GRT31CR61H155ME01x Ref Sheet Datasheet by Murata Electronics

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ur Cap Change (RelTemp) (25 ”C) 5.Package EMBOSSED W8P4 EMBOSSED W8P4
GRT31CR61H155ME01_ (1206, X5R, 1.5uF, DC50V)
_: packaging code Reference Sheet
1.Scope
  
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
4.Rated value
5.Package
Product specifications in this catalog are as of Apr.17,2015,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
1.5 min.
(1)-1 L
3.2±0.2
(1)-2 W
1.6±0.2
e
Chip Monolithic Ceramic Capacitor meet AEC-Q200 for Infotainment
mark
(4)
Rated
Voltage
DC 50 V
Temp. coeff
or Cap. Change
This product specification is applied to Chip Monolithic Ceramic Capacitor used for Car Multimedia, Car Interior, Car Comfort application and General Electronic
equipment.
Please contact us when using this product for any other applications than described in the above.
Do not use these products in applications critical to passenger safety and car driving function (e.g. ABS, AIRBAG, etc.).
(2) T
1.6±0.2
-15 to 15 %
(6)
Capacitance
Tolerance
1.5 uF
±20 %
(3) Temperature Characteristics
(Public STD Code):X5R(EIA)
g
0.3 to 0.8
(5) Nominal
Capacitance
L
K
(1)L/W
Dimensions
(2)T
Dimensions
(3)Temperature
Characteristics
(4)Rated
Voltage
(5)Nominal
Capacitance
(6)Capacitance
Tolerance
(8)Packaging
Code
(7)Murata’s
Control Code
GRT 31 CR6 1H 155 M E01 L
GRT31CR61H155ME01-01 1
Pre-and Post-Stress 
Electrical Test
2 High Temperature The measured and observed characteristics should satisfy the Set the capacitor for 1000±12 hours at maximum operating
Exposure (Storage) specifications in the following table.
temperature ±3.
Appearance No marking defects Set for 24±2 hours at room temperature, then measure.
Capacitance R6, C8: Within ±12.5%
Change
Dissipation R6, C8: 0.2 max.
Factor
Insulation
25ΩF min.
Resistance
3 Temperature Cycling The measured and observed characteristics should satisfy the Fix the capacitor to the supporting jig in the same manner and under
specifications in the following table. the same conditions as (18). Perform the 1000 cycles test according
Appearance No marking defects to the four heat treatments in the following table.
Capacitance R6, C8: Within ±7.5% Set for 24±2 hours at room temperature, then measure.
Change
Dissipation R6, C8: 0.2 max.
Factor
Insulation
50ΩF min.
Resistance
Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10 for one hour and then set
for 24±2 hours at room temperature.
Perform the initial measurement.
4 Destructive No defects or abnormalities Per EIA-469
Physical Analysis
5 Biased Humidity The measured and observed characteristics should satisfy the
Apply the rated voltage and 1.3+0.2/-0vdc (add 6.8kΩ resister)
specifications in the following table.
at 85±3 and 80 to 85% humidity for 1000±12 hours.
Appearance No marking defects
Remove and set for 24±2 hours at room temperature, then measure.
Capacitance R6,C8: Within ±12.5%
The charge/discharge current is less than 50mA.
Change
Dissipation R6,C8: 0.2 max
Measurement after test for high dielectric constant type
Factor
Perform a heat treatment at 150+0/–10°C for one hour and then let
sit for 24±2 hours at room temperature, then measure.
Insulation
5ΩF min.
Resistance
-
1
AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
AEC-Q200 Test Method
Specifications.
Step
1
2
3
4
Temp.
(C)
-55+0/-3
Room
Temp.
85 +3/-0 (For R6)
105+3/-0 (For C8)
Room
Temp.
Time
(min.)
153
1
153
1
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6 Operational Life The measured and observed characteristics should satisfy the Apply 100% of the rated voltage for 1000±12 hours at maximum operating
specifications in the following table.
temperature ±3. Set for 24±2 hours at room temperature, then measure.
Appearance No marking defects The charge/discharge current is less than 50mA.
Capacitance R6,C8: Within ±12.5%
Change
Initial measurement for high dielectric constant type
Dissipation R6,C8: 0.2max
Perform a heat treatment at 150+0/-10 for one hour and then set
Factor for 24±2 hours at room temperature.
Perform the initial measurement.
Measurement after test for high dielectric constant type
Insulation
5ΩF min. Perform a heat treatment at 150+0/–10°C for one hour and then let
Resistance
sit for 24±2 hours at room temperature, then measure.
7 External Visual No defects or abnormalities Visual inspection
8 Physical Dimension Within the specified dimensions Using calipers
9 Resistance to Appearance No marking defects
Per MIL-STD-202 Method 215
Solvents Capacitance Within the specified tolerance Solvent 1 : 1 part (by volume) of isopropyl alcohol
Change
3 parts (by volume) of mineral spirits
Dissipation R6,C8: 0.125max Solvent 2 : Terpene defluxer
Factor
Solvent 3 : 42 parts (by volume) of water
      1 part (by volume) of propylene glycol monomethyl ether
      1 part (by volume) of monoethanolamine
Insulation
50Ω F min.
Resistance
10 Mechanical Appearance No marking defects
Three shocks in each direction should be applied along 3 mutually
Shock Capacitance Within the specified tolerance
perpendicular axes of the test specimen (18 shocks).
Change
The specified test pulse should be Half-sine and should have a
Dissipation R6,C8: 0.125max
duration :0.5ms, peak value:1500g and velocity change: 4.7m/s.
Factor
Insulation
50ΩF min.
Resistance
11 Vibration Appearance No defects or abnormalities
Solder the capacitor to the test jig (glass epoxy board) in the same
Capacitance Within the specified tolerance
manner and under the same conditions as (18). The capacitor
Change
should be subjected to a simple harmonic motion having a total
Dissipation R6,C8: 0.125max
amplitude of 1.5mm, the frequency being varied uniformly between
Factor the approximate limits of 10 and 2000Hz. The frequency range, from
10 to 2000Hz and return to 10Hz, should be traversed in
approximately 20 minutes. This motion should be applied for 12
Insulation
50ΩF min. items in each 3 mutually perpendicular directions (total of 36 times).
Resistance
12 Resistance to The measured and observed characteristics should satisfy the
Immerse the capacitor in a eutectic solder solution at 260±5 for
Soldering Heat specifications in the following table.
10±1 seconds. Set at room temperature for 24±2 hours, then
Appearance No marking defects
measure.
Capacitance Within the specified tolerance
Change
Initial measurement for high dielectric constant type
Dissipation R6,C8: 0.125max
Perform a heat treatment at 150+0/-10 for one hour and then set
Factor
for 24±2 hours at room temperature.
Perform the initial measurement.
Insulation 50ΩF min.
Resistance
AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
AEC-Q200 Test Method
Specifications.
JEMCGS-01744J 3
Cray Hem
13 Thermal Shock The measured and observed characteristics shall satisfy the
Fix the capacitor to the supporting jig in the same manner and under
specifications in the following table.
the same conditions as (18). Perform the 300 cycles according to
Appearance No marking defects
the two heat treatments listed in the following table (Maximum
Capacitance R6,C8: Within ±10.0%
transfer time is 20 seconds).
Change
Set for 24±2 hours at room temperature, then measure.
Dissipation R6,C8: 0.125max
Factor
Insulation
50ΩF min.
