SmartFusion2 Product Brief Datasheet by Microsemi SoC

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O Microsemi, a @MIcnncmp company
PB0115
Product Brief
SmartFusion2 SoC FPGA
O Microsemi a Q MIERDCHID company
51700115. 27.0 8/18
Microsemi Headquarters
One Enterprise, Aliso Viejo,
CA 92656 USA
Within the USA: +1 (800) 713-4113
Outside the USA: +1 (949) 380-6100
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www.microsemi.com
©2018 Microsemi, a wholly owned
subsidiary of Microchip Technology Inc. All
rights reserved. Microsemi and the
Microsemi logo are registered trademarks of
Microsemi Corporation. All other trademarks
and service marks are the property of their
respective owners.
Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of
its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the
application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi have
been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any
performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all
performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not
rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyer’s responsibility to
independently determine suitability of any products and to test and verify the same. The information provided by Microsemi
hereunder is provided “as is, where is” and with all faults, and the entire risk associated with such information is entirely
with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP
rights, whether with regard to such information itself or anything described by such information. Information provided in this
document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this
document or to any products and services at any time without notice.
About Microsemi
Microsemi, a wholly owned subsidiary of Microchip Technology Inc. (Nasdaq: MCHP), offers a comprehensive portfolio of
semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets.
Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and
ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's
standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication
solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and
midspans; as well as custom design capabilities and services. Learn more at www.microsemi.com.
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Microsemi Proprietary and Confidential PB0115 Product Brief Revision 27.0 iii
Contents
1 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Revision 27.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.2 Revision 26.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Revision 25.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Revision 24.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.5 Revision 23.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.6 Revision 22.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.7 Revision 21.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.8 Revision 20.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.9 Revision 19.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.10 Revision 18.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.11 Revision 17.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.12 Revision 16.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.13 Revision 15.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.14 Revision 14.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.15 Revision 13.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.16 Revision 12.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.17 Revision 11.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.18 Revision 10.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.19 Revision 9.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.20 Revision 8.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.21 Revision 7.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.22 Revision 6.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.23 Revision 5.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.24 Revision 4.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.25 Revision 3.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.26 Revision 2.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.27 Revision 1.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2 SmartFusion2 SoC FPGA Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1.1 Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1.2 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1.3 Low Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1.4 High Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1.5 Microcontroller Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1.6 Clocking Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1.7 High-Speed Serial Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1.8 High-Speed Memory Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1.9 Operating Voltage and I/Os . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3 I/Os Per Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.4 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.5 Temperature Grades . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.5.1 SmartFusion2 Commercial and Industrial Temperature Grade Devices . . . . . . . . . . . . . . . . . 15
2.5.2 SmartFusion2 Military Temperature Grade Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.6 SmartFusion2 Device Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
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2.7 SmartFusion2 Datasheet and Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.8 Marking Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.8.1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3 SmartFusion2 SoC FPGA Feature Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.1 Highest Security Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.1.1 Design Security vs. Data Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.1.2 Design Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.1.3 Data Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.2 Low Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.3 High-Performance FPGA Fabric . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.3.1 Dual-Port Large SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.3.2 Three-Port Micro SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.3.3 Mathblocks for DSP Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.4 Microcontroller Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.4.1 ARM Cortex-M3 Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.4.2 Cache Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.4.3 DDR Bridge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.4.4 AHB Bus Matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.4.5 System Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.4.6 Fabric Interface Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.4.7 Embedded SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.4.8 Embedded NVM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.4.9 DMA Engines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.4.10 APB Configuration Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.4.11 Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.5 Clock Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.6 High-Speed Serial Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.6.1 SerDes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.6.2 PCI Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.6.3 XAUI/XGXS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.7 High-Speed Memory Interfaces: DDRx Memory Controllers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.7.1 MDDR Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.7.2 FDDR Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.8 SmartFusion2 Development Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.8.1 Design Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.8.2 Design Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.8.3 IP Cores . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
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Figures
Figure 1 SmartFusion2 SoC FPGA Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 2 Elements in a Part Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 3 SmartFusion2 SoC FPGA Chip Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
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Tables
Table 1 SmartFusion2 SoC FPGA Product Family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 2 Package Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 3 I/Os per Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 4 Features per Device-Package Combination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 5 Programming Interfaces per Device-Package Combination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 6 Resources Required per Programming Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 7 Transceiver and Data Security Support in SmartFusion2 Devices . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 8 Design Security Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 9 Data Security Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 10 SmartFusion2 Kits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
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Revision History
Microsemi Proprietary and Confidential PB0115 Product Brief Revision 27.0 1
1 Revision History
The revision history describes the changes that were implemented in the document. The changes are
listed by revision, starting with the most current publication.
1.1 Revision 27.0
Information about M2S150 FCV484M was added. See SmartFusion2 Military Temperature Grade
Devices, page 15.
1.2 Revision 26.0
The following is a summary of changes made in revision 26.0:
The maximum payload size was updated from 2 KB to 256 bytes. For more information, see High-
Speed Serial Interfaces, page 7 and PCI Express, page 25.
•The tables SmartFusion2 Devices without Data Security (All Speed Grades, C, and I Temperature)
and SmartFusion2 Data Security S Devices (All Speed Grades, C, and I Temperature) were merged
and updated. See Tab le 7, page 15 (Transceiver and Data Security Support in SmartFusion2
Devices).
1.3 Revision 25.0
Name change from native SerDes interface to native EPCS SerDes interface in the High-Speed Serial
Interfaces, page 25 was updated in revision 25.0.
1.4 Revision 24.0
The following is a summary of changes made in revision 24.0:
Updated Table 1, page 8 for Automotive grade 2 (SAR 80232).
Added a note on Automotive grade 2 in the I/Os Per Package, page 10 (SAR 80232)
Added Automotive grade 2 information in the Ordering Information, page 14 (SAR 80232)
1.5 Revision 23.0
Updated Table 1, page 8 with more footnotes. (SAR 66079, SAR 77444, and SAR 73335).
1.6 Revision 22.0
The following is a summary of changes made in revision 22.0:
Updated Table 1, page 8 (SAR 71992).
Updated Marking Specifications, page 16 (SAR 71992).
Updated Low Power, page 21 (SAR 71992).
Updated Table 10, page 27 (SAR 71992).
1.7 Revision 21.0
The following is a summary of changes made in revision 21.0:
Updated Table 3, page 10
Added Ta ble 6 , page 13, Tab l e 7, page 15, Table 8, page 15
Updated Marking Specifications, page 16
Updated Table 10, page 27
1.8 Revision 20.0
The following is a summary of changes made in revision 20.0:
Updated Table 1, page 8, Ta b le 3 , page 10, Table 4, page 11, Table 5, page 12, and Table 9,
page 20
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Microsemi Proprietary and Confidential PB0115 Product Brief Revision 27.0 2
Updated Ordering Information, page 14
Updated Marking Specifications, page 16
Updated Table 8, page 19, Ta ble 9 , page 20
Updated SmartFusion2 Development Tools, page 26
1.9 Revision 19.0
The following is a summary of changes made in revision 19.0:
Updated Table 1, page 8, Ta b le 3 , page 10, Table 4, page 11, Table 5, page 12, and Table 9,
page 20
Removed all instances of and references to M2S100. VQ144 is replaced with TQ144 (SAR 62858).
Updated Ordering Information, page 14
Updated Table 8, page 19 and Ta bl e 9, page 20
Updated Table 10, page 27
1.10 Revision 18.0
The following is a summary of changes made in revision 18.0:
Ordering information added to Ta bl e 2 , page 10 and Tab l e 3, page 10 for the M2S090(T) device in
the FCS/FCSG325 package.
Trademark changed to the Register mark for ARM Cortex-M3.
1.11 Revision 17.0
Updated Device Packages 005-VF256 and 150-FCS536 in Table 2, page 10 and Ta bl e 5, page 12.
1.12 Revision 16.0
Updated Table 3, page 10, Tab le 4, page 11, and Table 5, page 12.
1.13 Revision 15.0
The following is a summary of changes made in revision 15.0:
Table 1, page 8 to Ta bl e 9, page 20 and Ordering Information, page 14 were updated with Military
device data.
Table 9, page 20 and the Marking Specifications, page 16 were added.
1.14 Revision 14.0
The following is a summary of changes made in revision 14.0:
Tables 3-6 were combined into Table 4, page 11.
Fabric Interface Controller features were added to Table 1, page 8.
Packages VQ144 and FCV484 were added to Table 2, page 10 and Ta bl e 4, page 11.
