BU7445(S)HFV Datasheet by Rohm Semiconductor

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ROHITI ssmlcuunucvun I: :l Pin No. Pin Name 1 |N+ l: 2 V33 3 IN- |: :I 4 OUT 5 VDD Package HVSOFS BU7445HFV BU7445$HFV Ordering lnlormation B U 7 4 4 5 x x x x - x x % # Part Number Package Packagmg and lormmg specmcauon BU7445HFV HFV I HVSOF5 TR: Embossed tape and reel BU7445$HFV www.mhmcom TSZD2201-0RAROG200180-1-2 © 2014 ROHM 00., Ltd. AH rights reserved. 1/13 17_Jan_2o14 nevgm TSZzzm-M-nm
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© 2014 ROHM Co., Ltd. All rights reserved. 1/18 17.Jan.2014 Rev.001
TSZ2211114001
Datashee
t
Operational Amplifiers
Ground Sense Low Voltage Operation
CMOS Operational Amplifiers
BU7445HFV BU7445SHFV
General Description
The BU7445HFV is an input ground sense output full
swing CMOS operational amplifier. The BU7445SHFV
has expanded temperature range. They have feature
of low operating supply voltage, low supply current and
low input bias current. These are suitable for battery
powered equipment and sensor amplifiers.
Features
Low Supply Current
Low Operating Supply Voltage
Wide Temperature Range
Low Input Bias Current
Input Ground Sense, Output Full Swing
Applications
Sensor Amplifier
Portable Equipment
Battery-powered Equipment
Consumer Equipment
Key Specifications
Operating Supply Voltage (single supply):
+1.7V to +5.5V
Supply Current: 40µA(Typ)
Temperature Range:
BU7445HFV -40°C to +85°C
BU7445SHFV -40°C to +105°C
Input Offset Current: 1pA (Typ)
Input Bias Current: 1pA (Typ)
Packages W(Typ) x D(Typ) x H(Max)
HVSOF5 1.60mm x 1.60mm x 0.60mm
Pin Configuration
BU7445HFV, BU7445SHFV: HVSOF5
Pin No. Pin Name
1 IN+
2 VSS
3 IN-
4 OUT
5 VDD
Ordering Information
B U 7 4 4 5 x x x x - x x
Part Number
BU7445HFV
BU7445SHFV
Package
HFV : HVSOF5 Packaging and forming specification
TR: Embossed tape and reel
Package
HVSOF5
BU7445HFV
BU7445SHFV
1
+
-
2
3 4
5
VSS
IN-
IN+ VDD
OUT
Product structureSilicon monolithic integrated circuitThis product has no designed protection against radioactive rays.
Datasheet
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© 2014 ROHM Co., Ltd. All rights reserved. 2/18 17.Jan.2014 Rev.001
TSZ2211115001
BU7445HFV BU7445SHFV
Line-up
Topr Package Orderable Part Number
-40°C to +85°C HVSOF5 Reel of 3000 BU7445HFV-TR
-40°C to +105°C HVSOF5 Reel of 3000 BU7445SHFV-TR
Absolute Maximum Ratings (TA=25°C)
Parameter Symbol Rating Unit
BU7445HFV BU7445SHFV
Supply Voltage VDD-VSS +7 V
Power Dissipation PD 0.53
(Note 1,2) W
Differential Input
Voltage(Note 3) VID VDD - VSS V
Input Common-mode
Voltage Range VICM (VSS - 0.3) to (VDD + 0.3) V
Input Current (Note 4) II ±10 mA
Operating Supply Voltage Vopr +1.7 to +5.5 V
Operating Temperature Topr -40 to +85 -40 to +105 °C
Storage Temperature Tstg -55 to +125 °C
Maximum
Junction Temperature TJmax +125 °C
(Note 1) To use at temperature above TA=25C reduce 5.3mW.
(Note 2) Mounted on a FR4 glass epoxy PCB 70mm×70mm×1.6mm (Copper foil area less than 3%)
(Note 3) The voltage difference between inverting input and non-inverting input is the differential input voltage.
Then input terminal voltage is set to more than VSS.
(Note 4) An excessive input current will flow when input voltages of more than VDD+0.6V or less than VSS-0.6V are applied.
The input current can be set to less than the rated current by adding a limiting resistor.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open
circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case
the IC is operated over the absolute maximum ratings.
