SPSGRF-868 Datasheet by STMicroelectronics

View All Related Products | Download PDF Datasheet
(y, hie‘cugmemed
This is information on a product in full production.
October 2017 DocID027664 Rev 6 1/24
SPSGRF
Sub-GHz (868 or 915 MHz) low power programmable RF
transceiver modules
Datasheet - production data
Features
Programmable radio features
Based on Sub-1GHz SPIRIT1 transceiver
and integrated Balun (BALF-SPI-01D3)
Modulation schemes: 2-FSK, GFSK, MSK,
GMSK, OOk, ASK
Air data rate from 1 to 500 kbps
On-board antenna
Operating temperature range from -40 °C
to 85 °C
RF features
Receiver sensitivity: -118 dBm
Programmable RF output power up to
+11.6 dBm
Host interface
– SPI
General I/O
Up to 32 programmable I/O functions on 4
GPIO programmable module pins
Two typical carrier frequency versions:
SPSGRF-868 with 868 MHz tuned antenna
SPSGRF-915 with 915 MHz tuned antenna
Certification:
CE (SPSGRF-868)
FCC (SPSGRF-915)
IC (SPSGRF-915)
Applications
AMR (automatic meter reading)
Home and building automation
WSN (wireless sensor network)
Industrial monitoring and control
Wireless fire and security alarm systems
Point-to-point wireless link
Description
The SPSGRF-868 and SPSGRF-915 are easy-to-
use, low power sub-GHz modules based on the
SPIRIT1 RF transceiver, operating respectively in
the 868 MHz SRD and 915 MHz ISM bands.
The modules provide a complete RF platform in a
tiny form factor.
The SPSGRF series enables wireless
connectivity in electronic devices, requiring no RF
experience or expertise for integration into the
final product. As an FCC, IC, and CE certified
solution, the SPSGRF series optimizes the time-
to-market of end applications. The SPSGRF-915
is an FCC certified module (FCC ID:
S9NSPSGRF) and IC certified (IC 8976C-
SPSGRF), while the SPSGRF-868 is certified CE.
The modules are designed for maximum
performance in minimal space and include 4
programmable I/O pins and SPI serial interfaces.
www.st.com
Contents SPSGRF
2/24 DocID027664 Rev 6
Contents
1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 SPSGRF module functional behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 Hardware specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.2 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.3 Module current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.4 Module RF compliance limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.5 SPSGRF module RF typical performance . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.6 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4 Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5 Hardware design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.1 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6 Regulatory compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6.1 FCC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6.1.1 Labeling instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6.1.2 Product manual instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.2 IC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.2.1 Labeling instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6.2.2 Product manual instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6.3 CE certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7 Module traceability and marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
8 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
9 ECOPACK® . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Emery a Exisma‘ supp y swam _RF- 2014mm: - ‘36: MHz arms MHz IITERNALLV TUNED \ RF anhnna SPI LIN E i
DocID027664 Rev 6 3/24
SPSGRF Block diagram
24
1 Block diagram
Figure 1. SPSGRF block diagram
SPSGRF module functional behavior SPSGRF
4/24 DocID027664 Rev 6
2 SPSGRF module functional behavior
The SPIRIT1 device in the SPSGRF module is equipped with a built-in main controller which
controls the switching between the two main operating modes: transmit (TX) and receive
(RX).
In shutdown condition, the SPSGRF module can be switched on/off with the external SDN
pin; all other functions/registers/commands are available through the SPI interface and
GPIOs. No internal supply is generated (in order to minimize battery leakage), and therefore
all stored data and configurations are lost.
The GPIO and SPI ports of the module during shutdown are in HiZ. From the SHUTDOWN
state, the SPSGRF module can be switched on from the SDN pin and goes into a READY
state, which is the default, where the reference signal from XO is available.
From the READY state, the SPSGRF module can be moved to a LOCK state to generate
the high precision LO signal and/or TX or RX modes. Switching from RX to TX and vice-
versa can occur only by passing through the LOCK state. This operation is normally
managed by radio control with a single user command (TX or RX).