1.15 Revision 13.0
The following is a summary of changes made in revision 13.0:
Data Security Feature sections and Device Status table were removed.
Figure 1, page 8 was updated.
1.16 Revision 12.0
The following is a summary of changes made in revision 12.0:
Packages FCS325 and VF256 were added to Table 2, page 10.
Ordering Information, page 14 was updated.
Typo fixed on Figure 1, page 8.
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1.17 Revision 11.0
The following is a summary of changes made in revision 11.0:
LSRAM x32/36 widths added. In Tab le 1, page 8, notes are added referring to updates in Table 3,
page 10 –Tabl e 5, page 12 and Table 6.
Ordering Information, page 14 was updated. Part Numbers (tables 7 and 8) were removed.
SmartFusion2 Device Status, page 16 was updated.
M2S090-FG676 and M2S005-VF400 package pinouts finalized.
1.18 Revision 10.0
M2S005-FG484 package pinout I/O count finalized. Typos were corrected.
1.19 Revision 9.0
The following is a summary of changes made in revision 9.0:
A note regarding total logic was added to Table 1, page 8.
Design Security Features, page 19 and Data Security Features, page 20 were added to show the
security features supported.
1.20 Revision 8.0
The following is a summary of changes made in revision 8.0:
Figure 1, page 8 was revised to clarify the connections between the Cortex-M3 processor and cache
(SAR 45967).
I/O counts were updated in Table 1, page 8 (SAR 46000).
I/O counts and devices were updated. The FG676 package was added to Table 3, page 10 (SAR
46000).
Features per Device/Package Combination was divided into four new tables, Table 3 through Table
6 to accommodate new features for package/device combinations for the FG676 package, for T and
non-T devices (SAR 46000).
The status for M2S050T was changed from Advance to Preliminary in the SmartFusion2 Device
Status, page 16 (SAR 46967).
1.21 Revision 7.0
The following is a summary of changes made in revision 7.0:
The SmartFusion2 product brief has been separated from the rest of the SmartFusion2 datasheet.
The SmartFusion2 Development Tools, page 26 has been updated and is now part of the product
brief (SAR 45184).
The M2S090 device is new. The product family tables and ordering information have been updated
(SAR 45127).
1.22 Revision 6.0
The number of PLLs and CCCs for MS2025 was corrected from 4 to 6 (SAR 44480).
1.23 Revision 5.0
The following is a summary of changes made in revision 5.0:
Table 1, page 8 and Ta bl e 3 , page 10 were revised to correct I/O counts for M2S005/M2S025 and
the VF400 and FG484 packages (SAR 42618).
Junction temperature for military, industrial, and commercial SmartFusion2 SoC FPGAs was added
to the Reliability section. In the Operating Voltage and I/Os section, market leading number of user
I/Os with 5G SerDes was added to the (SAR 42618). LVTTL/LVCMOS 3.3 V was qualified as MSIO
only and DDR was removed from the list under DDRIOs (SAR 44652).
Table 4, page 11 is new (SARs 42618, 44414).
RMII was removed from as a supported PHY interface in the Triple Speed Ethernet MAC, page 23
(SAR 42618).
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1.24 Revision 4.0
The following is a summary of changes made in revision 4.0:
•The Ordering Information, page 14 was revised to add Pre-Production as a temperature range.
Ambient temperature was corrected to junction temperature in the defined temperature ranges.
Speed grades were defined. Table 8 SmartFusion2 Valid Lead-Free Part Numbers for Devices with
Design Security is new (SAR 43648).
The maximum payload size for PCIe was corrected from 256 bytes to up to 2 kbytes. (SAR 42215).
More information was included on SDRAM Support in the High-Speed Memory Interfaces, page 7
(SAR 42594).
The phrase, with 16-bit PIPE interface (Gen1/Gen2), was removed from the PCIe bullet in the
High-Speed Serial Interfaces, page 25 (SAR 43851).
•In Ta ble 1, page 8, PCIe Endpoint x4 was corrected to PCIe Endpoint ×1, ×2, ×4 (SAR 43851).
The number of I/Os for M2S025 in the FG484 package was corrected from 267 to 289 in Tab le 2,
page 10 and Tab le 3, page 10 (SAR 42618).
The Y security designator was removed from SmartFusion2 Ordering Information (SAR 42231).
•The SGMII PHY Interface, page 24 was revised to change from allocating one of the high-speed
serial channels to SGMII and by implementing custom logic in the fabric to allocating one of the
high-speed serial channels to and utilizing the CoreTBI soft IP block (SAR 43851).
•The PCI Express, page 25 was corrected to state the SmartFusion2 family has up to four high-speed
serial interface blocks rather than two. The following bullets were removed (SAR 43851):
Intel’s PIPE interface (8-bit/16-bit) to interface between the PHY MAC and PHY (SerDes)
Fully compliant PHY PCS sub-layer (125/250 MHz)
Support for SDRAM memories was removed from the High-Speed Memory Interfaces: DDRx
Memory Controllers , page 25 (SAR 42594). The text was corrected to state there are up to three,
rather than two, DDR subsystems (SAR 43851).
•The MDDR Subsystem, page 26 was revised to explain that support for 3.3 V Single Data Rate
DRAMs (SDRAM) can be obtained by using the SMC_FIC interface (SAR 42594).
•The FDDR Subsystem, page 26 was revised to remove the statement that the APB configuration
bus can be mastered by the MSS directly (SAR 42594).
•The SmartFusion2 Development Tools, page 26chapter was revised to indicate that Libero SoC
includes SoftConsole (GNU/Eclipse) (SAR 41972).
1.25 Revision 3.0
The following is a summary of changes made in revision 3.0:
Figure 1, page 8 was updated.
Table 7, page 15 was added.
1.26 Revision 2.0
Information was updated based on ongoing development of specifications.
1.27 Revision 1.0
Information was reorganized and updated based on ongoing development of specifications.
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2 SmartFusion2 SoC FPGA Overview
Microsemi SmartFusion®2 SoC FPGAs integrate a fourth-generation, flash-based FPGA fabric, an ARM
Cortex-M3 processor, and high-performance communications interfaces on a single chip. The
SmartFusion2 family is the industry’s lowest-power, most reliable, and highest-security programmable
logic solution.
SmartFusion2 SoC FPGAs offer up to 3.6X the gate density and up to 2X the performance of previous
flash-based FPGA families, and also include multiple memory blocks and multiply-accumulate blocks for
DSP processing. The 166-MHz ARM Cortex-M3 processor is enhanced with an embedded trace
macrocell (ETM), a memory protection unit (MPU), an 8-KB instruction cache, and additional peripherals,
including controller area network (CAN), gigabit Ethernet, and a high-speed universal serial bus (USB).
High-speed serial interfaces include PCI Express (PCIe), 10-Gbps Attachment Unit Interface
(XAUI)/XGMII extended sublayer (XGXS), plus native serialization/deserialization (SerDes)
communication. The DDR2/DDR3 memory controllers available in the devices provide high-speed
memory interfaces.
2.1 Features
The following sections list the features of SmartFusion2 SoC FPGAs.
