LM561B - 5630 Middle Power (S1,S2,S3) Datasheet by Samsung Semiconductor, Inc.
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Rev:
Product Family Data Sheet
SAMSUNG ELECTRONICS
95, Samsung2-Ro, Giheung-Gu,
Yongin City, Gyeonggi Do 446 711, KOREA
001
LM561B -
--
-5630 Middle Power LED
Copyright © 1995-2013 SAMSUNG ELECTRONICS Co.,Ltd. All rights reserved. The information in this document is subject to
change without notice. SAMSUNG, is aregistered trademark of SAMSUNG ELECTRONICS.
Introduction
Features
Beam Angle: 120˚
Precondition :JEDEC Level 2a
Dimension : 5.6 x 3.0 x 0.8 mm
ESD withstand Voltage :up to ± 5KV [HBM]
Applications
INDOOR LIGHTING :Ambient Light, LED tube, Down light, LED bulb and Ceiling Light

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Contents
1. Product Code Information ----------------------- 3
2. Characteristics ----------------------- 9
3. Typical CharacteristicsGraph ----------------------- 10
4. Outline Drawing &Dimension ----------------------- 16
5. Reliability Test Items &Conditions ----------------------- 17
6. Solder Conditions ----------------------- 18
7. Tape &Reel ----------------------- 19
8. Label Structure ----------------------- 20
9. Packing Structure ----------------------- 21
10. Precaution For Use ----------------------- 23
11. Hazard Substance Analysis Report ----------------------- 26
Revision History ----------------------- 46

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1. Product Code Information
1) Luminous Flux Bins (T
s
= 25℃
℃℃
℃)
Nominal
CCT Product Code Flux Rank
Sorting Condition lm @65mA
Flux Range (Φ
v
,lm)
2700K
SPMWHT541MD5WAW0S1 S1 24.0 ~ 26.0
SPMWHT541MD5WAW0S2 S2 26.0 ~ 28.0
SPMWHT541MD5WAW0S3 S3 28.0 ~ 30.0
3000K
SPMWHT541MD5WAV0S1 S1 24.5 ~ 26.5
SPMWHT541MD5WAV0S2 S2 26.5 ~ 28.5
SPMWHT541MD5WAV0S3 S3 28.5 ~ 30.5
3500K
SPMWHT541MD5WAU0S1 S1 25.0 ~ 27.0
SPMWHT541MD5WAU0S2 S2 27.0 ~ 29.0
SPMWHT541MD5WAU0S3 S3 29.0 ~ 31.0
4000K
SPMWHT541MD5WAT0S1 S1 26.0 ~ 28.0
SPMWHT541MD5WAT0S2 S2 28.0 ~30.0
SPMWHT541MD5WAT0S3 S3 30.0 ~32.0
5000K
SPMWHT541MD5WAR0S1 S1 27.0 ~ 29.0
SPMWHT541MD5WAR0S2 S2 29.0 ~ 31.0
SPMWHT541MD5WAR0S3 S3 31.0 ~ 33.0
5700K
SPMWHT541MD5WAQ0S1 S1 26.5 ~ 28.5
SPMWHT541MD5WAQ0S2 S2 28.5 ~ 30.5
SPMWHT541MD5WAQ0S3 S3 30.5 ~ 32.5
6500K
SPMWHT541MD5WAP0S1 S1 26.0 ~ 28.0
SPMWHT541MD5WAP0S2 S2 28.0 ~ 30.0
SPMWHT541MD5WAP0S3 S3 30.0 ~ 32.0
Notes: SAMSUNG ELECTRONICS maintains atolerance of
±5%
on Luminous Flux measurements