At the end of the events above, the SPSGRF module can return to its default state (READY)
and can then be put into a sleep condition (SLEEP state), characterized by very low power
consumption.
If no timeout is required, the SPSGRF module can be moved from READY to STANDBY
state, which has the lowest possible current consumption while retaining FIFO, status and
configuration registers. To manage the transitions towards and between these operating
modes, the controller works as a state machine, the state switching of which is driven by SPI
commands.
Figure 2. Module functional state transitions diagram
DocID027664 Rev 6 5/24
SPSGRF Hardware specifications
24
3 Hardware specifications
3.1 Absolute maximum ratings
General conditions (VIN= 3.3 V and 25 °C)
3.2 Recommended operating conditions
3.3 Module current consumption
Table 1. Absolute maximum ratings
Rating Min. Typ. Max. Unit
Storage temperature range -40 +85 °C
Supply voltage, VIN -0.3 3.9 V
I/O pin voltage -0.3 3.9 V
RF saturation input power +10 dBm
Table 2. Recommended operating conditions
Rating Min. Typ. Max. Unit
Operating temperature range -40 +85 °C
Supply voltage, VIN 1.8 3.3 3.6 V
Signals & I/O pin voltage (according
supply voltage) 1.8 3.6 V
RF frequency bandwidth
(SPSGRF-868) 863 870 MHz
RF frequency bandwidth
(SPSGRF-915) 902 928 MHz
Table 3. SPSGRF-868 module
Symbol Parameter Test conditions Typ. Unit
IDD Supply current
Operating mode
Tx, +11.6 dBm, 2-FSK, 868 MHz 22 mA
Operating mode
Tx, - 7 dBm, 2-FSK, 868 MHz 9mA
Operating mode Rx, 868MHz 10 mA
Command mode 0.6 mA
Shutdown high level -VDD
(with other I/O in High impedance) 0.1 μA
Hardware specifications SPSGRF
6/24 DocID027664 Rev 6
3.4 Module RF compliance limits
The RF compliance limits are those tested for FCC, IC and CE certification using the
dedicated dongle (PC92A.V01). These limits are enforced by the dongle firmware. Care
must be taken with custom application firmware to ensure these limits are not exceeded,
voiding the FCC, IC and CE certification.
Table 4. SPSGRF-915 module
Symbol Parameter Test conditions Typ. Unit
IDD Supply current
Operating mode
Tx, +11.6 dBm, 2-FSK, 915 MHz 22 mA
Operating mode
Tx, - 7 dBm, 2-FSK, 915 MHz 9mA
Operating mode Rx, 915 MHz 10 mA
Command mode 0.6 mA
Shutdown high level -VDD
(with other I/O in high impedance) 0.1 μA
Table 5. RF compliance limits table
Modulation Standards Parameter Max. Unit
2-FSK
GFSK
MSK
FCC Part 15.207 (1)
FCC Part 15.247 (1)
IC RSS-210
EN 300 220-2 V2.4.1 (2)
EN 301 489-01 V1.9.2 (2)
EN 301 489-03 V1.4.1 (2)
1. FCC and IC standards are applicable only to the SPSGRF-915 module.
2. EN standards are applicable only to the SPSGRF-868 module.
Data rate 500 kbps
Output power +11.6 dBm
OOK
ASK
FCC Part 15.207 (1)
FCC Part 15.247 (1)
IC RSS-210
EN 300 220-2 V2.4.1 (2)
EN 301 489-01 V1.9.2 (2)
EN 301 489-03 V1.4.1 (2)
Data rate 250 kbps
Output power +6 dBm
DocID027664 Rev 6 7/24
SPSGRF Hardware specifications
24
3.5 SPSGRF module RF typical performance
The RF performance of the SPSGRF-868 and SPSGRF-915 modules are dependent on
many factors, related to the customer hardware application board where the module is
connected and also to the customer application firmware. In order to provide some basic
information to the customer integrating the module, it may be useful to provide the RF
measurements taken in an anechoic chamber using a dongle containing a connected
SPSGRF-868 or SPSGRF-915 module.