2.1.1 Reliability
Single event upset (SEU)-immune
Zero FIT FPGA configuration cells
Junction temperature
125 °C—military temperature
100 °C—industrial temperature
85 °C—commercial temperature
125 °C—automotive
Single error correct double error detect (SECDED) protection on the following:
Ethernet buffers
CAN message buffers
Cortex-M3 embedded scratch pad memory (eSRAMs)
USB buffers
PCIe buffer
DDR memory controllers with optional SECDED modes
Buffers implemented with SEU resistant latches on the following:
DDR bridges (MSS, MDDR, and FDDR)
Instruction cache
MMUART FIFOs
SPI FIFOs
NVM integrity check at power-up and on demand
No external configuration memory required—instant-on, retains configuration when powered off
2.1.2 Security
Design security features (available on all devices)
Intellectual property (IP) protection through unique security features and use models new to the
PLD industry
Built-in CRI DPA pass-through license from Rambus Cryptography Research
Encrypted user key and bitstream loading, enabling programming in less-trusted locations
Supply-chain assurance device certificate
Enhanced anti-tamper features
• Zeroization
Data security features
Non-deterministic random bit generator (NRBG)
User cryptographic services (AES-256, SHA-256, and elliptical curve cryptographic (ECC)
engine)
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User physically unclonable function (PUF) key enrollment and regeneration
CRI pass-through DPA patent portfolio license
Hardware firewalls protecting microcontroller subsystem (MSS) memories
2.1.3 Low Power
Low static and dynamic power
Flash*Freeze mode for fabric
Power as low as 13 mW/Gbps per lane for SerDes devices
Up to 50% lower total power than competing SoC devices
2.1.4 High Performance
Efficient 4-input look-up tables (LUTs) with carry chains for high performance and low power
Up to 236 blocks of dual-port 18-Kbit SRAM (LSRAM) with 400 MHz synchronous performance (512
× 36, 512 × 32, 1 Kb × 18, 1 Kb × 16, 2 kbit × 9, 2 Kb × 8, 4 Kb × 4, 8 Kb × 2, or 16 Kb × 1)
Up to 240 blocks of three-port 1-Kb SRAM with two read ports and one write port (micro SRAM)
High-performance DSP signal processing
Up to 240 fast mathblocks with 18 × 18 signed multiplication, 17 × 17 unsigned multiplication
and 44-bit accumulator
2.1.5 Microcontroller Subsystem
Hard 166-MHz 32-Bit ARM Cortex-M3 processor
1.25 DMIPS/MHz
8 Kbyte instruction cache
Embedded trace macrocell (ETM)
Memory protection unit (MPU)
Single cycle multiplication, hardware divide
JTAG debug (4 wires), serial wire debug (SWD, 2 wires), and serial wire viewer (SWV)
interfaces
64 KB embedded SRAM (eSRAM)
Up to 512 KB embedded nonvolatile memory (eNVM)
Triple-speed Ethernet (TSE) 10/100/1000 Mbps MAC
USB 2.0 high speed on-the-go (OTG) controller with ULPI interface
2.0B-compliant CAN controller, conforms to ISO11898-1, 32 transmit and 32 receive buffers
Two SPI ports, two I2C ports, and multi-mode UARTs (MMUART) peripherals
Hardware-based watchdog timer
One general-purpose 64-bit (or two 32-bit) timer(s)
Real-time calendar/counter (RTC)
DDR bridge (4-port data R/W buffering bridge to DDR memory) with 64-bit AXI interface
Non-blocking, multi-layer AHB bus matrix allowing multi-master scheme supporting 10 masters and
7 slaves
Two AHB-Lite/APB3 interfaces to FPGA fabric (master/slave-capable)
Two DMA controllers to offload data transactions from the Cortex-M3 processor
8-channel peripheral DMA (PDMA) for data transfer between MSS peripherals and memory
High-performance DMA (HPDMA) for data transfer between eSRAM and DDR memories
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2.1.6 Clocking Resources
Clock sources
Up to two high precision 32 KHz to 20 MHz main crystal oscillator
1-MHz embedded RC oscillator
50-MHz embedded RC oscillator
Up to eight clock conditioning circuits (CCCs) with up to eight integrated analog PLLs
Output clock with eight output phases and 45° phase difference (multiply/divide and delay
capabilities)
Frequency: 1 MHz to 200 MHz input, 20 MHz to 400 MHz output
2.1.7 High-Speed Serial Interfaces
Up to 16 SerDes lanes, each supporting:
XGXS/XAUI extension (to implement a 10-Gbps (XGMII) Ethernet PHY interface)
Native EPCS SerDes interface that facilitates implementation of serial rapidIO (SRIO) in fabric
or an SGMII interface to the Ethernet MAC in MSS
PCI express (PCIe) endpoint controller
×1, ×2, and ×4 lane PCI express core
Maximum payload size of up to 256 bytes
64-bit/32-bit AXI interface and 64-Bit/32-Bit AHB master and slave interfaces to the application
layer
2.1.8 High-Speed Memory Interfaces
Up to two high-speed DDRx memory controllers
MSS DDR (MDDR) and fabric DDR (FDDR) controllers
Supports LPDDR/DDR2/DDR3
Maximum 333 MHz DDR clock rate
SECDED enable/disable feature
Supports various DRAM bus width modes, ×8, ×9, ×16, ×18, ×32, ×36
Supports command reordering to optimize memory efficiency
Supports data reordering, returning critical word first for each command
SDRAM support through the SMC_FIC and additional soft SDRAM memory controller
2.1.9 Operating Voltage and I/Os
1.2 V core voltage
Multi-standard user I/Os (MSIO/MSIOD)
LVTTL/LVCMOS 3.3 V (MSIO Only)
LVCMOS 1.2 V, 1.5 V, 1.8 V, 2.5 V
DDR (SSTL2_1, SSTL2_2)
LVDS, MLVDS, Mini-LVDS, RSDS differential standards
•PCI
LVPECL (receiver only)
DDR I/Os (DDRIO)
DDR2, DDR3, LPDDR, SSTL2, SSTL18, HSTL
LVCMOS 1.2 V, 1.5 V, 1.8 V, 2.5 V
Market-leading number of user I/Os with 5G SerDes
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2.2 Block Diagram
The following figure shows the various blocks available in SmartFusion2 SoC FPGAs, such as MSS,
system controller, FPGA fabric logic elements (LE), and user I/Os.
Figure 1 • SmartFusion2 SoC FPGA Block Diagram
The following table lists the features supported by devices in the SmartFusion2 SoC FPGA family.
Table 1 • SmartFusion2 SoC FPGA Product Family1 2
Peripheral Feature
M2S005
(S)
M2S010
(S/T/TS)
M2S025
(T/TS)
M2S050
(T/TS)
M2S060
(T/TS)
M2S090
(T/TS)
M2S150
(T/TS)
Logic/DSP Maximum logic
elements
(4-input LUT +
DFF)3
6,060 12,084 27,696 56,340 56,520 86,184 146,124
Mathblocks
(18 × 18)
11 22 34 72 72 84 240
Fabric interface
controllers
11 1 2 1 1 2
PLLs and CCCs 2 2 6 6 6 6 8
Data security AES256,
SHA256,
and RNG
AES256,
SHA256,
and RNG
AES256,
SHA256,
and RNG
AES256,
SHA256,
and RNG
AES256,
SHA256,
RNG,
ECC, and
PUF
AES256,
SHA256,
RNG,
ECC, and
PUF
AES256,
SHA256,
RNG,
ECC, and
PUF
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MSS Cortex-M3 +
instruction cache
Yes Yes Yes Yes Yes Yes Yes
eNVM (KB) 128 256 256 256 256 512 512
eSRAM (KB) 64 64 64 64 64 64 64
eSRAM (KB) Non-
SECDED
80 80 80 80 80 80 80
CAN 11 11111
10/100/1000
Ethernet
11 1 1 1 1 1
High-speed USB 1 1 1 1 1 1 1
Multi-mode UART 2 2 2 2 2 2 2
SPI 2 2 2 2 2 2 2
I2C 22 22222
Timer 22 22222
Fabric
Memory
LSRAM 18 K blocks 10 21 31 69 69 109 236
uSRAM 1 K blocks 11 22 34 72 72 112 240
Total RAM (Kb) 191 400 592 1314 1314 2074 4488
High Speed DDR Controllers
(Count × Width)
1 × 18 1 × 18 1 × 18 2 × 36 1 × 18 1 × 18 2 × 36
SerDes lanes (T) 0 4 4 8 4 4 16
PCIe endpoints 0 1 1 2 2 2 4
User I/Os MSIO (3.3 V) 119 123 157 139 271 309 292
MSIOD (2.5 V) 28 40 40 62 40 40 106
DDRIO (2.5 V) 66 70 70 176 76 76 176
Total user I/Os 209 233 267 377 387 425 574
Grades Commercial (C)
Industrial (I)
Military (M)
Automotive (T2)
C, I, T2 C, I, M, T2 C, I, M, T2 C, I, M, T2 C, I, M, T2 C, I, M, T2 C, I, M
1. Feature availability is package dependent.
2. Data security features are only available in S and TS devices.
3. Total logic may vary based on utilization of DSP and memories in the design. See UG0445: IGLOO2 FPGA and SmartFusion2
SoC FPGA Fabric User Guide for details.
Table 1 • SmartFusion2 SoC FPGA Product Family1 2 (continued)
Peripheral Feature
M2S005
(S)
M2S010
(S/T/TS)
M2S025
(T/TS)
M2S050
(T/TS)
M2S060
(T/TS)
M2S090
(T/TS)
M2S150
(T/TS)
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2.3 I/Os Per Package
The following table lists the package options.
Notes:
All the packages mentioned in this table are available both with lead and lead-free.