Resistance
Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10 for one hour and then set
for 24±2 hours at room temperature.
Perform the initial measurement.
14 ESD Appearance No marking defects
Per AEC-Q200-002
Capacitance Within the specified tolerance
Voltage setting level : 2kV
Change
Dissipation R6,C8: 0.125max
Factor
Insulation
50ΩF min.
Resistance
15 Solderability
(a) Preheat at 155 for 4 hours. After preheating, immerse the
  capacitor in a solution of ethanol(JIS-K-8101) and rosin (JIS-K-
  5902) (25% rosin in weight proportion). Immerse in
 eutectic solder solution for 5+0/-0.5 seconds at 235±5.
(b) Should be placed into steam aging for 8 hours±15 minutes.
  After preheating, immerse the capacitor in a solution of
  ethanol(JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in weight
  proportion). Immerse in eutectic solder solution for 5+0/-0.5
  seconds at 235±5.
(c) Should be placed into steam aging for 8 hours±15 minutes.
  After preheating, immerse the capacitor in a solution of
  ethanol(JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in weight
  proportion). Immerse in eutectic solder solution for 120±5 seconds
at 260±5.
16 Electrical Appearance No defects or abnormalities Visual inspection.
Chatacteri- Capacitance Within the specified tolerance
The capacitance/Q/D.F. should be measured at 25 at the
zation Change
frequency and voltage shown in the table.
Dissipation R6.C8 :0.125max
Factor
Insulation
50ΩF min. The insulation resistance should be measured with a DC voltage not
Resistance
exceeding the rated voltage at 25 and maximum operating temperature
25within 1 minute of charging.
Insulation
5ΩF min.
Resistance
85+3/-0(For R6), 105+3/-0(For C8)
85(For R6)
105(For C8)
Dielectric No failure No failure should be observed when 250% of the rated voltage is
Strength applied between the terminations for 1 to 5 seconds, provided the
charge/ discharge current is less than 50mA.
95% of the terminations is to be soldered evenly and continuously.
AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
AEC-Q200 Test Method
Specifications.
Step
1
2
Temp.
()
-55+0/-3
105+3/-0 (For C8)
85+3/-0 (For R6)
Time
(min.)
15±3
15±3
Char.
Item
R6,C8
6.3V max.
(C10F)
R6,C8
10V min.
(C10F)
R6,C8
(10F< C)
Frequency
10.1kHz
10.1kHz
12024Hz
Voltage
0.50.1Vrms
10.2Vrms
0.50.1Vrms
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17 Board Flex Appearance No marking defects
Solder the capacitor on the test jig (glass epoxy board) shown in
Fig1 using a eutectic solder. Then apply a force in the direction
shown in Fig 2 for 5±1sec. The soldering should be done by the
reflow method and should be conducted with care so that the
Capacitance Within specified tolerance
soldering is uniform and free of defects such as heat shock.
Change
Dissipation R6,C8: 0.125max
Factor
Insulation
50Ω・F min.
Resistance
(in mm)
18 Terminal Appearance No marking defects Solder the capacitor to the test jig (glass epoxy board) shown in
Strength Fig.3 using a eutectic solder. Then apply *18N force in parallel with
Capacitance Within specified tolerance the test jig for 60sec.
Change The soldering should be done either with an iron or using the reflow
Dissipation R6,C8: 0.125max method and should be conducted with care so that the soldering is
Factor uniform and free of defects such as heat shock
Insulation
50ΩF min.
Resistance
in mm
19 Beam Load Test Destruction value should be exceed following one. Place the capacitor in the beam load fixture as Fig 4.
< Chip L dimension : 2.5mm max. > Apply a force.
< Chip Length : 2.5mm max. >
< Chip L dimension : 3.2mm min. >
< Chip Length : 3.2mm min. >
Speed supplied the Stress Load : *0.5mm / sec.
*GRT03: 0.1mm/sec.
Chip thickness < 1.25mm rank : 15N
  Chip thickness 1.25mm rank : 54.5N
Chip thickness > 0.5mm rank : 20N
Chip thickness 0.5mm rank : 8N
AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
AEC-Q200 Test Method
Specifications.
t : 1.6mm
(GRT03,15:0.8mm)
Fig.3
Fig.4
*2N(GRT03,15)
t : 1.6mm
(GRT03,15:0.8mm)
2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
1
φ1.5
+0.1
-0
t
*1,22.0±0.05
1.75±0.1
100
40
a
c
b
C
Fig.1
2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
1
φ1.5
+0.1
-0
t
*1,22.0±0.05
1.75±0.1
a
a
c
b
ランド
f4.5
c
Solder resist
Baked electrode
or copper foil
b
Iron Board
45
45
Flexure:≦2
(Chip thickness0.85mm rank
High Dielectric Type)
Flexure:≦1
(Chip thickness0.85mm rank
High Dielectric Type))
Capacitance meter
支持台
45
45
Fig.2
R4
Pressurizing
speed:1.0mm/sec
Pressurize
20
114
L
0.6L
Type
a
b
c
GRT03
0.3
0.9
0.3
GRT15
0.5
1.5
0.6
GRT18
0.6
2.2
0.9
GRT21
0.8
3.0
1.3
GRT31
2.0
4.4
1.7
Type
a
b
c
GRT03
0.3
0.9
0.3
GRT15
0.4
1.5
0.5
GRT18
1.0
3.0
1.2
GRT21
1.2
4.0
1.65
GRT31
2.2
5.0
2.0
JEMCGS-01744J 5
20 Capacitance Capacitance R6 : Within ±15% The capacitance change should be measured after 5 min. at
Temperature Change    (-55 to +85) each specified temperature stage.
Characteristics The ranges of capacitance change compared with the above 25
C8 : Within ±22% value over the temperature ranges shown in the table should be
   (-55 to +105)within the specified ranges.
Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10 for one hour
and then set for 24±2 hours at room temperature.
Perform the initial measurement.
AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
AEC-Q200 Test Method
Specifications.
Step
Temperature.(C)
1
25±2
2
-55±3
3
25±2
4
85±3for R6, 105±3for C8
5
25±2
JEMCGS-01744J 6
giaifflg fl *7
1.Tape Carrier Packaging(Packaging Code:D/E/F/L/J/K)
1.1 Minimum Quantity(pcs./reel)
φ180mm reel φ330mm reel
Paper Tape Plastic Tape Paper Tape Plastic Tape
Code:D/E Code:L Code:J/ F Code:K
GRT03 15000 50000
5(Dimensions Tolerance:±0.05) 10000 50000
5(Dimensions Tolerance:±0.1min.) 10000 40000
GRT18 4000 10000
64000 10000
94000 10000
B3000 10000
64000 10000
94000 10000
M3000 10000
C2000 6000
N2000 8000
D/E 1000 4000
1.2 Dimensions of Tape
(1)GRT03/15(Paper Tape) (in mm)
*3 Nominal value
Type
GRT21
GRT31
GRT15
Package
GRT Type
GRT32
GRT15 GRT15 GRT15
(Dimensions Tolerance
±0.05)
(Dimensions Tolerance
±0.1)
(Dimensions Tolerance
±0.2)
A *3 0.37 0.39 0.65 0.70 0.75
B *3 0.67 0.69 1.15 1.20 1.35
0.5 max. 0.5 max. 0.8 max. 0.8 max. 0.8 max.