Table 6. SPSGRF-868 or 915 modules radiated typical performance
Symbol Parameter Test conditions Typ. Unit
Tx RF
power RF radiated power
Operating mode
Tx, +11.6 dBm, 2-FSK, 868,0-868,6 MHz +5.3 dBm
Operating mode
Tx, +11.6 dBm, 2-FSK, 902-928 MHz +2.2 dBm
Hardware specifications SPSGRF
8/24 DocID027664 Rev 6
Table 7. SPSGRF-868 or 915 module conducted typical performance before the RF
antenna circuits (positive RF power signal values measured)
Parameter Test conditions(1) Conducted
programmable value
Measured
conducted
value Typ.
Unit
Tx RF
conducted
power
(before the
antenna
circuits)
Tx, +11.6 dBm, 2-FSK, 868 MHz
Tx, +11.6 dBm, 2-FSK, 915 MHz +11.6 +11.2 dBm
Tx, +11 dBm, 2-FSK, 868 MHz
Tx, +11 dBm, 2-FSK, 915 MHz +11.0 +10.8 dBm
Tx, +10 dBm, 2-FSK, 868 MHz
Tx, +10 dBm, 2-FSK, 915 MHz +10.0 +9.7 dBm
Tx, +9 dBm, 2-FSK, 868 MHz
Tx, +9 dBm, 2-FSK, 915 MHz +9.0 +8.5 dBm
Tx, +8 dBm, 2-FSK, 868 MHz
Tx, +8 dBm, 2-FSK, 915 MHz +8.0 +7.6 dBm
Tx, +7 dBm, 2-FSK, 868 MHz
Tx, +7 dBm, 2-FSK, 915 MHz +7.0 +7.2 dBm
Tx, +6 dBm, 2-FSK, 868 MHz
Tx, +6 dBm, 2-FSK, 915 MHz +6.0 +6.2 dBm
Tx, +5 dBm, 2-FSK, 868 MHz
Tx, +5 dBm, 2-FSK, 915 MHz +5.0 +5.4 dBm
Tx, +4 dBm, 2-FSK, 868 MHz
Tx, +4 dBm, 2-FSK, 915 MHz +4.0 +4.0 dBm
Tx, +3 dBm, 2-FSK, 868 MHz
Tx, +3 dBm, 2-FSK, 915 MHz +3.0 +3.1 dBm
Tx, +2 dBm, 2-FSK, 868 MHz
Tx, +2 dBm, 2-FSK, 915 MHz +2.0 +2.1 dBm
Tx, +1 dBm, 2-FSK, 868 MHz
Tx, +1 dBm, 2-FSK, 915 MHz +1.0 +1.2 dBm
Tx, +0 dBm, 2-FSK, 868 MHz
Tx, +0 dBm, 2-FSK, 915 MHz +0.0 +0.6 dBm
1. Operating mode
DocID027664 Rev 6 9/24
SPSGRF Hardware specifications
24
Table 8. SPSGRF-868 or 915 module conducted typical performance before the RF
antenna circuits (negative RF power signal values measured)
Parameter Test conditions(1) Conducted
programmable value
Measured
conducted
value Typ.