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TSZ2211115001
BU7445HFV BU7445SHFV
Electrical Characteristics
BU7445HFV, BU7445SHFVUnless otherwise specified VDD=+3V, VSS=0V, TA=25°C
Parameter Symbol
Temperature
Range
Limit Unit Conditions
Min Typ Max
Input Offset Voltage (Note 5) V
IO 25°C - 1 6 mV -
Input Offset Current (Note 5) I
IO 25°C - 1 - pA -
Input Bias Current (Note 5) I
B 25°C - 1 - pA -
Supply Current (Note 6) I
DD 25°C - 40 90
μA RL=, AV=0dB
IN+=0.9V
Full range - - 120
Maximum Output Voltage(High) VOH 25°C VDD-0.1 - - V RL=10k
Maximum Output Voltage(Low) VOL 25°C - - VSS+0.1 V RL=10k
Large Signal Voltage Gain AV 25°C 60 100 - dB RL=10k
Input Common-mode
Voltage Range VICM 25°C 0 - 1.8 V VSS to VDD-1.2V
Common-mode Rejection Ratio CMRR 25°C 45 60 - dB -
Power Supply Rejection Ratio PSRR 25°C 60 80 - dB -
Output Source Current (Note 7) I
SOURCE 25°C 4 8 - mA OUT=VDD-0.4V
Output Sink Current (Note 7) I
SINK 25°C 9 18 - mA OUT=VSS+0.4V
Slew Rate SR 25°C - 0.25 - V/µs CL=25pF
Unity Gain Frequency fT 25°C - 0.4 - MHz CL=25pF, AV=40dB
Phase Margin θ 25°C - 60 - deg CL=25pF, AV=40dB
Total Harmonic Distortion
+ Noise THD+N 25°C - 0.05 - % OUT=0.8VP-P
f=1kHz
(Note 5) Absolute value
(Note 6) Full range BU7445: TA=-40C to +85C BU7445S: TA=-40C to +105C
(Note 7) Under the high temperature environment, consider the power dissipation of IC when selecting the output current.
When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC.
Datasheet
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TSZ2211115001
BU7445HFV BU7445SHFV
Description of Electrical Characteristics
Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also
shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or
general document.
1. Absolute maximum ratings
Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute
maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.
(1) Supply Voltage (VDD/VSS)
Indicates the maximum voltage that can be applied between the VDD terminal and VSS terminal without
deterioration or destruction of characteristics of internal circuit.
(2) Differential Input Voltage (VID)
Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging
the IC.
(3) Input Common-mode Voltage Range (VICM)
Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration
or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure
normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.
(4) Power Dissipation (PD)
Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25°C
(normal temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in
the package (maximum junction temperature) and the thermal resistance of the package.
2. Electrical characteristics
(1) Input Offset Voltage (VIO)
Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the
input voltage difference required for setting the output voltage at 0 V.
(2) Input Offset Current (IIO)
Indicates the difference of input bias current between the non-inverting and inverting terminals.
(3) Input Bias Current (IB)
Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at
the non-inverting and inverting terminals.
(4) Supply Current (IDD)
Indicates the current that flows within the IC under specified no-load conditions.
(5) Maximum Output Voltage(High) / Maximum Output Voltage(Low) (VOH/VOL)
Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output
voltage High and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output
voltage low indicates the lower limit.
(6) Large Signal Voltage Gain (AV)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal
and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.
Av = (Output voltage) / (Differential Input voltage)
(7) Input Common-mode Voltage Range (VICM)
Indicates the input voltage range where IC normally operates.
(8) Common-mode Rejection Ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is
normally the fluctuation of DC.
CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation)
(9) Power Supply Rejection Ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed.
It is normally the fluctuation of DC.
PSRR= (Change of power supply voltage)/(Input offset fluctuation)
(10) Output Source Current/ Output Sink Current (ISOURCE / ISINK)
The maximum current that can be output from the IC under specific output conditions. The output source current
indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC.
(11) Slew Rate (SR)
Indicates the ratio of the change in output voltage with time when a step input signal is applied.
(12) Unity Gain Frequency (fT)
Indicates a frequency where the voltage gain of operational amplifier is 1.
(13) Phase Margin (θ)
Indicates the margin of phase from 180 degree phase lag at unity gain frequency.
(14) Total Harmonic Distortion + Noise (THD+N)
Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage
of driven channel.