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2) Color Bins (T
s
= 25℃
℃℃
℃)
1) Color Binning
Nominal
CCT Product Code Color Rank Chromaticity Bins
2700K
SPMWHT541MD5WAW0S1
SPMWHT541MD5WAW0S2
SPMWHT541MD5WAW0S3
W0(Whole bin) W1, W2, W3, W4, W5, W6, W7, W8,
W9, WA, WB, WC, WD, WE, WF, WG
3000K
SPMWHT541MD5WAV0S1
SPMWHT541MD5WAV0S2
SPMWHT541MD5WAV0S3
V0(Whole bin) V1, V2, V3, V4, V5, V6, V7, V8,
V9, VA, VB, VC, VD, VE, VF, VG
3500K
SPMWHT541MD5WAU0S1
SPMWHT541MD5WAU0S2
SPMWHT541MD5WAU0S3
U0(Whole bin) U1, U2, U3, U4, U5, U6, U7, U8,
U9, UA, UB, UC, UD, UE, UF, UG
4000K
SPMWHT541MD5WAT0S1
SPMWHT541MD5WAT0S2
SPMWHT541MD5WAT0S3
T0(Whole bin) T1, T2, T3, T4, T5, T6, T7, T8,
T9, TA, TB, TC, TD, TE, TF, TG
5000K
SPMWHT541MD5WAR0S1
SPMWHT541MD5WAR0S2
SPMWHT541MD5WAR0S3
R0(Whole bin) R1, R2, R3, R4, R5
R6, R7, R8, R9 ,RA
5700K
SPMWHT541MD5WAQ0S1
SPMWHT541MD5WAQ0S2
SPMWHT541MD5WAQ0S3
Q0(Whole bin) Q1, Q2, Q3, Q4, Q5
Q6, Q7, Q8, Q9, QA
6500K
SPMWHT541MD5WAP0S1
SPMWHT541MD5WAP0S2
SPMWHT541MD5WAP0S3
P0(Whole bin) P1, P2, P3, P4, P5
P6, P7, P8, P9, PA

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2) Chromaticity Region &Coordinates

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2) Chromaticity Region &Coordinates (Continued)

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2) Chromaticity Region &Coordinates (Continued)

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2) Chromaticity Region &Coordinates (Continued)
Notes: SAMSUNG ELECTRONICS maintains ±0.007 tolerance of Cx,Cy

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2. Characteristics
1) Absolute Maximum Rating
Item Symbol Rating Condition
Operating temperature range T
op
-40 ~ +85
Storage temperature range T
stg
-40 ~ +120
LED junction temperature T
J
110
Forward Current I
F
150 mA
Peak Pulsed Forward Current I
FP
300 mA Duty 1/10 pulse width 10ms
Thermal resistance R
th,
j-s 16 /W Junction to solder point
Assembly Process Temperature 260 , < 10sec
ESD 5kV HBM
2) Electro-
--
-
optical Characteristics
Item Unit
Nominal
CCT
Product
Code Rank Min Typ Max
Forward Voltage
1)
(V
F
)
(@65 mA, Ts = 25 ) VWA
AZ
2
.
7
0
2
.
8
0
A1
2
.
8
0
2
.
9
0
A2
2
.
9
0
3
.
0
0
A3
3
.
0
0
3
.
1
0
A4
3
.
1
0
3
.
2
0
Luminous Flux
2)
(Φ
v
)
(@65 mA, Ts = 25 ) lm
2700K
(W0)
*
WAW0S1
S1
2
4
.
0
2
6
.
0
*
WAW0S2
S2
2
6
.
0
2
8
.
0
*
WAW0S3
S3
2
8
.
0
3
0
.
0
3000K
(V0)
*
WAV0S1
S1
2
4
.
5
2
6
.
5
*
WAV0S2
S2
2
6
.
5
2
8
.
5
*
WAV0S3
S3
2
8
.
5
3
0
.
5
3500K
(U0)
*
WAU0S1
S1
2
5
.
0
2
7
.
0
*
WAU0S2
S2
2
7
.
0
2
9
.
0
*
WAU0S3
S3
2
9
.
0
3
1
.
0
4000K
(T0)
*
WAT0S1
S1
2
6
.
0
2
8
.
0
*
WAT0S2
S2
2
8
.
0
3
0
.
0
*
WAT0S3
S3
3
0
.
0
3
2
.
0
5000K
(R0)
*
WAR0S1
S1
2
7
.
0
2
9
.
0
*
WAR0S2
S2
2
9
.
0
3
1
.
0
*
WAR0S3
S3
3
1
.
0
3
3
.
0
5700K
(Q0)
*
WAQ0S1
S1
2
6
.
5
2
8
.
5
*
WAQ0S2
S2
2
8
.
5
3
0
.
5
*
WAQ0S3
S3
3
0
.
5
3
2
.
5
6500K
(P0)
*
WAP0S1
S1
2
6
.
0
2
8
.
0
*
WAP0S2
S2
2
8
.
0
3
0
.
0
*
WAP0S3
S3
3
0
.
0
3
2
.
0
Reverse Voltage
(@5 mA, Ts = 25 ) V 0.7 1.2
Color
Rendering
Index
3
)
(
R
a
)
5
8
0
Special
CRI
4)
(
R9
)
0
Notes:
1)~4) SAMSUNG ELECTRONICS maintains atolerance of
V
F
:±0.1 V,
Φ
v
:±5 %, R
a
:±3.0, R9 :±6.5
on
measurements
5) " * " is Product Code of "SPMWHT541MD5"