Unit
Tx RF
conducted
power
(before the
antennas
circuits)
Tx, -1 dBm, 2-FSK, 868 MHz
Tx, -1 dBm, 2-FSK, 915 MHz -1.0 -1.1 dBm
Tx, -2 dBm, 2-FSK, 868 MHz
Tx, -2 dBm, 2-FSK, 915 MHz -2.0 -2.3 dBm
Tx, -3 dBm, 2-FSK, 868 MHz
Tx, -3 dBm, 2-FSK, 915 MHz -3.0 -3.4 dBm
Tx, -4 dBm, 2-FSK, 868 MHz
Tx, -4 dBm, 2-FSK, 915 MHz -4.0 -4.9 dBm
Tx, -5 dBm, 2-FSK, 868 MHz
Tx, -5 dBm, 2-FSK, 915 MHz -5.0 -5.8 dBm
Tx, -6 dBm, 2-FSK, 868 MHz
Tx, -6 dBm, 2-FSK, 915 MHz -6.0 -6.9 dBm
Tx, -7 dBm, 2-FSK, 868 MHz
Tx, -7 dBm, 2-FSK, 915 MHz -7.0 -6.5 dBm
Tx, -8 dBm, 2-FSK, 868 MHz
Tx, -8 dBm, 2-FSK, 915 MHz -8.0 -7.3 dBm
Tx, -9 dBm, 2-FSK, 868 MHz
Tx, -9 dBm, 2-FSK, 915 MHz -9.0 -8.2 dBm
Tx, -10 dBm, 2-FSK, 868 MHz
Tx, -10 dBm, 2-FSK, 915 MHz -10.0 -9.7 dBm
Tx, -15 dBm, 2-FSK, 868 MHz
Tx, -15 dBm, 2-FSK, 915 MHz -15.0 -14.6 dBm
Tx, -20 dBm, 2-FSK, 868 MHz
Tx, -20 dBm, 2-FSK, 915 MHz -20.0 -19.2 dBm
Tx, -25 dBm, 2-FSK, 868 MHz
Tx, -25 dBm, 2-FSK, 915 MHz -25.0 -23.3 dBm
Tx, -30 dBm, 2-FSK, 868 MHz
Tx, -30 dBm, 2-FSK, 915 MHz -30.0 -26.2 dBm
Tx, -35 dBm, 2-FSK, 868 MHz
Tx, -35 dBm, 2-FSK, 915 MHz -35.0 -27.8 dBm
1. Operating mode
TOP VIEW EPWU l3! ‘ 1 II SUN r J EMU £21 In SPLES PM“ W S 3 9%] W Mn“ 5mm w 3 4 M SPLMSU W! Y) 3 e 76 SPLELK END
Hardware specifications SPSGRF
10/24 DocID027664 Rev 6
3.6 Pin connections
Figure 3. Pin connection diagram
Table 9. Pin assignment
Name Type Pin# Description Alt
function V max. tolerance Initial state
SPI interface
SPI_CLK I 7 SPI CLOCK (Max. 8 MHz) Vin
SPI_MISO O 8 SPI MISO (MASTER in / SLAVE out) Vin
SPI_MOSI I 9 SPI MOSI (MASTER out SLAVE in) Vin
SPI_CS I 10 SPI “Chip Select” (SPI slave select) Vin
Power and ground
Vin 5V
in (1.8V - 3.6V max.)
GND 6 GND
Module shutdown
SDN I 11 Shutdown input (active high) (1.8V - 3.6V max.)
GPIO - general purpose input/output
GPIO [0] I/O 4 Programmable input / output &
analog temperature output (1.8V - Vin max.) Digital output.
Low power
GPIO [1] I/O 3 Programmable input / output (1.8V - Vin max.) Digital output.
Low power
GPIO [2] I/O 2 Programmable input / output (1.8V - Vin max.) Digital output.
Low power
GPIO [3] I/O 1 Programmable input / output (1.8V - Vin max.) Digital output.
Low power
M pads Mlmm
DocID027664 Rev 6 11/24
SPSGRF Mechanical dimensions
24
4 Mechanical dimensions
Figure 4. Mechanical dimensions
Figure 5. Recommended land pattern
Hardware design SPSGRF
12/24 DocID027664 Rev 6
5 Hardware design
The SPSGRF module supports SPI hardware interfaces.
Note: - All unused pins should be left floating; do not ground.
- All GND pins must be well grounded.
- The area around the module should be free of any ground planes, power planes, trace
routings, or metal for 6 mm from the module antenna position, in all directions.