W M
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TSZ2211115001
BU7445HFV BU7445SHFV
Typical Performance Curves
BU7445HFV, BU7445SHFV
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
BU7445HFV: -40C to +85C BU7445SHFV: -40C to +105C
0
25
50
75
100
-50 -25 0 25 50 75 100 125
Ambient Temperature [°C]
Supply Current [μA]
0
25
50
75
100
123456
Supply Voltage [V]
Supply Current [μA]
0
0.2
0.4
0.6
0.8
0 25 50 75 100 125
Ambient Temperature [°C]
Power Dissipation [W]
Figure 1.
Power Dissipation vs Ambient Temperature
(Derating Curve)
Figure 2.
Power Dissipation vs Ambient Temperature
(Derating Curve)
Figure 3.
Supply Current vs Supply Voltage
Figure 4.
Supply Current vs Ambient Temperature
0
0.2
0.4
0.6
0.8
0255075100125
Ambient Temperature [°C]
Power Dissipation [W]
BU7445HFV BU7445SHFV
85 105
-40°C
25°C
85°C 105°C
1.7V
5.5V
3.0V
AH \\\ f n \
Datasheet
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TSZ2211115001
BU7445HFV BU7445SHFV
Typical Performance Curves - continued
BU7445HFV, BU7445SHFV
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
BU7445HFV: -40C to +85C BU7445SHFV: -40C to +105C
0
1
2
3
4
5
6
123456
Supply Voltage [V]
Maximum Output Voltage (High) [V]
0
5
10
15
20
123456
Supply Voltage [V]
Maximum Output Voltage (Low) [mV]
0
1
2
3
4
5
6
-50 -25 0 25 50 75 100 125
Ambient Temperature [°C]
Maximum Output Voltage (High) [V]
0
5
10
15
20
-50-250 255075100125
Ambient Temperature [°C]
Maximum Output Voltage (Low) [mV]
Figure 7.
Maximum Output Voltage (Low) vs Supply Voltage
(RL=10k)
Figure 5.
Maximum Output Voltage (High) vs Supply Voltage
(RL=10k)
Figure 6.
Maximum Output Voltage (High) vs Ambient Temperature
(RL=10k)
Figure 8.
Maximum Output Voltage (Low) vs Ambient Temperature
(RL=10k)
-40°C
25°C
85°C
105°C
1.7V
5.5V
3.0V
-40°C
25°C
85°C 105°C
1.7V
5.5V
3.0V
// / /
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TSZ2211115001
BU7445HFV BU7445SHFV
Figure 10.
Output Source Current vs Ambient Temperature
(OUT=VDD-0.4V)
Typical Performance Curves - continued
BU7445HFV, BU7445SHFV
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
BU7445HFV: -40C to +85C BU7445SHFV: -40C to +105C
0
10
20
30
40
50
-50 -25 0 25 50 75 100 125
Ambient Temperature [°C]
Output Source Current [mA]
0
10
20
30
40
50
0.0 0.5 1.0 1.5 2.0 2.5 3.0
Output Voltage [V]
Output Source Current [mA]
0
10
20
30
40
50
60
70
80
-50 -25 0 25 50 75 100 125
Ambient Temperature [°C]
Output Sink Current [mA]
0
10
20
30
40
50
60
70
80
0.0 0.5 1.0 1.5 2.0 2.5 3.0
Output Voltage [V]
Output Sink Current [mA]
Figure 12.
Output Sink Current vs Ambient Temperature
(OUT=VSS+0.4V)
Figure 11.
Output Sink Current vs Output Voltage
(VDD=3V)
Figure 9.
Output Source Current vs Output Voltage
(VDD=3 V)
-40°C
25°C
85°C
105°C
1.7V
5.5V
3.0V
-40°C
25°C
85°C
105°C
5.5V
1.7V
3.0V
‘7 K k \ \\ \\ ( 10m)
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TSZ2211115001
BU7445HFV BU7445SHFV
Typical Performance Curves - continued
BU7445HFV, BU7445SHFV
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
BU7445HFV: -40C to +85C BU7445SHFV: -40C to +105C
-10.0
-7.5
-5.0
-2.5
0.0
2.5
5.0
7.5
10.0
123456
Supply Voltage [V]
Input Offset Voltage [mV]
-10.0
-7.5
-5.0
-2.5
0.0
2.5
5.0
7.5
10.0
-50 -25 0 25 50 75 100 125
Ambient Temperature [°C]
Input Offset Voltage [mV]
-10.0
-7.5
-5.0
-2.5
0.0
2.5
5.0
7.5
10.0
-10123
Input Voltage [V]
Input Offset Voltage [mV]
60
80
100
120
140
160
123456
Supply Voltage [V]
Large Signal Voltage Gain [dB]
Figure 13.
