LZ4-04UV00 Datasheet by OSRAM SYLVANIA Inc.

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LED Ensln' m 0mm ausNEss ntegrated flat glass lens
COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-04UV00 (1.4 11/19/2018)
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
365nm UV LED Gen 2 Emitter
LZ4-04UV00
Key Features
High flux density 365nm surface mount ceramic package UV LED with integrated flat glass lens
2.2 mm x 2.2 mm Light Emitting Surface (LES) in a 7.0 mm x 7.0mm emitter footprint
Ideal for imaging optics with beam angles as narrow as ±3o
Very low Thermal Resistance (1.1°C/W)
Electrically neutral thermal path
JEDEC Level 1 for Moisture Sensitivity Level
Lead (Pb) free and RoHS compliant
Reflow solderable (up to 6 cycles)
Emitter available on Star MCPCB (optional)
Typical Applications
Curing
Printing
PCB Exposure
Sterilization
Medical
Currency Verification
Fluorescence Microscopy
Inspection of dyes, rodent and animal contamination
Forensics
Description
The LZ4-04UV00 UV LED emitter provides superior radiometric power in the wavelength range specifically required
for applications like curing, printing, sterilization, currency verification, and various medical applications. With a
2.2mm x 2.2mm LES, this package provides exceptional optical power density. The flat glass lens facilitates the use
of imaging optics to produce extreme narrow beam angle, as well as light pipes and other optics. The high quality
materials used in the package are chosen to optimize light output, have excellent UV resistance, and minimize
stresses which results in monumental reliability and radiant flux maintenance.
UV RADIATION
Avoid exposure to the beam
Wear protective eyewear
LED EI'IGII'I m nsm auswsss
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Part number options
Base part number
Part number
Description
LZ4-04UV00-xxxx
LZ4 emitter
LZ4-44UV00-xxxx
LZ4 emitter on Standard Star MCPCB
Bin kit option codes
UV, Ultra-Violet (365nm)
Kit number
suffix
Color Bin Range
Description
0000
U0
Q minimum flux; wavelength U0 bin only
LED EI'IEII'I ,n‘ uwu 4, 5‘ max
3
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Radiant Flux Bins
Table 1:
Bin Code
Minimum
Radiant Flux (Φ)
@ IF = 700mA [1,2]
(W)
Maximum
Radiant Flux (Φ)
@ IF = 700mA [1,2]
(W)
Q
2.00
2.40
R
2.40
3.00
S
3.00
3.80
Notes for Table 1:
1. Radiant flux performance is measured at 10ms pulse, TC = 25°C. LED Engin maintains a tolerance of ± 10% on flux measurements.
Peak Wavelength Bins
Table 2:
Bin Code
Minimum
Peak Wavelength (λP)
@ IF = 700mA [1]
(nm)
Maximum
Peak Wavelength (λP)
@ IF = 700mA [1]
(nm)
U0
365
370
Notes for Table 2:
1. Peak wavelength is measured at 10ms pulse, TC = 25oC. LED Engin maintains a tolerance of ± 2.0nm on peak wavelength measurements.
Forward Voltage Bins
Table 3:
Bin Code
Minimum
Forward Voltage (VF)
@ IF = 700mA
[1]
(V)
Maximum
Forward Voltage (VF)
@ IF = 700mA
[1]
(V)
0
14.0
18.0
Notes for Table 3:
1. Forward voltage is measured at 10ms pulse, TC = 25oC. LED Engin maintains a tolerance of ± 0.04V for forward voltage measurements.
LED EI'IEII'I ,n‘ uswv' A um
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Absolute Maximum Ratings
Table 4:
Parameter
Symbol
Value
Unit
DC Forward Current[1]
IF
1000
mA
Peak Pulsed Forward Current
[2]
IFP
1000
mA
Reverse Voltage
VR
See Note 3
V
Storage Temperature
Tstg
-40 ~ +150
°C
Junction Temperature
TJ
130
°C
Soldering Temperature[4]
Tsol
260
°C
Allowable Reflow Cycles
6
ESD Sensitivity[5]
> 2,000 V HBM
Class 2 JESD22-A114-D
Notes for Table 4:
1. Maximum DC forward current is determined by the overall thermal resistance and ambient temperature. Follow the curves in Figure 11 for current derating.
2. Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%.