(G) indicates that the package is RoHS 6/6-compliant (Pb-free).
Automotive T2 grade devices are only available in the VF(G)256, VF(G)400, FG(G)484, and
FG(G)676 packages.
The following table lists the I/Os per package. Shaded cells indicate vertical migration capability.
Table 2 • Package Options
Packages Pitch (mm) Length × Width (mm)
FCS(G)325 0.5 11 × 11
VF(G)256 0.8 14 × 14
FCS(G)536 0.5 16 × 16
VF(G)400 0.8 17 × 17
FCV(G)484 0.8 19 × 19
TQ(G)144 0.5 20 × 20
FG(G)484 1.0 23 × 23
FG(G)676 1.0 27 × 27
FG(G)896 1.0 31 × 31
FC(G)1152 1.0 35 × 35
Table 3 • I/Os per Package
Packages
M2S005
(S)
M2S010
(S/T/TS)1,2
M2S025
(T/TS)1
M2S050
(T/TS)1
M2S060
(T/TS)1
M2S090
(T/TS)1, 3, 4
M2S150
(T/TS)5
FCS(G)325 I/Os 180 200 200 180
Lanes 2224
VF(G)256 I/Os 161 138 138
Lanes 2 2
FCS(G)536 I/Os 293
Lanes 4
VF(G)400 I/Os 171 195 207 207 207
Lanes 4444
FCV(G)484 I/Os 248
Lanes 4
TQ(G)144 I/Os 84 84
Lanes
FG(G)484 I/Os 209 233 267 267 267 267
Lanes 44444
FG(G)676 I/Os 387 425
Lanes 4 4
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The following table lists features supported for various device-package combinations.
FG(G)896 I/Os 377
Lanes 8
FC(G)1152 I/Os 574
Lanes 16
1. Military temperatures 010, 025, 050, 060, and 090 are only available in the FG(G)484 package.
2. The M2S010S device is only available in the TQ(G)144 package.
3. The 090 FCSG325 package dimensions are 11 × 13.5 mm.
4. The M2S090 (T/TS) device in the FCS(G)325 package is available with an ordering code of XZ48. This ordering code
pre-configures the device for Auto Update mode. Minimum order quantities apply. Contact your local Microsemi sales office for
details.
5. Military temperature 150 devices are only available in the FC(G)1152 package.
Table 4 • Features per Device-Package Combination
Features
Package Devices MDDR FDDR
Crystal
Oscillators
5G
SerDes
Lanes1PCIe
Endpoints ULPI UTMI
MSIO
(3.3 V
max)2
MSIOD
(2.5 V
max)3
DDRIO
(2.5 V
max)
Total User
I/Os
TQ(G)144 M2S005 (S) 2 1 1 52 9 23 84
M2S010 (S) 2 1 1 50 11 23 84
VF(G)256 M2S005 (S) 2 1 1 119 12 30 161
M2S010 (T/TS) ×1842 2 1 1 1 66 8 64 138
M2S025 (T/TS) ×1852 2 1 1 1 66 8 64 138
FCS(G)325 M2S025 (T/TS) ×1852 2 1 1 1 94 22 64 180
M2S050 (T/TS) ×1861 2 1 0 1 90 22 88 200
M2S060 (T/TS) ×1852 2 2 1 1 114 22 64 200
M2S090 (T/TS) ×1852 4 2 1 1 104 12 64 180
VF(G)400 M2S005 (S) ×1852 1 1 79 28 64 171
M2S010 (T/TS) ×1852 4 1 1 1 99 32 64 195
M2S025 (T/TS) ×1852 4 1 1 1 111 32 64 207
M2S050 (T/TS) ×1851 4 1 0 1 87 32 88 207
M2S060 (T/TS) ×1852 4 2 1 1 111 32 64 207
FCV(G)484 M2S150 (T/TS) ×185×185244
61 1 91 34 123 273
FG(G)484 M2S005 (S) ×1852 1 1 115 28 66 209
M2S010 (T/TS) ×1852 4 1 1 1 123 40 70 233
M2S025 (T/TS) ×1852 4 1 1 1 157 40 70 267
M2S050 (T/TS) ×1861 4 1 0 1 105 40 122 267
M2S060 (T/TS) ×1852 4 2 1 1 157 40 70 267
M2S090 (T/TS) ×1852 4 2 1 1 157 40 70 267
FCS(G)536 M2S150 (T/TS) ×185×185244
71 1 151 16 126 293
Table 3 • I/Os per Package (continued)
Packages
M2S005
(S)
M2S010
(S/T/TS)1,2
M2S025
(T/TS)1
M2S050
(T/TS)1
M2S060
(T/TS)1
M2S090
(T/TS)1, 3, 4
M2S150
(T/TS)5
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The following table lists the programming interfaces supported for various device-package combinations.
FG(G)676 M2S060 (T/TS) ×1852 4 2 1 1 271 40 76 387
M2S090 (T/TS) ×1852 4 2 1 1 309 40 76 425
FG(G)896 7M2S050 (T/TS) ×368×3691 8 2 1 1 139 62 176 377
FC(G)1152 M2S150 (T/TS) ×369×3610 2 16 4 1 1 292 106 176 574
1. Maximum SerDes rate for military temperature devices is 3.125 Gbps.
2. Number of differential MSIO is the number of MSIOs/2 for even and (Number of MSIOs-1)/2 for odd MSIO. Supports LVDS 3.3/2.5
standard.
3. Number of differential MSIOD is Number of MSIODs/2 for even and (Number of MSIODs-1)/2 for odd MSIOD. Supports only
LVDS 2.5 standard.
4. DDR supports ×18, ×16, ×9, and ×8 modes.
5. DDR supports ×18 and ×16 modes.
6. 4 PCIe Gen1/Gen2 endpoints ×1 lane configuration.
7. DDR3 is non-compliant. Call technical support for details.
8. DDR supports ×36, ×32, ×18, and ×16 modes.
9. DDR supports ×36, ×32, ×18, ×16, ×9, and ×8 modes.
Table 5 • Programming Interfaces per Device-Package Combination
Package Devices JTAG SPI_0 Flash_GOLDEN_N
System
Controller SPI
Port
TQ(G)144 M2S005 (S) Yes Yes No No
M2S010 (S) Yes Yes No No
VF(G)256 M2S005 (S) Yes Yes Yes Yes
M2S010 (T/TS) Yes Yes Yes No
M2S025 (T/TS) Yes Yes Yes No
FCS(G)325 M2S025 (T/TS) Yes Yes No No
M2S050 (T/TS) Yes Yes No No
M2S060 (T/TS) Yes Yes No No
M2S090 (T/TS) Yes Yes No No
VF(G)400 M2S005 (S) Yes Yes Yes Yes
M2S010 (T/TS) Yes Yes Yes Yes
M2S025 (T/TS) Yes Yes Yes Yes
M2S050 (T/TS) Yes Yes Yes Yes
M2S060 (T/TS) Yes Yes Yes Yes
FCV(G)484 M2S150 (T/TS) Yes Yes Yes Yes
Table 4 • Features per Device-Package Combination (continued)
Features
Package Devices MDDR FDDR
Crystal
Oscillators
5G
SerDes
Lanes1PCIe
Endpoints ULPI UTMI
MSIO
(3.3 V
max)2
MSIOD
(2.5 V
max)3
DDRIO
(2.5 V
max)
Total User
I/Os
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The following table lists the resources required for various programming modes.
FG(G)484 M2S005 (S) Yes Yes Yes Yes
M2S010 (T/TS) Yes Yes Yes Yes
M2S025 (T/TS) Yes Yes Yes Yes
M2S050 (T/TS) Yes Yes Yes Yes
M2S060 (T/TS) Yes Yes Yes Yes
M2S090 (T/TS) Yes Yes Yes Yes
FCS(G)536 M2S150 (T/TS) Yes Yes Yes Yes
FG(G)676 M2S060 (T/TS) Yes Yes Yes Yes
M2S090 (T/TS) Yes Yes Yes Yes
FG(G)896 M2S050 (T/TS) Yes No Yes Yes
FC(G)1152 M2S150 (T/TS) Yes Yes Yes Yes
Table 6 • Resources Required per Programming Mode
Programming Mode JTAG SPI_0 Flash_GOLDEN_N
System
Controller SPI
Port
External FlashPro4/5 Yes No No No
External uP – JTAG slave Yes No No No
External uP – SPI slave No No No Yes
Autoprogramming No Yes Yes No
Two-step IAP No Yes No No
Programming recovery No Yes No No
Table 5 • Programming Interfaces per Device-Package Combination (continued)
Package Devices JTAG SPI_0 Flash_GOLDEN_N
System
Controller SPI
Port
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2.4 Ordering Information
Each SmartFusion2 device model has a unique part number, which is used for ordering the device. The
part number consists of various elements, each providing additional information about the device. Using
the M2S050 device as an example, the following figure shows the significance of each element in the
part number.