- Traces should not be routed underneath the module
5.1 Reflow soldering
The SPSGRF is a surface mount sub-1 GHz transceiver module supplied on an 11 pin, 4-
layer PCB. The final assembly recommended reflow profiles are indicated below.
The soldering phase must be executed with care. In order to avoid an undesired melting
phenomenon, particular attention should be given to the setup of the peak temperature.
Table 10 provides suggestions for the temperature profile based on IPC/JEDEC J-STD-
020C, July 2004 recommendations.
Table 10. Soldering recommendations
Profile feature PB-free assembly
Average ramp up rate (TSMAX to Tp) 3°C/ sec max
Preheat
Temperature min (TS min) 150 °C
Temperature max (TS max) 200 °C
Time (tS min to tS max) (tS) 60-100 sec
Time maintained above:
Temperature TL217 °C
Time tL60-70 sec
Peak temperature (TP) 240 + 0 °C
Time within 5 °C of actual peak temperature (tP) 10-20 sec
Ramp down rate 6 °C/sec
Time from 25 °C to peak temperature 8 minutes max
Temperature =(> 744 4— Preheat ZS‘C m Peak —>. We ={> cmim Zone T, w TV
DocID027664 Rev 6 13/24
SPSGRF Hardware design
24
Figure 6. Soldering profile
Regulatory compliance SPSGRF
14/24 DocID027664 Rev 6
6 Regulatory compliance
6.1 FCC certification
The SPSGRF-915 module has been tested and found compliant with the FCC part 15 rules.
These limits are designed to provide reasonable protection against harmful interference in
approved installations. This equipment generates, uses, and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful
interference to radio communications.
However, there is no guarantee that interference may not occur in a particular installation.
This device complies with part 15 of the FCC rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired
operation.
Modifications or changes to this equipment not expressly approved by STMicroelectronics
may render void the user's authority to operate this equipment.
Modular approval
FCC ID: S9NSPSGRF
In accordance with FCC part 15, the SPSGRF-915 is listed as a modular transmitter device.
This module is evaluated for stand-alone use only. Finished products incorporating multiple
transmitters must comply with collocation and RF exposure requirements in accordance
with FCC multi-transmitter product procedures. Collocated transmitters operating in portable
RF exposure conditions (e.g. <20 cm from persons including but not limited to body worn
and hand-held devices) may require separate approval.
6.1.1 Labeling instructions
When integrating the SPSGRF-915 into the final product, the OEM must ensure that the
FCC labeling requirements are satisfied. A statement must be included on the exterior of the
final product which indicates that the product includes a certified module. The label should
state the following (or similar wording that conveys the same meaning):
The OEM must include the following statements on the exterior of the final product unless
the product is too small (e.g. less than 4 x 4 inches):
This device complies with part 15 of the FCC rules. Operation is subject to the following two
conditions:
1. this device may not cause harmful interference
2. this device must accept any interference received, including any interference that may
cause undesired operation.
Contains FCC ID: S9NSPSGRF
OR This product contains FCC ID: S9NSPSGRF
DocID027664 Rev 6 15/24
SPSGRF Regulatory compliance
24
6.1.2 Product manual instructions
This section applies to OEM final products containing the SPSGRF-915 module, subject to
FCC compliance. The final product manual must contain the following statement (or a
similar statement that conveys the same meaning):
“Warning: Changes or modifications not expressly approved by the party responsible for
compliance could void the user's authority to operate the equipment. (Part. 15.21)”
In the case where an OEM seeks Class B (residential) limits for the final product, the
following statement must be included in the final product manual:
“Note: This equipment has been tested and found to comply with the limits for a Class B
digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed and
used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user
is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.”