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3. Typical Characteristics Graph
(T
s
= 25℃
℃℃
℃)
1) Spectrum Distribution
[CCT : 2700K & 3000K]
[CCT : 3500K & 4000K]

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[CCT : 5000K & 5700K]
[CCT : 6500K]

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2) Forward Current Characteristics
[Relative Luminous Flux vs. Forward Current]
(T
s
= 25℃
℃℃
℃)
[Forward Current vs. Forward Voltage]
(T
s
= 25℃
℃℃
℃)

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3) Temperature Characteristics
[Relative Luminous Flux vs. Ts]
(I
F
= 65mA)
[Forward Voltage vs. Ts]
(I
F
= 65mA)

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4) Color shift Characteristics
[Forward Current vs. Color x, y]
(T
s
= 25℃
℃℃
℃)

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5) Derating Curve
6) Beam Angle Characteristics

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4. Outline Drawing &Dimension
Recommended Land Pattern
Notes:
1) This LED has built-in ESD protection device(s) connected in parallel to LED Chip(s).
2) Ts point &measurement method
Measure the nearest point to the thermal pad. If necessary, remove PSR of PCB to reach Ts
point.
Thermal pad must be soldered to the PCB to dissipate heat properly. Otherwise, LED can be
damaged.
3) Precautions
The pressure on the LEDs will influence to the reliability of the LEDs. Precautions should be
taken to avoid the strong pressure on the LEDs. Do not put stress on the LEDs during heating.
Re-soldering should not be done after the LEDs have been soldered. If re-soldering is
unavoidable, LED`s characteristics should be carefully checked before and after such repair.
Do not stack assembled PCBs together. Since materials of LEDs is soft, abrasion between two
PCB assembled with LED might cause catastrophic failure of the LEDs.
1. Tolerance is ±0.10 mm
2. The maximum compressing force is 15N on the body
3. Do not place pressure on the encapsulation resin
Bottom View
Top View
Front View
Left Side View
Anode Mark
Cathode
Anode