3. LEDs are not designed to be reverse biased.
4. Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 3.
5. LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ4-04UV00 in an electrostatic protected area (EPA).
An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.
Optical Characteristics @ TC = 25°C
Table 5:
Parameter
Symbol
Typical
Unit
Radiant Flux (@ IF = 700mA)
Φ
3.30
W
Radiant Flux (@ IF = 1000mA)
Φ
4.60
W
Peak Wavelength
[1]
λP
365
nm
Viewing Angle
[2]
1/2
110
Degrees
Total Included Angle
[3]
Θ0.9V
150
Degrees
Notes for Table 5:
1. When operating the UV LED, observe IEC 60825-1 class 3B rating. Avoid exposure to the beam.
2. Viewing Angle is the off axis angle from emitter centerline where the radiometric power is ½ of the peak value.
3. Total Included Angle is the total angle that includes 90% of the total radiant flux.
Electrical Characteristics @ TC = 25°C
Table 6:
Parameter
Symbol
Typical
Unit
Forward Voltage (@ IF = 700mA)
VF
15.2
V
Temperature Coefficient
of Forward Voltage
ΔVF/ΔTJ
-5.2
mV/°C
Thermal Resistance
(Junction to Case)
J-C
1.1
°C/W
LED EI'IGII'I m MM: wws:
5
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IPC/JEDEC Moisture Sensitivity Level
Table 7 - IPC/JEDEC J-STD-20D.1 MSL Classification:
Soak Requirements
Floor Life
Standard
Accelerated
Level
Time
Conditions
Time (hrs)
Conditions
Time (hrs)
Conditions
1
Unlimited
≤ 30°C/
85% RH
168
+5/-0
85°C/
85% RH
n/a
n/a
Notes for Table 7:
1. The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and
includes the maximum time allowed out of the bag at the distributor’s facility.
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3
4
1
2
5
6
7
8
Mechanical Dimensions (mm)
Figure 1: Package outline drawing.
Notes for Figure 1:
1. Unless otherwise noted, the tolerance = ± 0.20 mm.
2. Thermal contact, Pad 9, is electrically neutral.
Recommended Solder Pad Layout (mm)
Non-pedestal MCPCB Design Pedestal MCPCB Design
Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad for non-pedestal and pedestal design
Note for Figure 2a:
1. Unless otherwise noted, the tolerance = ± 0.20 mm.
2. Pedestal MCPCB allows the emitter thermal slug to be soldered directly to the metal core of the MCPCB. Such MCPCB eliminate the high thermal resistance
dielectric layer that standard MCPCB technologies use in between the emitter thermal slug and the metal core of the MCPCB, thus lowering the overall system
thermal resistance.
3. LED Engin recommends x-ray sample monitoring for solder voids underneath the emitter thermal slug. The total area covered by solder voids should be less
than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to higher failure
rates due to thermal over stress.
4. MCPCBs designed for other LZ4 emitters are compatible for this emitter.
Pin Out
Pad
Die
Function
1
A
Anode
2
A
Cathode
3
B
Anode
4
B
Cathode
5
C
Anode
6
C
Cathode
7
D
Anode
8
D
Cathode
9 [2]
n/a
Thermal
1.26
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7
COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-04UV00 (1.4 11/19/2018)
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Recommended Solder Mask Layout (mm)
Non-pedestal MCPCB Design Pedestal MCPCB Design
Figure 2b: Recommended solder mask opening for anode, cathode, and thermal pad for non-pedestal and pedestal design
Note for Figure 2b:
1. Unless otherwise noted, the tolerance = ± 0.20 mm.
Recommended 8mil Stencil Apertures Layout (mm)
Non-pedestal MCPCB Design Pedestal MCPCB Design
Figure 2c: Recommended solder mask opening for anode, cathode, and thermal pad for non-pedestal and pedestal design
Note for Figure 2c:
1. Unless otherwise noted, the tolerance = ± 0.20 mm.
Temperature (C) LED EI'IGII'I AN 0mm BusNEss 300 25° ‘ ‘T 235 - 255 c ‘ W W A .. 200 1 i i 150 - 1 , : ‘ <——>‘ Solking Zano ; Rm", an ‘ (2.0 mln.mlx.) .‘ 100 .
