MRB Size: Approximately 51 x 51mm (2.01 x 2.01 inches)
RCM Size: Approximately 86 x 178 mm (3.4 x 7.0 inches)
REM Size: Approximately 79 x 79 mm (3.1 x 3.1 inches)
PCB Manufacturing Specifications
1323x Development Hardware Reference Manual, Rev. 1.1
6-2 Freescale Semiconductor
MRB, RCM and REM Final thickness (Cu/Cu): 0.34 mm (0.8 inches) +/- 10% (excluding
solder mask)
The following table defines some of the layers of the completed PCB. The artwork identification refers to
the name of the layer in commonly used terms.
The 1323x MRB contains high frequency 2.4 GHz RF circuitry. As a result,
RF component placement, line geometries and layout, and spacing to the
ground plane are critical parameters. As a result, BOARD STACKUP
GEOMETRY IS CRITICAL. Dielectric and copper thicknesses and spacing
must not be changed; follow the stackup (see Figure 6-1) information is
provided with the reference design.
Table 6-1. MRB Layer by Layer Overview
Layer Artwork Identification File Name
1 Silkscreen Top SILK_TOP.art
2 Top Layer Metal TOP.art
3 Ground Layer GND.art
4 Power Layer PWR.art
5 Bottom Layer Metal BOTTOM.art
6 Silkscreen Bottom SILK_BOTTOM.art
Table 6-2. RCM Layer by Layer Overview
Layer Artwork Identification File Name
1 Silkscreen Top SILK_TOP.art
2 Top Layer Metal TOP.art
3 Ground Layer GND.art
4 Power Layer PWR.art
5 Bottom Layer Metal BOTTOM.art
6 Silkscreen Bottom SILK_BOTTOM.art
Table 6-3. REM Layer by Layer Overview
Layer Artwork Identification File Name
1 Silkscreen Top SILK_TOP.art
2 Top Layer Metal TOP.art
3 Bottom Layer Metal BOTTOM.art
4 Silkscreen Bottom SILK_BOTTOM.art
PCB Manufacturing Specifications
1323x Development Hardware Reference Manual, Rev. 1.1
Freescale Semiconductor 6-3
Figure 6-1. MRB PCB Stackup Cross-Section (Four Layer)
Solder mask is required
Silk screen is required
6.2 Panelization
The panel size can be negotiated depending on production volume.
6.3 Materials
The PCB composite materials must meet the following requirements:
Laminate - The base laminate material (laminate) must be FR4. If the laminate material were
changed the RF electrical characteristics may change and degrade RF performance.
Copper Foil -
Top and Bottom copper layers must be 1 oz. copper
Interior layers must be 1/2 oz. copper
Plating - All pad plating must be Hot Air Levelling (HAL)
6.4 Solder Mask
The solder mask must meet the following requirements:
Solder mask type: Liquid Film Electra EMP110 or equivalent
Solder mask thickness: 10 – 30 µm
Dielectric
Dielectric
Dielectric
Metal 1
Metal 2
Metal 3
Metal 4
PCB Manufacturing Specifications
1323x Development Hardware Reference Manual, Rev. 1.1
6-4 Freescale Semiconductor
6.5 Silk Screen
The silk screen must meet the following requirements:
Silkscreen color: White
Silkscreen must be applied after application of solder mask if solder mask is required
The silkscreen ink must not extend into any plated-thru-holes
The silk screen must be clipped back to the line of resistance
6.6 Electrical PCB Testing
All PCBs must be 100 percent tested for opens and shorts
Impedance Measurement - An impedance measurement report is not mandatory
6.7 Packaging
Packaging for the PCBs must be the following requirements:
Finished PCBs must remain in panel
Finished PCBs must be packed in plastic bags that do not contain silicones or sulphur materials.
These materials can degrade solderability.
6.8 Hole Specification/Tool Table
See the ncdrill-1-4.tap file included with the Gerber files and the FAB-23451.pdf file.
6.9 File Description
Files included with the download include Design, Gerber and PDF files.
Gerber files are RS-374x format. Not all files included with the Gerber files are for PCB manufacturing.
PDF files included are:
FAB-2611x.pdf — Board fabrication drawing
GRB-2611x.pdf — Metal layers, solder mask, solder paste and silk screen
SPF-2611x.pdf — Schematic
Design files are in Allegro format with OrCAD schematic capture.

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