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5. Reliability Test Items and Conditions
1) Test Items
Test Item Test Conditions Test
Hours/Cycles Sample No
MSL Test 125 24hrs drying 60 , 60 %RH 120hrs
260 10sec 3cycles 1cycle 11
Room Temperature
life test 25 ±3 , DC150 1,000 hrs 22
High Temperature
life test 85 ±3 , DC150 1,000 hrs 22
High Temperature
humidity life test 85 ±3 , 85 %±2 %RH, DC150 1,000 hrs 22
Low Temperature
life test -40 ±3 , DC150 1,000 hrs 22
Powered Temperature
Cycle test
-45 /20 min 85 /20 min, Sweep
100min cycle on/off: each 5min, DC 150mA
100 cycle 22
Thermal Shock
-45 /15 min 125 /15 min
Hot plate 180
500 cycle 100
High Temperature
Storage Ta=120 ±3 1000 hrs 11
Low Temperature
Storage Ta=-40 ±3 1000 hrs 11
ESD(HBM)
R1:10 ,
R2:1.5 ,
C:100 ,
V = ±5 kV
5times 5
ESD(MM)
R1:10 ,
R2: 0,
C:200 ,
V = ±0.5 kV
5times 5
Vibration Test
20~2000~20 Hz 200 m/s
2
,Sweep 4min
X, Y, Z 3 direction, each 1cycle 4cycles 11
Mechanical Shock Test
1500G, 0.5 ms,
3shocks each X-Y-Z axis
5cycles 11
2) Criteria for Judging the Damage
Item Symbol Test Condition Limit
Min Max
Forward Voltage V
F
I
F
= 65 Init. Value*0.9 Init. Value*1.1
Luminous Flux
Φ
v
I
F
= 65 Init. Value*0.7 Init. Value*1.2

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6. Solder Conditions
1) Reflow Conditions (Pb Free )
Reflow Frequency : 2 times max.
2) For Manual Soldering
Not more than 5seconds @Max. 300 , under soldering iron.

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7. Tape &Reel
(1) Quantity :The quantity/Reel to be Max. 2,000 pcs, .
(2) Cumulative Tolerance :Cumulative tolerance/10 pitches to be ±0.2
(3) Adhesion Strength of Cover Tape :Adhesion strength to be 0.1-0.7N when the
cover tape is turned off from the carrier tape at 10 angle to be the carrier tape.
(4) Packaging :P/N, Manufacturing data code no. and quantity to be indicated on a
damp proof Package.
PKG direction
directiondirection
direction in carrier tape pocket
Anode Mark (Cutting )
unit:mm
More than 500
Unloaded tape
Mounted with
Flash LED
Leading part more than
500
More than 100~200
Unloaded tape
End Start

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8. Label Structure
1) Label Structure
N.B) Denoted rank is the only example.
' ' means All kind of Chromaticity Coordinate Rank.
Rank Code
:Forward Voltage(V
F
)Rank (refer to page. 9)
:Chromaticity Coordinate Rank (refer to page. 5~8)
:Luminous Flux(Φ
v
,lm) Rank (refer to page. 3)
2) LOT Number
The Lot number is composed of the following characters
/ 1 / 2,000 PCS
:Production Site (S:SAMSUNG ELECTRONICS,G:GOSIN CHINA)
: L (LED)
:Product State (A:Normality, B:Bulk, C:First Production, R:Reproduction, S:Sample)
:Year (V:2011, W:2012, X:2013...)
:Month (1 ~ 9, A, B)
:Day (1 ~ 9, A, B ~ V)
:SAMSUNG ELECTRONICS LED Product number (1 ~ 999)
:Reel Number (1 ~ 999)
SPMWHT541MD5WA 0S1 AZ 1S1 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAW94001 / 1001 / 2,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
Rank Code
AZ★
★★
★1S1
SPMWHT541MD5WA 0S1 AZ 1S1 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAW94001 / 1001 / 2,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
AZ★
★★
★1S1

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9. Packing Structure
1) Packing Process
Reel
Aluminum Vinyl Bag
LEVEL
2a
LEVEL
2a
①SIDE
Material :Paper(SW3B(B))
TYPE SIZE(mm)
L W H
7inch 245 220 182
CHIP
CHIPCHIP
CHIP LED
LEDLED
LED
①
H
W
L
SPMWHT541MD5WA 0S1 AZ 1S1 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAW94001 / 1001 / 2,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
AZ★
★★
★1S1
SPMWHT541MD5WA 0S1 AZ 1S1 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAW94001 / 1001 / 2,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
AZ★
★★
★1S1
SPMWHT541MD5WA 0S1 AZ 1S1 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAW94001 / 1001 / 2,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
AZ★
★★
★1S1