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COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-04UV00 (1.4 11/19/2018)
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
Relatiive Intensity
Angular Displacement (Degrees)
Reflow Soldering Profile
Figure 3: Reflow soldering profile for lead free soldering
Typical Radiation Pattern
Figure 4: Typical representative spatial radiation pattern
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9
COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-04UV00 (1.4 11/19/2018)
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
300 325 350 375 400 425 450
Wavelength (nm)
Relative Spectral Power
0
200
400
600
800
1000
1200
11.0 12.0 13.0 14.0 15.0 16.0 17.0 18.0
IF - Forward Current (mA)
VF - Forward Voltage (V)
Typical Relative Spectral Power Distribution
Figure 5: Typical relative spectral power vs. wavelength @ TC = 25°C
Typical Forward Current Characteristics
Figure 6: Typical forward current vs. forward voltage @ TC = 25°C
._. ._. L E D E I1 [3 I H AnasRAMmswsss
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0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0200 400 600 800 1000 1200
Normalized Radiant Flux
IF - Forward Current (mA)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
025 50 75 100
Normalized Radiant Flux
TC - Case Temperature (°C)
Typical Normalized Radiant Flux over Current
Figure 7: Typical normalized radiant flux vs. forward current @ TC = 25°C
Typical Normalized Radiant Flux over Temperature
Figure 8: Typical normalized radiant flux vs. case temperature
LED EI'IGII'I m 05w Buswiss
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-3.00
-2.00
-1.00
0.00
1.00
2.00
3.00
0200 400 600 800 1000 1200
Peak Wavelength Shift (nm)
IF - Forward Current (mA)
-2.00
-1.00
0.00
1.00
2.00
3.00
4.00
5.00
025 50 75 100
Peak Wavelength Shift (nm)
TC - Case Temperature (°C)
Typical Peak Wavelength Shift over Current
Figure 9: Typical peak wavelength shift vs. forward current @ Tc = 25°C
Typical Peak Wavelength Shift over Temperature
Figure 10: Typical peak wavelength shift vs. case temperature
._. ._. L E D E H G I H M 05mm Buswzss \\
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COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-04UV00 (1.4 11/19/2018)
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
0
200
400
600
800
1000
1200
025 50 75 100 125 150
IF - Forward Current (mA)
TA - Ambient Temperature (°C)
700
(Rated)
(TJ(MAX) = 130)
RΘJA = C/W
RΘJA = C/W
RΘJA = C/W
Current De-rating
Figure 11: Maximum forward current vs. ambient temperature based on TJ(MAX) = 130°C
Notes for Figure 11:
1. J-C [Junction to Case Thermal Resistance] for the LZ4-04UV00 is typically 1.1°C/W.
2. J-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance].
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13
COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ4-04UV00 (1.4 11/19/2018)
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Emitter Tape and Reel Specifications (mm)
Figure 12: Emitter carrier tape specifications (mm).
Figure 13: Emitter reel specifications (mm).
Notes for Figure 13:
1. Small reel quantity: up to 250 emitters
2. Large reel quantity: 250-1200 emitters.
3. Single flux bin and single wavelength bin per reel.
Ø 178mm (SMALL REEL)
Ø 330mm (LARGE REEL)
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LZ4 MCPCB Family
Part number
Type of MCPCB
Diameter
(mm)
Emitter + MCPCB
Thermal Resistance
(oC/W)
Typical VF
(V)
Typical IF
(mA)
LZ4-4xxxxx
1-channel
19.9
1.1 + 1.1 = 2.2
15.2
700
LED EI'IGII'I AN 05w BusNEss 9319mm: Fun GLASS lENS BOARD ) 115)
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LZ4-4xxxxx
1 channel, Standard Star MCPCB (1x4) Dimensions (mm)
Notes:
Unless otherwise noted, the tolerance = ± 0.2 mm.
Slots in MCPCB are for M3 or #4-40 mounting screws.
LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.
LED Engin recommends thermal interface material when attaching the MCPCB to a heatsink
The thermal resistance of the MCPCB is: RΘC-B 1.1°C/W
Components used
MCPCB: HT04503 (Bergquist)
ESD chips: BZX585-C30 (NXP, for 4 LED dies in series)
Pad layout
Ch.