Code
GRT03
(Dimensions Tolerance
±0.03)
GRT03
(Dimensions Tolerance
±0.05)
±0.03 0.37 0.67
±0.05 0.39 0.69
±0.05 0.65 1.15
±0.1 0.70 1.20
±0.2 0.75 1.35
GRT03
GRT15
0.5 max.
0.8 max.
A *3
B *3
Type
LW Dimensions
Tolerance(Chip)
*1,22.0±0.05
2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
1
φ1.5
+0.1
-0
t
*1,22.0±0.05
1.75±0.1
4.0±0.1
*1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
t
*2
0.05 max.
JEMCGP-01742F 7
 (2)GRT18/21/31/32(Paper Tape) (in mm)
 (3)GRT21/31/32(Plastic Tape)
Package
GRT Type
4.0±0.1
4.0±0.1
2.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
t
0.8±0.1
0.8±0.15
±0.2 0.0.2
1.10±0.10 2.00±0.10
0.6±0.1
0.6+0/-0.15
0.85±0.1
0.85+0/-0.2
6 ±0.15 0.6±0.1
9 ±0.2 within 0.85±0.1
±0.15 within
±0.1
LW Dimensions
Tolerance(Chip)
GRT21
GRT31
T Dimensions
(Chip)
A
1.1 max.
1.55±0.15
2.30±0.15
2.00±0.20
B
t
1.05±0.10
1.85±0.10
±0.15 within
GRT18
Type
8
6
9
3.60±0.20
±0.1 1.25±0.1
1.45±0.20 2.25±0.20 1.7 max.
B ±0.15
1.25±0.15
±0.2
1.25±0.2
±0.15 1.15±0.1
±0.2 1.15±0.15
C ±0.2 1.0.2 2.5 max.
N 1.35±0.15 2.5 max.
D 2.0±0.2 3.0 max.
E 2.5±0.2 3.7 max.
B
LW Dimensions
Tolerance(Chip)
T Dimensions
(Chip)
1.7 max.
L:±0.3
W:±0.2
GRT32
2.80±0.20
3.50±0.20
t
A
GRT31
1.90±0.20
3.50±0.20
M
2.0 max.
Type
GRT21
1.50±0.20
2.30±0.20
φ1.5
+0.1
-0
4.0±0.1
8.0±0.1
φ1.5
+0.2
-0
12.0±0.3
5.5±0.1
1.75±0.1
*
*1
2.5 max.(T1.8mm)
*1
*2.0±0.1
0.3±0.1
8.0±0.3
4.0±0.1
3.5±0.05
1.75±0.1
t
2.0±0.1
φ1.5
+0.1
-0
4.0±0.1
0.25±0.1(T2.0mm)
0.3±0.1(T2.5mm)
JEMCGP-01742F 8
Package
GRT Type
1
ップ詰め状態
(
単位:
mm)
φ21±0.8
1
W
Top Tape : Thickness 0.06
Feeding Hole :As specified in 2.2.
Hole for Chip : As specified in 2.2.
Base Tape : As specified in 2.2.
Bottom Tape :Thickness 0.05
(Only a bottom tape existence )
W
w1
GRT32 max.
16.5 max.
10±1.5
φ180+0/-3.0
φ330±2.0
φ50 min.
φ13±0.5
2.0±0.5
Chip
(in mm)
Fig.1 Package Chips
Fig.2 Dimensions of Reel
Fig.3 Taping Diagram
JEMCGP-01742F 9
5....0 >..<>,....<><*% e="" ,="" :/\="" \,:;§="" break="" down="" force="" of="" boitom="" tape="" :="" 5n="" min.="" 10n‘ya="" batmm="" iape="" exislence)="" number="" and="" quantiiy,="" wih="" be="" put="" in="" outside="" of="" reel.="">
1.3 Tapes for capacitors are wound clockwise shown in Fig.3.
(The sprocket holes are to the right as the tape is pulled toward the user.)
1.4 Part of the leader and part of the vacant section are attached as follows. (in mm)
1.5 Accumulate pitch : 10 of sprocket holes pitch = 40±0.3mm
1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.
1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
1.8 There are no jointing for top tape and bottom tape.
1.9 There are no fuzz in the cavity.
1.10 Break down force of top tape : 5N min.
Break down force of bottom tape : 5N min. (Only a bottom tape existence )
1.11 Reel is made by resin and appeaser and dimension is shown in Fig 1. There are possibly
to change the material and dimension due to some impairment.
1.12 Peeling off force : 0.1N to 0.6N* in the direction as shown below.
* GRT03:0.05N to 0.5N
1.13 Label that show the customer parts number, our parts number, our company name, inspection
number and quantity, will be put in outside of reel.
Package
GRT Type
1
ップ詰め状態
(
単位:
mm)
Tail vacant Section
Chip-mounting Unit
Leader vacant Section
Leader Unit
(Top Tape only)
Direction
of Feed
160 min.
190 min.
210 min.
1
ップ詰め状態
(
単位:
mm)
165 to 180°
Top tape
JEMCGP-01742F 10
nmRata Please contact us pelore using our products for the applications listed below which require especially high reliability lor the prevention of delects which might directly cause damage to the third party's lile, body or property. Aircralt equipment Aerospace equipment Undersea equipment Power plant control equipment Medical equipment Transportation equipment(vehicles.trains,ships,etct) Trailic signal equipment Disaster prevention / crime prevention equipment Data-processing equipment Application of similar complexity and/or reliability requirements to the applications listed in the above. Storage and Operation condition 1»1. Store the capacitors in the following conditions: Room Temperature ol +5 to +40 and a Relative Humidity Rating 1.1emgerature Dependent Characteristics
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
  for the prevention of defects which might directly cause damage to the third party's life, body or property.
   ①Aircraft equipment Aerospace equipment Undersea equipment Power plant control equipment
   ⑤Medical equipment Transportation equipment(vehicles,trains,ships,etc.) Traffic signal equipment
   ⑧Disaster prevention / crime prevention equipment Data-processing equipment
   ⑩Application of similar complexity and/or reliability requirements to the applications listed in the above.
  This series is designed for use in Car Multimedia, Car Interior, Car Comfort application and General
  Electronic equipment. It shall not be used in applications critical to passenger safety and car driving
  function(e.g. ABS,AIRBAG, etc.).
Storage and Operation condition
1. The performance of chip monolithic ceramic capacitors may be affected by the storage conditions.
1-1. Store the capacitors in the following conditions: Room Temperature of +5 to +40 and a Relative Humidity
of 20% to 70%.
(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere or high temperature and humidity
 
conditions during storage may affect solderability and packaging performance.
Therefore, please maintain the storage temperature and humidity. Use the product within six months,
as prolonged storage may cause oxidation of the electrodes.
(2) Please confirm solderability before using after six months.
Store the capacitors without opening the original bag.
Even if the storage period is short, do not exceed the specified atmospheric conditions.
1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result
in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,hydrogen
sulfide, sulfur dioxide, chlorine, ammonia gas etc.).
1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused
by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and
electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity
conditions
Rating
1.Temperature Dependent Characteristics
1. The electrical characteristics of the capacitor can change with temperature.
1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature
changes. The following actions are recommended in order to ensure suitable capacitance values.
(1) Select a suitable capacitance for the operating temperature range.
(2) The capacitance may change within the rated temperature.
When you use a high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance
tolerance (e.g., a time-constant circuit), please carefully consider the temperature characteristics, and
carefully confirm the various characteristics in actual use conditions and the actual system.