Figure 2 • Elements in a Part Number
Notes:
M2S005 devices do not support transceivers and are not available in the military temperature grade.
Automotive grade devices are available with S and TS prefixes.
Speed Grade
Blank
=
PCIe Gen 1 Support Only Standard Speed Grade
TS
T
=
S
=
Design
and Data
Security
=
Transceiver, Design, and Data Security
Transceiver and Design Security
Blank
=
Design Security
1
=
15 % Faster than STD, PCIe Gen 1 and Gen 2
M2S050 TS FG
Device Family (Digits indicate approximate number of LUTs in Thousands)
Prefix
1
Package Type
VF
=
=
Very Fine Pitch Ball Grid Array (0.8 mm pitch)
896 I
Package Lead Count
G
RoHS Status
Application (Temperature Range)
Blank
=
Commercial (0 °C to 85 °C Junction Temperature
)
I
=
Industrial (–40 °C to 100 °C Junction Temperature)
M
=
Military (–55 °C to 125 °C Junction Temperature)
AEC-Q100 Automotive Grade 2
(–40 °C to 125 °C Junction Temperature)
T2
=
Blank
=
RoHs 5/6 Compliant / Package contains Pb (Lead)
G
=
RoHS 6/6 Compliant / Pb-free packaging
M2S005
M2S010
M2S025
M2S060
M2S050
M2S090
M2S150
FG
=
Fine Pitch Ball Grid Array (1.0 mm pitch)
FC Flip Chip Ball Grid Array (1.0 mm pitch)
TQ
=
Thin Quad Flat Pack Rectangular Package (0.5 mm pitch)
=
FCS Flip Chip Ball Grid Array (0.5 mm pitch)
FCV
=
Very Fine Pitch Flip Chip Ball Grid Array (0.8 mm pitch)
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2.5 Temperature Grades
This section provides details of SmartFusion2 SoC devices available in commercial, industrial, and
military temperature grades.
2.5.1 SmartFusion2 Commercial and Industrial Temperature Grade
Devices
The following table indicates transceiver and data security support in SmartFusion2 C and I temperature
grade devices. The following feature codes are used in the table:
T—indicates that a transceiver-only version is available for the device
S—indicates that a data security-only version is available for the device
TS—indicates that a version with both transceiver and data security is available for the device
Depending on the features desired, the associated feature code (T, S, or TS) is included after the device
name and before the package name in the device part number. All the devices can also be ordered
without transceiver and data security. In this case, no feature code is included in the part number. For
example, the following are the part numbers for an M2S025 device in an FCSG325 package:
With transceiver only: M2S025TFCSG325
With both transceiver and data security: M2S025TSFCSG325
Without both transceiver and data security: M2S025FCSG325
2.5.2 SmartFusion2 Military Temperature Grade Devices
The following are the SmartFusion2 military temperature grade devices:
M2S010 (T/TS)-1FG(G)484M
M2S025 (T/TS)-1FG(G)484M
M2S050 (T/TS)-1FG(G)484M
M2S060 (T/TS)-1FG(G)484M
M2S090 (T/TS)-1FG(G)484M
M2S150 (T/TS)-1FC(G)1152M
M2S150 (T/TS)-1FCV484M
Note: Gold wire bonds are available for the FG484 package. To order a package with gold wire bonds, append
X399 to the part number when placing the order (for example, M2S090 (T/TS)-1FG484MX399).
Table 7 • Transceiver and Data Security Support in SmartFusion2 Devices
M2S FCS(G)325 VF(G)256 FCS(G)536 VF(G)400 FCV(G)484 TQ(G)144 FG(G)484 FG(G)676 FG(G)896 FC(G)1152
005 S S S S
010 T, TS T, TS S T, TS
02 5 T, T S T, TS T, TS T, TS
050 T, TS T, TS T, TS T, TS
060 T, TS T, TS T, TS T, TS
090 T, TS T, TS T, TS
150 T, TS T, TS T, TS
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2.6 SmartFusion2 Device Status
See DS0128: IGLOO2 and SmartFusion2 Datasheet for device status.
2.7 SmartFusion2 Datasheet and Pin Descriptions
The following documents contain detailed specifications and pin descriptions for SmartFusion2 SoC
FPGAs:
DS0128: IGLOO2 and SmartFusion2 Datasheet
DS0134: SmartFusion2 and IGLOO2 Automotive Grade 2 Datasheet
PB0136: Automotive Grade 2 SmartFusion2 SoC FPGAs Product Brief
DS0115: SmartFusion2 Pin Descriptions Datasheet
2.8 Marking Specifications
Microsemi normally topside-marks the part number on every SmartFusion2 device along with other
device specifications, as shown in the following figure.
2.8.1 Description
Device Name (M2XXXX): M2S for SmartFusion2 Devices
Example: M2S050TS
Package (PK###): Available package, assigned as follows:
PK: Package code1:
FG(G): Fine Pitch BGA, 1.00 mm pitch
FC(G): Flip Chip Fine Pitch BGA with Metal LID on top, 1.00 mm pitch
FCV(G): Flip Chip Very Fine Pitch BGA with Metal LID on top, 0.8 mm pitch
FCS(G): Flip Chip Ultra Fine Pitch BGA with Metal LID on top, 0.5 mm pitch
VF(G): Very Fine Pitch BGA, 0.8 mm pitch
TQ(G): Ultra Fine Pitch Thin Quad Flat Pack Package, 0.5 mm pitch
###: Number of Pins: Can be three or four digits. For example,144, 256, or 1152
Wafer lot (AAAAAASSX): Microsemi wafer lot number
AAAAAA: Wafer lot number
X: One digit die revision code
SS: Two blank spaces
Speed grade (-##): Speed Binning Number
Blank: Standard speed grade
-1: -1 Speed grade
1. All the packages mentioned above are available both with lead and lead-free. (G) indicates that the package is
RoHS 6/6-compliant (Pb-free).
Device Name
Package
Product Grade
Wafer Lot#
Date Code
Speed Grade
Part Number Prefix
Country of Origin
Customer Type
Number
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Product grade (Z): Product Grade; assigned as follows:
Blank/C: Commercial
ES: Engineering Samples
I: Industrial
M: Military Temperature
PP: Pre Production
T2: AEC-Q100 Automotive Grade 2
Date code (YYWWSS%): Assembly Date Code
YY: Last two digits for seal year
WW: Work week the part was sealed
SS: Two blank spaces
%: Can be digital number or character for new product
Customer type number: As specified on the lot traveler
GW: Gold Wire bond
Part number prefix: Part number prefix, assigned as follows:
Blank: Design security
T: Transceivers and design security
S: Design and data security
TS: Transceiver, design, and data security
Country of origin (CCD): Assembly house country code
China: CHN
Hong Kong: HKG
Japan: JPN
Korea, South: KOR
Philippines: PHL
Taiwan: TWN
Singapore: SGP
United States: USA
Malaysia: MYS
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3 SmartFusion2 SoC FPGA Feature
Description
The following figure shows the SmartFusion2 SoC FPGA chip layout with various components of the
FPGA highlighted.
Figure 3 • SmartFusion2 SoC FPGA Chip Layout
The following sections provide detailed information about the security, reliability, power, and performance
features supported by SmartFusion2 SoC FPGAs. Reliability
SmartFusion2 flash-based fabric has zero FIT configuration rate due to its SEU immunity, which is critical
in reliability applications. The flash fabric also has the advantage that no external configuration memory
is required, making the device instant-on; it retains configuration when powered off. To complement this
unique FPGA capability, SmartFusion2 devices add reliability to many other aspects of the device. Single
error correct double error detect (SECDED) protection is implemented on the Cortex-M3 embedded
scratch pad memory, Ethernet, CAN, and USB buffers, and is optional on the DDR memory controllers.
This means that if a one-bit error is detected, the error is corrected automatically. If errors of more than
one bit are detected, they are not corrected. SECDED error signals are brought to the FPGA fabric to
allow the user to monitor the status of these protected internal memories. Other areas of the architecture
are implemented with latches, which are more resistant to SEUs. Therefore, no correction is needed in
DDR bridges (MSS, MDDR, and FDDR), instruction cache and MMUART, SPI, and PCIe FIFOs.