MCPCB
Pad
String/die
Function
1
1, 2, 3
1/ABCD
Cathode -
4, 5
Anode +
(3.01)
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Application Guidelines
MCPCB Assembly Recommendations
A good thermal design requires an efficient heat transfer from the MCPCB to the heat sink. In order to minimize air
gaps in between the MCPCB and the heat sink, it is common practice to use thermal interface materials such as
thermal pastes, thermal pads, phase change materials and thermal epoxies. Each material has its pros and cons
depending on the design. Thermal interface materials are most efficient when the mating surfaces of the MCPCB
and the heat sink are flat and smooth. Rough and uneven surfaces may cause gaps with higher thermal resistances,
increasing the overall thermal resistance of this interface. It is critical that the thermal resistance of the interface is
low, allowing for an efficient heat transfer to the heat sink and keeping MCPCB temperatures low.
When optimizing the thermal performance, attention must also be paid to the amount of stress that is applied on
the MCPCB. Too much stress can cause the ceramic emitter to crack. To relax some of the stress, it is advisable to
use plastic washers between the screw head and the MCPCB and to follow the torque range listed below. For
applications where the heat sink temperature can be above 50oC, it is recommended to use high temperature and
rigid plastic washers, such as polycarbonate or glass-filled nylon.
LED Engin recommends the use of the following thermal interface materials:
1. Bergquist’s Gap Pad 5000S35, 0.020in thick
Part Number: Gap Pad® 5000S35 0.020in/0.508mm
Thickness: 0.020in/0.508mm
Thermal conductivity: 5 W/m-K
Continuous use max temperature: 200°C
Using M3 Screw (or #4 screw), with polycarbonate or glass-filled nylon washer (#4) the
recommended torque range is: 20 to 25 oz-in (1.25 to 1.56 lbf-in or 0.14 to 0.18 N-m)
2. 3M’s Acrylic Interface Pad 5590H
Part number: 5590H @ 0.5mm
Thickness: 0.020in/0.508mm
Thermal conductivity: 3 W/m-K
Continuous use max temperature: 100°C
Using M3 Screw (or #4 screw), with polycarbonate or glass-filled nylon washer (#4) the
recommended torque range is: 20 to 25 oz-in (1.25 to 1.56 lbf-in or 0.14 to 0.18 N-m)
Mechanical Mounting Considerations
The mounting of MCPCB assembly is a critical process step. Excessive mechanical stress build up in the MCPCB can
cause the MCPCB to warp which can lead to emitter substrate cracking and subsequent cracking of the LED dies
LED Engin recommends the following steps to avoid mechanical stress build up in the MCPCB:
o Inspect MCPCB and heat sink for flatness and smoothness.
o Select appropriate torque for mounting screws. Screw torque depends on the MCPCB mounting
method (thermal interface materials, screws, and washer).
o Always use three M3 or #4-40 screws with #4 washers.
o When fastening the three screws, it is recommended to tighten the screws in multiple small
steps. This method avoids building stress by tilting the MCPCB when one screw is tightened in a
single step.
o Always use plastic washers in combinations with the three screws. This avoids high point contact
stress on the screw head to MCPCB interface, in case the screw is not seated perpendicular.
o In designs with non-tapped holes using self-tapping screws, it is common practice to follow a
method of three turns tapping a hole clockwise, followed by half a turn anti-clockwise, until the
appropriate torque is reached.
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Wire Soldering
To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC.
Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is
recommended to use a solder iron of more than 60W.
It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:
24-7068-7601)
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About LED Engin
LED Engin, an OSRAM business based in California’s Silicon Valley, develops, manufactures, and sells advanced LED
emitters, optics and light engines to create uncompromised lighting experiences for a wide range of
entertainment, architectural, general lighting and specialty applications. LuxiGenTM multi-die emitter and
secondary lens combinations reliably deliver industry-leading flux density, upwards of 5000 quality lumens to a
target, in a wide spectrum of colors including whites, tunable whites, multi-color and UV LEDs in a unique patented
compact ceramic package. Our LuxiTuneTM series of tunable white lighting modules leverage our LuxiGen emitters
and lenses to deliver quality, control, freedom and high density tunable white light solutions for a broad range of
new recessed and downlighting applications. The small size, yet remarkably powerful beam output and superior in-
source color mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional
light is required. LED Engin is committed to providing products that conserve natural resources and reduce
greenhouse emissions; and reserves the right to make changes to improve performance without notice.
For more information, please contact LEDE-Sales@osram.com or +1 408 922-7200.

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