In the case where an OEM seeks the lesser category of a Class A digital device for the final
product, the following statement must be included in the final product manual:
“Note: This equipment has been tested and found to comply with the limits for a Class A
digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference when the equipment is operated in a
commercial environment. This equipment generates, uses, and can radiate radio frequency
energy and, if not installed and used in accordance with the instruction manual, may cause
harmful interference to radio communications. Operation of this equipment in a residential
area is likely to cause harmful interference in which case the user will be required to correct
the interference at his expense.”
6.2 IC certification
The SPSGRF-915 module has been tested and found compliant with the IC RSS-210 rules.
These limits are designed to provide reasonable protection against harmful interference in
approved installations. This equipment generates, uses, and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful
interference to radio communications.
However, there is no guarantee that interference may not occur in a particular installation.
This device complies with RSS-210 of the IC rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired
operation.
Regulatory compliance SPSGRF
16/24 DocID027664 Rev 6
Modifications or changes to this equipment not expressly approved by STMicroelectronics
may render void the user's authority to operate this equipment.
Modular approval
IC: 8976C-SPSGRF
In accordance with IC RSS-210, the SPSGRF-915 is listed as a modular transmitter device.
This module is evaluated for stand-alone use only. Finished products incorporating multiple
transmitters must comply with collocation and RF exposure requirements in accordance
with IC multi-transmitter product procedures. Collocated transmitters operating in portable
RF exposure conditions (e.g. <20 cm from persons including but not limited to body worn
and hand-held devices) may require separate approval.
6.2.1 Labeling instructions
When integrating the SPSGRF-915 into the final product, the OEM must ensure that the IC
labeling requirements are satisfied. A statement must be included on the exterior of the final
product which indicates that the product includes a certified module. The label should state
the following (or similar wording that conveys the same meaning):
The OEM must include the following statements on the exterior of the final product unless
the product is too small (e.g. less than 4 x 4 inches):
“This device complies with RSS-210 of the IC Rules. Operation is subject to the following
two conditions:
1. this device may not cause harmful interference
2. this device must accept any interference received, including any interference that may
cause undesired operation.”
6.2.2 Product manual instructions
This section applies to OEM final products containing the SPSGRF-915 module, subject to
IC compliance. The final product manual must contain the following statement (or a similar
statement that conveys the same meaning):
“Warning: Changes or modifications not expressly approved by the party responsible for
compliance could void the user's authority to operate the equipment. (RSS-210)”
In the case where an OEM seeks Class B (residential) limits for the final product, the
following statement must be included in the final product manual:
“Note: This equipment has been tested and found to comply with the limits for a Class B
digital device, pursuant to RSS-210 of the IC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed and
used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
Contains IC ID: 8976C-SPSGRF
OR This product contains IC ID: 8976C-SPSGRF
DocID027664 Rev 6 17/24
SPSGRF Regulatory compliance
24
television reception, which can be determined by turning the equipment off and on, the user
is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.”
In the case where an OEM seeks the lesser category of a Class A digital device for the final
product, the following statement must be included in the final product manual:
“Note: This equipment has been tested and found to comply with the limits for a Class A
digital device, pursuant to RSS-210 of the IC Rules. These limits are designed to provide
reasonable protection against harmful interference when the equipment is operated in a
commercial environment. This equipment generates, uses, and can radiate radio frequency
energy and, if not installed and used in accordance with the instruction manual, may cause
harmful interference to radio communications. Operation of this equipment in a residential
area is likely to cause harmful interference in which case the user will be required to correct
the interference at his expense.”
CE
Regulatory compliance SPSGRF
18/24 DocID027664 Rev 6
6.3 CE certification
The module has been certified according to the following certification rules:
EN 300 328 V 2.1.1 (2016-11)(a)
ETSI EN 301 489-17 V3.1.1 (2017-02)(b)
ETSI EN 301 489-1 V2.1.1 (2017-02)(c)
EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 + A2:2013(d)
EN 62479:2010
The module is provided by CE marking:
The SPSGRF-868 module has obtained the RED certificate: No. 0051-RED-0024 REV. 0
The certified module test platform is based on STSW-SP1ML868AT production firmware
release: 1.X
For additional information please refer to:
STMicroelectronics Via C. Olivetti 2, Agrate Brianza 20864 (ITALY)
a. EN 300 328 V 2.1.1 (2016 11): “electromagnetic compatibility and radio spectrum Matters (ERM); Wideband
transmission systems; data transmission equipment operating in the 2.4 GHZ ISM band and using wideband
modulation techniques; harmonized EN covering essential requirements under article 3.2 of the R&TTE
directive”.