[Example of Temperature Characteristics R7] [Example of Temperature Characteristics R6]
Sample: 0.1μF, Rated Voltage 50VDC Sample: 22μF, Rated Voltage 4VDC
!
-20
-10
-15
-5
5
0
10
15
20
Temperature (°C)
-75 -50 -25 025 50 75 100 125 150
Capacitance Change (%)
-20
-10
-15
-5
5
0
10
15
20
Temperature (°C)
-75 -50 -25 025 50 75 100
Capacitance Change (%)
JEMCGC-01743C 11
2.Measurement of Capacitance 3‘2]! 11 Voltage Typlcal voltage applled lo the DC capacitor DC voltage DC voltage+AC AC voltage Pulse voltage T T WW l l (E Maximum possible applled voltage) 41192 at AEEIied Voltage and Self-heating Temgerature such that when measunng at atmosphenc temperature of 25 ‘C, the product's self-heating remalns below 20“C and the surface
2.Measurement of Capacitance
1. Measure capacitance with the voltage and frequency specified in the product specifications.
1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high.
Please confirm whether a prescribed measured voltage is impressed to the capacitor.
1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.
3.Applied Voltage
1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications.
1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.
(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.
When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the rated DC voltage.
(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated DC voltage.
Typical voltage applied to the DC capacitor
DC voltage DC voltage+AC AC voltage Pulse voltage
(EMaximum possible applied voltage.)
1-2. Influence of over voltage
Over voltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown
of the internal dielectric layers .
The time duration until breakdown depends on the applied voltage and the ambient temperature.
4.Type of Applied Voltage and Self-heating Temperature
1.Confirm the operating conditions to make sure that nolarge current is flowing into the capacitor due to the
continuous application of an AC voltage or pulse voltage.
When a DC rated voltage product is used in an AC voltage circuit or a pulse voltage circuit, the AC current
or pulse current will flow into the capacitor; therefore check the self-heating condition.
Please confirm the surface temperature of the capacitor so that the temperature remains within the upper limits
of the operating temperature, including the rise in temperature due to self-heating. When the capacitor is
used with a high-frequency voltage or pulse voltage, heat may be generated by dielectric loss.
<Applicable to Rated Voltage of less than 100VDC>
1-1. The load should be contained to the level
  such that when measuring at atmospheric
   temperature of 25°C, the product's self-heating
   remains below 20°C and the surface
temperature of the capacitor in the actual circuit
remains within the maximum operating
temperature.
Caution
!
1
10
100
0 1 2 3
Current (Ar.m.s.)
4 5 6
Temperature Rise (°C)
[Example of Temperature Rise (Heat Generation) in Chip
Monolithic Ceramic Capacitors in Contrast to Ripple
Current]
Sample: R1 characteristics 10μF, Rated voltage: DC10V
Ripple Current
100kHz
500kHz
1MHz
E
E
E
E
0
0
0
0
JEMCGC-01743C 12
5. DC Voltage and AC Voltage Charact capacitor changes depending on the DC voltage applied. type capacitor is used in a circuit that requires a an actual system. 6.0agac nceAg g 7.Vibration and Shock ol another printed circuit board should not be allowed to hit the capacitor in order to avoid 20 20 40 an an um Example of Change Over Time (Aging characteristics) ]
5. DC Voltage and AC Voltage Characteristic
1. The capacitance value of a high dielectric constant type
capacitor changes depending on the DC voltage applied.
Please consider the DC voltage characteristics when a
capacitor is selected for use in a DC circuit.
1-1. The capacitance of ceramic capacitors may change
sharply depending on the applied voltage. (See figure)
Please confirm the following in order to secure the
capacitance.
(1) Determine whether the capacitance change caused
by the applied voltage is within the allowed range .
(2) In the DC voltage characteristics, the rate of
capacitance change becomes larger as voltage
increases, even if the applied voltage is below
the rated voltage. When a high dielectric constant
type capacitor is used in a circuit that requires a
tight (narrow) capacitance tolerance (e.g., a time
constant circuit), please carefully consider the
voltage characteristics, and confirm the various
characteristics in actual operating conditions in
  an actual system.
2. The capacitance values of high dielectric
constant type capacitors changes depending
on the AC voltage applied.
Please consider the AC voltage characteristics
when selecting a capacitor to be used in a
AC circuit.
6. Capacitance Aging
[ Example of Change Over Time (Aging characteristics) ]
1. The high dielectric constant type capacitors
have the characteristic in which the capacitance
value decreases with the passage of time.
When you use a high dielectric constant type
capacitors in a circuit that needs a tight (narrow)
capacitance tolerance (e.g., a time-constant circuit),
please carefully consider the characteristics
of these capacitors, such as their aging, voltage,
and temperature characteristics. In addition,
check capacitors using your actual appliances
at the intended environment and operating conditions.
7.Vibration and Shock
1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.
Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.
2. Mechanical shock due to being dropped may cause damage or
a crack in the dielectric material of the capacitor.
Do not use a fallen capacitor because the quality and reliability
may be deteriorated.
3. When printed circuit boards are piled up or handled, the corner
 of another printed circuit board
should not be allowed to hit the capacitor in order to avoid
a crack or other damage to the capacitor.
Caution
-100
-80
-60
-40
-20
0
20
0 10 20 30
DC Voltage (V)
40 50
[Example of DC Voltage Characteristics]
Sample: R7 Characteristics 0.1μF, Rated Voltage 50VDC
Capacitance Change (%)
0 0.5 1
AC Voltage (Vr.m.s.)
1.5 2
[Example of AC Voltage Characteristics]
Sample: R7 Characteristics 10μF, Rated Voltage 6.3VDC
Capacitance Change (%)
30
20
10
0
-10
-20
-30
-40
-50
-60
Floor
Crack
Mounting printed circuit board
Crack
!
20
10
0
-10
-20
-30
-40
10
100
1000
10000
Time(h)
Capacitance Change(%)
5C
R7
R6
JEMCGC-01743C 13
Soldering and Mounting 1.Mounling Pas n 1-1.Choose a mounting posuien that minimizes the stress imposed on the chip during flexing or bending oi the board. [Component Direction] Locate chip horizontal lo the @Efl-tfl 2.lnlormalion before Mountin
Soldering and Mounting
1.Mounting Position
1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing
or bending the printed circuit board.
1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.
  [Component Direction]
Locate chip horizontal to the
direction in which stress acts.
[Chip Mounting Close to Board Separation Point]
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
A > D
(2) Add slits in the board separation part.
A > B
(3) Keep the mounting position of the component away from the board separation surface.
A > C
[Mounting Capacitors Near Screw Holes]
When a capacitor is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible.
 
2.Information before Mounting
1. Do not re-use capacitors that were removed from the equipment.
2. Confirm capacitance characteristics under actual applied voltage.
3. Confirm the mechanical stress under actual process and equipment use.
4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.
5. Prior to use, confirm the solderability for the capacitors that were in long-term storage.
6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.
7.The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.
Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.
Caution
Contents of Measures
Screw Hole Recommended
!
1C
1B
1A
Perforation
Slit
A
B
C
D
1A
JEMCGC-01743C 14
3.M nlenance of (he Mounlin ick and lace Machine [I ncorrecl] EFLZE?\ [Correcl] / E\ /'E
3.Maintenance of the Mounting (pick and place) Machine
1. Make sure that the following excessive forces are not applied to the capacitors.
1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept
to prevent them from any bending damage or cracking. Please take into account the following precautions
and recommendations for use in your process.