MSS and
DDR
East I/Os
PLLs
PLLs
West I/Os
PLLs
FPGA
Fabric
SERDES
uSRAM
(1 Kb)
Math
Blocks
LSRAM
(18 Kb)
SERDES
eNVM
Oscillators
System
Controller
Crystal
Fabric DDR
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3.1 Highest Security Devices
Building further on the intrinsic security benefits of flash nonvolatile memory technology, the
SmartFusion2 family incorporates all the legacy security features that made the original SmartFusion®,
Fusion®, IGLOO®, and ProASIC®3 third-generation flash FPGAs and cSoCs the gold standard for
secure devices in the PLD industry. In addition, the fourth-generation flash-based SmartFusion2 SoC
FPGAs add many unique design security features, data security features, and use models new to the
PLD industry.
3.1.1 Design Security vs. Data Security
When classifying the security attributes of programmable logic devices (PLDs), a useful distinction is
made between design security and data security.
3.1.2 Design Security
Design security protects the intent of the owner of the design such as keeping the design and associated
bitstream keys confidential, preventing design changes (for example, insertion of Trojan Horses), and
controlling the number of copies made throughout the device life cycle. Design security may also be
known as intellectual property (IP) protection. It is one aspect of anti-tamper (AT) protection. Design
security applies to the device from initial production, includes any updates such as in-the-field upgrades,
and can include decommissioning of the device at the end of its life, if desired. Good design security is a
prerequisite for good data security.
The following table lists the design security features supported in various SmartFusion2 devices. Blank
cells indicate that the feature is not supported.
Table 8 • Design Security Features
Feature M2S005,
M2S010,
M2S025, and
M2S050
M2S060,
M2S090, and
M2S150
Software memory protection unit (MPU) Yes Yes
FlashLock® passcode security (256-bit) Yes Yes
Flexible security settings using flash lock-bits Yes Yes
Encrypted/authenticated design key loading Yes Yes
Symmetric key design security (256-bit) Yes Yes
Design key verification protocol Yes Yes
Encrypted/authenticated configuration loading Yes Yes
Certificate-of-conformance (C-of-C) Yes Yes
Back-tracking prevention (also known as, versioning) Yes Yes
Device certificate(s) (anti-counterfeiting) Yes Yes
Support for configuration variations Yes Yes
Fabric NVM and eNVM integrity tests Yes Yes
Information services (S/N, Cert., USERCODE, and others) Yes Yes
Tamper detection Yes Yes
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3.1.3 Data Security
Data security is protecting the information the FPGA is storing, processing, or communicating in its role in
the end application. If, for example, the configured design is implementing the key management and
encryption portion of a secure military radio, data security could entail encrypting and authenticating the
radio traffic, and protecting the associated application-level cryptographic keys. Data security is closely
related to the terms information assurance (IA) and information security. All SmartFusion2 devices
incorporate enhanced design security, making them the most secure programmable logic devices ever
made. Select SmartFusion2 models also include an advanced set of on-chip data security features that
make designing secure information assurance applications easier and better than ever before.
The following table lists the data security features supported in various SmartFusion2 devices. Blank
cells indicate that the feature is not supported.
Tamper response (includes Zeroization) Yes Yes
ECC public key design security (384-bit) Yes
Hardware intrinsic design key (SRAM-PUF) Yes
Table 9 • Data Security Features
Feature M2S005S,
M2S010S,
M2S010TS,
M2S025TS, and
M2S050TS
M2S060TS,
M2S090TS, and
M2S150TS
CRI pass-through DPA patent license Yes Yes
Hardware firewalls protecting access to memories Yes Yes
Non-deterministic random bit generator service Yes Yes
AES-128/256 service (ECB, OFB, CTR, CBC modes) Yes Yes
SHA-256 service Yes Yes
HMAC-SHA-256 service Yes Yes
Key tree service Yes Yes
PUF emulation (Pseudo-PUF) Yes
PUF emulation (SRAM-PUF) Yes
ECC point-multiplication service Yes
ECC point-addition service Yes
User SRAM-PUF enrollment service Yes
User SRAM-PUF activation code export service Yes
SRAM-PUF intrinsic key generation and enrollment service Yes
SRAM-PUF key importance and enrollment service Yes
SRAM-PUF key regeneration service Yes
Table 8 • Design Security Features (continued)
Feature M2S005,
M2S010,
M2S025, and
M2S050
M2S060,
M2S090, and
M2S150
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3.2 Low Power
Microsemi’s flash-based FPGA fabric results in extremely low-power design implementation with static
power as low as 7.5 mW for 6,060 LE devices. Flash*Freeze technology provides an ultra-low power
static mode (Flash*Freeze mode) for SmartFusion2 devices with power less than 11 mW for the largest
device that contains146,124 logic elements. Flash*Freeze mode entry retains all the SRAM and register
information, and the exit from Flash*Freeze mode achieves rapid recovery to active mode.
3.3 High-Performance FPGA Fabric
Built on 65 nm process technology, the SmartFusion2 SoC FPGA fabric is composed of four building
blocks such as the logic module, the large SRAM, the micro SRAM, and the mathblock. The logic module
is the basic logic element and has advanced features:
A fully permutable 4-input LUT optimized for lowest power
A dedicated carry chain based on carry look-ahead technique
A separate flip-flop which can be used independently from the LUT
The 4-input LUT can be configured either to implement any 4-input combinatorial function or to
implement an arithmetic function where the LUT output is XORed with carry input to generate the sum
output.
3.3.1 Dual-Port Large SRAM
Large SRAM (LSRAM) (RAM1Kx18) is targeted for storing large memory for use with various operations.
Each LSRAM block can store up to 18,432 bits. Each RAM1Kx18 block contains two independent data
ports such as Port A and Port B. LSRAM is synchronous for both read and write operations. Operations
are triggered on the rising edge of the clock. The data output ports of the LSRAM have pipeline registers
which have control signals that are independent of the SRAM’s control signals.
3.3.2 Three-Port Micro SRAM
SRAM(RAM64x18) is the second type of SRAM, which is embedded in the fabric of SmartFusion2
devices. RAM64x18 uSRAM is a 3-port SRAM; Port A and Port B are used as read ports and Port C is
used as write port. The two read ports are independent of each other and can perform read operations in
both synchronous and asynchronous modes. The write port is always synchronous. The uSRAM block is
approximately 1 KB (1,152 bits) in size. These uSRAM blocks are primarily targeted for building
embedded FIFOs to be used by any embedded fabric masters.
3.3.3 Mathblocks for DSP Applications
The fundamental building block in any digital signal processing algorithm is the MACC function.
SmartFusion2 SoC FPGAs implement a custom 18 x 18 MACC block for efficient implementation of
complex DSP algorithms such as finite impulse response (FIR) filters, infinite impulse response (IIR)
filters, and fast fourier transform (FFT) for filtering and image processing applications.
Each mathblock has the following capabilities:
Supports 18 x 18 signed multiplications natively (A[17:0] x B[17:0])
Supports dot product; the multiplier computes:
(A[8:0] x B[17:9] + A[17:9] x B[8:0]) x 29
Built-in addition, subtraction, and accumulation units to combine multiplication results efficiently
In addition to the basic MACC function, DSP algorithms typically need small amounts of RAM for
coefficients and larger RAMs for data storage. SmartFusion2 micro RAMs are ideally suited to serve the
needs of coefficient storage while the large RAMs are used for data storage.
3.4 Microcontroller Subsystem
The microcontroller subsystem (MSS) contains a high-performance integrated Cortex-M3 processor,
running at up to 166 MHz. The MSS contains an 8 Kbyte instruction cache to provide low latency access
to internal eNVM and external DDR memory. The MSS provides multiple interface options to the FPGA
fabric in order to facilitate tight integration between the MSS and user logic in the fabric.
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3.4.1 ARM Cortex-M3 Processor
The MSS uses the latest revision (r2p1) of the ARM Cortex-M3 processor. Microsemi’s implementation
includes the optional embedded trace macrocell (ETM) features for easier development and debug and
the memory protection unit (MPU) for real-time operating system support.