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2) Aluminum Packing Bag
Silica gel &Humidity Indicator Card in Aluminum Vinyl Bag
SPMWHT541MD5WA 0S1 AZ 1S1 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAW94001 / 1001 / 2,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
AZ★
★★
★1S1

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10. Precaution for use
1) For over-current-proof function, customers are recommended to apply resistors to
prevent sudden change of the current caused by slight shift of the voltage.
.
2) This device should not be used in any type of fluid such as water, oil, organic
solvent, etc. When washing is required, IPA is recommended to use.
, , ,
IPA .
3) When the LEDs illuminate, operating current should be decided after considering the
ambient maximum temperature.
LED , .
4) LEDs must be stored in aclean environment.
If the LEDs are to be stored for 3months or more after being shipped from
Samsung Electronics,they should be packed by asealed container with nitrogen gas
injected.(Shelf life of sealed bags: 12 months, temp. ~40 , ~90%RH)
LED ,
3 .
(bag : 12 , ~40 , ~90%RH)
5) After storage bag is open, device subjected to soldering, solder reflow,or other
high temperature processes must be:
Bag ,reflow
.
a. Mounted within 672 hours(28 days) at an assembly line with acondition of no
more than 30 /60%RH,
a. 30 /60%RH 672 (28 ) .
b. Stored at <10%RH.
b. 10% .
6) Repack unused Products with anti-moisture packing, fold to close any opening and
then store in adry place.
,
.

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7) Devices require baking before mounting, if humidity card reading is >60% at 23±5 .
23±5 60% , baking .
8) Devices must be baked for 1hour at 65±5 , if baking is required.
baking , 65±5 1 baking .
9) TheLEDs are sensitive to the static electricity and surge. It is recommended to
use awrist band or anti-electrostatic glove when handling the LEDs.
LED ,LED
.
If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause
damage or even destruction to LED devices.
LED ,LED
.
Damaged LEDs may show some unusual characteristics such as increase in leak
current, lowered turn-on voltage, or abnormal lighting of LEDs at low current.
,Turn on ,
.
10) VOCs (volatile organic compounds) may be occurred by adhesives, flux, hardener or
organic additives which is used in luminaires (fixture) and LED silicone bags are
permeable to it. It may lead adiscoloration when LED expose to heat or light.
VOCs( ) , Flux, ,
LED ,
.
This phenomenon can give asignificant loss of light emitted(output) from the
luminaires(fixtures).
.
In order to prevent these problems, we recommend you to know the physical
properties for the materials used in luminaires, It requires to select carefully.
,
.

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11) Risk of Sulfurization (or Tarnishing)
The lead frame from Samsung Electronics is aplated package and it may change to
black(or dark colored) when it is exposed to Ag (a), Sulfur (S), Cchlorine (Cl) or other
halogen compound. It requires attention.
Ag( ) Package (S), (Cl),
Ag( ) ( )
.
Sulfide (Sulfurization) of the lead frame may cause achange of degradation intensity,
chromaticity coordinates and it may cause open circuit in extreme cases. It requires
attention.
(Sulfurization) ,
LED (Open) .
Sulfide (Sulfurization) of the lead frame may cause of storage and using with oxidizing
substances together. Therefore, LED is not recommend to use and store with the
below list.
:Rubber, Plain paper, lead solder cream etc.
(Sulfurization) LED
, : , ,

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11. Hazard Substance Analysis -SGS

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11. Hazard Substance Analysis -SVHC(REACH)

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Date No. Revision History Writer
Drawn Approved
2013.2.08 001 New version W.H Jung Y.T KIM
Revision History
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