Input Offset Voltage vs Supply Voltage
(VICM=VDD-1.2V, EK=-VDD/2)
Figure 14.
Input Offset Voltage vs Ambient Temperature
(VICM=VDD-1.2V, EK=-VDD/2)
Figure 15.
Input Offset Voltage vs Input Voltage
(VDD=3V)
Figure 16.
Large Signal Voltage Gain vs Supply Voltage
(
RL=10k
)
-40°C
25°C
85°C
105°C
5.5V
1.7V
3.0V
-40°C
25°C
85°C
105°C
-40°C
25°C
85°C
105°C
\H %\\
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TSZ2211115001
BU7445HFV BU7445SHFV
Typical Performance Curves - continued
BU7445HFV, BU7445SHFV
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
BU7445HFV: -40C to +85C BU7445SHFV: -40C to +105C
0
20
40
60
80
100
120
123456
Supply Voltage [V]
Common Mode Rejection Ratio [dB]
60
80
100
120
140
160
-50 -25 0 25 50 75 100 125
Ambient Temperature [°C]
Large Signal Voltage Gain [dB]
0
20
40
60
80
100
120
-50 -25 0 25 50 75 100 125
Ambient Temperature [°C]
Common Mode Rejection Ratio [dB]
0
20
40
60
80
100
120
140
-50 -25 0 25 50 75 100 125
Ambient Temperature [°C]
Power Supply Rejection Ratio [dB]
Figure 17.
Large Signal Voltage Gain vs Ambient Temperature
(RL=10k)
Figure 18.
Common Mode Rejection Ratio vs Supply Voltage
Figure 19.
Common Mode Rejection Ratio vs Ambient Temperature
Figure 20.
Power Supply Rejection Ratio vs Ambient Temperature
5.5V
1.7V
3.0V
-40°C 25°C
85°C
105°C
5.5V
1.7V
3.0V
\\ \\
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TSZ2211115001
BU7445HFV BU7445SHFV
Typical Performance Curves - continued
BU7445HFV, BU7445SHFV
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
BU7445HFV: -40C to +85C BU7445SHFV: -40C to +105C
0
20
40
60
80
100 1000 10000 100000 1000000 10000000
Frequency [Hz]
Voltage Gain [dB]
0
50
100
150
200
Phase [deg]
0.0
0.2
0.4
0.6
0.8
-50 -25 0 25 50 75 100 125
Ambient Temperature [°C]
Slew Rate L-H [V/µs]
0.0
0.2
0.4
0.6
0.8
-50 -25 0 25 50 75 100 125
Ambient Temperature [°C]
Slew Rate H-L [V/µs]
Figure 21.
Slew Rate L-H vs Ambient Temperature Figure 22.
Slew Rate H-L vs Ambient Temperature
Figure 23.