(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.
(2) Adjust the nozzle pressure within a static load of 1N to 3N during mounting.
  [Incorrect]
  [Correct]
2.Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent
the nozzle from moving smoothly. This imposes greater force upon the chip during mounting,
causing cracked chips. Also, the locating claw, when worn out, imposes uneven forces on the chip
when positioning, causing cracked chips. The suction nozzle and the locating claw must be maintained,
checked and replaced periodically.
Caution
!
Board Guide
Board
Suction Nozzle
Deflection
Backup Pin
JEMCGC-01743C 15
4- Rellow Solde ng Temperamrem (me) (we) usual (we) Table 1 Recommended Condihons Subeflng Temperamrc % ‘GRTOS: 1/3 of Chip Thickness min.
4-1.Reflow Soldering
1. When sudden heat is applied to the components, the [Standard Conditions for Reflow Soldering]
mechanical strength of the components will decrease
because a sudden temperature change causes Reflow
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
the components surface (ΔT) as small as possible.
2. Solderability of tin plating termination chips might be
deteriorated when a low temperature soldering profile where
the peak solder temperature is below the melting point of
tin is used. Please confirm the solderability of tin plated Temperature
termination chips before use. Incase of Lead Free Solder
( ): In case of Pb-Sn Solder
3. When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (ΔT)
between the component and the solvent within the range Vapor Reflow
shown in the table 1.
Table 1
GRT03/15/18/21/31
GRT32
Recommended Conditions [Allowable Reflow Soldering Temperature and Time]
Reflow Vapor Reflow
Peak
Temperature
Saturated vapor
of inactive solvent
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
4. Optimum Solder Amount for Reflow Soldering
4-1. Overly thick application of solder paste results in
a excessive solder fillet height.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause
the chips to crack.
4-2. Too little solder paste results in a lack of adhesive
*GRT03: 1/3 of Chip Thickness min.
strength on the outer electrode, which may result in in section
chips breaking loose from the PCB.
4-3. Make sure the solder has been applied smoothly
to the end surface to a height of 0.2mm* min.
Make sure not to impose any abnormal mechanical shocks to the PCB.
Temperature Differential
Atmosphere
Air
Air or N2
Inverting the PCB
230 to 250
230 to 240
240 to 260
Caution
ΔT190
ΔT130
Pb-Sn Solder
Lead Free Solder
Part Number
!
Soldering Temperature()
Soldering Time(s)
280
270
260
250
240
230
220
0
30
60
120
90
0.2mm min*
Temperature()
Peak Temperature
(170)
(150)
(130)
(200)
Soldering
Gradual
Cooling
Preheating
ΔT
60-120 seconds
30-60 seconds
Time
190
170
150
220
Temperature()
Peak Temperature
(170)
(150)
(130)
ΔT
Soldering
Gradual
Cooling
Preheating
Time
60-120 seconds
20 seconds max.
190
170
150
JEMCGC-01743C 16
4-2.Flow Soldering [Standard Condiliens for Flow Soldenng] Table 2 Prehealing condilxons are shown in table 2. ll is required to swarm mperamrefic Recommended Conditxons 5. Oplxmum Solder Amounl lor Flow Soldering
4-2.Flow Soldering
1. Do not apply flow soldering to chips not listed in Table 2.
     [Standard Conditions for Flow Soldering]
Table 2
2. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both of the components and the PCB.
Preheating conditions are shown in table 2. It is required to
[Allowable Flow Soldering Temperature and Time]
keep the temperature differential between the solder and
the components surface (ΔT) as low as possible.
3. Excessively long soldering time or high soldering
temperature can result in leaching of the outer electrodes,
causing poor adhesion or a reduction in capacitance value
due to loss of contact between the electrodes and end termination.
4. When components are immersed in solvent after mounting,
be sure to maintain the temperature differential (ΔT)
between the component and solvent within the range
shown in the table 2. In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Recommended Conditions
Pb-Sn Solder Lead Free Solder
90 to 110 100 to 120
240 to 250250 to 260
Air Air
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
5. Optimum Solder Amount for Flow Soldering
5-1. The top of the solder fillet should be lower than the
thickness of components. If the solder amount is
excessive, the risk of cracking is higher during
board bending or any other stressful condition.
Part Number
GRT18/21/31
Preheating Peak Temperature
Soldering Peak Temperature
Atmosphere
Caution
Temperature Differential
ΔT150
!
Soldering mperature()
Soldering Time(s)
280
270
260
250
240
230
220
0
10
20
40
30
Temperature()
Soldering
Peak
Temperature
Preheating
Peak
Temperature
30-90 seconds
Preheating
5 seconds max.
Time
Gradual
Cooling
Soldering
ΔT
Up to Chip Thickness
Adhesive
in section
JEMCGC-01743C 17
4-3.Correclion 0| Soldered Portion Table 3 Solderi ng Iron tip Temperature Differential(AT) ‘Applicaole for both Pb-Sn and Lead Free Soldr Lead Free Solder: Sn-3.0Ag-0.500 2-1. ll the distance lrom the hot air outlet ol the spot heater to the component is too close, cracks may occur due to Table 4 Distance 5mm or more Hot Air Application angle 45” "Figure 1 Hot Air Temperature Nozzle Outlet 400°C max. Less than 10 seconds Application Time (1206 (in inch) / (3216 (in mm) size or smaller) Less than 30 seconds (1210 (in inch) / 3225 (in mm) size or larger) Onenole Nozz Ln Angie or 0.5mm, whichever is smallert %
4-3.Correction of Soldered Portion
When sudden heat is applied to the capacitor, distortion caused by the large temperature difference occurs internally,
and can be the cause of cracks. Capacitors also tend to be affected by mechanical and thermal stress depending
on the board preheating temperature or the soldering fillet shape, and can be the cause of cracks.
Please refer to "1. PCB Design" or "3. Optimum solder amount" for the solder amount and the fillet shapes.
1. Correction with a Soldering Iron
1-1. In order to reduce damage to the capacitor, be sure to preheat the capacitor and the mounting board.
Preheat to the temperature range shown in Table 3. A hot plate, hot air type preheater, etc. can be used for preheating.
1-2. After soldering, do not allow the component/PCB to cool down rapidly.
1-3. Perform the corrections with a soldering iron as quickly as possible. If the soldering iron is applied too long,
there is a possibility of causing solder leaching on the terminal electrodes, which will cause deterioration of the
adhesive strength and other problems.
Table 3
*Applicable for both Pb-Sn and Lead Free Solder.
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
2. Correction with Spot Heater
Compared to local heating with a soldering iron, hot air heating by a spot heater heats the overall component
and board, therefore, it tends to lessen the thermal shock. In the case of a high density mounted board,
a spot heater can also prevent concerns of the soldering iron making direct contact with the component.
2-1. If the distance from the hot air outlet of the spot heater to the component is too close, cracks may occur due to
thermal shock. To prevent this problem, follow the conditions shown in Table 4.
2-2. In order to create an appropriate solder fillet shape, it is recommended that hot air be applied at the angle shown
in Figure 1.
Table 4
Distance 5mm or more
Hot Air Application angle 45° *Figure 1
Hot Air Temperature Nozzle Outlet 400°C max.