b. EN 301 489-17 V 3.1.1 (2017 02): “electromagnetic compatibility and radio spectrum Matters (ERM);
electromagnetic compatibility (EMC) standard for radio equipment and services; part 17: specific condition for
2.4 GHz wideband transmission systems and 5 GHz high performance RLAN equipment”.
c. ETSI EN 301 489-1 V2.1.1 (2017 02): “electromagnetic compatibility and radio spectrum Matters (ERM);
electromagnetic compatibility (EMC) standard for radio equipment and services; part 1: Common technical
requirements”.
d. EN60950-1:2006 +A11:2009+A1:2010+A12:2011+A2:2013: “Information technology equipment - safety”.
DocID027664 Rev 6 19/24
SPSGRF Module traceability and marking
24
7 Module traceability and marking
The SPSGRF bottom-side label contains the following information:
Model: “MODEL: SPSGRF-915” indicating the SPSGRF RF module family
FCC USA Certification Identification number: “FCCID:S9NSPSGRF”. This code is valid
only for 915 MHz frequency band
IC Canada certification number: “IC: 8976C-SPSGRF”. This code is used only for the
Canadian market
2D laser data matrix
Figure 7. SPSGRF bottom side
Each module is univocally identified by serial number stored in a 2D laser data matrix
marked on the bottom of the module.
The figure below shows the standard bottom-side QR-code laser marking.
Figure 8. SPSGRF QR-code laser marking
Module traceability and marking SPSGRF
20/24 DocID027664 Rev 6
The serial number has the following format: WW YY K PP NNN
where:
WW - Week
YY - Year
K - Product ID (refer to Table 11 below)
PP - internal ST use only
NNN - internal ST use only
Each module bulk package is identified by a bulk ID.
The Bulk ID and module 2D data matrix are linked by a reciprocal traceability link.
The module 2D data matrix traces the lot number of any raw material used.
Table 11. Module Product ID
K Product family identification
W SPSGRF-868
X SPSGRF-915
DocID027664 Rev 6 21/24
SPSGRF Ordering information
24
8 Ordering information
Table 12. Ordering information
Order code Description Packing MOQ
SPSGRF-868 868 MHz SPIRIT1 transceiver module (Region 1, Europe) JEDEC tray 2448 pcs
SPSGRF-915 915 MHz SPIRIT1 transceiver module (Region 2, The Americas) JEDEC tray 2448 pcs
ECOPACK®SPSGRF
22/24 DocID027664 Rev 6
9 ECOPACK®
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
DocID027664 Rev 6 23/24
SPSGRF Revision history
24
10 Revision history
Table 13. Document revision history
Date Revision Changes
31-Mar-2015 1 Initial release.
14-Apr-2015 2 Updated Features and Description in cover page.
22-May-2015 3 Updated Description in cover page.
29-Jun-2016 4
Added marking and module identification details in
Section 7: Module traceability and marking.
Updated Figure 5: Recommended land pattern
17-Oct-2016 5
Corrected typographical error in part number SPSGRF-
915 in the Features and Description sections of the
coverpage.
04-Oct-2017 6 Updated Section 6.3: CE certification
SPSGRF
24/24 DocID027664 Rev 6
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on
ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
the design of Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2017 STMicroelectronics – All rights reserved

Products related to this Datasheet

RX TXRX MOD ISM < 1GHZ CHIP SMD
RX TXRX MOD ISM < 1GHZ CHIP SMD
EVAL BOARD SPSGRF-868 USB DONGLE