Voltage GainPhase vs Frequency
5.5V
1.7V
3.0V
5.5V
1.7V
3.0V
Phase
Gain
102 10
3 10
4 10
5 10
6 107
EEEEEE WPM LJ
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BU7445HFV BU7445SHFV
Application Information
NULL method condition for Test circuit1
VDD, VSS, EK, VICM Unit:V
Parameter V
F SW1 SW2 SW3 VDD VSS EK V
ICM Calculation
Input Offset Voltage VF1 ON ON OFF 3 0 -1.5 1.8 1
Large Signal Voltage Gain VF2 ON ON ON 3 0
-0.5 0.9 2
VF3 -2.5
Common-mode Rejection Ratio
(Input Common-mode Voltage Range)
VF4 ON ON OFF 3 0 -1.5
0 3
VF5 1.8
Power Supply Rejection Ratio VF6 ON ON OFF 1.7 0 -0.9 0 4
VF7 5.5
- Calculation -
1. Input Offset Voltage (VIO)
2. Large Signal Voltage Gain (AV)
3. Common-Mode Rejection Ratio (CMRR)
4. Power Supply Rejection Ratio (PSRR)
Figure 24. Test Circuit 1
VICM
RS=50
RS=50
RF=50k
RI=1M
RI=1M
0.015μF0.015μF
SW1
SW2 50k
SW3
RL
VRL
0.1μF
EK
500k
500k
1000pF
VF
0.01μF
15V
-15V
VDD
VSS
Vo
V
NULL
DUT
|VF5 - VF4|
CMRR = 20Log VICM × (1+RF/RS)[dB]
A
v = 20Log |VF3 - VF2|
EK × (1+RF/RS)[dB]
PSRR = 20Log |VF7 - VF6|
VDD × (1+ RF/RS)[dB]
VIO = 1 + RF/RS[V]
|VF1|
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BU7445HFV BU7445SHFV
Application Information - continued
Switch Condition for Test circuit2
SW No. SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10SW11SW12
Supply Current OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF
Maximum Output Voltage RL=10k OFF ON OFF OFF ON OFF OFF ON OFF OFF ON OFF
Output Current OFF ON OFF OFF ON OFF OFF OFF OFF ON OFF OFF
Slew Rate OFF OFF ON OFF OFF OFF ON OFF ON OFF OFF ON
Unity Gain Frequency ON OFF OFF ON ON OFF OFF OFF ON OFF OFF ON
Figure 25. Test Circuit 2
Figure 26. Slew Rate Input and Output Wave
t
1.8V P-P
1.8 V
0
V
SR =
Δ
V
Δ
t
Δ
tt
1.8 V
0 V
Δ
V
Input Voltage Output Voltage
Input Wave Output Wave
SW3
SW1 SW2
SW9 SW10 SW11SW8
SW5 SW6 SW7
CL
SW12
SW4
R1
1k
R2 100k
RL
VSS
VDD=3V
Vo
IN- IN+
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BU7445HFV BU7445SHFV
Examples of Circuit
Voltage Follower
Inverting Amplifier
Non-inverting Amplifier
Figure 28. Inverting Amplifier Circuit
Figure 29. Non-inverting Amplifier Circuit
Figure 27. Voltage Follower Circuit
Voltage gain is 0dB.
Using this circuit, the output voltage (OUT) is configured
to be equal to the input voltage (IN). This circuit also
stabilizes the output voltage (OUT) due to high input
impedance and low output impedance. Computation for
output voltage (OUT) is shown below.
OUT=IN
For inverting amplifier, input voltage (IN) is amplified by
a voltage gain and depends on the ratio of R1 and R2.
The out-of-phase output voltage is shown in the next
expression
OUT=-(R2/R1)IN
This circuit has input impedance equal to R1.
For non-inverting amplifier, input voltage (IN) is amplified
by a voltage gain, which depends on the ratio of R1 and
R2. The output voltage (OUT) is in-phase with the input
voltage (IN) and is shown in the next expression.
OUT=(1 + R2/R1)IN
Effectively, this circuit has high input impedance since its
input side is the same as that of the operational
amplifier.
R 2
R 1
VSS
IN
OUT
VDD
VSS
R2
VDD
IN
OUT
R1
VSS
OUT
IN
VDD
08 06 04 Power Dissipa‘ion [W] 02 25 50 Ambienl When usmg when FFM g www.mhm,cam ©2014 ROHM 00., Ltd AH fights re TSZzzm-IS-om
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BU7445HFV BU7445SHFV
Power Dissipation
Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC
consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable
temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and
consumable power.
Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the
thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the
maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold
resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation
capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.
Figure 30 (a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the
Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (TJmax), and power dissipation
(PD).
θJA = (TJmaxTA) / PD °C/W
The Derating curve in Figure 30 (b) indicates the power that the IC can consume with reference to ambient temperature.
Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal
resistance (θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition,
wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a
reference value measured at a specified condition. Figure 30(c) to (d) shows an example of the derating curve for
BU7445HFV and BU7445SHFV.