Less than 10 seconds
Application Time (1206 (in inch) / (3216 (in mm) size or smaller)
Less than 30 seconds
(1210 (in inch) / 3225 (in mm) size or larger)
3. Optimum solder amount when re-working with a soldering iron
3-1. In the case of 0603 (in inch) / 1608 (in mm) and smaller
sizes (GRT03/15/18), the top of the solder fillet should
be lower than 2/3 of the thickness of the component or
0.5mm, whichever is smaller.
In the case of 0805 (in inch) / 2012(in mm) and larger
sizes (GRT21/31/32), the top of the solder fillet in section
should be lower than 2/3 of the thickness of the component.
If the solder amount is excessive, the risk of cracking is higher
during board bending or under any other stressful condition.
3-2. A soldering iron with a tip of ø3mm or smaller should be used.
It is also necessary to keep the soldering iron from touching
the components during the re-work.
3-3. Solder wire with ø0.5mm or smaller is required for soldering.
Temperature
Differential(ΔT)
Atmosphere
Caution
Air
Air
ΔT190
ΔT130
150 min.
150 min.
GRT32
Part Number
GRT03/15/18/21/31
Temperature of
Soldering Iron tip
350 max.
280 max.
Preheating
Temperature
!
One-hole Nozzle
an Angle of 45°
[Figure 1]
Solder Amount
JEMCGC-01743C 18
5.Washing 6.Eleclrical Tes! on Primed Circ i: Board 7.Prinled Circuit Board Cro in 2. Check me cropping melhod forthe prmled cxrcuit board m advance
5.Washing
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips
or broken solder joints. Take note not to vibrate PCBs.
6.Electrical Test on Printed Circuit Board
1. Confirm position of the backup pin or specific jig, when inspecting the electrical performance of a
capacitor after mounting on the printed circuit board.
1-1. Avoid bending the printed circuit board by the pressure of a test-probe, etc.
The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder
joints. Provide backup pins on the back side of the PCB to prevent warping or flexing.
Install backup pins as close to the test-probe as possible.
1-2. Avoid vibration of the board by shock when a test -probe contacts a printed circuit board.
[Not Recommended] [Recommended]
7.Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that
caused bending or twisting the board.
1-1. In cropping the board, the stress as shown at right may cause the capacitor to crack.
Cracked capacitors may cause deterioration of the insulation resistance, and result in a short.
Avoid this type of stress to a capacitor.
[Bending] [Twisting]
2. Check the cropping method for the printed circuit board in advance.
2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus (Disk separator, router
type separator, etc.) to prevent the mechanical stress that can occur to the board.
* When a board separation jig or disk separator is used, if the following precautions are not observed,
a large board deflection stress will occur and the capacitors may crack.
Use router type separator if at all possible.
Caution
Notes
Hand and nipper
separation apply a high
level of stress.
Use another method.
· Board handling
· Board bending direction
· Layout of capacitors
· Board handling
· Layout of slits
· Design of V groove
· Arrangement of blades
· Controlling blade life
Board handling
Recommended
High
Medium
Medium
Low
Level of stress on board
×
*
*
Board Separation Method
Hand Separation
Nipper Separation
(1) Board Separation Jig
Board Separation Apparatus
2) Disk Separator
3) Router Type Separator
!
Peeling
Test-probe
Backup
Pin
Test-probe
1A
JEMCGC-01743C 19
m Direcuon m \aad U, d ‘ ‘ aned 2mm, \ 3 pg _//\oad If ‘ r \[ ' 3 yi> \y; f ‘ c x j ‘ y (Measures) II M is difficu‘l Io introduce a rouler Iype separator, imp‘ement the following measures [Cross-section Dxagram]
(1) Example of a suitable jig
[In the case of Single-side Mounting]
An outline of the board separation jig is shown as follows.
Recommended example: Stress on the component mounting position can be minimized by holding the
portion close to the jig, and bend in the direction towards the side where the capacitors are mounted.
Not recommended example: The risk of cracks occurring in the capacitors increases due to large stress
being applied to the component mounting position, if the portion away from the jig is held and bent in the
direction opposite the side where the capacitors are mounted.
[Outline of jig]
[In the case of Double-sided Mounting]
Since components are mounted on both sides of the board, the risk of cracks occurring can not be avoided with the
above method. Therefore, implement the following measures to prevent stress from being applied to the components.
  (Measures)
(1) Consider introducing a router type separator.
   If it is difficult to introduce a router type separator, implement the following measures.
(Refer to item 1. Mounting Position)
(2) Mount the components parallel to the board separation surface.
(3) When mounting components near the board separation point, add slits in the separation position
near the component.
(4) Keep the mounting position of the components away from the board separation point.
(2) Example of a Disk Separator
An outline of a disk separator is shown as follows. As shown in the Principle of Operation, the top
blade and bottom blade are aligned with the V-grooves on the printed circuit board to separate the board.
In the following case, board deflection stress will be applied and cause cracks in the capacitors.
(1) When the adjustment of the top and bottom blades are misaligned, such as deviating in the top-bottom,
left-right or front-rear directions
(2) The angle of the V groove is too low, depth of the V groove is too shallow, or the V groove is misaligned
top-bottom
IF V groove is too deep, it is possible to brake when you handle and carry it. Carefully design depth of the
V groove with consideration about strength of material of the printed circuit board.
[ Outline of Machine ] [ Principle of Operation ] [ Cross-section Diagram ]
Top Blade Top Blade Top Blade Top Blade
Bottom Blade Bottom Blade Bottom Blade Bottom Blade
Not recommended
Recommended
Top-bottom Misalignment
Left-right Misalignment
Front-rear Misalignment
Caution
Recommended
Not recommended
Depth too Shallow
Depth too Deep
Example of
Recommended
V-groove Design
Not Recommended
Left-right Misalignment
Low-Angle
Printed Circuit Board
Top Blade
V-groove
Bottom Blade
Top Blade Printed Circuit Board
V-groove
!
Board Cropping Jig
V-groove
Printed Circuit Board
Printed circuit
board
Components
Load point
Direction of
load
Printed circuit
board
Component
s
Load point
Direction of load
JEMCGC-01743C 20
The router type separamr peflorms cutting by a router 8. Assembly capacimrs have been moumed on (he opposne side. Q3) Plan the work so mat the board does not bend when a ‘ l *5}— En fl} «,1
(3) Example of Router Type Separator
The router type separator performs cutting by a router
rotating at a high speed. Since the board does not
bend in the cutting process, stress on the board can
be suppressed during board separation.
When attaching or removing boards to/from the router type
separator, carefully handle the boards to prevent bending.
8. Assembly
1. Handling
If a board mounted with capacitors is held with one hand, the board may bend.
Firmly hold the edges of the board with both hands when handling.
If a board mounted with capacitors is dropped, cracks may occur in the capacitors.
Do not use dropped boards, as there is a possibility that the quality of the capacitors may be impaired.
2. Attachment of Other Components
2-1. Mounting of Other Components
Pay attention to the following items, when mounting other components on the back side of the board after
capacitors have been mounted on the opposite side.
When the bottom dead point of the suction nozzle is set too low, board deflection stress may be applied
to the capacitors on the back side (bottom side), and cracks may occur in the capacitors.
· After the board is straightened, set the bottom dead point of the nozzle on the upper surface of the board.
· Periodically check and adjust the bottom dead point.
2-2. Inserting Components with Leads into Boards
When inserting components (transformers, IC, etc.) into boards, bending the board may cause cracks in the
capacitors or cracks in the solder. Pay attention to the following.