3.4.2 Cache Controller
To minimize latency for instruction fetches when executing firmware out of off-chip DDR or on-chip
eNVM, an 8 Kbyte, 4-way set associative instruction cache is implemented. This provides zero wait state
access for cache hits and is shared by both I and D code buses of the Cortex-M3 processor. In the event
of cache misses, cache lines are filled, replacing existing cache entries based on a least recently used
(LRU) algorithm.
There is a configurable option available to operate the cache in a locked mode, whereby a fixed segment
of code from either the DDR or eNVM is copied into the cache and locked there, so that it is not replaced
when cache misses occur. This would be used for performance-critical code.
It is also possible to disable the cache altogether, which is desirable in systems requiring very
deterministic execution times.
The cache is implemented with SEU tolerant latches.
3.4.3 DDR Bridge
The DDR bridge is a data bridge between four AHB bus masters and a single AXI bus slave. The DDR
bridge accumulates AHB writes into write combining buffers prior to bursting out to external DDR
memory. The DDR bridge also includes read combining buffers, allowing AHB masters to efficiently read
data from the external DDR memory from a local buffer. The DDR bridge optimizes reads and writes from
multiple masters to a single external DDR memory. Data coherency rules between the four masters and
the external DDR memory are implemented in hardware. The DDR bridge contains three write
combining / read buffers and one read buffer. All buffers within the DDR bridge are implemented with
SEU tolerant latches and are not subject to the single event upsets (SEUs) that SRAM exhibits.
SmartFusion2 devices implement three DDR bridges in the MSS, FDDR, and MDDR subsystems.
3.4.4 AHB Bus Matrix
The AHB bus matrix (ABM) is a non-blocking, AHB-Lite multi-layer switch, supporting 10 master
interfaces and 7 slave interfaces. The switch decodes access attempts by masters to various slaves,
according to the memory map and security configurations. When multiple masters are attempting to
access a particular slave simultaneously, an arbiter associated with that slave decides which master
gains access, according to a configurable set of arbitration rules. These rules can be configured by the
user to provide different usage patterns to each slave. For example, a number of consecutive access
opportunities to the slave can be allocated to one particular master, to increase the likelihood of same
type accesses (all reads or all writes), which makes more efficient usage of the bandwidth to the slave.
3.4.5 System Registers
The MSS system registers are implemented as an AHB slave on the AHB bus matrix. This means the
Cortex-M3 processor or a soft master in the FPGA fabric may access the registers and therefore control
the MSS. The system registers can be initialized by user-defined flash configuration bits on power-up.
Each register also has a flash bit to enable write protecting the contents of the registers. This allows the
MSS system configuration to be reliably fixed for a given application.
3.4.6 Fabric Interface Controller
The fabric interface controller (FIC) block provides two separate interfaces between the MSS and the
FPGA fabric such as the MSS master (MM) and fabric master (FM). Each of these interfaces can be
configured to operate as AHB-Lite or APB3. Depending on device density, there are up to two FIC blocks
(FIC_0 and FIC_1) present in the MSS.
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3.4.7 Embedded SRAM
The MSS contains two blocks of 32 KB embedded SRAM (eSRAM), giving a total of 64 KB. Having the
eSRAM arranged as two separate blocks allows the user to take advantage of the Harvard architecture
of the Cortex-M3 processor. For example, code could be located in one eSRAM, while data, such as the
stack, could be located in the other.
The eSRAM is designed for SECDED protection. When SECDED is disabled, the SRAM usually used to
store SECDED data may be reused as an extra 16 KB of eSRAM.
3.4.8 Embedded NVM
The MSS contains up to 512 KB of embedded NVM (eNVM) (64 bits wide). Accesses to the eNVM from
the Cortex-M3 processor are cacheable.
3.4.9 DMA Engines
Two DMA engines are present in the MSS such as high-performance DMA and peripheral DMA.
3.4.9.1 High-Performance DMA
The high-performance DMA (HPDMA) engine provides efficient memory to memory data transfers
between an external DDR memory and internal eSRAM. This engine has two separate AHB-Lite
interfaces—one to the MDDR bridge and the other to the AHB bus matrix. All transfers by the HPDMA
are full word transfers.
3.4.9.2 Peripheral DMA
The peripheral DMA engine (PDMA) is tuned for offloading byte-intensive operations, involving MSS
peripherals, to and from the internal eSRAMs. Data transfers can also be targeted to user logic/RAM in
the FPGA fabric.
3.4.10 APB Configuration Bus
Each SmartFusion2 device has an APB configuration bus that allow the user to initialize the SerDes
ASIC blocks, the fabric DDR memory controller, and user instantiated peripherals in the FPGA fabric.
3.4.11 Peripherals
A large number of communications and general purpose peripherals are implemented in the MSS.
3.4.11.1 USB Controller
The MSS contains a high speed USB 2.0 on-the-go (OTG) controller with the following features:
Operates either as the function controller of a high-speed / full-speed USB peripheral or as the
host/peripheral in point-to-point or multi-point communications with other USB functions.
Complies with the USB 2.0 standard for high-speed functions and with the On-The-Go supplement
to the USB 2.0 specification.
Supports OTG communications with one or more high-speed, full-speed, or low-speed devices.
3.4.11.2 Triple Speed Ethernet MAC
The triple speed Ethernet (TSE) MAC supports IEEE 802.3 10/100/1000 Mbps Ethernet operation. The
following PHY interfaces are directly supported by the MAC:
•GMII
•MII
•TBI
The Ethernet MAC hardware implements the following functions:
4 KB internal transmit FIFO and 8 KB internal receive FIFO
IEEE 802.3X full-duplex flow control
DMA of Ethernet frames between internal FIFOs and system memory (such as eSRAM or DDR)
Cut-through operation
SECDED protection on internal buffers
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3.4.11.3 SGMII PHY Interface
SGMII mode is implemented by means of configuring the MAC for 10-bit interface (TBI) operation,
allocating one of the high-speed serial channels to SGMII, and by implementing custom logic in the
fabric.
3.4.11.4 10 Gbps Ethernet
Support for 10 Gbps Ethernet is achieved by programming the SerDes interface to XAUI mode. In this
mode, a soft 10G EMAC with XGMII interface can be directly connected to the SerDes interface.
3.4.11.5 Communication Block
The communication block (COMM_BLK) provides a UART-like communications channel between the
MSS and the system controller. System services are initiated through the COMM_BLK.
3.4.11.6 Serial Peripheral Interface
The serial peripheral interface (SPI) controller is compliant with the Motorola SPI, Texas Instruments
synchronous serial, and National Semiconductor MICROWIRE formats. In addition, the SPI supports
interfacing to large SPI flash and EEPROM devices by way of the slave protocol engine. The SPI
controller supports both master and slave modes of operation.
The SPI controller embeds two 4 x 32 (depth x width) FIFOs for receive (Rx) and transmit (Tx) data.
These FIFOs are accessible through Rx data and Tx data registers. Writing to the Tx data register
causes the data to be written to the transmit FIFO. This is emptied by transmit logic. Similarly, reading
from the Rx data register causes data to be read from the receive FIFO.
3.4.11.7 Multi-Mode UART
SmartFusion2 devices contain two identical multi-mode universal asynchronous/synchronous
receiver/transmitter (MMUART) peripherals that provide software compatibility with the popular 16550
device. They perform serial-to-parallel conversion on data originating from modems or other serial
devices, and perform parallel-to-serial conversion on data from the Cortex-M3 processor to these
devices. The following are the main features supported:
Fractional baud rate capability
Asynchronous and synchronous operation
Full programmable serial interface characteristics
Data width is programmable to 5, 6, 7, or 8 bits
Even, odd, or no-parity bit generation/detection
1,1½, and 2 stop bit generation
9-bit address flag capability used for multidrop addressing topologies
3.4.11.8 I2C
SmartFusion2 devices contain two identical master/slave I2C peripherals that perform serial-to-parallel
conversion on data originating from serial devices, and perform parallel-to-serial conversion on data from
the ARM Cortex-M3 processor, or any other bus master, to these devices. The following are the main
features supported:
•I
2C v2.1
100 Kbps
400 Kbps
Dual-slave addressing
•SMBus v2.0
•PMBus v1.1
3.5 Clock Sources
SmartFusion2 devices have two on-chip RC oscillators—a 1 MHz RC oscillator and a 50 MHz RC
oscillator—and up to two main crystal oscillators (32 kHz–20 MHz). These are available to the user for
generating clocks to the on-chip resources and the logic built on the FPGA fabric array. The second
crystal oscillator available on the SmartFusion2 devices is dedicated for RTC clocking. These oscillators
(except the RTC crystal oscillator) can be used in conjunction with the integrated user phase-locked
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loops (PLLs) and fabric clock conditioning circuits (FAB_CCC) to generate clocks of varying frequency
and phase. In addition to being available to the user, these oscillators are also used by the system
controller, power-on reset circuitry, MSS during Flash*Freeze mode, and the RTC.