When using the unit above TA=25°C, subtract the value above per Celsius degree. Power dissipation is the value
when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area below 3%) is mounted
5.3 mW/°C
0
0.2
0.4
0.6
0.8
0 25 50 75 100 125
Ambient Temperature [°C]
Power Dissipation [W]
Figure 30. Thermal Resistance and Derating Curve
0
0.2
0.4
0.6
0.8
0 25 50 75 100 125
Ambient Temperature [°C]
Power Dissipation [W]
BU7445HFV BU7445SHFV
(c) BU7445HFV (d) BU7445SHFV
85 105
0
A
mbient temperature TA[C]
P2
P1
25 125
75 100 50
Power dissipation of LSI [W]
PDma
x
TJma
x
θJA2
θJA1
θJA2 < θJA1
(b) Derating Curve
Power dissipation of IC
θJA=(TJma
x
-TA)/ PD °C/W
A
mbient temperature TA [ °C ]
Chip surface temperature TJ [ °C ]
(a) Thermal Resistance
Datasheet
www.rohm.com TSZ02201-0RAR0G200180-1-2
© 2014 ROHM Co., Ltd. All rights reserved. 15/18 17.Jan.2014 Rev.001
TSZ2211115001
BU7445HFV BU7445SHFV
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the PD stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the PD rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The
operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical
damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an
input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when
no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins
have voltages within the values specified in the electrical characteristics of this IC.
Datasheet
www.rohm.com TSZ02201-0RAR0G200180-1-2
© 2014 ROHM Co., Ltd. All rights reserved. 16/18 17.Jan.2014 Rev.001
TSZ2211115001
BU7445HFV BU7445SHFV
Operational Notes – continued
12. Input Voltage
Applying (VSS-0.3) to (VDD+0.3) to the input terminal is possible without causing deterioration of the electrical
characteristics or destruction, regardless of the supply voltage. However, this does not ensure normal circuit operation.
Please note that the circuit operates normally only when the input voltage is within the common mode input voltage
range of the electric characteristics.
13. Power Supply(single/dual)
The op-amp operates when the voltage supplied is between VDD and VSS. Therefore, the single supply op-amp can
be used as dual supply op-amp as well.
14. Output Capacitor
If a large capacitor is connected between the output pin and VSS pin, current from the charged capacitor will flow into
the output pin and may destroy the IC when the VDD pin is shorted to ground or pulled down to 0V. Use a capacitor
smaller than 0.1uF between output pin and VSS pin.
15. Oscillation caused by Output Capacitor
Please pay attention to the oscillation caused by output capacitor when designing an application of negative feedback
loop circuit with these ICs.
16. Latch up
Be careful of input voltage that exceed the VDD and VSS. When CMOS device have sometimes occur latch up and
protect the IC from abnormaly noise.
0. 05 6: 1. fi (m 05) 5 2:. 1V 0 0 X\ 231m: ude BURkl) (n, a) Am 31) (0. 41) E A E?- (Uh I 'l' ,mm) : > PKfizHVSOI‘S 0 a Dr nwi n g NW. D \% w W O 0 O O O O O O O O E253 [:23 E282? J n zMAx 0. EXIOE 13+0 05 5002
Datasheet
www.rohm.com TSZ02201-0RAR0G200180-1-2
© 2014 ROHM Co., Ltd. All rights reserved. 17/18 17.Jan.2014 Rev.001
TSZ2211115001
BU7445HFV BU7445SHFV
Physical Dimension, Tape and Reel Information
Package Name HVSOF5
Direction of feed
Reel
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
3000pcs
TR
()
1pin
BU7445H Marking D HVSO Part Number Marking l—i L V\ LOT Number Product Nam BU7445HF BU74458HF Land Pattern Data 0 2 mifi n 02 ”FF 0 i3 012 053i 0 . _ I ‘25 ab 5 g I] 7D o Cii ‘u i .a i 02‘ c 7 05 05‘ Revision Hisiory Date 17 Jan 2014 www.rohm,ccm © 2014 ROHM 00., Lid TSZzzm-IS-nm
Datasheet
www.rohm.com TSZ02201-0RAR0G200180-1-2
© 2014 ROHM Co., Ltd. All rights reserved. 18/18 17.Jan.2014 Rev.001
TSZ2211115001
BU7445HFV BU7445SHFV
Marking Diagram
Product Name Package Type Marking
BU7445HFV HVSOF5 AL
BU7445SHFV FX
Land Pattern Data
Revision History
Date Revision Changes
17.Jan.2014 001 New Release
HVSOF5(TOP VIEW)
Part Number Marking
LOT Number
HVSOF5
Datasheet
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASS CLASS CLASSb CLASS
CLASS CLASS
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
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responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
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extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
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Datasheet
Notice - GE Rev.002
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Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred by you or third parties resulting from inaccur acy or errors of or
concerning such information.

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