· Increase the size of the holes to insert the leads, to reduce the stress on the board during insertion.
· Fix the board with backup pins or a dedicated jig before insertion.
· Support below the board so that the board does not bend. When using multiple backup pins on the board,
periodically confirm that there is no difference in the height of each backup pin.
2-3. Attaching/Removing Sockets
When the board itself is a connector, the board may bend when a socket is attached or removed.
Plan the work so that the board does not bend when a socket is attached or removed.
2-4. Tightening Screws
The board may be bent, when tightening screws, etc. during the attachment of the board to a shield or
chassis. Pay attention to the following items before performing the work.
· Plan the work to prevent the board from bending.
· Use a torque screwdriver, to prevent over-tightening of the screws.
· The board may bend after mounting by reflow soldering, etc. Please note, as stress may be applied
to the chips by forcibly flattening the board when tightening the screws.
Caution
!
Suction Nozzle
Component with Leads
Socket
Screwdriver
[ Outline Drawing ] Router
JEMCGC-01743C 21
Others 1. Under Ogemion of Eguigmenl 2. Others
Others
1. Under Operation of Equipment
1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of an electric shock.
1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit).
Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.
1-3. Confirm the environment in which the equipment will operate is under the specified conditions.
Do not use the equipment under the following environments.
(1) Being spattered with water or oil.
(2) Being exposed to direct sunlight.
(3) Being exposed to ozone, ultraviolet rays, or radiation.
(4) Being exposed to toxic gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.)
(5) Any vibrations or mechanical shocks exceeding the specified limits.
(6) Moisture condensing environments.
1-4. Use damp proof countermeasures if using under any conditions that can cause condensation.
2. Others
2-1. In an Emergency
(1) If the equipment should generate smoke, fire, or smell, immediately turn off or unplug the equipment.
If the equipment is not turned off or unplugged, the hazards may be worsened by supplying continuous power.
(2) In this type of situation, do not allow face and hands to come in contact with the capacitor or burns may be caused
by the capacitor's high temperature.
2-2. Disposal of waste
When capacitors are disposed of, they must be burned or buried by an industrial waste vendor with the appropriate
licenses.
2-3. Circuit Design
(1) Addition of Fail Safe Function
Capacitors that are cracked by dropping or bending of the board may cause deterioration of the
insulation resistance, and result in a short.If the circuit being used may cause an electrical shock,
smoke or fire when a capacitor is shorted, be sure to install fail-safe functions, such as a fuse,
to prevent secondary accidents.
(2) The GRT series are not safety standard certified products.
2-4. Remarks
Failure to follow the cautions may result, worst case, in a short circuit and smoking when the product is used.
The above notices are for standard applications and conditions. Contact us when the products are used in special
mounting conditions.
Select optimum conditions for operation as they determine the reliability of the product after assembly.
The data herein are given in typical values, not guaranteed ratings.
Caution
!
JEMCGC-01743C 22
Rating 1.09am ng Temgeralure 2.Atmosghere Surround gs gaseous and liguidl electrodes may result in breakdown when the capacitor is exposed lo corrosive or volatile gases or solvents 3.Piezo-eleclric Phenomenon
Rating
1.Operating Temperature
1. The operating temperature limit depends on the capacitor.
1-1. Do not apply temperatures exceeding the upper operating temperature.
It is necessary to select a capacitor with a suitable rated temperature that will cover the operating temperature range.
It is also necessary to consider the temperature distribution in equipment and the seasonal temperature variable
factor.
1-2. Consider the self-heating factor of the capacitor
The surface temperature of the capacitor shall be the upper operating temperature or less when including
the self-heating factors.
2.Atmosphere Surroundings (gaseous and liquid)
1. Restriction on the operating environment of capacitors.
1-1. Capacitors, when used in the above, unsuitable, operating environments may deteriorate due to the corrosion
of the terminations and the penetration of moisture into the capacitor.
1-2. The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are subject
to moisture condensation.
1-3. The deterioration of characteristics and insulation resistance due to the oxidization or corrosion of terminal
  electrodes may result in breakdown when the capacitor is exposed to corrosive or volatile gases or solvents
for long periods of time.
3.Piezo-electric Phenomenon
1. When using high dielectric constant type capacitors in AC or pulse circuits, the capacitor itself vibrates
at specific frequencies and noise may be generated.
Moreover, when the mechanical vibration or shock is added to capacitor, noise may occur.
Notice
JEMCGC-01743C 23
Soldering and Mounting 1.PCB Design Pattern Forms 9“ .% ,% in section in section in section in section \% in section in section E“
Soldering and Mounting
1.PCB Design
1. Notice for Pattern Forms
1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted
directly on the substrate.
They are also more sensitive to mechanical and thermal stresses than leaded components.
Excess solder fillet height can multiply these stresses and cause chip cracking.
When designing substrates, take land patterns and dimensions into consideration to eliminate the possibility
of excess solder fillet height.
1-2. There is a possibility of chip cracking caused by PCB expansion/contraction with heat, because stress
on a chip is different depending on PCB material and structure.When the thermal expansion coefficient
greatly differs between the board used for mounting and the chip,it will cause cracking of the chip due to
the thermal expansion and contraction. When capacitors are mounted on a fluorine resin printed circuit
board or on a single-layered glass epoxy board, it may also cause cracking of the chip for the same reason.
Pattern Forms
in section in section
in section in section
in section in section
Notice
Placing of Leaded
Components
after Chip Component
Lateral Mounting
Prohibited
Correct
Placing Close to Chassis
Placing of Chip
Components
and Leaded
Components
Chassis
Solder (ground)
Electrode Pattern
Solder Resist
Lead Wire
Solder Resist
Lead Wire
Soldering Iron
Solder Resist
ソ
Solder Resist
JEMCGC-01743C 24
Please cunlirm lhe suitable land dimension by a A Table 1 Flow Solderin Method Dimensions Pan Number Flow soldering can only be used for pruducis wiln a chip size uf1.6x0.8mmlo 3.2x1.6mm. Table 2 Rellow Soldering Method Dimensions Pan Numbe
2. Land Dimensions
2-1. Chip capacitors can be cracked due to the stress
of PCB bending , etc. if the land area is larger than
needed and has an excess amount of solder.
Please refer to the land dimensions in table 1
for flow soldering, table 2 for reflow soldering.
Please confirm the suitable land dimension by
evaluating of the actual SET / PCB.
Table 1 Flow Soldering Method
Dimensions
Part Number
Flow soldering can only be used for products with a chip size of 1.6x0.8mm to 3.2x1.6mm.