SmartFusion2 devices have up to eight fabric CCC (FAB_CCC) blocks and a dedicated PLL associated
with each CCC to provide flexible clocking to the FPGA fabric portion of the device. The user has the
freedom to use any of the eight PLLs and CCCs to generate the fabric clocks and the internal MSS clock
from the base fabric clock (CLK_BASE). There is also a dedicated CCC block for the MSS (MSS_CCC)
and an associated PLL (MPLL) for MSS clocking and de-skewing the CLK_BASE clock. The fabric
alignment clock controller (FACC), part of the MSS CCC, is responsible for generating various aligned
clocks required by the MSS for correct operation of the MSS blocks and synchronous communication
with the user logic in the FPGA fabric.
3.6 High-Speed Serial Interfaces
3.6.1 SerDes
SmartFusion2 has up to four 5-Gbps SerDes transceivers, each supporting four SerDes lanes.
The native EPCS SerDes interface facilitates the implementation of SRIO in the fabric or an SGMII
interface for the Ethernet MAC in the MSS. In EPCS mode, the transceiver runs at a maximum rate of
3.2 Gbps.
3.6.2 PCI Express
PCI express (PCIe) is a high speed, packet-based, point-to-point, low pin count, and serial interconnect
bus. The SmartFusion2 family has two hard high-speed serial interface blocks. Each SerDes block
contains a PCIe system block. The PCIe system is connected to the SerDes block and following are the
main features supported:
Supports ×1, ×2, and ×4 lane configuration
Endpoint configuration only
PCI Express Base Specification Revision 2.0
2.5 and 5.0 Gbps compliant
Embedded receive (2 KB), transmit (1 KB) and retry (1 KB) buffer dual-port RAM implementation
Maximum payload size of up to 256 bytes
64-bit AXI or 32-bit AHB-Lite Master and Slave interface to the application layer
32-bit APB interface to access configuration and status registers of PCIe system
Up to 3 × 64 bit base address registers
1 virtual channel (VC)
3.6.3 XAUI/XGXS
The XAUI/XGXS extension allows the user to implement a 10 Gbps (XGMII) Ethernet PHY interface by
connecting the Ethernet MAC fabric interface through an appropriate soft IP block in the fabric.
3.7 High-Speed Memory Interfaces: DDRx Memory
Controllers
There are up to three DDR subsystems, MDDR (MSS DDR), and FDDR (fabric DDR) present in
SmartFusion2 devices. Each subsystem consists of a DDR controller, PHY, and a wrapper. The MDDR
has an interface from the MSS and fabric, and FDDR provides an interface from the fabric.
The following are the main features supported by the FDDR and MDDR:
Support for LPDDR, DDR2, and DDR3 memories
Simplified DDR command interface to standard AMBA AXI/AHB interface
Up to 667 Mbps (333 MHz double data rate) performance
Supports 1, 2, or 4 ranks of memory
Supports different DRAM bus width modes: x8, x9, x16, x18, x32, and x36
Supports DRAM burst length of 2, 4, or 8 in full bus-width mode; supports DRAM burst length of 2, 4,
8, or 16 in half bus-width mode
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Supports memory densities up to 4 GB
Supports a maximum of 8 memory banks
SECDED enable/disable feature
Embedded physical interface (PHY)
Read and Write buffers in fully associative CAMs, configurable in powers of 2, up to 64 Reads plus
64 Writes
Support for dynamically changing clock frequency while in self-refresh
Supports command reordering to optimize memory efficiency
Supports data reordering, returning critical word first for each command
3.7.1 MDDR Subsystem
The MDDR subsystem has two interfaces to the DDR. One is an AXI 64-bit bus from the DDR bridge
within the MSS. The other is a multiplexed interface from the FPGA fabric, which can be configured as
either a single AXI 64-bit bus or two 32-bit AHB-Lite buses. There is also a 16-bit APB configuration bus,
which is used to initialize the majority of the internal registers within the MDDR subsystem after reset.
This APB configuration bus can be mastered by the MSS directly or by a master in the FPGA fabric.
Support for 3.3 V Single Data Rate DRAMs (SDRAM) can be obtained by using the SMC_FIC interface
in the MDDR subsystem. Users would then instantiate a soft AHB or AXI SDRAM memory controller in
the FPGA fabric and connect I/O ports to 3.3 V MSIO.
3.7.2 FDDR Subsystem
The FDDR subsystem has one interface to the DDR. This is a multiplexed interface from the FPGA
fabric, which can be configured as either a single AXI 64-bit bus or two 32-bit AHB-Lite buses. There is
also a 16-bit APB configuration bus, which is used to initialize the majority of the internal registers within
the FDDR subsystem after reset. This APB configuration bus can be mastered by the MSS or a master in
the FPGA fabric.
3.8 SmartFusion2 Development Tools
This section describes the SmartFusion2 SoC FPGA development tools.
3.8.1 Design Software
Microsemi's Libero® SoC is a comprehensive software toolset to design applications using the
SmartFusion2 device. Libero SoC manages the entire design flow from design entry, synthesis and
simulation, place and route, timing and power analysis, with enhanced integration of the embedded
design flow. System designers can leverage the easy-to-use Libero SoC that includes the following
features:
System Builder for creation of system-level architecture
Synthesis, DSP, and debug support from Synopsys
Simulation from mentor graphics
Push-button design flow with power analysis and timing analysis
SmartDebug for access to non-invasive probes within the SmartFusion2 devices
Integrated firmware flows for SoftConsole (GNU/Eclipse), IAR, and Keil
Operating system support includes uClinux from Emcraft Systems, FreeRTOS, SAFERTOS and
uc/OS-III from Micrium
See the Libero SoC Design Suite webpage for more information about Libero.
3.8.2 Design Hardware
Several SmartFusion2 kits are available for quick evaluation of the device features and prototyping. The
demo designs ensure faster learning for the users. See SmartFusion2 Kits page for more information
about various kits available in SmartFusion2.
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The following table describes the various SmartFusion2 kits and provides the board image for each kit.
3.8.3 IP Cores
SmartFusion2 SoC FPGAs contain an ARM Cortex-M3 processor and multiple peripherals hardcoded
into the device. In addition to these, Microsemi offers many soft peripherals that can be placed in the
FPGA fabric of the device. These include Core429, Core1553, CoreJESD204BRX/TX, CoreFRI,
CoreFFT, and many other DirectCores. See the IP Cores webpage for more information.
Table 10 • SmartFusion2 Kits
Kit Board Image
SmartFusion2 Starter Kit
The SmartFusion2 Starter Kit provides a cost effective platform for
evaluation and development of a SmartFusion2 SoC FPGA based
solution. The kit utilizes a miniature mezzanine form factor
system-on-module, which integrates the SmartFusion2 device with 64 MB
LPDDR, 16 MB SPI flash, and Ethernet PHY. The baseboard provides
easy to use benchtop access to the SmartFusion2 SoC and interfaces.
SmartFusion2 Security Evaluation Kit
The SmartFusion2 Security Evaluation Kit is a low cost platform to
evaluate the security, low-power consumption, reliability, and high
integration capabilities of the SmartFusion2 device. This kit has a 90K LE
device that allows a larger system to be implemented on the kit. The board
contains 512 Mb LPDDR, 64 Mb SPI flash, X1 PCIe Edge connector,
4-SMA connectors, 10/100/1000 Ethernet and GPIO connector.
SmartFusion2 Advanced Development Kit
The SmartFusion2 Advanced Development Kit offers a full featured
150K LE device. This kit has several standards and advanced peripherals
such as PCIe x4 edge connector, two FMC connectors for using several
off the shelf daughter cards, USB, Philips I2C, two Gigabit Ethernet ports,
SPI, and UART. A high precision operational amplifier circuitry on the
board measures the core power consumed by the device. The kit has
1 GB of on-board DDR3 memory and 2 Gb SPI flash.
SmartFusion2 Motor Control Kit
The SmartFusion2 Motor Control Kit is used for quick evaluation of the
motor control solution using the SmartFusion2 device. This kit supports
two axis motor control (one BLDC motor and one stepper motor).

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