(in mm)
Table 2 Reflow Soldering Method
Dimensions
Part Number
(in mm)
GRT15
1.0×0.5
2.2 to 2.4
GRT18
GRT21
2.0×1.25
GRT31
3.2×1.6
1.6×0.8
0.35 to 0.45
0.3 to 0.5
GRT31
3.2×1.6
2.2 to 2.6
1.0 to 1.1
c
Notice
L×W
a
b
c
0.8 to 0.9
GRT18
0.6 to 0.8
1.6×0.8
0.6 to 1.0
2.0×1.25
1.0 to 1.2
GRT21
a
L×W
0.9 to 1.0
0.8 to 1.1
1.0 to 1.4
b
0.6 to 0.8
0.6 to 0.7
0.6 to 0.8
0.8 to 1.1
0.4 to 0.6
0.8 to 0.9
1.0 to 1.4
1.0 to 1.2
GRT32
3.2×2.5
2.0 to 2.4
1.0 to 1.2
1.8 to 2.3
0.6 to 0.7
GRT03
0.6×0.3
0.2 to 0.3
0.2 to 0.35
0.2 to 0.4
c
b
a
Solder Resist
Chip Capacitor
Land
JEMCGC-01743C 25
2.Adhesive Agglicalion 5000Pa ~ 5 (500ps) min, (a‘ 25 Covera e Swze (LXW) (in mm) 1 6 x O 8 3.Adhesive Curing 4.Flux 1. An excessive amount of flux generates a large quantity m flux gas, wmch can cause a deterioration of so‘derabilityA ) Adheswe Coverage" 0.05mg min. 0.1 m min. 0.15mg min.
3. Board Design
When designing the board, keep in mind that the amount of strain which occurs will increase depending on the size
and material of the board.
2.Adhesive Application
1. Thin or insufficient adhesive can cause the chips to loosen or become disconnected during flow soldering.
The amount of adhesive must be more than dimension c, shown in the drawing at right, to obtain the correct bonding
strength. The chip's electrode thickness and land thickness must also be taken into consideration.
2. Low viscosity adhesive can cause chips to slip after mounting. The adhesive must have a viscosity of
5000Pa s (500ps) min. (at 25)
3. Adhesive Coverage
Size (L×W) (in mm) Adhesive Coverage*
1.6 × 0.8 0.05mg min.
2.0 × 1.25 0.1mg min.
3.2 × 1.6 0.15mg min.
*Nominal Value
3.Adhesive Curing
1. Insufficient curing of the adhesive can cause chips to disconnect during flow soldering and causes
deterioration in the insulation resistance between the outer electrodes due to moisture absorption.
Control curing temperature and time in order to prevent insufficient hardening.
4.Flux
1. An excessive amount of flux generates a large quantity of flux gas, which can cause a deterioration of solderability,
so apply flux thinly and evenly throughout. (A foaming system is generally used for flow solderring.)
2. Flux containing too high a percentage of halide may cause corrosion of the outer electrodes unless there is
sufficient cleaning. Use flux with a halide content of 0.1% max.
3. Do not use strong acidic flux.
4. Do not use water-soluble flux.*
(*Water-soluble flux can be defined as non-rosin type flux including wash-type flux and non-wash-type flux.)
Notice
Land
Adhesive
Board
Chip Capacitor
a
b
c
a=20 to 70μm
b=30 to 35μm
c=50 to 105μm
Relationship with amount of strain to the board thickness, length, width, etc.]
ε=
3PL
2Ewh2
Relationship between load and strain
When the load is constant, the following relationship can be established.
· As the distance between the supporting points (L) increases,the amount of strain also increases.
→Reduce the distance between the supporting points.
· As the elastic modulus (E) decreases, the amount of strain increases.
→Increase the elastic modulus.
· As the board width (w) decreases, the amount of strain increases.
→Increase the width of the board.
· As the board thickness (h) decreases, the amount of strain increases.
→Increase the thickness of the board.
Since the board thickness is squared, the effect on the amount of strain becomes even greater.
εStrain on center of board (μst)
LDistance between supporting points (mm)
w Board width (mm)
h Board thickness (mm)
E Elastic modulus of board (N/m2=Pa)
Y Deflection (mm)
P Load (N)
JEMCGC-01743C 26
5.Flow Soldering Set temperature and time to ensure that teaching at the 6.Washing 7.Coating Others 1.1ransgortation low air temperature : -40 change at temperature air/air : -25 /+25 low air pressure :30 kPa change at air pressure :6 kPa/mint capacitors, the capacitance may change depending on the operating conditions in the actual system.
5.Flow Soldering
Set temperature and time to ensure that leaching of the
outer electrode does not exceed 25% of the chip end
area as a single chip (full length of the edge A-B-C-D
shown at right) and 25% of the length A-B shown as
mounted on substrate.
6.Washing
1. Please evaluate the capacitor using actual cleaning equipment and conditions to confirm the quality,
and select the solvent for cleaning.
2. Unsuitable cleaning solvent may leave residual flux or other foreign substances, causing deterioration of
electrical characteristics and the reliability of the capacitors.
3. Select the proper cleaning conditions.
3-1. Improper cleaning conditions (excessive or insufficient) may result in the deterioration of the performance
of the capacitors.
7.Coating
1. A crack may be caused in the capacitor due to the stress of the thermal contraction of the resin during curing process.
The stress is affected by the amount of resin and curing contraction. Select a resin with low curing contraction.
The difference in the thermal expansion coefficient between a coating resin or a molding resin and the capacitor
may cause the destruction and deterioration of the capacitor such as a crack or peeling, and lead to the deterioration
of insulation resistance or dielectric breakdown.
Select a resin for which the thermal expansion coefficient is as close to that of the capacitor as possible.
A silicone resin can be used as an under-coating to buffer against the stress.
2. Select a resin that is less hygroscopic.
Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation resistance
of a capacitor. An epoxy resin can be used as a less hygroscopic resin.
Others
1.Transportation
1. The performance of a capacitor may be affected by the conditions during transportation.
1-1. The capacitors shall be protected against excessive temperature, humidity and mechanical force during transportation.
(1) Climatic condition
 ・ low air temperature : -40
change of temperature air/air : -25/+25
low air pressure : 30 kPa
change of air pressure : 6 kPa/min.
(2) Mechanical condition
Transportation shall be done in such a way that the boxes are not deformed and forces are not directly passed
on to the inner packaging.
1-2. Do not apply excessive vibration, shock, or pressure to the capacitor.
(1) When excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking may occur
in the ceramic body of the capacitor.
(2) When the sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly on the surface
of the capacitor, the capacitor may crack and short-circuit.
1-3. Do not use a capacitor to which excessive shock was applied by dropping etc.
A capacitor dropped accidentally during processing may be damaged.
2.Characteristics Evaluation in the Actual System
1. Evaluate the capacitor in the actual system,to confirm that there is no problem with the performance and specification
values in a finished product before using.
2. Since a voltage dependency and temperature dependency exists in the capacitance of high dielectric type ceramic
capacitors, the capacitance may change depending on the operating conditions in the actual system.
Therefore,be sure to evaluate the various characteristics, such as the leakage current and noise absorptivity,
which will affect the capacitance value of the capacitor.
3. In addition,voltages exceeding the predetermined surge may be applied to the capacitor by the inductance in
the actual system. Evaluate the surge resistance in the actual system as required.
Notice
A
B
D
C
Outer Electrode
As a Single Chip
As Mounted on Substrate
A
B
JEMCGC-01743C 27
4.GRT series is manufactured under a quality management system compliant to ISOSOOL but is not registered to ISO/T816949.
4.GRT series is manufactured under a quality management system compliant to ISO9001,
but is not registered to ISO/TS16949.
NOTE
1.Please make sure that your product has been evaluated in view of your specifications with our
product being mounted to your product.
2.Your are requested not to use our product deviating from this product specification.
3.We consider it not appropriate to include any terms and conditions with regard to the business
transaction in the product specifications, drawings or other technical documents. Therefore,
if your technical documents as above include such terms and conditions such as warranty clause,
product liability clause, or intellectual property infringement liability clause, they will be deemed to
be invalid.
!
JEMCGC-01743C 28

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